01-10-2018 дата публикации
Номер: KR1020180106397A
Принадлежит:
The present invention relates to a low-melting point lead-free alloy solder composition and a lead-free solder paste and semiconductor package including the same. According to the present invention, the lead-free alloy solder composition includes antimony as an optimal composition in addition to tin, bismuth, indium, gallium, and silver so as to have an excellent bonding property with a bonding base material compared to conventionally used tin, silver, and copper alloy compositions. Therefore, the mechanical strength, thermal strength, and dropping impact performance of the alloy can be significantly increased. Accordingly, the lead-free alloy can be applied to electronic equipment and a printed circuit board, in particular, applied to a Ni/Au-treated board, a Ni/Au-treated printed circuit board, a Cu/OSP-treated board, and a Cu/OSP-treated printed circuit board so as to resolve impact performance and dropping performance at once. COPYRIGHT KIPO 2018 (AA) Embodiment 1 (BB) Embodiment 2 ...
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