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Применить Всего найдено 6. Отображено 6.
11-08-2015 дата публикации

BONDING HEAD AND DIE BONDING APPARATUS INCLUDING THE SAME

Номер: KR0101543864B1
Автор: 이항림, 원종진, 김순현, 석승대
Принадлежит: 세메스 주식회사, 삼성전자주식회사

... 다이를 기판 상에 본딩하기 위한 본딩 헤드를 포함하는 다이 본딩 장치에 있어서, 상기 본딩 헤드는, 상기 다이를 이송하기 위한 구동부에 장착되며 적어도 하나의 냉각 채널이 형성된 하부면을 갖는 본체와, 상기 본체의 하부면에 장착되는 판상의 히터와, 및 상기 히터의 하부면에 장착되며 진공압을 이용하여 상기 다이를 파지하기 위한 콜릿을 포함한다. 상기 본체에는 상기 냉각 채널과 연결되는 냉각 유로들이 형성되며, 상기 냉각 유로들은 상기 히터를 냉각시키기 위하여 상기 냉각 채널을 통해 냉각 유체를 공급 및 회수하는 냉각 모듈과 연결된다.

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Номер записи: 1
21-05-2015 дата публикации

BONDING HEAD AND DIE BONDING APPARATUS INCLUDING SAME

Номер: KR1020150055234A
Автор: LEE, HANG LIM, WON, JONG JIN, KIM, SOON HYUN, SEOK, SEUNG DAE
Принадлежит:

In a die bonding apparatus which includes a bonding head for bonding a die on a substrate, the bonding head includes a body which is mounted on a driving part to transfer the die and includes a bottom side on which at least one cooling channel is formed, a planar heater which is mounted on the bottom side of the body, and a collet which is mounted on the lower side of the heater and grips the die by using vacuum pressure. Cooling paths connected to the body are formed on the body. The cooling paths are connected to a cooling module to supply and restore cooling fluid through the cooling channel to cool the heater. COPYRIGHT KIPO 2015 ...

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Номер записи: 2
26-05-2017 дата публикации

BONDING STAGE AND BONDING APPARATUS INCLUDING SAME

Номер: KR1020170057972A
Автор: SEOK, SEUNG DAE, KIM, SANG YOON, KIM, HUI JAE, SHIN, JAE BONG, LEE, BYUNG JOON
Принадлежит:

Provided is a bonding stage. The bonding stage includes: a first heater which is arranged on the lower part of a first area in a substrate having multiple semiconductor chips arranged thereon; a second heater which is arranged on the lower part of a second area different from the first area in the substrate; a cooler which is arranged on the lower part of the first and second heaters to prevent the heat from the first and second heaters from being transmitted to the lower part thereof; and a thin-film plate which is arranged on the first and second heaters to support the substrate and transmit the heat from the first and second heaters to the substrate. The first and second heaters operate while being independent. COPYRIGHT KIPO 2017 ...

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Номер записи: 3
29-06-2018 дата публикации

BONDING DEVICE

Номер: KR1020180072035A
Автор: LEE, JOONG HA, KIM, SANG YOON, KIM, YOUNG BUM, KIM, HUI JAE, SEOK, SEUNG DAE, SHIN, JAE BONG, LEE, BYUNG JOON, LEE, YONG IN, PYO, JAE YEON
Принадлежит:

The present invention provides a bonding device capable of effectively performing a bonding process of a chip. The bonding device of the present invention comprises: a stage unit supporting a substrate; a first bonding head located at one side of the stage unit, picking up the chip, and bonding the chip on the substrate; a second bonding head located at the other side of the stage unit, picking up the chip, and bonding the chip on the substrate; and a first image obtaining unit located over a moving path of the stage unit, and capturing the stage unit. COPYRIGHT KIPO 2018 ...

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Номер записи: 4
09-06-2015 дата публикации

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD

Номер: KR1020150063232A
Автор: LEE, BYUNG JOON, KAJINAMI MASATO, YUKIMORI YOSHIAKI, KIM, SANG YOON, KIM, HUI JAE, PARK, BYEONG KUK, SEOK, SEUNG DAE, SHIN, JAE BONG, CHOI, BYEONG KAP
Принадлежит:

A semiconductor manufacturing apparatus is provided. The semiconductor manufacturing apparatus according to the present invention comprises: a pickup unit to pick up at least one chip disposed in a first region; a bonding head to receive the picked-up chip to move the chip from the first region onto a circuit board disposed in a second region; and an optical unit to detect a bonding location on the circuit board while the chip is being moved from the first region to the second region. COPYRIGHT KIPO 2015 ...

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Номер записи: 5
24-03-2016 дата публикации

SEMICONDUCTOR CHIP BONDING DEVICE

Номер: KR1020160032594A
Автор: SEOK, SEUNG DAE, KIM, SANG YOON, KIM, HUI JAE, SHIN, JAE BONG
Принадлежит:

According to a technical concept of the present invention, a semiconductor chip bonding device comprises: a bonding head to adsorb a semiconductor chip to be gripped; a bonding stage on which a substrate having the semiconductor chip mounted thereon is arranged and in which a process for mounting and bonding the semiconductor chip on the substrate is performed; a first camera for capturing an image of the semiconductor chip to obtain position information of the semiconductor chip; a second camera for capturing an image of the substrate to obtain position information of the substrate; a correction device structure which is formed on one side of a side portion of the bonding stage and includes a correction chip and a correction substrate; and a bonding control unit which grips the correction chip by a bonding head and is mounted on the correction substrate to control bonding position correction. COPYRIGHT KIPO 2016 ...

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Номер записи: 6