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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Форма поиска

Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 26. Отображено 26.
15-10-2015 дата публикации

SEMICONDUCTOR PACKAGE AND METHOD FOR PACKAGING SEMICONDUCTOR DEVICE

Номер: KR1020150116308A
Автор: RYU, JI YEON, KIM, BYONG JIN, SHIM, JAE BEUM
Принадлежит:

The present invention relates to a semiconductor package and a method for packaging a semiconductor device, and relates to a wafer level chip scale package (WLCSP) and a packaging method thereof. For an example, disclosed is the semiconductor package including: a semiconductor die which has a number of die pads formed on one plane thereof; a passivation layer which is formed on one plane of the semiconductor die, and has an aperture exposing at least a part of the die pad; a number of UBM which contact the part of the die pad through the aperture respectively, and are exposed out of the passivation layer by being formed vertically to the die pad to have a fixed thickness from the part of the die pad; and a number of solder bumps which are connected to the UBM respectively. COPYRIGHT KIPO 2016 ...

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Номер записи: 1
14-09-2017 дата публикации

EXTERNAL WALL WATERPROOFING METHOD FOR LARGE-DIAMETER TRENCHLESS TUNNELING

Номер: KR101778206B1
Автор: SHIM, JAI BEOM
Принадлежит: SAMHO DEVELOPMENT

An outer wall waterproofing method for large-diameter trench-less tunneling according to the present invention comprises: pressing a guidance pipe (203) into a tunneling site (207); assembling a back section steel structure (301) inside the guidance pipe (203); drilling the guidance pipe (203) by pushing the back section steel structure (301) assembled inside the guidance pipe (203); installing waterproof sheets (501) in a space where the guidance pipe (203) is drilled; assembling a front section steel structure (301) inside the guidance pipe (203) where the waterproof sheets (501) are installed; a repetitive installation of multiple lagging panels (303) between the front and back section steel structures (301) so that multiple tunneling pipes are arranged adjacent to each other in a transverse direction in the tunneling site (207), and the waterproof sheets (501) in each of the tunneling pipes overlapping and are connected to each other; and forming a communication space (601) to make ...

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Номер записи: 2
19-06-2018 дата публикации

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Номер: KR1020180066800A
Автор: HAN, YI SEUL, LEE, TAE YONG, SHIM, JAE BEOM
Принадлежит:

A semiconductor device and a manufacturing method thereof are provided. As a nonrestrictive example, various aspects of the present disclosure provide the semiconductor device comprising a semiconductor die coupled to a substrate and surrounded by a perforated metal plane, and the manufacturing method thereof. COPYRIGHT KIPO 2018 (105) Start (110) Forming a seed layer (120) Plating (130) Etching (140) Attaching a die (150) Encapsulating (160) Removing a carrier (170) Forming a substrate (180) Forming a conductive ball (195) Continuing ...

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Номер записи: 3
08-03-2017 дата публикации

ACCESS POINT AND METHOD FOR PREVENTING MALIGNANT OPERATION BY USING ADVANCED VERIFICATION OF MALIGNANT DATA

Номер: KR101713191B1
Автор: RYU, DONG JU, CHEONG, IL AHN, MUN, GIL JONG, LEE, DONG HOUAL, SIM, JAE BUM
Принадлежит: KINFOSEC

The present invention relates to an access point and method for preventing malignant operation by using advanced verification of malignant data, which verify a malignant URL and malignant data before a user terminal is connected to the URL and the data and control transmission and reception to and from the user terminal, and which verify whether a DNS is falsified or forged in advance, thereby securely protecting the user terminal from malignant data and malignant operation. The access point according to the present invention comprises: a URL verification unit which, when a user terminal attempts to be connected to a specific URL, performs advanced verification so as to verify whether the URL is a malignant URL before the user terminal is connected to the URL, and prevents the user terminal from being connected when it is verified that the URL is the malignant URL; and a DNS verification unit which receives response data from a DNS from which the user terminal has requested DNS service, ...

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Номер записи: 4
14-09-2017 дата публикации

SEGMENT-TYPE STEEL TUBE PROPULSION APPARATUS TO CONSTRUCT CURVED PART OF TRENCHLESS TUNNEL USING LARGE DIAMETER STEEL TUBE

Номер: KR101778208B1
Автор: SHIM, JAI BEOM
Принадлежит: SAMHO DEVELOPMENT

The present invention relates to a segment-type steel tube propulsion apparatus to construct a curved part of a trenchless tunnel using a large diameter steel tube. The segment-type steel tube propulsion apparatus comprises: a rear guidance tube, a front guidance tube, a first propelling tube, a second propelling tube, a protective steel tube, and an angle checking unit. The segment-type steel tube propulsion apparatus to construct the curved part of the trenchless tunnel using the large diameter steel tube is able to allow the trenchless tunnel to easily be constructed in a curved linear shape appropriate for an optimal curved diameter by dividing a guidance tube pressed in a tunnel construction site at a predetermined position, and individually propelling the divided guidance pipe; is able to allow a worker to directly check a rotation angle of a front guidance tube using an angle checking unit; is able to have high reliability by working along with an external worker; and is able to ...

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Номер записи: 5
12-05-2011 дата публикации

PASTE-POWDER DUAL POLYMER-BASED BONE CEMENT AND INJECTION APPARATUS FOR SAME

Номер: KR2011056006A2
Автор: SHIM, Jae Bum
Принадлежит:

The present invention relates to polymer-based bone cement to be used in arthroplasty or vertebroplasty. In detail, the present invention relates to paste-powder dual polymer-based bone cement prepared by: dissolving certain powder components, from among powder components, which cause no chemical reaction into a liquid monomer to produce a viscous paste; mixing the residual powder components with the paste and exposing the mixture to the minimum amount of air during a surgical operation such that the mixture can be directly used on the part of the body being operated upon without requiring additional time for adhesion. The present invention also relates to an apparatus for injecting the bone cement.

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Номер записи: 6
07-01-2010 дата публикации

SYSTEM THAT PROVIDES METHOD FOR EXTRACTING MOBILE DEVICE INFORMATION FROM WEBPAGE LOADED IN MOBILE DEVICE AND CONTROL METHOD THEREOF

Номер: WO2010002124A3
Автор: SHIM, Jae Bum
Принадлежит:

The present invention relates to a system that provides a method for extracting mobile device information from a webpage loaded in the mobile device and a control method thereof. The system in the invention comprises: the mobile device that displays on an output device a webpage received from a web server and enables the webpage to extract the device information, and the web server connected to the mobile device through a network which transmits the webpage to the mobile device and allows the webpage to receive the information extracted from the mobile device. According to the invention, the webpage displayed on the mobile device is able to extract and use the information about the mobile device and transmit the information to the web server so that a specialized web service may be allowed in the mobile device.

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Номер записи: 7
26-07-2017 дата публикации

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Номер: KR1020170086440A
Автор: RYU, JI YEON, KIM, BYONG JIN, SHIM, JAE BEUM
Принадлежит:

The present invention provides a method for manufacturing a semiconductor device, and a semiconductor device compensating the height of an electronic device coupled to a lower portion of a substrate to reduce overall thickness and realizing a fine pitch. According to one embodiment, disclosed is the semiconductor device, comprising: the substrate where a conductive pad is exposed to a lower surface; the electronic device of which at least a portion is inserted into the substrate; a semiconductor die coupled to an upper surface of the substrate; and an encapsulant formed on the upper surface of the substrate to surround the semiconductor die. COPYRIGHT KIPO 2017 ...

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Номер записи: 8
17-05-2018 дата публикации

SYSTEM AND METHOD FOR PREVENTING PHARMING ATTACK USING WHITELIST DATABASE OF DOMAIN NAME SYSTEM

Номер: KR1020180051806A
Автор: CHEONG, IL AHN, SIM, JAE BUM
Принадлежит:

The present invention relates to a system and a method for preventing a pharming attack using a whitelist database of a domain name system (DNS) which update and store latest information in a whitelist database of a DNS used to detect a pharming attack to effectively block a pharming attack. According to the present invention, the system and a method for preventing a pharming attack using a whitelist database of a DNS responds to a DNS request packet of a user terminal to use a whitelist database of a DNS to verify and block a pharming attack for DNS information of a DNS response packet transmitted from a DNS server, and comprises: the DNS whitelist database to store DNS information received from a reliable DNS server which is a reliable DNS server; a DNS whitelist database update unit to update the DNS information stored in the DNS whitelist database; a DNS response analysis unit linked to the DNS whitelist database to analyze the DNS Information including a domain name and an IP address ...

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Номер записи: 9
07-04-2016 дата публикации

SEGMENTAL-TYPE STEEL TUBE PROPULSION APPARATUS FOR CONSTRUCTING SHIELD TUNNEL CURVED PART USING LARGE-CALIBER STEEL TUBE

Номер: KR1020160038544A
Автор: SHIM, JAI BEOM
Принадлежит:

The present invention relates to a segmental-type steel tube propulsion apparatus which segments a leading tube propelled for a precise construction of a tunnel curved part; individually propels each segmented leading tube; and makes it possible to smoothly construct even for a minimum curve radius. That is, when a shield tunnel method using a large-caliber steel tube is applied for a curved part, the apparatus of the present invention makes it possible to precisely construct a cross-sectional excavation used in accordance with the curved radius specified in the design. The apparatus of the present invention minimizes the cross-sectional excavation, and increases economic gain and the safety of the railway or road facilities. COPYRIGHT KIPO 2016 ...

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Номер записи: 10
07-01-2010 дата публикации

SYSTEM THAT PROVIDES METHOD FOR EXTRACTING MOBILE DEVICE INFORMATION FROM WEBPAGE LOADED IN MOBILE DEVICE AND CONTROL METHOD THEREOF

Номер: KR2010002124A2
Автор: SHIM, Jae Bum
Принадлежит:

The present invention relates to a system that provides a method for extracting mobile device information from a webpage loaded in the mobile device and a control method thereof. The system in the invention comprises: the mobile device that displays on an output device a webpage received from a web server and enables the webpage to extract the device information, and the web server connected to the mobile device through a network which transmits the webpage to the mobile device and allows the webpage to receive the information extracted from the mobile device. According to the invention, the webpage displayed on the mobile device is able to extract and use the information about the mobile device and transmit the information to the web server so that a specialized web service may be allowed in the mobile device.

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Номер записи: 11
03-03-2011 дата публикации

CAISSON FOR A BREAKWATER STRUCTURE IMPLEMENTING A HONEYCOMB CONFIGURATION, AND QUAY, PIER, AND WATERFRONT PROVIDED WITH SAME

Номер: KR2011025093A1
Автор: KANG, Yoon Koo, BYUN, Gi Jun, SONG, Young Jae, SHIM, Jai Beom, KANG, Yeoun Ike, YU, Byeong Hwa, CHEONG, Hae Yong, KIM, Jin Heung, JEONG, Jun Mo, RYU, Cheong Ro, KIM, Hong Jin
Принадлежит:

The present invention relates to a top caisson (100) used for a breakwater structure that includes a plurality of caissons (100) installed on an upper portion of a foundation layer (1), wherein the caisson (100) is provided with a plurality of cells (110) divided by vertically oriented partition walls (120), and the cells (110) are structures having hexagonal cross-sections in order to provide ample space for the amount of material to be filled therein, thereby ensuring good structural integrity and buffering effects against waves coming from multiple directions.

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Номер записи: 12
28-07-2017 дата публикации

SEMICONDUCTOR DEVICE

Номер: KR101762541B1
Автор: RYU, JI YEON, SHIM, JAE BEUM, LEE, JI HUN, KIM, TAE KI
Принадлежит: AMKOR TECHNOLOGY KOREA, INC.

The present invention relates to a semiconductor device. The purpose of the present invention is to provide a semiconductor device which has a molding part formed to fill both a rewiring layer protruding upward from an interposer and a recessed groove recessed from the same, or formed to cover both an opening or a protrusion part provided on an organic film to increase bonding strength with the interposer. To this end, the semiconductor device comprises: an interposer including a lower pad, an organic film having an opening to expose the lower pad to the outside, a rewiring layer formed on the organic film and connected with the lower pad, and an upper pad connected onto the rewiring layer; a semiconductor die connected to the upper pad of the interposer; a molding part for covering the upper pad, the rewiring layer, and the organic film of the interposer and the semiconductor die; and a conductive bump connected to the lower pad. COPYRIGHT KIPO 2017 ...

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Номер записи: 13
14-07-2017 дата публикации

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Номер: KR1020170082359A
Автор: RYU, JI YEON, KIM, BYONG JIN, SHIM, JAE BEUM
Принадлежит:

The present invention provides a semiconductor device capable of implementing a fine pitch and reducing the whole thickness thereof by compensating for the height of an electronic device combined with the lower side of a substrate and a manufacturing method thereof. According to an embodiment of the present invention, disclosed is the semiconductor device including: the substrate exposing a conductive pad on a lower side thereof; the electronic device which is formed by being at least partially inserted into the substrate; a semiconductor die which is formed by being combined with the upper side of the substrate; and an encapsulant formed on the upper side of the substrate to surround the semiconductor die. COPYRIGHT KIPO 2017 ...

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Номер записи: 14
18-05-2016 дата публикации

SEMICONDUCTOR PACKAGE AND METHOD FOR PACKAGING SEMICOMDUCTOR DEVICE

Номер: KR0101622455B1
Автор: 유지연, 김병진, 심재범
Принадлежит: 앰코 테크놀로지 코리아 주식회사

... 본 발명은 반도체 패키지 및 반도체 디바이스의 패키징 방법에 관한 것으로, 웨이퍼 레벨 칩 스케일 패키지(wafer level chip scale package; WLCSP) 및 그 패키징 방법에 관한 것이다. 일례로, 일면에 다수의 다이 패드가 형성된 반도체 다이; 상기 반도체 다이의 일면 상에 형성되고, 상기 다이 패드의 적어도 일부분을 각각 노출시키는 개구부가 형성된 패시베이션층; 상기 개구부를 통해 상기 다이 패드의 적어도 일부분과 각각 접촉하고, 상기 다이 패드의 적어도 일부분으로부터 상기 다이 패드에 대해 수직방향으로 일정 두께를 갖도록 형성되어 상기 패시베이션층의 외부로 노출된 다수의 UBM; 및 상기 UBM과 각각 연결된 다수의 솔더 범프를 포함하는 반도체 패키지를 개시한다.

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Номер записи: 15
29-11-2016 дата публикации

웨이퍼 레벨 반도체 패키지 및 이의 제조 방법

Номер: KR0101680458B1
Автор: 심재범, 김병진, 유지연, 소광섭
Принадлежит: 앰코 테크놀로지 코리아 주식회사

... 본 발명은 웨이퍼 레벨 반도체 패키지 및 이의 제조 방법에 관한 것으로서, 더욱 상세하게는 입출력단자가 융착되는 자리인 언더범프메탈 구조를 외부응력을 분산시켜 완충시킬 수 있는 구조로 새롭게 개선시킨 웨이퍼 레벨 칩 사이즈/스케일 반도체 패키지 및 이의 제조 방법에 관한 것이다. 즉, 본 발명은 반도체 칩의 본딩패드에 형성되는 언더범프 메탈층을 외부응력을 분산시켜 제거할 수 있는 구조로 개선하고, 언더범프 메탈층 위에 입출력단자인 솔더를 도금함으로써, 언더범프 메탈층과 입출력단자 간의 결합력 및 반도체 칩의 본딩패드에 대한 언더범프 메탈층의 결합력 등을 향상시킬 수 있도록 한 웨이퍼 레벨 반도체 패키지 및 이의 제조 방법을 제공하고자 한 것이다.

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Номер записи: 16
25-07-2017 дата публикации

반도체 디바이스 및 그 제조 방법

Номер: KR0101761502B1
Автор: 유지연, 김병진, 심재범
Принадлежит: 앰코 테크놀로지 코리아 주식회사

... 본 발명은 기판의 하부에 결합되는 전자 소자의 높이를 보상하여, 전체적인 두께를 줄일 수 있고, 파인 피치의 구현이 가능한 반도체 디바이스 및 그 제조 방법을 제공한다. 일 실시예로서, 하면에 도전성 패드가 노출된 기판; 상기 기판에 적어도 일부가 삽입되어 형성된 전자 소자; 상기 기판의 상면에 결합되어 형성된 반도체 다이; 및 상기 반도체 다이를 감싸도록 상기 기판의 상면에 형성된 인캡슐런트를 포함하는 반도체 디바이스가 개시된다.

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Номер записи: 17
06-10-2016 дата публикации

WAFER LEVEL SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Номер: KR1020160114750A
Автор: SHIM, JAE BEUM, KIM, BYONG JIN, RYU, JI YEON, SO, KWANG SUP
Принадлежит:

The present invention relates to a wafer level semiconductor package and a manufacturing method thereof. More specifically, the present invention relates to a wafer level chip size/scale semiconductor package which improves an under bump metal structure, where an input/output port is fused, as a structure capable of dispersing and buffering external stress newly, and the manufacturing method thereof. That is, the present invention is to provide the wafer level semiconductor package which can improve bonding force of an under bump metal layer as to a bonding pad of a semiconductor chip and bonding force between the under bump metal layer and the input/output port, by improving the under bump metal layer formed on the bonding pad of the semiconductor chip as the structure capable of removing the external stress by dispersing the external stress, and plating the input/output port, a solder, on the under bump metal layer, and the manufacturing method thereof. COPYRIGHT KIPO 2016 ...

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Номер записи: 18
12-05-2011 дата публикации

PASTE-POWDER DUAL POLYMER-BASED BONE CEMENT AND INJECTION APPARATUS FOR SAME

Номер: WO2011056006A3
Автор: SHIM, Jae Bum
Принадлежит:

The present invention relates to polymer-based bone cement to be used in arthroplasty or vertebroplasty. In detail, the present invention relates to paste-powder dual polymer-based bone cement prepared by: dissolving certain powder components, from among powder components, which cause no chemical reaction into a liquid monomer to produce a viscous paste; mixing the residual powder components with the paste and exposing the mixture to the minimum amount of air during a surgical operation such that the mixture can be directly used on the part of the body being operated upon without requiring additional time for adhesion. The present invention also relates to an apparatus for injecting the bone cement.

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Номер записи: 19
05-02-2016 дата публикации

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Номер: KR1020160013652A
Автор: RYU, JI YEON, KIM, BYONG JIN, SHIM, JAE BEOM
Принадлежит:

According to the present invention, disclosed are a semiconductor device and a manufacturing method thereof. The semiconductor device forms widths of a connection region of a redistribution layer and other regions except the connection region to be equal to each other wherein UBM is formed in the connection region to easily obtain a space when a redistribution layer route is designed. According to an embodiment, the semiconductor device comprises: a semiconductor die on which a plurality of bond pads are formed; the redistribution layer formed on an upper portion of the semiconductor die and having one end electrically connected to the bond pads; the UBM formed on another end of the redistribution layer and electrically connected to the redistribution layer; and a bump connected to the UBM. In the redistribution layer, widths of the connection region and the other regions except the connection region are formed equal to each other wherein the UBM is formed in the connection region. COPYRIGHT ...

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Номер записи: 20
18-08-2015 дата публикации

CARTRIDGE FOR MIXING AND INJECTING BONE CEMENT AND SYSTEM FOR MIXING AND DELIVERING BONE CEMENT COMPRISING CARTRIDGE

Номер: KR101544922B1
Автор: SHIM, JAE BUM
Принадлежит: INJECTA INC.

The present invention relates to bone cement and, more specifically, to a system for mixing and delivering bone cement with a structure for immediately injecting bone cement by mixing the same in one device. The present invention comprises: a main body including a cylindrical member, a first coupling member, and a second coupling member; a first opening and shutting means detachably coupled with the first coupling member; a second opening and shutting means detachably coupled with the second coupling member; at least one mixing ball arranged inside the main body; and a holding member for maintaining a vacuum state. COPYRIGHT KIPO 2015 ...

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Номер записи: 21
30-12-2015 дата публикации

CARTRIDGE FOR MIXING AND INJECTING BONE CEMENT, AND BONE CEMENT MIXING AND TRANSFERRING SYSTEM INCLUDING SAME

Номер: WO2015199336A1
Автор: SHIM, Jae Bum
Принадлежит:

The present invention relates to a bone cement transferring device and, more particularly, to a bone cement mixing and transferring system having a structure in which a single apparatus can mix and directly inject bone cement.

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Номер записи: 22
17-06-2016 дата публикации

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME

Номер: KR101631406B1
Автор: KIM, JAE YUN, HWANG, TAE KYUNG, KIM, JIN HAN, KIM, BYONG JIN, PAEK, JONG SIK, SHIM, JAE BEUM, KIM, KYOUNG ROCK
Принадлежит: AMKOR TECHNOLOGY KOREA, INC.

The present invention relates to a semiconductor package and a method for manufacturing the same. The method for manufacturing a semiconductor package comprises the steps of: forming a mold layer to cover a semiconductor die having a plurality of bond pads on the first surface thereof and exposing the bond pad to the outside through a mold hole provided in the mold layer; forming a conductive layer on the inner wall of the mold hole of the mold layer; and forming a solder ball to fill the inside of the mold hole having the conductive layer formed therein. The solder ball is electrically connected to the bond pad. The method of the present invention can reduce stress applied to the solder ball due to differences in temperature and thermal expansion coefficient between the solder ball and the mold layer by forming the conductive layer having excellent bond strength between the mold layer and the solder ball. COPYRIGHT KIPO 2016 ...

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Номер записи: 23
07-12-2016 дата публикации

반도체 디바이스 및 그 제조 방법

Номер: KR0101683972B1
Автор: 유지연, 김병진, 심재범
Принадлежит: 앰코 테크놀로지 코리아 주식회사

... 본 발명에서는 재배선층 중 UBM이 형성되는 접속 영역 및 접속 영역을 제외한 다른 영역의 너비를 모두 동일하게 형성함으로써, 재배선층 경로 설계시 공간의 확보가 용이한 반도체 디바이스 및 그 제조 방법이 개시된다. 일 예로, 다수의 본드 패드가 형성된 반도체 다이; 상기 반도체 다이의 상부에 형성되며 일단부가 상기 본드 패드와 전기적으로 연결되는 재배선층; 상기 재배선층의 타단부에 형성되며 상기 재배선층과 전기적으로 연결되는 UBM; 및 상기 UBM과 접속하는 범프를 포함하고, 상기 재배선층은 상기 UBM이 형성되는 접속 영역 및 상기 접속 영역을 제외한 다른 영역의 너비가 동일하게 형성되는 반도체 디바이스가 개시된다.

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Номер записи: 24
01-04-2016 дата публикации

METHOD FOR WATERPROOFING OUTER WALL WHEN CONSTRUCTING LARGE DIAMETER TRENCHLESS TUNNEL

Номер: KR1020160035829A
Автор: SHIM, JAI BEOM
Принадлежит:

Disclosed in the present invention is a method for waterproofing an outer wall when constructing a large diameter trenchless tunnel. The method comprises: a step of inserting a leading pipe (203) in a tunnel construction site (207); a step of assembling a rear shape steel structure (301) inside the leading pipe (203); a step of excavating the leading pipe (203) to push the rear shape steel structure (301) assembled in the leading pipe (203); a step of installing a waterproof sheet (501) in a space where the leading pipe (203) is excavated; a step of assembling a front shape steel structure (301) in the leading pipe (203) installed with the waterproofing sheet (501); a step of repeating a process of placing a plurality of soil retaining plates (303) between the front and the rear shape steel structures (301) in such a way that a plurality of tunnel construction pipes are located in the tunnel construction site (207) and are adjacently arranged in a transverse direction, and the waterproof ...

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Номер записи: 25
17-06-2016 дата публикации

METHOD TO MANUFACTURE SEMICONDUCTOR PACKAGE

Номер: KR101631405B1
Автор: HAN, GYU WAN, KIM, JIN SEONG, KIM, BYONG JIN, SHIM, JAE BEOM, RYU, JI YEON
Принадлежит: AMKOR TECHNOLOGY KOREA, INC.

An embodiment of the present invention provides a method to manufacture a semiconductor package, capable of slimming a semiconductor package, and a semiconductor package manufactured thereby. For the same, the method to manufacture the semiconductor package according to the embodiment of the present invention includes: a step (A) of forming a redistribution layer, a first under bump metal (UBM) and a second UBM on one plane of a semiconductor die; a step (B) of arranging at least one second semiconductor die so as to be electrically connected to the second UBM; a step (C) of arranging a first solder ball so as to be electrically connected to the first UBM; and a step (D) of encapsulating one plane of the first semiconductor die with an encapsulant. COPYRIGHT KIPO 2016 ...

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Номер записи: 26