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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Применить Всего найдено 6. Отображено 6.
07-04-2023 дата публикации

HL7V3 standard/FHIR standard analysis mapping processing method and device

Номер: CN115935946A
Принадлежит:

The invention discloses an HL7V3 standard/FHIR standard analysis mapping processing method and device. The method comprises the steps of mapping relation configuration and data conversion. The mapping relation configuration comprises the following steps: performing recursive analysis on an imported source data template and a target data template to obtain a source data XPath tree set and a target data XPath tree set; performing cyclic node mapping and value node mapping according to the set to obtain cyclic node XPath mapping information and value node XPath mapping information of the source data and the target data; the data conversion comprises the following steps: performing format verification on input source data, and analyzing the input source data into corresponding XML document objects; generating a complete structure target data template with a loop structure; obtaining a target XPath tree-shaped set with a mapping relation; if the target data template passes the detection, acquiring ...

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18-04-2023 дата публикации

Wireless communication antenna of integrated circuit and design method thereof

Номер: CN115986375A
Принадлежит:

The invention provides a wireless communication antenna of an integrated circuit and a design method thereof. The wireless communication antenna of the integrated circuit comprises an interposer; the insulating layers are arranged on two opposite side surfaces of the interposer; the wiring layer is arranged on one side, deviating from the intermediate layer, of the insulating layer; the two groups of antenna through holes are arranged in parallel and penetrate through the insulating layer and the intermediate layer so as to be connected with the wiring layer; the antenna through hole is filled with a copper column with a sunken side wall and is used for receiving or sending signals as an antenna; the copper column comprises four connecting positions and is connected with the inner wall of the antenna through hole through the connecting positions, and the antenna through hole is electrically connected with an external circuit through the wiring layer. According to the invention, a double-insulating-layer ...

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23-06-2011 дата публикации

EQUIPMENT AND METHOD FOR TESTING PERFORMANCE OF RADIO FREQUENCY IDENTIFICATION SYSTEM

Номер: WO2011072486A1
Принадлежит:

An equipment and a method for testing the performance of a radio frequency identification system are disclosed. The equipment includes: a turntable(5), a driving motor(8) and a transmitting antenna(1) of a reader-writer, wherein the driving motor(8) turns at a predetermined speed, and the turntable(5) including tag recesses is placed on the turning plane of the driving motor(8); the tag recess fixes the radio frequency identification (RFID) electronic tag(4) to be tested on the position which is perpendicular to the turning plane; the transmitting antenna(1) of the reader-writer is located at a fixed position around the turntable(5) and is connected with the reader-writer to be tested(11), and the main lobe axis direction of the transmitting antenna(1) of the reader-writer is in the same plane with the main lobe axis direction of the built-in antenna of the RFID electronic tag(4) to be tested. Using the speed of turntable(5) in tangential direction to simulate the lineal moving speed of ...

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26-05-2023 дата публикации

Three-dimensional integrated circuit stack structure and preparation method thereof

Номер: CN116169039A
Принадлежит:

The invention provides a three-dimensional integrated circuit stacked structure and a preparation method thereof, and the preparation method comprises the steps: providing a plurality of wafer packaging bodies, enabling the plurality of wafer packaging bodies to form a pairwise connected stacked structure through the opposite arrangement of electrodes at the same side, and carrying out the temporary bonding between two adjacent wafer packaging bodies in the stacked structure through a passivation layer, enabling the same-side electrodes of the two adjacent wafer packaging bodies to be aligned with each other; and heating and decomposing the passivation layer to carry out permanent bonding on the wafer packaging bodies in the stacking structure, so that signal paths penetrating through the stacking structure are formed among the wafer packaging bodies in the stacking structure through respective electrodes, and manufacturing of the device stacking structure is completed. The production process ...

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02-03-2021 дата публикации

具有瞬态特性的柔性相控阵雷达

Номер: CN107422309B
Принадлежит: 浙江大学

... 本发明公开了一种具有瞬态特性的柔性相控阵雷达,其包括相控阵雷达组件、互连线、柔性基底及自毁结构;所述的自毁结构包含PAG/聚合物结构;PAG/聚合物结构被激发后会产生酸性溶液腐蚀互连线或相控阵雷达组件。将刚性TR组件集成在具有瞬态特性的柔性基底上,柔性基底具有可变形,韧性好等特点,大大减少了相控阵雷达的体积和重量,并且可以改变相控阵雷达的形状,使其应用到各种复杂环境。具有瞬态自毁特性的柔性基底,在需要情况下,使得电子设备自毁,确保军事机密安全、保持技术优势,该发明可以广泛的应用到军事领域。 ...

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12-05-2023 дата публикации

Chip bonding interconnection method

Номер: CN116110811A
Принадлежит:

The invention provides a chip bonding interconnection method comprising the following steps: providing a first to-be-bonded structure and a second to-be-bonded structure, the first to-be-bonded structure and the second to-be-bonded structure each comprising a gold layer and a tin layer arranged in a ladder shape; stacking the first to-be-bonded structure and the second to-be-bonded structure, so that the tin layer of the first to-be-bonded structure and the tin layer of the second to-be-bonded structure are oppositely arranged; pressure is applied to the two sides, away from the tin layer, of the stacked first to-be-bonded structure and the second to-be-bonded structure, heating is conducted on one side so that the tin layer and the gold layer can form a gold-tin compound, and bonding is completed. The trapezoidal structures of the gold layer and the tin layer can ensure the directional migration effect, and the bonding quality can be effectively ensured.

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