23-05-2023 дата публикации
Номер: CN116153872A
Принадлежит:
The invention relates to the technical field of packaging, in particular to a semiconductor ceramic packaging shell which comprises a shell body, a ceramic piece is arranged in the middle of the shell body in a penetrating mode, a substrate and a cover plate are packaged on the two opening sides of the shell body respectively, and a pin set is installed on the shell body. The ceramic shell structure is adopted, the higher the purity of ceramic is, the better the mechanical strength thermal conductivity is, therefore, the better heat dissipation performance, physical performance and corrosion resistance are achieved, meanwhile, compared with a packaging shell in the prior art, the packaging shell has the advantages that the heat dissipation performance is improved, and the packaging cost is reduced. According to the semiconductor device, the overall weight of the semiconductor is effectively reduced, the overall structure is designed to be a modular structure, assembly and production are ...
Подробнее