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Применить Всего найдено 3. Отображено 3.
14-08-2014 дата публикации

COMPONENT BUILT-IN SUBSTRATE AND METHOD FOR MANUFACTURING SAME

Номер: WO2014122779A1
Автор: SANO Yoshinori, OKAMOTO Masahiro
Принадлежит:

A component built-in substrate comprising: a first substrate having a first insulating layer having a first surface and a second surface, a first electroconductive layer formed on the first surface of the first insulating layer, and an interlayer conduction part passing through the first insulating layer, connected to the first electroconductive layer, and protruding from the second surface of the first insulating layer; an electronic component connected with the interlayer conduction part; and a second substrate having a second insulating layer having a first surface, a second surface, and an opening in which the electronic component is built in, and a second electroconductive layer formed on the first surface and/or the second surface of the second insulating layer; the second electroconductive layer having a frame part that is frame-shaped in a plan view, and the opening being formed so as to pass through the second insulating layer in the thickness direction in the entire inside area ...

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Номер записи: 1
15-03-2018 дата публикации

COMPONENT-INCORPORATED SUBSTRATE AND METHOD FOR MANUFACTURING SAME

Номер: WO2018047612A1
Автор: OKAMOTO Masahiro
Принадлежит:

A component-incorporated substrate has a multilayer structure in which a plurality of printed wiring base members are laminated together via an adhesive layer, the printed wiring base members comprising a resin base member that has a wiring pattern formed on at least one surface thereof and that is formed with a via connected to the wiring pattern. Of the plurality of printed wiring base members, at least one printed wiring base member sandwiched on both sides between the other printed wiring base members is formed with an opening portion, wherein an electronic component is incorporated in the opening portion. At least a part of the wiring pattern of the printed wiring base member formed with the opening portion is disposed in a frame shape around the opening portion so as to surround the opening portion.

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Номер записи: 2
06-06-2013 дата публикации

BOARD WITH EMBEDDED COMPONENT AND METHOD FOR MANUFACTURING SAME, AND PACKAGE WITH BOARD WITH EMBEDDED COMPONENT

Номер: WO2013080790A1
Автор: ITOI, Kazuhisa, OKAMOTO, Masahiro
Принадлежит:

A package with a board with an embedded component (100) comprises a board with an embedded component (1), and a mounting board (2) on which the board with the embedded component is mounted. The board with the embedded component (1) is provided with a structure wherein second to fourth printed wiring substrates (20-40) and a cover lay film (3) are laminated in a package by thermocompression bonding. Inside an open part (29) formed in a second resin substrate (21) of the second printed wiring substrate (20), the back (91a) of an electronic component (90) and a heat-conducting layer (23A) are bonded and embedded in a fixed state by an adhesion layer (9) with holes (23B) therebetween. Bumps (49) are formed on a mounting surface (2a) side of the fourth printed wiring substrate (40). Heat from the electronic component (90): passes through thermal vias and thermal wiring of each layer via thermal vias (24) and the heat-conducting layers (23A), which are in contact with the back (91a) of the electronic ...

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Номер записи: 3