18-08-2023 дата публикации
Номер: CN116607136A
Принадлежит:
The invention discloses a bonding agent for surface treatment of a circuit board and a preparation method of the bonding agent. The bonding agent comprises the following components: 15-25 g/L of a mercapto molecule and nitrogen heterocyclic molecule composition, 15-30 g/L of a coupling agent, 3-6 g/L of a dispersing agent, 5-10 g/L of a penetrating agent, 2-5 g/L of an additive and the balance of deionized water. According to the bonding agent prepared by the invention, the added polyvinylpyrrolidone can be used as a dispersing agent on one hand, and belongs to a water-soluble amide high-molecular polymer on the other hand, and methylene of a pyrrolidone ring in a molecular chain of the polyvinylpyrrolidone is a non-polar group, so that the polyvinylpyrrolidone can be bonded with 3, 3 '-biphenyl through an N-H or O-H bond in a molecule in a water solution; according to the bonding agent, 1, 5-dimethyl-2-mercapto benzimidazole and 1, 3-di (1H-benzotriazolyl) propane interact with each other ...
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