16-05-2019 дата публикации
Номер: WO2019090859A1
Принадлежит:
A manufacturing method for controlling an independent pore size and an independent wire thickness, comprising the following steps: substrate trimming, substrate surface treatment, laser wiring pattern forming, line forming, line film design, substrate drilling, substrate and line film alignment, pressurized curing, borehole etching and warehousing storage. In the substrate trimming, the rotating speed of a polishing machine is 400-550 r/min. In the laser wiring pattern forming, the laser modulation frequency is 1200-5000 Hz, the pulse width is 60-150 ns, and the average laser power is 10-200 W. In the substrate surface treatment, nonmetallic light-induced catalyst aldehydes are solid, liquid or gaseous trihydric alcohol, and the thermoplastic bearing materials are polyvinyl chloride, polycarbonate and polybutylene terephthalate. In the substrate drilling, after the substrate is loaded to a vacuum suction disc, an alignment mark is used to enable a drilling beam to be matched with a circuit ...
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