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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 73. Отображено 73.
31-08-2017 дата публикации

TSV를 이용한 VCM의 코일 제조방법 및 그에 의해 제조된 코일

Номер: KR0101773017B1
Автор: 최재경, 이종원, 김은동, 정현학
Принадлежит: 주식회사 에스에프에이반도체

... 본 발명은 서로 전기적으로 연결되고 적층된 코일 칩을 양산하기 위한 TSV를 이용한 VCM의 코일 제조방법으로서, 기판 상에 포토레지스트막을 형성하고, 보이스코일모터(voice coil motor, VCM)의 코일 형상에 대응한 마스크 패턴을 갖는 노광 마스크를 이용하여 상기 포토레지스트막에 코일 패턴을 형성하는 코일 패턴 공정; 상기 코일 패턴 아래의 상기 기판이 관통되지 않도록 식각하여 상기 기판의 상부에 상기 코일 형상에 대응한 형상의 TSV(Through-Silicon Via)를 형성하는 홈 형성 공정; 상기 TSV의 내표면과 상기 기판의 상면에 보호막을 형성하는 피막 공정; 상기 보호막이 형성된 기판의 외곽 부위에 형성된 도금 패턴을 이용하여 제 1 코일을 도금하는 코일 도금 공정; 및 상기 제 1 코일 및 기판의 상부를 제거하여 제 1 코일베이스부를 만드는 코일 칩 공정;을 포함한다.

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Номер записи: 1
12-05-2017 дата публикации

STACKED SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Номер: KR1020170052304A
Автор: JUNG, HYUN HAK, KIM, EUN DONG, LEE, JONG WON, CHOI, JAI KYOUNG, JEONG, BYEONG HO
Принадлежит:

A stacked semiconductor package is disclosed. The stacked semiconductor package adds a passivation layer functioning as a partition wall between bumps which connect an upper semiconductor package and a lower semiconductor package to prevent defects which form bump bridges between adjacent bumps. COPYRIGHT KIPO 2017 ...

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Номер записи: 2
22-05-2020 дата публикации

METHOD FOR PROVIDING SERVICE USING EARSET

Номер: WO2020101358A3
Автор: KIM, Eundong
Принадлежит:

Disclosed are a system and a method for providing an application service using a noise-blocking earset. The system and method for providing an application service using a noise-blocking earset, according to the present invention, comprise: a wireless earset comprising a left earphone, which comprises a left speaker driver unit, a left microphone, and a left wireless communication module, and a right earphone, which comprises a right speaker driver unit, a right microphone, and a right wireless communication module; and a terminal which carries out processing and controlling of sound and voice signals for each of the left earphone and right earphone and provides a service corresponding to the execution of an application, wherein the wireless earset is a noise-blocking earset, and the noise-blocking earset is configured such that back holes of the left speaker driver unit and the right speaker driver unit communicate with microholes that block out noise.

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Номер записи: 3
22-05-2020 дата публикации

SMART EARSET HAVING KEYWORD WAKEUP FUNCTION

Номер: WO2020101357A1
Автор: KIM, Eundong
Принадлежит:

Disclosed is a smart earset having a keyword wakeup function. The smart earset having a keyword wakeup function, according to the present invention, comprises: a microphone which generates a voice signal by collecting the voice of an utterer; a control unit which generates a keyword corresponding to the voice signal (wherein the keyword is text that executes a particular program of a particular terminal) and generates a drive signal corresponding to the keyword; and a wireless communication module which is driven correspondingly to the drive signal.

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Номер записи: 4
07-12-2017 дата публикации

적층형 반도체 패키지 및 그 제조 방법

Номер: KR0101806141B1
Автор: 정현학, 김은동, 이종원, 최재경, 정병호
Принадлежит: 주식회사 에스에프에이반도체

... 적층형 반도체 패키지가 개시된다. 이 적층형 반도체 패키지에서는, 상부 반도체 패키지와 하부 반도체 패키지를 연결하는 범프들 사이에 격벽으로 역할을 하는 패시베이션층을 추가하여, 인접한 범프들 간에 범프 브릿지(bump bridge)가 형성되는 불량을 방지한다.

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Номер записи: 5
10-07-2017 дата публикации

APPARATUS AND METHOD FOR EXPANDING BANDWIDTH OF EARSET HAVING IN-EAR MICROPHONE

Номер: KR1020170080387A
Автор: KIM, EUN DONG
Принадлежит:

Disclosed are an apparatus and a method for expanding a bandwidth of an earset having an in-ear microphone. According to the present invention, the apparatus of the present invention comprises: a high frequency signal generating unit for doubling and expanding a frequency of an excitation signal expanded from an input super-narrowband signal, and the super-narrowband signal, and synthesizing a filtered high frequency band signal to generate a high frequency signal; and a mixing unit for mixing the high frequency signal and the super-narrowband signal. According to the present invention, a narrowband signal input in an in-ear microphone is simply doubled to be expanded to a high frequency band, and simple filtering is only performed in the expanded high frequency band to extract the high frequency band, thereby remarkably reducing the amount of computation. Accordingly, a real-time processing is possible in accordance with reduction in the amount of computation, thereby preventing a signal ...

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Номер записи: 6
06-07-2017 дата публикации

MANAGEMENT SERVER FOR MANAGING CHARGING OF ELECTRICAL PROPULSION APPARATUS AND CHARGING MANAGEMENT METHOD THEREBY

Номер: KR1020170077552A
Автор: HA, YOON CHEOL, KIM, EUN DONG, SON, SUNG HO
Принадлежит:

Disclosed is a charging management system of an electrical propulsion apparatus according to an embodiment of the present invention which includes: a mobile charging device for charging a battery of the electrical propulsion apparatus; and a management server which receives chargeable time information and position information of the electrical propulsion apparatus from the electrical propulsion apparatus or a user terminal of the electrical propulsion apparatus, sets the operation schedule of the mobile charging device, and then transmits the set operation schedule to the mobile charging device or a driver terminal. Accordingly, the present invention can provide a charging method in consideration of the convenience of a user. COPYRIGHT KIPO 2017 ...

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Номер записи: 7
28-03-2013 дата публикации

METHOD FOR PROVIDING A COMPENSATION SERVICE FOR CHARACTERISTICS OF AN AUDIO DEVICE USING A SMART DEVICE

Номер: WO2013042968A3
Автор: KIM, Eun Dong
Принадлежит:

A method for providing a compensation service for characteristics of an audio device using a smart device proposed by the present invention enables a service providing server to take, as an input, information on the audio device from the smart device, search for audio characteristics and transmit a compensation signal according to the audio characteristics to the smart device, thus performing equalizing in consideration of output characteristics of the audio device and achieving improved user convenience by allowing a user to be provided with an audio compensation service based on the audio characteristics of the audio device of the user, even without having to permit the user to directly detect the audio characteristics of the audio device.

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Номер записи: 8
30-11-2016 дата публикации

HEADSET WITH FUNCTION FOR CANCELLING HOWLING AND ECHO

Номер: KR1020160137291A
Автор: KIM, EUN DONG
Принадлежит:

Disclosed is a headset comprising: a first head which includes a first speaker unit; a second head which includes a second speaker unit and a microphone which is positioned inside an external auditory meatus of a user; a communicating unit which communicates with a mobile device; and a controlling unit which stops sound signal output to the second speaker unit when a howling catch signal is received from the mobile device through the communicating unit. The headset effectively cancels noise from the outside; and offers clear sound to the user by capturing enough voice of the user and fundamentally blocking generation of the howling and echo. When the headset is applied to a voice recognizing device, the headset can increase accuracy of voice recognition. COPYRIGHT KIPO 2016 (410) Mobile device (420) Headset (421) Communicating unit (422) Controlling unit ...

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Номер записи: 9
06-01-2017 дата публикации

헤드셋의 하울링 및 에코 제거 방법 및 컴퓨터 프로그램

Номер: KR0101693483B1
Автор: 김은동
Принадлежит: 중소기업은행

... 제1 스피커 유닛이 구비된 제1 헤드와 제2 스피커 유닛 및 마이크가 구비된 제2 헤드를 포함하는 헤드셋과 연결된 모바일 기기에서 헤드셋의 하울링 및 에코를 제거하는 방법이 개시되며, 마이크를 통해 수신되는 음향 신호를 모니터링 하는 단계와, 모니터링의 결과 수신되는 음향 신호에서 하울링 또는 에코에 해당하는 파형이 감지되는 경우, 헤드셋의 제2 스피커 유닛으로 인가되는 채널을 차단하는 단계를 포함하는 것을 특징으로 한다. 이에 의할 때, 외부로부터의 소음을 효과적으로 차폐할 뿐 아니라, 사용자의 음성을 충분히 포착하되 하울링과 에코의 발생을 원천적으로 차단함으로써 사용자에게 깨끗한 음향을 제공할 뿐만 아니라, 음성 인식 기기에 적용될 때 음성 인식의 정확도를 높일 수 있다.

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Номер записи: 10
07-08-2017 дата публикации

METHOD FOR MANUFACTURING COIL OF VOICE COIL MOTOR USING THROUGH-SILICON VIA AND COIL MANUFACTURED THEREBY

Номер: KR1020170090126A
Автор: CHOI, JAI KYOUNG, LEE, JONG WON, KIM, EUN DONG, JUNG, HYUN HAK
Принадлежит:

The present invention relates to a method for manufacturing a coil of a voice coil motor (VCM) using a through-silicon via (TSV) to mass-produce coil chips that are electrically connected to one another and stacked. The method for manufacturing a coil of a VCM using a TSV comprises the following: a coil pattern process of forming a photoresist film on a substrate, and forming a coil pattern on the photoresist film by using an exposure mask having a mask pattern corresponding to a coil shape of a VCM; a groove forming process of forming a TSV having a shape corresponding to the coil shape on an upper part of the substrate by etching the substrate below the coil pattern so as not to be penetrated; a filming process of forming a protective film on an inner surface of the TSV and an upper surface of the substrate; a coil plating process of plating a first coil by using a plating pattern formed on an outer part of the substrate formed with the protective film; and a coil chip process of forming ...

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Номер записи: 11
29-05-2018 дата публикации

임베디드 몰드형 코어리스 기판 제조방법

Номер: KR0101862004B1
Автор: 김은동, 이종원, 최재경, 오유진
Принадлежит: 주식회사 에스에프에이반도체

... 임베디드 몰드형 코어리스 기판 제조방법이 개시된다. 본 발명의 일 실시예에 따른 임베디드 몰드형 코어리스 기판 제조방법은, 전기가 통전되되 코어(core)가 없는 코어리스(coreless) 도전판을 준비하는 코어리스 도전판 준비 단계; 코어리스 도전판에 몰드(mold)가 충전될 몰드 충전용 패턴을 형성시키는 몰드 충전용 패턴 형성 단계; 몰드 충전용 패턴이 형성된 코어리스 도전판의 일측면에 제1 커버레이 테이프(coverlay tape)를 부착시키는 제1 커버레이 테이프 부착 단계; 및 제1 커버레이 테이프가 일측면에 부착된 코어리스 도전판의 타측면을 통해 몰드 충전용 패턴으로 몰드를 충전시키는 몰드 충전 단계를 포함한다.

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Номер записи: 12
19-12-2016 дата публикации

METHOD TO MANUFACTURE VOICE COIL

Номер: KR1020160144672A
Автор: CHOI, JAI KYOUNG, KIM, EUN DONG, JUNG, HYUN HAK, KIM, HYEONG MIN, LIM, SU KYUNG
Принадлежит:

The present invention relates to a method to manufacture a voice coil, and more specifically, to a method to manufacture a voice coil, capable of forming a coil pattern on a wafer level package. According to one embodiment of the present invention, the method comprises the following steps of: forming a first passivation layer on an upper surface of a wafer; directly forming a first coil on the first passivation layer; forming a second passivation layer on the upper surface of the first passivation layer and the first coil; forming a third passivation layer on an upper surface of the second passivation layer; directly forming a second coil on the third passivation layer; and forming an external connection terminal in one area of the second coil. COPYRIGHT KIPO 2016 ...

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Номер записи: 13
27-10-2017 дата публикации

APPARATUS AND METHOD FOR COMPENSATING TIMBRE OF EARSET

Номер: KR1020170119655A
Автор: KIM, EUN DONG
Принадлежит:

Disclosed are an apparatus and method for compensating timbre of an earset. According to the present invention, the apparatus (method) for compensating timbre of an earset allows a parameter extraction unit to extract phase and amplitude parameters for each frequency from a voice signal transferred from an in-ear microphone and an out-ear microphone, allows a parameter comparison unit to compare the extracted phase and amplitude parameters for each frequency of the in-ear microphone and phase and amplitude parameters for each frequency of the out-ear microphone, and allows a parameter compensation unit to compensate a parameter having a difference between measured values with phase and amplitude parameter values for each frequency of the out-ear microphone. According to the present invention, a voice inputted from the in-ear microphone and the out-ear microphone is restored to the timbre of a user by a comparison therebetween to provide the user and conversation with the other party with ...

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Номер записи: 14
03-04-2017 дата публикации

WAFER LEVEL-LAMINATED FAN OUT PACKAGE AND METHOD FOR MANUFACTURING SAME

Номер: KR1020170036237A
Автор: KIM, EUN DONG, LEE, JONG WON, CHOI, JAI KYOUNG, OH, YOU JIN
Принадлежит:

According to the present invention, a method for manufacturing a wafer level-laminated fan out package comprises: a step of attaching a first semiconductor chip to a partial area of an IO pattern formed on one surface of a wafer; a step of forming a first protective film on the first semiconductor chip and the surface of the wafer; a step of forming a first redistribution layer (RDL) on a partial area of the upper surface of the first protective film to be electrically connected to the first semiconductor chip; a step of attaching a second semiconductor chip to the upper surface of the first semiconductor chip; a step of forming a second protective film on the second semiconductor chip and the upper surface of the first protective film; a step of forming a second RDL on a partial area of the upper surface of the second protective film to be electrically connected to the first RDL and the second semiconductor chip; and a step of forming a third protective film on the upper surface of the ...

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Номер записи: 15
19-01-2017 дата публикации

HEADSET HAVING AUDIO FEEDBACK AND ECHO ELIMINATING FUNCTION

Номер: WO2017010610A1
Автор: KIM, Eundong
Принадлежит:

Disclosed is a headset comprising: a first head having a first speaker unit; a second head having a second speaker unit and a microphone disposed at a position inside the outer ear canal of a user when worn; a communication unit for communicating with a mobile device; and a controller for stopping an audio signal output to the second speaker unit when a audio feedback capture signal is received from the mobile device through the communication unit. Accordingly, noise from the outside can be effectively screened, and also, a user's voice can be sufficiently captured in order to prevent audio feedback and echo from occurring at the source, so that clean sound can be provided to the user and voice recognition accuracy can be increased when the headset is applied to a voice recognition device.

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Номер записи: 16
25-07-2017 дата публикации

중공채널을 갖는 이어셋

Номер: KR0101756652B1
Автор: 김은동
Принадлежит: 주식회사 오르페오사운드웍스

... 중공채널을 갖는 이어셋이 개시된다. 본 발명에 의한 중공채널을 갖는 이어셋은 케이스와, 케이스에 내장된 스피커와, 스피커의 전방에서 스피커 음향의 출력공간과 격리되는 튜브와, 튜브 내부에 삽입된 마이크로폰을 포함할 수 있다. 본 발명에 따르면, 스피커 음향의 출력공간에 마이크로폰이 설치되어 별도의 마이크로폰 설치공간을 필요로 하지 않으므로 이어셋의 전체 부피를 콤팩트화할 수 있다. 또한, 스피커 전방에 배치되는 마이크로폰이 튜브에 의해 스피커 음향의 출력공간과 격리되므로 하울링 현상을 최소화할 수 있다. 그리고, 스피커와 마이크로폰이 동일방향으로 설치되므로 스피커와 마이크로폰의 배선단자간 접촉 방지를 위한 별도의 공간 및 절연체를 구성할 필요가 없을 뿐 아니라 케이스 후미로 배선을 함께 인출할 수 있으므로 제조공정이 단순해져 대량생산이 용이하다.

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Номер записи: 17
03-04-2017 дата публикации

WAFER-LEVEL LAMINATED FAN-OUT PACKAGE AND METHOD OF MANUFACTURING SAME

Номер: KR1020170036238A
Автор: KIM, EUN DONG, LEE, JONG WON, CHOI, JAI KYOUNG, OH, YOU JIN
Принадлежит:

Provided are a wafer-level laminated fan-out package and a method of manufacturing the same, capable of omitting a molding process from a packaging process, and suppressing occurrence of cracks and warpage. The method of manufacturing a wafer-level laminated fan-out package includes the steps of: attaching a first semiconductor chip in a partial area of an IO pattern formed on one surface of a wafer; forming a first passivation layer on surfaces of the first semiconductor chip and the wafer; forming a first redistribution layer (RDL) that is electrically conducted with the IO pattern and the first semiconductor chip, in a partial area of the top surface of the first passivation layer; forming a second passivation layer on the top surface of the first passivation layer and a partial surface of the redistribution layer; attaching a second semiconductor chip on the top surface of the second passivation layer so as to correspond to the first semiconductor chip; forming a third passivation layer ...

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Номер записи: 18
31-08-2017 дата публикации

APPARATUS AND METHOD FOR COMPENSATING TIMBRE OF EARSET

Номер: KR101773353B1
Автор: KIM, EUN DONG
Принадлежит: ORFEO SOUNDWORKS CORPORATION

Disclosed are an apparatus and a method for compensating the timbre of an earset. According to the present invention, the apparatus (method) for compensating the timbre of an earset extracts phase and amplitude parameters for each frequency from a voice signal transferred from an in-ear microphone and an out-ear microphone by a parameter extraction unit, compares the extracted phase and amplitude parameters for each frequency of the in-ear microphone and the extracted phase and amplitude parameters for each frequency of the out-ear microphone by a parameter comparison unit, and compensates a parameter having a difference between measurement values with phase and amplitude parameter values for each frequency of the out-ear microphone by a parameter compensation unit. According to the present invention, a voice inputted from the in-ear microphone and the out-ear microphone is restored to the timbre of a user by comparison to provide comfort in a conversation between the user and the other ...

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Номер записи: 19
10-07-2017 дата публикации

EARSET WITH HOLLOW CHANNEL

Номер: KR1020170080386A
Автор: KIM, EUN DONG
Принадлежит:

Disclosed is an earset with a hollow channel. According to the present invention, the earset comprises: a case; a speaker embedded in the case; a tube separated from a sound output space of the speaker in front of the speaker; and a microphone inserted in the tube. According to the present invention, since a separate microphone installation space is not required as the microphone is installed in the sound output space of the speaker, the entire volume of the earset can be compact. Moreover, since the microphone disposed in the front of the speaker is separated from the sound output space of the speaker by the tube, howling can be minimized. Moreover, since the speaker and the microphone are installed in the same direction, a separate space and an insulating body to prevent contact between wiring terminals of the speaker and the microphone are not required to be configured, and wires can be withdrawn together to the rear part of the case, thereby facilitating mass production due to a simplified ...

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Номер записи: 20
03-04-2017 дата публикации

WAFER LEVEL FAN-OUT PACKAGE HAVING HEAT SPREADER ATTACHED THEREON, AND MANUFACTURING METHOD THEREOF

Номер: KR1020170036236A
Автор: KIM, EUN DONG, LEE, JONG WON, CHOI, JAI KYOUNG, OH, YOU JIN
Принадлежит:

A method for manufacturing a wafer level fan-out package having a heat spreader attached thereon according to the present invention comprises the steps of: attaching a semiconductor chip to a part of an IO pattern formed on one side of a wafer; forming a first protective film on surfaces of the semiconductor chip and the wafer; forming a thermal paste on upper surfaces of the first protective film and the semiconductor chip; attaching a heat spreader on a surface of the thermal paste; polishing and removing the wafer to expose the bottom surface of the semiconductor chip; and sawing along each package sawing line. COPYRIGHT KIPO 2017 ...

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Номер записи: 21
22-05-2020 дата публикации

METHOD FOR PROVIDING SERVICE USING EARSET

Номер: WO2020101358A2
Автор: KIM, Eundong
Принадлежит:

Disclosed are a system and a method for providing an application service using a noise-blocking earset. The system and method for providing an application service using a noise-blocking earset, according to the present invention, comprise: a wireless earset comprising a left earphone, which comprises a left speaker driver unit, a left microphone, and a left wireless communication module, and a right earphone, which comprises a right speaker driver unit, a right microphone, and a right wireless communication module; and a terminal which carries out processing and controlling of sound and voice signals for each of the left earphone and right earphone and provides a service corresponding to the execution of an application, wherein the wireless earset is a noise-blocking earset, and the noise-blocking earset is configured such that back holes of the left speaker driver unit and the right speaker driver unit communicate with microholes that block out noise.

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Номер записи: 22
11-08-2017 дата публикации

NOISE SHIELDING EARSET AND MANUFACTURING METHOD THEREOF

Номер: KR101767467B1
Автор: KIM, EUN DONG
Принадлежит: ORFEO SOUNDWORKS CORPORATION

Disclosed are a noise shielding earset and a manufacturing method thereof. According to the present invention, the noise shielding earset comprises a driver unit including a back hole, and a case having the driver unit installed therein, and a fine hole communicating with the back hole; or comprises a driver unit forming a back hole, and a case having a driver unit installed therein, wherein a shielding member with a fine hole can be inserted into the back hole; or comprises a driver unit formed with a back hole, a case having a driver unit formed therein, and a shielding member formed with a fine hole to be combined with the case or back hole of the driver unit. At this point, a ratio of the diameter (D) of the fine hole to the thickness (T) of the case (thickness of the shielding member) is advisably set within a range of 1 : 100-1,000. According to the present invention, the upper register and the middle register are removed through the fine hole and only the lower register, which is ...

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Номер записи: 23
17-11-2016 дата публикации

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Номер: KR101677270B1
Автор: KIM, EUN DONG, YU, BONG SEOK
Принадлежит: SFA SEMICON CO., LTD.

Provided is a manufacturing method of a semiconductor package. The manufacturing method comprises the steps of: attaching a semiconductor die and a component device to a substrate to electrically connect the semiconductor die and the component device to a wiring pattern of the substrate; bonding a connector bar to the wiring pattern electrically connected to the component device; encapsulating the semiconductor die, the component device, the wiring pattern, and the connector bar with an encapsulant, and encapsulating the other part except for an upper end of the connector bar with the encapsulant; and forming an antenna layer on the surface of the encapsulant to electrically connect the upper end surface of the connector bar and the antenna layer. COPYRIGHT KIPO 2016 ...

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Номер записи: 24
26-10-2017 дата публикации

TONE COMPENSATION DEVICE AND METHOD FOR EARSET

Номер: WO2017183789A1
Автор: KIM, Eundong
Принадлежит:

Disclosed are tone compensation device and method for an earset. A tone compensation device (method) for an earset, according to the present invention, is characterized by: extracting, in a parameter extraction unit, phase and amplitude parameters for each frequency from a voice signal transmitted from an in-ear microphone and an out-ear microphone; comparing, in a parameter comparison unit, the extracted phase and amplitude parameters for each frequency of the in-ear microphone and the extracted phase and amplitude parameters for each frequency of the out-ear microphone, respectively; and compensating, in a parameter compensation unit, for parameters having differentials between measurement values by means of the phase and amplitude parameter value for each frequency of the out-ear microphone.

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Номер записи: 25
28-04-2017 дата публикации

음질 개선을 위한 방법 및 헤드셋

Номер: KR0101731714B1
Автор: 김은동
Принадлежит: 중소기업은행

... 적어도 하나의 인이어 마이크(In-Ear Microphone)와, 적어도 하나의 아웃이어 마이크(Out-Ear Microphone)와, 인이어 마이크를 통해 감지된 신호로부터 저음 성분을 추출하는 인이어 신호 처리 모듈, 아웃이어 마이크를 통해 감지된 신호로부터 고음 성분을 추출하는 아웃이어 신호 처리 모듈, 및 추출된 저음 성분 및 고음 성분을 믹싱하여 출력하는 믹싱 모듈을 포함하는 제어부와, 제어부의 믹싱 모듈로부터 출력되는 신호를 외부 기기로 전송하기 위한 통신부를 포함하는 것을 특징으로 하는 헤드셋이 개시되어 헤드셋을 통해 전달되는 사용자 음성 신호의 소음을 제거하고 사용자의 음성에 가까운 신호를 생성함으로써 음질을 개선할 수 있다.

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Номер записи: 26
09-02-2018 дата публикации

반도체 패키지 및 이의 제조 방법

Номер: KR0101827269B1
Автор: 정병호, 김은동, 이종원, 정현학, 최재경
Принадлежит: 주식회사 에스에프에이반도체

... 본 발명은 반도체 패키지 및 이의 제조 방법에 관한 것으로서, 보다 상세하게는 인접한 도전성 범프 사이에 범프 브릿지가 형성되는 것을 방지하여 미세 범프 피치를 구현하기 위한 반도체 패키지 및 이의 제조 방법에 관한 것이다. 본 발명의 실시 예에 따른 반도체 패키지는 제1 단위 회로부, 상기 제1 단위 회로부 상에 형성되는 제1 패시베이션층, 및 상기 제1 단위 회로부와 전기적으로 연결되는 도전성 범프를 포함하는 제1 반도체 칩 구조물; 및 제2 단위 회로부, 내부로 함입되는 단차부를 가지며 상기 제2 단위 회로부 상에 형성되는 제2 패시베이션층, 및 상기 단차부에 제공되는 범프 패드를 포함하는 제2 반도체 칩 구조물;을 포함하고, 상기 제1 반도체 칩 구조물과 제2 반도체 칩 구조물은, 상기 도전성 범프가 상기 단차부 내에서 상기 범프 패드와 접합하여 적층된다.

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Номер записи: 27
30-11-2016 дата публикации

METHOD AND COMPUTER PROGRAM TO REMOVE HOWLING AND ECHO IN HEADSET

Номер: KR1020160137290A
Автор: KIM, EUN DONG
Принадлежит:

According to the present invention, disclosed is a method to remove howling and echo of a headset in a mobile device connected to the headset which includes a first head having a first speaker unit, and a second head having a second speaker unit and a microphone. The method comprises the following steps: monitoring an audio signal received through a microphone; and blocking a channel applied to a second speaker unit of a headset when a waveform corresponding to howling or echo is detected in the received audio signal according to a monitoring result. Thus, noise from the outside is effectively blocked, and occurrence of howling or echo is fundamentally blocked while fully capturing a voice of a user, so the method can provide a clear sound to the user and can also increase the correctness of voice recognition when being applied to a voice recognition device. COPYRIGHT KIPO 2016 (D1,D2) No (S502) Is an audio signal received through a microphone? (S504) Monitore an audio signal received through ...

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Номер записи: 28
18-04-2016 дата публикации

manufacturing method of stacked semiconductor package

Номер: KR0101613115B1
Автор: 유봉석, 김은동
Принадлежит: 주식회사 에스에프에이반도체

... 본 발명은 적층형 반도체 패키지 제조방법에 관한 것으로, 더욱 상세하게는 감광성 필름을 이용하여 에칭홀을 형성하고, 건식 또는 습식 식각 방식으로 비아홀을 형성하기 때문에 비아홀가공 및 표면 개질 공정을 연속적으로 진행할 수 있으며, 레이저 가공을 통해 비아홀(TMV,through mold via)를 형성하는 것에 비해 비용 및 공정 소요 시간을 절감할 수 있는 적층형 반도체 패키지 제조방법에 관한 것이다.

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Номер записи: 29
03-04-2017 дата публикации

WAFER-LEVEL FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF

Номер: KR1020170036235A
Автор: KIM, EUN DONG, LEE, JONG WON, CHOI, JAI KYOUNG, OH, YOU JIN
Принадлежит:

A wafer-level fan-out package manufacturing method according to the present invention comprises the steps of: attaching a semiconductor chip to a part of an IO pattern formed on one surface on a wafer; forming a first protective film on a surface of the semiconductor chip and the wafer; forming a redistribution layer (RDL), which is electrically conductive with the IO pattern and the semiconductor chip, in a part of an upper side of the first protective film; and forming a second protective film on the upper side of the first protective film and a surface of the RDL. COPYRIGHT KIPO 2017 ...

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Номер записи: 30
01-09-2017 дата публикации

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Номер: KR1020170099513A
Автор: KIM, EUN DONG, LEE, JONG WON, CHOI, JAI KYOUNG, OH, YOU JIN
Принадлежит:

Disclosed are a semiconductor package, which can suppress occurrence of cracks and bending during a manufacturing process while reducing the number of processing steps and prevent the volume of the package from increasing, and a manufacturing method thereof. The manufacturing method of the semiconductor package comprises the steps of: attaching a semiconductor chip to at least a part of a lower wiring circuit pattern formed on a base; forming a passivation layer on an upper part of the base to surround the semiconductor chip; forming a wiring circuit pattern electrically connected to the lower wiring circuit pattern on the passivation layer and the semiconductor chip; and removing the base. COPYRIGHT KIPO 2017 ...

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Номер записи: 31
01-09-2017 дата публикации

EMBEDDED MOLD-TYPE CORELESS SUBSTRATE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR PACKAGE INCLUDING SAME

Номер: KR1020170099514A
Автор: KIM, EUN DONG, LEE, JONG WON, CHOI, JAI KYOUNG, OH, YOU JIN
Принадлежит:

Disclosed are an embedded mold-type coreless substrate, a manufacturing method thereof, and a semiconductor package including the same. The method for manufacturing an embedded mold-type coreless substrate according to an embodiment of the present invention includes a coreless conductive plate preparing step of preparing a coreless conductive plate which has no core while being electrically conductive, a mold filling pattern forming step of forming a mold filling pattern on the coreless conductive plate to fill the mold, a first coverlay tape attaching step of attaching a first coverlay tape to one side of the coreless conductive plate on which the mold filling pattern is formed; and a mold filling step of filling the mold with the mold filling pattern through the other side of the coreless conductive plate where the first coverlay tape is attached on one side. Accordingly, the embedded mold-type coreless substrate has an efficient structure to which the core is not applied, which makes ...

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Номер записи: 32
28-12-2017 дата публикации

웨이퍼 레벨의 팬 아웃 패키지 및 그 제조 방법

Номер: KR0101812980B1
Автор: 김은동, 이종원, 최재경, 오유진
Принадлежит: 주식회사 에스에프에이반도체

... 본 발명에 따른 웨이퍼 레벨의 팬 아웃 패키지 제조 방법은 웨이퍼 상에 하나 이상의 인쇄회로기판를 부착하는 단계; 상기 인쇄회로기판 상의 일측면에 형성된 IO 패턴의 일부 영역에 반도체 칩을 부착하는 단계; 상기 반도체 칩 및 상기 인쇄회로기판의 표면에 제 1 보호막을 형성하는 단계; 상기 제 1 보호막의 표면의 일부 영역에 상기 IO 패턴 및 상기 반도체 칩과 전기적으로 도통되는 재배선(RDL, Redistribution layer)을 형성하는 단계 및 상기 제 1 보호막의 표면과 일부 재배선의 표면에 제 2 보호막을 형성하는 단계를 포함한다.

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Номер записи: 33
23-01-2017 дата публикации

반도체 패키지 및 웨이퍼 레벨 패키지의 제조 방법

Номер: KR0101694932B1
Автор: 김은동, 이종원, 최재경
Принадлежит: 주식회사 에스에프에이반도체

... 웨이퍼 레벨 패키지의 제조 방법이 제공된다. 이 제조 방법은, 웨이퍼로부터 낱개로 분리된 다수의 반도체 칩을 인캡슐레이션 하는 제1 리패시베이션층(repassivation layer)을 형성하는 단계; 상기 제1 리패시베이션층의 내부를 관통하는 관통 인캡슐레이션 전극(Through Encapsulation Via: TEV)으로서, 상기 반도체 칩의 측면을 인캡슐레이션 하는 상기 리패시베이션층의 내부를 관통하는 제1 TEV와, 상기 반도체 칩의 제1 면에 반대면인 제2 면에 형성된 입출력 패드를 인캡슐레이션 하는 상기 제1 리패시베이션층의 내부를 관통하여 상기 입출력 패드에 전기적으로 연결되는 제2 TEV을 포함하는 상기 TEV를 형성하는 단계; 상기 제1 리패시베이션층 상에 형성되고, 상기 TEV의 일단부와 전기적으로 연결되는 재배선층을 형성하는 단계; 및 (D) 상기 재배선층 상에 형성되고, 상기 재배선층과 전기적으로 연결되는 도전성 범프를 형성하여, 웨이퍼 레벨 패키지를 완성하는 단계를 포함한다.

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Номер записи: 34
31-10-2018 дата публикации

인이어 마이크와 아웃이어 마이크 수음특성을 이용한 소음 제거 이어셋 및 소음 제거 방법

Номер: KR0101898911B1
Автор: 김은동
Принадлежит: 주식회사 오르페오사운드웍스

... 인이어 마이크와 아웃이어 마이크 수음특성을 이용한 소음 제거 이어셋 및 소음 제거 방법이 개시된다. 본 발명에 의한 인이어 마이크와 아웃이어 마이크 수음특성을 이용한 소음 제거 이어셋 및 소음 제거 방법은, 인이어 마이크 신호와 아웃이어 마이크 신호로부터 사용자 목소리를 제거하여 소음을 추출하고, 인이어 마이크와 아웃이어 마이크의 상호관계 각각에 적용할 소음 보정값을 산출하여 소음을 보정하며, 인이어 마이크와 아웃이어 마이크 신호로부터 보정된 실제 소음을 각각 제거하여 사용자 목소리를 복원하다. 본 발명에 따르면, 내부와 외부에 각각 구비된 마이크로 입력되는 내부소음과 외부소음으로부터 하드웨어 특성 및 환경 특성 등을 고려하여 실제 소음으로 보정한 후 제거하므로, 사용자 목소리를 더욱 명확하게 출력할 수 있다. 이에, 이어셋 형상, 이어셋 착용 상태, 공연장 등의 매우 시끄러운 장소 등에 상관없이 사용자 목소리를 상대방에게 명확하게 전달할 수 있다.

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Номер записи: 35
17-07-2017 дата публикации

WAFER LEVEL FAN OUT PACKAGE AND MANUFACTURING METHOD THEREOF

Номер: KR1020170082848A
Автор: KIM, EUN DONG, LEE, JONG WON, CHOI, JAI KYOUNG, OH, YOU JIN
Принадлежит:

The present invention relates to a wafer level fan out package to which a printed circuit board capable of omitting a molding process and easily achieving a fan out package structure while suppressing occurrence of crack and warpage in a packaging process is bonded, and a manufacturing method thereof. The manufacturing method of the wafer level fan out package comprises the steps of: attaching at least one printed circuit board on a wafer; attaching a semiconductor chip to a part of an IO pattern formed on one side of the printed circuit board; forming a first protective film on a surface of the semiconductor chip and the printed circuit board; forming a redistribution layer (RDL) electrically conductive with the IO pattern and the semiconductor chip on a part of a surface of the first protective film; and forming a second protective film on a surface of the first protective film and a surface of a part of the RDL. COPYRIGHT KIPO 2017 ...

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Номер записи: 36
19-12-2016 дата публикации

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING WAFER LEVEL PACKAGE

Номер: KR1020160144789A
Автор: KIM, EUN DONG, LEE, JONG WON, CHOI, JAI KYOUNG
Принадлежит:

Provided is a semiconductor package separated from a wafer level package. The semiconductor package includes: a repassivation layer (120) configured to encapsulate a wafer chip; an upper structure formed on a first surface of the repassivation layer; and a lower structure formed on a second surface of the repassivation layer. The upper structure and the lower structure are electrically connected by a TEV, which penetrates the inside of the repassivation layer, and a TSV, which penetrates the inside of the wafer chip. COPYRIGHT KIPO 2016 ...

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Номер записи: 37
20-04-2018 дата публикации

인-이어 마이크로폰을 갖는 이어셋의 대역폭 확장 장치 및 방법

Номер: KR0101850693B1
Автор: 김은동
Принадлежит: 주식회사 오르페오사운드웍스

... 인-이어 마이크로폰을 갖는 이어셋의 대역폭 확장 장치 및 방법이 개시된다. 본 발명에 의한 인-이어 마이크로폰을 갖는 이어셋의 대역폭 확장 장치 및 방법은 입력된 초협대역 신호(Super-Narrowband signal)로부터 확장된 여기신호(excitation signal)와 초협대역 신호의 주파수를 배가시켜 확장시키고 필터링한 고주파 대역 신호를 합성하여 고주파 신호를 생성하는 고주파 신호 생성부와, 고주파 신호와 초협대역 신호를 믹싱하는 믹싱부를 포함한다. 본 발명에 따르면, 인-이어 마이크로폰에 입력되는 협대역 신호를 단순하게 배가시켜 고주파 대역으로 확장시키고, 확장된 고주파 대역에서 단순 필터링만을 수행하여 고주파 대역을 추출하므로 연산량을 현저하게 감소시킬 수 있다. 이에, 연산량 감소에 따라 실시간 처리가 가능하므로, 신호 전달 지연 현상 등을 방지할 수 있다.

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Номер записи: 38
12-10-2018 дата публикации

이어셋의 음색 보상 장치 및 방법

Номер: KR0101907389B1
Автор: 김은동
Принадлежит: 주식회사 오르페오사운드웍스

... 이어셋의 음색 보상 장치 및 방법이 개시된다. 본 발명에 의한 이어셋의 음색 보상 장치(방법)는, 파라미터 추출부에서, 인-이어 마이크로폰과 아웃-이어 마이크로폰으로부터 전달된 음성 신호로부터 주파수별 위상 및 진폭 파라미터를 추출하고, 파라미터 비교부에서, 추출된 인-이어 마이크로폰의 주파수별 위상 및 진폭 파라미터와 아웃-이어 마이크로폰의 주파수별 위상 및 진폭 파라미터를 각각 비교하며, 파라미터 보상부에서, 측정값 간의 차이가 있는 파라미터에 대해 아웃-이어 마이크로폰의 주파수별 위상 및 진폭 파라미터값으로 보상한다. 본 발명에 따르면, 인-이어 마이크로폰과 아웃-이어 마이크로폰으로부터 입력된 음성을 비교를 통해 사용자 음색으로 복원함으로써 사용자 본인 및 상대방과의 대화에 편안함을 제공할 수 있다.

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Номер записи: 39
22-02-2017 дата публикации

반도체 패키지 및 웨이퍼 레벨 패키지의 제조 방법

Номер: KR0101705331B1
Автор: 김은동, 이종원, 최재경
Принадлежит: 주식회사 에스에프에이반도체

... 웨이퍼 레벨 패키지로부터 분리된 반도체 패키지가 제공된다. 이 반도체 패키지는, 웨이퍼 칩을 인캡슐레이션하는 리패시베이션층(120), 상기 리패시베이션층의 제1 면 상에 형성되는 상부 구조 및 상기 리패시베이션층의 제2 면 상에 형성되는 하부 구조를 포함한다. 상기 상부 구조와 상기 하부 구조는 상기 리패시베이션층의 내부를 관통하는 TEV와 상기 웨이퍼 칩의 내부를 관통하는 TSV에 의해 전기적으로 연결된다.

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Номер записи: 40
19-12-2016 дата публикации

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING WAFER LEVEL PACKAGE

Номер: KR1020160144790A
Автор: KIM, EUN DONG, LEE, JONG WON, CHOI, JAI KYOUNG
Принадлежит:

The present invention provides a method for manufacturing a wafer level package. The method for manufacturing a wafer level package comprises: a step of forming a first repassivation layer for encapsulating a plurality of semiconductor chips individually separated from a wafer; a step of forming a through encapsulation via (TEV) including a first TEV penetrating the inside of the repassivation layer encapsulating sides of the semiconductor chips, and a second TEV penetrating the inside of the first repassivation layer encapsulating input/output pads formed on second surfaces opposite to first surfaces of the semiconductor chips to be electrically connected to the input/output pads as the TEV penetrating the inside of the first repassivation layer; a step of forming a rewiring layer formed on the first repassivation layer and electrically connected to one end of the TEV; and (D) a step of forming a conductive bump formed on the rewiring layer and electrically connected to the rewiring layer ...

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Номер записи: 41
15-02-2018 дата публикации

DEVICE AND METHOD FOR MONITORING EARPHONE WEARING STATE

Номер: WO2018030589A2
Автор: KIM, Eundong
Принадлежит:

Disclosed is a device and method for monitoring an earphone wearing state. A device and method for monitoring an earphone wearing state according to the present invention comprises: an internal microphone for receiving an internal voice generated inside an ear and generating an internal voice signal; an external microphone for receiving an external sound selectively including external noise and an external voice transferred from a vocal cords to the outside of an oral cavity and generating an external sound signal; a control unit for determining the volume of external noise though a comparison between an internal voice signal and an external sound signal and determining whether to generate an alarm signal; and an alarm unit for performing alarming in response to an alarm signal.

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Номер записи: 42
01-09-2017 дата публикации

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

Номер: KR1020170099515A
Автор: KIM, EUN DONG, LEE, JONG WON, YU, BONG SEOK, OH, YOU JIN
Принадлежит:

A semiconductor package is disclosed. The semiconductor package according to the present invention includes a base having an input/output (IO) pattern on one side thereof, at least one semiconductor chip mounted on the base to be electrically connected to an input/output (IO) pattern and having a through silicon via (TSV), a molding part for molding the base and the semiconductor chip and exposing the upper surface of the semiconductor chip so that the through silicon via is electrically connected to an external circuit, and a connection line part disposed on the upper surface part of the semiconductor chip and electrically connecting the through silicon via to an external circuit. It is possible to provide a semiconductor package which can be directly connected to a motherboard without a separate I/O connector. COPYRIGHT KIPO 2017 ...

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Номер записи: 43
06-01-2017 дата публикации

하울링 및 에코 제거 기능을 갖는 헤드셋

Номер: KR0101693482B1
Автор: 김은동
Принадлежит: 중소기업은행

... 제1 스피커 유닛이 구비된 제1 헤드와, 제2 스피커 유닛 및 착용시 사용자의 외이도 내에 위치하도록 배치된 마이크가 구비된 제2 헤드와, 모바일 기기와 통신하기 위한 통신부와, 통신부를 통해 모바일 기기로부터 하울링 포착 신호를 수신하면 제2 스피커 유닛으로의 음향 신호 출력을 중지시키는 제어부를 포함하는 헤드셋이 개시된다. 이에 의할 때, 외부로부터의 소음을 효과적으로 차폐할 뿐 아니라, 사용자의 음성을 충분히 포착하되 하울링과 에코의 발생을 원천적으로 차단함으로써 사용자에게 깨끗한 음향을 제공할 뿐만 아니라, 음성 인식 기기에 적용될 때 음성 인식의 정확도를 높일 수 있다.

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Номер записи: 44
30-11-2017 дата публикации

반도체 칩 구조물, 반도체 패키지 및 이의 제조 방법

Номер: KR0101803516B1
Автор: 정병호, 김은동, 이종원, 정현학, 최재경
Принадлежит: 주식회사 에스에프에이반도체

... 본 발명은 반도체 칩 구조물, 반도체 패키지 및 이의 제조 방법에 관한 것으로서, 보다 상세하게는 인접한 도전성 범프 사이에 범프 브릿지가 형성되는 것을 방지하여 미세 범프 피치를 구현하기 위한 반도체 칩 구조물, 반도체 패키지 및 이의 제조 방법에 관한 것이다. 본 발명의 실시 예에 따른 반도체 칩 구조물은 기판에 형성되는 단위 회로부; 상기 기판의 일면 상에 형성되는 제1 패시베이션층; 상기 제1 패시베이션층에 부분적으로 삽입 형성되어 상기 단위 회로부와 전기적으로 연결되는 도전성 범프; 상기 기판의 타면 상에 형성되어, 내부로 함입되는 단차부를 가지는 제2 패시베이션층; 및 상기 단차부에 제공되는 범프 패드를 포함한다.

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Номер записи: 45
22-02-2017 дата публикации

METHOD TO IMPROVE SOUND QUALITY AND HEADSET

Номер: KR1020170019929A
Автор: KIM, EUN DONG
Принадлежит:

Disclosed is a headset comprising at least one in-ear microphone, at least one out-ear microphone, a control part and a communication part. The control part comprises: an in-ear signal processing module extracting a low sound element from a signal detected through the in-ear microphone; an out-ear signal processing module extracting a high sound element from a signal detected through the out-ear microphone; and a mixing module mixing the extracted low sound element with the extracted high sound element to be output. The communication part transmits a signal output from the mixing module of the control part to an external device. Noise in a user voice signal transmitted through the headset is removed, and a signal similar to the user′s voice is generated, thereby improving sound quality. COPYRIGHT KIPO 2017 (230) Communication part (241) In-ear microphone (251) Out-ear microphone (310) In-ear signal processing module (320) Out-ear signal processing module (330) Mixing module ...

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Номер записи: 46
15-02-2018 дата публикации

DEVICE AND METHOD FOR MONITORING EARPHONE WEARING STATE

Номер: WO2018030589A3
Автор: KIM, Eundong
Принадлежит:

Disclosed is a device and method for monitoring an earphone wearing state. A device and method for monitoring an earphone wearing state according to the present invention comprises: an internal microphone for receiving an internal voice generated inside an ear and generating an internal voice signal; an external microphone for receiving an external sound selectively including external noise and an external voice transferred from a vocal cords to the outside of an oral cavity and generating an external sound signal; a control unit for determining the volume of external noise though a comparison between an internal voice signal and an external sound signal and determining whether to generate an alarm signal; and an alarm unit for performing alarming in response to an alarm signal.

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Номер записи: 47
10-07-2017 дата публикации

NOISE SHIELDING EARSET HAVING ACOUSTIC FILTER

Номер: KR1020170080388A
Автор: KIM, EUN DONG
Принадлежит:

Disclosed is a noise shielding earset having an acoustic filter. According to the present invention, the noise shielding earset having an acoustic filter comprises a driver unit for generating sound and an acoustic filter covering a backhaul formed in the driver unit to shield external noise while allowing air to pass therethrough. The acoustic filter includes a filter layer having a through-hole and a sound movement path selectively formed therein and a plate having a through-hole formed therein to selectively communicate with the through-hole and the sound movement path, wherein the filter layer and the plate are repeatedly laminated on each other and the through-hole of the plate communicates with the through-hole of the filter layer or the sound movement path thereof. According to the present invention, since the upper register and the intermediate register are removed and substantially only the lower register of 100 Hz or less passes through the acoustic filter, the external noise ...

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Номер записи: 48
06-07-2017 дата публикации

APPARATUS AND METHOD FOR EXTENDING BANDWIDTH OF EARSET HAVING IN-EAR MICROPHONE

Номер: WO2017116022A1
Автор: KIM, Eundong
Принадлежит:

Disclosed is an apparatus and method for extending the bandwidth of an earset having an in-ear microphone. The apparatus and method for extending the bandwidth of an earset having an in-ear microphone according to the present invention comprises: a high-frequency signal generation unit for generating a high-frequency signal by synthesizing an excitation signal extended from an input super-narrowband signal with a high-frequency band signal, wherein the high-frequency band signal is obtained by multiplying the frequency of the super-narrowband signal, extending the super-narrowband signal to the multiplied frequency, and filtering the same; and a mixing unit for mixing the high-frequency signal and the super-narrowband signal.

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Номер записи: 49
26-10-2017 дата публикации

NOISE BLOCKING EARSET AND METHOD FOR MANUFACTURING SAME

Номер: WO2017183790A1
Автор: KIM, Eundong
Принадлежит:

Disclosed are a noise blocking earset and a method for manufacturing same. A noise blocking earset, according to the present invention, can have a driver unit, having a back hole formed thereon, and a case having the driver unit embedded therein and micro holes, which communicate with the back hole, formed thereon. Or, the noise blocking earset can comprise a driver unit, having a back hole formed thereon, and a case, having the driver unit embedded therein, and can have a blocking member, having micro holes formed thereon, inserted into a hole. Or, the noise blocking earset can have a driver unit, having a back hole formed thereon, a case, having the driver unit embedded therein, and a blocking member coupled to the case or the back hole of the driver unit and having micro holes formed thereon.

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Номер записи: 50
14-10-2016 дата публикации

METHOD FOR MANUFACTURING WAFER LEVEL FAN-OUT PACKAGE

Номер: KR101664411B1
Автор: CHOI, JAI KYOUNG, KIM, EUN DONG, JUNG, HYUN HAK, KIM, HYEONG MIN, LIM, SU KYUNG
Принадлежит: SFA SEMICON CO., LTD.

The present invention relates to a semiconductor package and, more specifically, to a method for manufacturing a semiconductor package, capable of eliminating a molding process in a packaging process and easily achieving a fan-out package while preventing cracks and warpage. To achieve this, according to an embodiment of the present invention, the method for manufacturing a wafer level fan-out package comprises: a step of attaching semiconductor chips sawn to a predetermined size to one side of a wafer at predetermined intervals; a step of forming a first passivation layer on the surface of the wafer and the semiconductor chip; a step of forming a redistribution layer (RDL) electrically connected to the semiconductor chip in a partial area on the top of the first passivation layer; a step of forming a second passivation layer on the partial surface of the RDL and on the top of the first passivation layer; a step of forming an external connection terminal on a partial area of the RDL, wherein ...

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Номер записи: 51
04-08-2017 дата публикации

WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURING SAME

Номер: KR101761588B1
Автор: JUNG, HYUN HAK, KIM, EUN DONG, CHOI, JAI KYOUNG, LEE, DAE YOUNG, JUNG, JONG HWI, LIM, SU KYUNG
Принадлежит: SFA SEMICON CO., LTD.

A wafer level package and a method of manufacturing the same are disclosed. The method of manufacturing a wafer level package according to an embodiment of the present invention includes a passivation layer forming step of forming a passivation layer on at least a part of a wire pattern formed on a wafer; a metal wire layer forming step of forming a metal wire layer in a non-passivation region where the passivation layer is not formed and the periphery thereof; and a metal wire surface machining step of machining the surface of the metal wire layer to be rougher than the surface of the metal wire layer formed in the metal wire layer forming step. Therefore, the reliability of the wafer level package can be improved. COPYRIGHT KIPO 2017 ...

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Номер записи: 52
17-07-2017 дата публикации

어쿠스틱 필터를 갖는 소음 차폐 이어셋

Номер: KR0101756653B1
Автор: 김은동
Принадлежит: 주식회사 오르페오사운드웍스

... 어쿠스틱 필터를 갖는 소음 차폐 이어셋이 개시된다. 본 발명에 의한 어쿠스틱 필터를 갖는 소음 차폐 이어셋은 음향을 생성하는 드라이버 유닛과, 공기는 통하고 외부 소음을 차폐하기 위해 드라이버 유닛에 형성된 백홀을 커버하는 어쿠스틱 필터를 포함하고, 어쿠스틱 필터는, 통공 및 소리 이동 경로가 선택적으로 형성된 필터층과, 통공 및 소리 이동 경로에 선택적으로 연통되는 통공이 형성된 플레이트를 포함하며, 필터층 및 플레이트는 서로 반복적으로 적층되며, 플레이트의 통공과 필터층의 통공 또는 소리 이동 경로가 연통되어 있다. 본 발명에 따르면, 어쿠스틱 필터를 통해 고음역 및 중음역은 제거되고 실질적으로 100Hz 이하 저음역만 통과하게 되므로, 외부 소음을 완벽하게 차폐할 수 있다.

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Номер записи: 53
19-06-2017 дата публикации

METHOD FOR FORMING SHIELDING UNIT AND SYSTEM IN PACKAGE MANUFACTURED THEREBY

Номер: KR101748132B1
Автор: KIM, EUN DONG, LEE, JONG WON, CHOI, JAI KYOUNG, OH, YOU JIN
Принадлежит: SFA SEMICON CO., LTD.

According to the present invention, a method of forming a shielding unit of a system in package includes the steps of: (a) mounting a plurality of semiconductor packages on a wiring board on which circuit wiring patterns are formed; (b) forming the shielding unit between the plurality of semiconductor packages by using a nozzle for dispensing a shielding material; and (c) molding the plurality of semiconductor packages and the shielding unit by performing a molding process. The present invention can minimize the process steps and increase the productivity by omitting a laser drilling process. COPYRIGHT KIPO 2017 ...

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Номер записи: 54
20-12-2016 дата публикации

MANUFACTURING METHOD OF WAFER LEVEL PACKAGE

Номер: KR1020160145339A
Автор: KIM, EUN DONG, LEE, JONG WON, CHOI, JAI KYOUNG
Принадлежит:

A manufacturing method of a wafer level package is provided. The manufacturing method comprises the following steps of: configuring a plurality of semiconductor chips in a wafer level as a repassivation layer wherein the plurality of semiconductor chips are separated from the wafer level package by pieces; forming a TEV in the repassivation layer; forming a rewiring layer electrically connected to the TEV; and forming a bump ball on the rewiring layer. And, a chip laminate type package is laminated on a semiconductor. COPYRIGHT KIPO 2016 ...

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Номер записи: 55
17-10-2017 дата публикации

반도체 패키지의 제조 방법 및 적층형 반도체 패키지

Номер: KR0101785907B1
Автор: 김은동, 유봉석
Принадлежит: 주식회사 에스에프에이반도체

PoP용 반도체 패키지 제조 방법에 제공된다. 이 제조 방법은, 더미(dummy) 소재를 준비하는 단계; 상기 더미 소재에 기판의 입출력 패드를 상부로 노출시키는 홀(hole) 및 상기 기판 상에 정의된 반도체 칩의 실장 영역을 상부로 노출시키는 캐비티(cavity)를 형성하는 단계; 상기 홀 및 캐비티가 형성된 더미 소재를 기판상에 부착하는 단계; 상기 캐비티에 의해 상부로 노출되는 상기 기판의 실장 영역 상에 상기 반도체 칩을 부착하는 단계; 상기 캐비티의 내부에 몰딩재를 충진하여 상기 반도체 칩을 상기 몰딩재로 몰딩하는 단계; 및 상기 홀의 내부에 금속 포스트(metal post)를 형성하는 단계를 포함한다.

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Номер записи: 56
11-03-2016 дата публикации

METHOD FOR PROCESSING ETCHING HOLE AND METHOD FOR MANUFACTURING STACKED SEMICONDUCTOR PACKAGE

Номер: KR1020160028116A
Автор: YU, BONG SEOK, KIM, EUN DONG
Принадлежит:

The present invention relates to a method for processing an etching hole and a method for manufacturing a stacked semiconductor package, and more specifically, to the method for processing the etching hole and the method for manufacturing the stacked semiconductor package, which can proceed via hole processing and a surface modification process continuously because of forming the etching hole using a photosensitive film and forming a via hole by a dry or wet etching method, and can reduce costs and process required time as compared to forming a via hole (TMV, through mold via) through laser processing. COPYRIGHT KIPO 2016 ...

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Номер записи: 57
30-08-2017 дата публикации

DEVICE AND METHOD FOR EXTENDING BANDWIDTH OF EARSET HAVING IN-EAR MICROPHONE

Номер: KR1020170098761A
Автор: KIM, EUN DONG
Принадлежит:

Disclosed are a device and a method for extending a bandwidth of an earset having an in-ear microphone. The device of the present invention comprises: a high frequency signal generating unit for generating high frequency signals by synthesizing excitation signals extended from inputted super-narrowband signals and high frequency band signals extended and filtered by doubling the frequency of the super-narrowband signals; and a mixing unit for mixing the high frequency signals and the super-narrowband signals. According to the present invention, narrowband signals inputted to an in-ear microphone are simply doubled to be extended to a high frequency band, and the high frequency band is extracted by performing only simple filtering in the extended high frequency band. Thus, a calculation amount can be remarkably reduced. Accordingly, due to a decrease in a calculation amount, a real-time treatment is possible, and thus a signal transfer delay or the like can be prevented. COPYRIGHT KIPO 2017 ...

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Номер записи: 58
22-08-2018 дата публикации

NOISE REDUCTION EARSET AND NOISE REDUCTION METHOD USING SOUND PICK-UP CHARACTERISTICS OF IN-EAR AND OUT-EAR MICROPHONES

Номер: KR1020180093363A
Автор: KIM, EUN DONG
Принадлежит:

Disclosed are a noise reduction earset and a noise reduction method using the sound pick-up characteristics of in-ear and out-ear microphones. According to the present invention, the noise reduction earset and the noise reduction method using the sound pick-up characteristics of in-ear and out-ear microphones remove a user voice from an in-ear microphone signal and an out-ear microphone signal to extract noise, calculate a noise correction value to be applied to each of mutual relations of the in-ear and out-ear microphones to correct the noise, and remove actual noise corrected from the in-ear and out-ear microphone signals to restore the user′s voice. According to the present invention, the actual noise can be corrected and then removed from the internal noise and the external noise, which are inputted to the in-ear and out-ear microphones, respectively, in consideration of the hardware characteristics, the environmental characteristics, and the like, and thus the user voice can be outputted ...

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Номер записи: 59
12-05-2017 дата публикации

히트 스프레더가 부착된 웨이퍼 레벨의 팬 아웃 패키지 및 그 제조 방법

Номер: KR0101734382B1
Автор: 김은동, 이종원, 최재경, 오유진
Принадлежит: 주식회사 에스에프에이반도체

... 본 발명에 따른 히트 스프레더가 부착된 웨이퍼 레벨의 팬 아웃 패키지 제조 방법은 웨이퍼 상의 일 면에 형성된 IO 패턴의 일부 영역에 반도체 칩을 부착하는 단계; 상기 반도체 칩 및 상기 웨이퍼의 표면에 제 1 보호막을 형성하는 단계; 상기 제 1 보호막 및 상기 반도체 칩의 상면에 서멀 페이스트를 형성하는 단계; 상기 서멀 페이스트의 표면에 히트 스프레더를 부착하는 단계 및 상기 웨이퍼를 연마하여 상기 반도체 칩의 저면이 노출되도록 상기 웨이퍼를 제거하는 단계; 각 패키지 소잉라인을 따라 소잉하는 단계를 포함하는 웨이퍼 레벨의 팬 아웃 패키지 제조 방법.

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Номер записи: 60
16-02-2017 дата публикации

METHOD AND HEADSET FOR IMPROVING SOUND QUALITY

Номер: WO2017026568A1
Автор: KIM, Eundong
Принадлежит:

Disclosed is a headset comprising: at least one in-ear microphone; at least one out-ear microphone; a control unit which includes an in-ear signal processing module for extracting a bass component from a signal detected through the in-ear microphone, an out-ear signal processing module for extracting a treble component from a signal detected through the out-ear microphone, and a mixing module for mixing the extracted bass and treble components and outputting the same; and a communication unit for transmitting a signal output from the mixing module of the control unit to an external device. Accordingly, the present invention can improve sound quality by eliminating noise from a user's voice signal transmitted through the headset and generating a signal close to the user's voice.

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Номер записи: 61
17-05-2017 дата публикации

보이스 코일 제조방법

Номер: KR0101736087B1
Автор: 최재경, 김은동, 정현학, 김형민, 정종휘, 임수경
Принадлежит: 주식회사 에스에프에이반도체

... 본 발명은 보이스 코일 제조방법에 관한 것으로서, 보다 상세하게는 웨이퍼 레벨 패키지 상에서 코일 패턴을 형성할 수 있는 보이스 코일 제조방법에 관한 것이다. 상술한 본 발명의 목적을 달성하기 위한 본 발명의 일 면에 따른 보이스 코일 제조방법은, (a) 웨이퍼의 상면에 제1 시드금속층이 상부로 노출되는 제1 영역과, 상기 제1 영역에 비아홀(via hole)을 형성하기 위한 제1 패시베이션층을 형성하는 제2 영역과, 상기 제1 영역과 상기 제2 영역 중 일부에 제1 포토레지스트층을 형성하는 제3 영역을 포함하는 제1 코일패턴을 형성하는 단계; (b) 상기 제1 코일패턴에 형성된 상기 비아홀 내부에 도전성 물질을 충진하여 제1 코일권선을 형성하는 단계; 및 (c) 상기 제3 영역에 형성된 상기 제1 포토레지스트층을 제거하는 단계를 포함한다.

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Номер записи: 62
11-08-2017 дата публикации

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE AND STACKED TYPE SEMICONDUCTOR PACKAGE

Номер: KR1020170092274A
Автор: KIM, EUN DONG, YU, BONG SEOK
Принадлежит:

Provided is a manufacturing method of a semiconductor package for a package on package (PoP). The manufacturing method comprises the following steps: preparing a dummy material; forming, in the dummy material, a hole exposing an input/output pad of a substrate to the upper part and a cavity exposing a semiconductor chip mounting area defined on the substrate; attaching the dummy material having the hole and the cavity on the substrate; attaching the semiconductor chip on the mounting area of the substrate exposed to the upper part through the cavity; filling a molding material inside the cavity to mold the semiconductor chip into the molding material; and forming a metal post inside the hole. COPYRIGHT KIPO 2017 ...

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Номер записи: 63
06-07-2017 дата публикации

EARSET HAVING HOLLOW CHANNEL

Номер: WO2017116021A1
Автор: KIM, Eundong
Принадлежит:

An earset having a hollow channel is disclosed. The earset having a hollow channel according to the present invention may comprise: a case; a speaker embedded in the case; a tube separated from an output space of speaker sound on the front of the speaker; and a microphone inserted in the tube. According to the present invention, the microphone is installed in the output space of the speaker sound and thus requires no separate installation space therefor. Therefore, the present invention enables the total volume of an earset to be compact.

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Номер записи: 64
28-03-2013 дата публикации

METHOD FOR PROVIDING A COMPENSATION SERVICE FOR CHARACTERISTICS OF AN AUDIO DEVICE USING A SMART DEVICE

Номер: WO2013042968A2
Автор: KIM, Eun Dong
Принадлежит:

A method for providing a compensation service for characteristics of an audio device using a smart device proposed by the present invention enables a service providing server to take, as an input, information on the audio device from the smart device, search for audio characteristics and transmit a compensation signal according to the audio characteristics to the smart device, thus performing equalizing in consideration of output characteristics of the audio device and achieving improved user convenience by allowing a user to be provided with an audio compensation service based on the audio characteristics of the audio device of the user, even without having to permit the user to directly detect the audio characteristics of the audio device.

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Номер записи: 65
02-04-2018 дата публикации

WET TYPE DEODORIZATION APPARATUS

Номер: KR101843478B1
Автор: KIM, EUN DONG
Принадлежит: SAMHYUN ENGINEERING & STEEL

The present invention relates to a wet type deodorization apparatus which is developed to collect large particles in polluted and odorous gas by using fine water particles before the polluted and odorous gas passes through a wet type washer apparatus and drops the large particles to maximize the apparatus efficiency. The wet type deodorization apparatus includes: a chamber including an inlet for drawing in the air from a side by using a pump, an outlet for discharging the air from the upper part, and a water tank for collecting water dropped to the lower part; and a wet type washing apparatus including a porous pall ring layer having multiple pall rings laminated thereon to increase the contact area of water and air in the chamber, multiple spray nozzles spraying the water to the lower part from the upper part of the porous pall ring layer, and a demister filled with a fiber-shaped objects in the upper part of the spray nozzles. The inlet includes: one or more guide ducts guiding the air ...

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Номер записи: 66
20-02-2017 дата публикации

METHOD FOR MANUFACTURING VOICE COIL

Номер: KR1020170018713A
Автор: CHOI, JAI KYOUNG, KIM, EUN DONG, JUNG, HYUN HAK, KIM, HYEONG MIN, JUNG, JONG HWI, LIM, SU KYUNG
Принадлежит:

The present invention relates to a method for manufacturing a voice coil, and more specifically, to a method for manufacturing a voice coil, which can form a coil pattern on a wafer level package. According to an aspect of the present invention, the method for manufacturing a voice coil comprises the following steps: (a) forming a first coil pattern including a first area on an upper surface of a wafer, which has a first seed metal layer exposed to the upper side, a second area which forms a first passivation layer for forming a via hole in the first area, and a third area which forms a first photoresist layer on a portion of the first area and the second area; (b) forming a first coil wiring by filling a conductive material in the via hole formed on the first coil pattern; and (c) removing the first photoresist layer formed in the third area. COPYRIGHT KIPO 2017 ...

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Номер записи: 67
19-01-2017 дата публикации

METHOD FOR ELIMINATING AUDIO FEEDBACK AND ECHO IN HEADSET, AND COMPUTER PROGRAM

Номер: WO2017010609A1
Автор: KIM, Eundong
Принадлежит:

Disclosed is a method for eliminating audio feedback and echo in a headset of a mobile device connected to the headset which includes a first head having a first speaker unit and a second head having a second speaker unit and a microphone, wherein the method is characterized by including the steps of: monitoring an audio signal received through the microphone; and blocking a channel applied to the second speaker unit of the headset when a waveform corresponding to audio feedback or echo is detected in the received audio signal through the monitoring. Accordingly, noise from the outside can be effectively screened, and also, a user's voice can be sufficiently captured in order to prevent audio feedback and echo from occurring at the source, so that clean sound can be provided to the user and voice recognition accuracy can be increased when the method is applied to a voice recognition device.

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Номер записи: 68
30-11-2017 дата публикации

APPARATUS AND METHOD FOR MONITORING STATE OF WEARING EARPHONE

Номер: KR101803306B1
Автор: KIM, EUN DONG
Принадлежит: ORFEO SOUNDWORKS CORPORATION

Disclosed are an apparatus for monitoring the state of wearing an earphone and a method thereof. The apparatus for monitoring the state of wearing an earphone according to the present invention comprises: an inner microphone receiving inner voice generated in an ear and generating an inner voice signal; an outer microphone receiving outer sound selectively including an outer voice transmitted from vocal cords to the outside of a mouth and an outer noise and generating an outer sound signal; a control unit determining the magnitude of the outer noise by comparing the inner voice signal with the outer sound signal and determining whether a warning signal is generated or not; and a warning unit making a warning to correspond to a warning signal. According to the present invention, the apparatus for monitoring the state of wearing an earphone can be used for playing high quality sound by clearly checking whether noise is generated using the inner microphone and the outer microphone. Further ...

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Номер записи: 69
16-08-2018 дата публикации

NOISE REMOVING EARSET USING SOUND RECEIVING CHARACTERISTICS OF IN-EAR MICROPHONE AND OVER-THE-EAR MICROPHONE, AND NOISE REMOVING METHOD

Номер: WO2018147573A1
Автор: KIM, Eundong
Принадлежит:

A noise removing earset using sound receiving characteristics of an in-ear microphone and an over-the-ear microphone, and a noise removing method are disclosed. According to the present invention, the noise removing earset using sound receiving characteristics of an in-ear microphone and an over-the-ear microphone, and the noise removing method: remove a user voice from an in-ear microphone signal and an over-the-ear microphone signal so as to extract noise; calculate a noise correction value to be mutually applied to each of the in-ear microphone and the over-the-ear microphone so as to correct the noise; and respectively remove corrected real noise from the in-ear microphone signal and the over-the-ear microphone signal so as to restore the user voice. According to the present invention, internal noise and external noise respectively inputted to microphones provided inside and outside are corrected into real noise in consideration of hardware characteristics, environmental characteristics ...

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Номер записи: 70
06-07-2017 дата публикации

NOISE SHIELDING EARSET HAVING ACOUSTIC FILTER

Номер: WO2017116023A1
Автор: KIM, Eundong
Принадлежит:

Disclosed is a noise shielding earset having an acoustic filter. The noise shielding earset having an acoustic filter according to the present invention comprises: a driver unit for generating sound; and an acoustic filter for covering a back hole formed through the driver unit, in order to shield an external noise while allowing air to pass through the acoustic filter, wherein: the acoustic filter comprises a filter layer having a through-hole and a sound movement path selectively formed therethrough, and a plate having a through-hole formed therethrough which selectively communicates with the through-hole and the sound movement path of the filter layer; the filter layer and the plate are repeatedly laminated on each other; and the through-hole of the plate communicates with the through-hole of the filter layer or the sound movement path thereof.

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Номер записи: 71
22-05-2020 дата публикации

EARSET HAVING UTTERER VOICE RESTORATION FUNCTION

Номер: WO2020101356A1
Автор: KIM, Eundong
Принадлежит:

Disclosed is an earset having an utterer voice restoration function. The earset having an utterer voice restoration function, according to the present invention, comprises: a case having a through hole; at least one speaker driver unit provided inside the case and having a back hole; and an in-ear microphone provided inside so as to be separated from the space in which the speaker driver unit is provided, wherein the speaker driver unit and the in-ear microphone are provided inside so as to be separated from the through hole by a separator, a microhole which allows the through hole to communicate with the back hole is formed in the separator, and a resonance space is formed between the microhole and the back hole.

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Номер записи: 72
15-02-2017 дата публикации

웨이퍼 레벨 패키지의 제조 방법

Номер: KR0101707172B1
Автор: 김은동, 이종원, 최재경
Принадлежит: 주식회사 에스에프에이반도체

... 웨이퍼 레벨 패키지의 제조 방법이 제공된다. 이 제조 방법은, 리패시베이션층으로, 웨이퍼 레벨 패키지로 낱개로 분리된 다수의 반도체 칩을 웨이퍼 레벨로 재구성하고, 상기 리패시베이션층 내부에 TEV를 형성하고, 상기 TEV와 전기적으로 연결되는 재배선층을 형성하고, 재배선층 상에 범프 볼을 형성한다. 그리고, 상기 반도체 상에 칩 적층형 패키지가 적층된다.

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Номер записи: 73