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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Форма поиска

Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 30. Отображено 30.
03-07-2018 дата публикации

ADHESIVE COMPOSITION AND FLEXIBLE FLAT CABLE USING SAME

Номер: KR1020180074208A
Принадлежит:

The present invention relates to an adhesive composition having excellent heat resistance and a flexible flat cable using the same. The adhesive composition comprises: (a) a urethane-modified polyester resin having a carboxyl group in a side chain thereof; (b) an epoxy resin; and (c) an isocyanate group-containing curing agent. COPYRIGHT KIPO 2018 ...

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22-03-2018 дата публикации

플렉서블 플랫 케이블 모듈과, 이를 구비하는 전원공급장치 및 디스플레이 장치

Номер: KR0101827060B1
Принадлежит: 주식회사 두산

... 본 발명은 고온고습 조건 하에서도 기계적 특성, 열적 특성 및 전기적 특성이 우수하고, 이방성 도전 접속을 통해 다른 전기전자 부품과의 연결구조가 개선된 플렉서블 플랫 케이블 모듈, 상기 플렉서블 플랫 케이블 모듈과 인쇄회로기판이 결합된 커넥터리스(connetorless)형 전원 공급 장치, 및 이를 구비하는 디스플레이 장치에 관한 것이다.

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07-07-2015 дата публикации

INSULATING RESIN SHEET FOR FORMING FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING SAME, AND PRINTED CIRCUIT BOARD COMPRISING SAME

Номер: KR1020150077225A
Принадлежит:

The present invention relates to an insulating resin sheet for forming a flexible printed circuit board (FPCB) including a polyimide film; a low dielectric constant polyphenylene ether (PPE) resin insulation layer formed on one side or both sides of the polyimide film; and a thermoplastic polyimide layer formed on the polyphenylene ether (PPE) resin insulation layer, and forming a certain surficial roughness on the surface, to a manufacturing method thereof, and to a flexible printed circuit board including the insulating resin sheet. Provided in the present invention are an insulating resin sheet achieving excellent additive, low dielectric constant, and a fine circuit pattern, and a buildup printed circuit board using the same. COPYRIGHT KIPO 2015 ...

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07-07-2015 дата публикации

INSULATING RESIN SHEET FOR FORMING FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING SAME, AND PRINTED CIRCUIT BOARD COMPRISING SAME

Номер: KR1020150077224A
Принадлежит:

The present invention relates to an insulating resin sheet for forming a flexible printed circuit board (FPCB) including a polyimide film; an epoxy insulation layer formed on one side or both sides of the polyimide film; and a thermoplastic polyimide layer formed on the epoxy insulation layer, and forming a certain surficial roughness on the surface, to a manufacturing method thereof, and to a flexible printed circuit board including the insulating resin sheet. Provided in the present invention are an insulating resin sheet achieving excellent additive, heat resistance, and a fine circuit pattern, and a buildup printed circuit board using the same. COPYRIGHT KIPO 2015 ...

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09-06-2016 дата публикации

INSULATING RESIN SHEET FOR FORMING FLEXIBLE PRINTED CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND PRINTED CIRCUIT BOARD COMPRISING SAME

Номер: KR1020160065627A
Принадлежит:

The present invention relates to an insulating resin sheet for forming a flexible printed circuit board (FPCB), a manufacturing method thereof, and a flexible printed circuit board including the same. The insulating sheet for forming the flexible printed circuit board includes: a polyimide film; a low permittivity polyphenylene ether (PPE) resin insulating layer formed on one surface or both surfaces of the polyimide film; a thermoplastic polyimide film formed on the polyphenylene ether (PPE) resin insulating layer; a metal seed layer formed on the thermoplasctic polyimide film; and a release film formed on the metal seed layer. The present invention provides the insulating resin layer which may realize securing of a favorable adhesive property, low permittivity, an excellent characteristic of peel resistance, and a microcircuit pattern at the same time, and also provides a buildup printed circuit board using the insulating resin layer. COPYRIGHT KIPO 2016 ...

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07-06-2017 дата публикации

FLEXIBLE FLAT CABLE MODULE, POWER SUPPLYING DEVICE AND DISPLAY DEVICE COMPRISING SAME

Номер: KR1020170062323A
Принадлежит:

The present invention relates to a flexible flat cable module which is excellent in mechanical properties, thermal characteristics and electrical characteristics even under high temperature and high humidity conditions and has improved connection structure with other electric and electronic parts through anisotropic conductive connection, a connetorless type power supply unit coupled to the flexible fat cable module and a printed circuit board, and a display device having the same. The flexible flat cable module includes a conductor, a flexible flat cable having an adhesive layer and a resin layer sequentially stacked thereon, and an anisotropic conductive layer disposed on the exposed conductor of the flexible flat cable. COPYRIGHT KIPO 2017 ...

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22-10-2015 дата публикации

METAL INK COMPOSITION WITH LOW VISCOSITY, LAMINATED SHEET USING SAME, FLEXIBLE METAL FOIL LAMINATE, AND PRINTED CIRCUIT BOARD

Номер: KR1020150118424A
Принадлежит:

The present invention relates to a metal ink composition with low viscosity, a laminated sheet using the same, a flexible metal foil laminate, and a printed circuit board, capable of forming a seed layer with excellent adhesive power to a polyimide film. COPYRIGHT KIPO 2016 ...

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18-07-2018 дата публикации

플렉서블 플랫 케이블 모듈과, 이를 구비하는 전원공급장치 및 디스플레이 장치

Номер: KR0101879993B1
Принадлежит: 주식회사 두산

... 본 발명은 고온고습 조건 하에서도 기계적 특성, 열적 특성 및 전기적 특성이 우수하고, 이방성 도전 접속을 통해 다른 전기전자 부품과의 연결구조가 개선된 플렉서블 플랫 케이블 모듈, 상기 플렉서블 플랫 케이블 모듈과 인쇄회로기판이 결합된 커넥터리스(connetorless)형 전원 공급 장치, 및 이를 구비하는 디스플레이 장치에 관한 것이다.

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11-06-2018 дата публикации

안테나 모듈 및 이를 구비하는 이동 단말기

Номер: KR0101866642B1
Принадлежит: 주식회사 두산

... 본 발명은 자성시트; 상기 자성시트의 일면에 배치되며, 제1안테나 패턴부를 구비하는 비(非)자성 기판; 및 상기 자성시트의 타면에 배치되며, 복수의 도체 라인이 평면 직선형으로 배열되는 제2안테나 패턴부를 구비하는 플렉서블 플랫 케이블을 포함하며, 상기 제1안테나 패턴부와 제2안테나 패턴부가 전기적으로 연결되는 것을 특징으로 하는 안테나 모듈, 및 이를 구비하는 이동 단말기를 제공한다. 본 발명에서는 무선충전, MST, NFC 등의 기능을 동시에 제공하면서, 공정의 단순화, 원가 절감 효과, 슬림화된 디자인과 메탈 소재의 그립감 등을 제공할 수 있다.

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31-07-2018 дата публикации

접착제 조성물 및 이를 이용하는 플렉시블 플랫 케이블

Номер: KR0101884095B1
Принадлежит: 주식회사 두산

... 본 발명은 내열성이 우수한 접착제 조성물 및 이를 이용하는 플렉시블 플랫 케이블에 관한 것으로, 상기 접착제 조성물은 (a) 측쇄에 카르복실기를 갖는 우레탄 변성 폴리에스테르 수지; (b) 에폭시 수지; 및 (c) 이소시아네이트기-함유 경화제을 포함한다.

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15-08-2019 дата публикации

FLEXIBLE COMPLEX SUBSTRATE AND METHOD FOR MANUFACTURING SAME

Номер: WO2019125047A3
Принадлежит:

The present invention provides a flexible complex substrate and a method for manufacturing the same, the substrate comprising: a first insulating film including one surface on which a first adhesive layer is disposed; and a second insulating film including one surface on which a second adhesive layer and a metal conductor patterned in a predetermined shape are sequentially arranged, wherein the one surface of the first insulating film, on which the first adhesive layer is disposed, and the one surface of the second insulating film, on which the metal conductor is disposed, are integrally bonded.

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01-06-2017 дата публикации

FLEXIBLE FLAT CABLE MODULE, POWER SUPPLY DEVICE HAVING SAME, AND DISPLAY DEVICE

Номер: WO2017090868A1
Принадлежит:

The present invention relates to: a flexible flat cable module having excellent mechanical properties, thermal properties, and electrical properties even under high temperature and high humidity conditions, and having an improved connection structure with other electrical/electronic components through anisotropic conductive connection; a connectorless-type power supply device to which the flexible flat cable module and a printed circuit board are coupled; and a display device having same.

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04-01-2016 дата публикации

METAL INK COMPOSITION HAVING LOW VISCOSITY AND LAMINATE SHEET, FLEXIBLE METAL-CLAD LAMINATE AND PRINTED CIRCUIT BOARD USING THE SAME

Номер: KR0101582407B1
Принадлежит: 주식회사 두산

... 본 발명은 폴리이미드 필름과의 접착력이 우수한 시드층을 형성할 수 있는 저점도 금속 잉크 조성물과, 이를 이용한 적층시트, 연성 금속박 적층판 및 인쇄회로기판에 대한 것이다.

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17-07-2014 дата публикации

INSULATION RESIN FILM, SUBSTRATE WITH THIN METAL LAYER AND PRINTED CIRCUIT BOARD INCLUDING INSULATION RESIN FILM, AND METHOD FOR FABRICATING CIRCUIT BOARD INCLUDING INSULATION RESIN FILM

Номер: WO2014109593A1
Принадлежит:

The present invention relates to an insulation film for improving the strength of adhering to the plated layer in a printed circuit board, a thin metal layer and a printed circuit board including the insulation resin film, and a method for fabricating a printed circuit board using the insulation resin film.

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02-02-2017 дата публикации

INSULATING FILM AND FLEXIBLE FLAT CABLE

Номер: WO2017018774A1
Принадлежит:

The present invention relates to an insulating film usable for a flexible flat cable (FFC) and having excellent flexibility and mechanical properties, and to a flexible flat cable (FFC) using the insulating film. The insulating film provided in the present invention has very excellent mechanical properties such as tensile strength, elongation ratio, and flexibility, and also exhibits very excellent heat resistance properties against degeneration, shrinkage, and the like caused by heat. In addition, the flexible flat cable provided in the present invention also has very superior mechanical properties and heat resistance properties by using the insulating film.

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07-02-2017 дата публикации

INSULATING FILM AND FLEXIBLE FLAT CABLE

Номер: KR1020170013706A
Принадлежит:

The present invention relates to an insulating film which is used for a flexible flat cable (FFC) and has high flexibility and mechanical properties, and the flexible flat cable (FFC) using the insulating film. The insulating film provided in the present invention has very high mechanical properties like tension intensity, an elongation rate, flexibility, etc. and also exhibits very high heat resistant properties like contractility, denaturalization, etc. due to heat. Also, the flexible flat cable provided in the present invention has very high mechanical and heat resistant properties by using the insulating film. The insulating film is formed by successively stacking an adhesion layer, an intermediate layer, and a resin layer. The adhesion layer includes polymer resins. COPYRIGHT KIPO 2017 (AA) Tensile strength rate: TH/TR (BB) Hardener content (compared to polyester 50 parts by weight) ...

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09-06-2016 дата публикации

INSULATING RESIN SHEET FOR FLEXIBLE PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF, AND PRINTED CIRCUIT BOARD COMPRISING SAME

Номер: KR1020160065628A
Принадлежит:

The present invention relates to a flexible circuit board including an insulating resin sheet and manufacturing a method thereof. The insulating sheet for forming the flexible circuit board including: a polyimide film; a low permittivity polyphenylene ethers (PPE) insulating resin layer formed on a surface or opposite surfaces of the polyimide film; a thermoplasticity polyimide film formed on the polyphenylene ether (PPE) insulating resin layer; a metal seed layer formed on the thermoplascticity polyimide film; and a release film formed on the metal seed layer. The present invention provides the insulating resin layer that may realize securing a favorable adhesive property, an excellent characteristic of peel resistance, and a micro circuit pattern at the same time and a buildup printed circuit board using the insulating resin layer. COPYRIGHT KIPO 2016 ...

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27-06-2019 дата публикации

FLEXIBLE COMPLEX SUBSTRATE AND METHOD FOR MANUFACTURING SAME

Номер: WO2019125047A2
Принадлежит:

The present invention provides a flexible complex substrate and a method for manufacturing the same, the substrate comprising: a first insulating film including one surface on which a first adhesive layer is disposed; and a second insulating film including one surface on which a second adhesive layer and a metal conductor patterned in a predetermined shape are sequentially arranged, wherein the one surface of the first insulating film, on which the first adhesive layer is disposed, and the one surface of the second insulating film, on which the metal conductor is disposed, are integrally bonded.

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02-07-2015 дата публикации

INSULATION RESIN SHEET FOR FORMING FLEXIBLE PRINTED CIRCUIT BOARD, METHOD FOR MANUFACTURING SAME, AND PRINTED CIRCUIT BOARD COMPRISING SAME

Номер: WO2015099451A1
Принадлежит:

The present invention relates to an insulation resin sheet for forming a flexible printed circuit board (FPCB), a method for manufacturing the same, and a flexible printed circuit board comprising the insulation resin sheet, the insulation resin sheet comprising: a polyimide film; an epoxy insulation layer formed on one surface or both surfaces of the polyimide film; and a thermoplastic polyimide layer, which is formed on the epoxy insulation layer, and which has a predetermined surface roughness formed on the surface thereof. The present invention can provide an insulation resin sheet capable of simultaneously implementing good adhesiveness securing, resistance to heat, and a micro-circuit pattern, and a buildup printed circuit board using the same.

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23-11-2015 дата публикации

INSULATING RESIN SHEET FOR FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME, AND PRINTED CIRCUIT BOARD COMPRISING THE SAME

Номер: KR0101571086B1
Принадлежит: 주식회사 두산

... 본 발명은 폴리이미드 필름; 상기 폴리이미드 필름의 일면 또는 양면 상에 형성된 에폭시 절연층; 및 상기 에폭시 절연층 상에 형성되고, 표면에 소정의 표면 조도가 형성되는 열가소성 폴리이미드층을 포함하는 연성 인쇄회로기판(FPCB) 형성용 절연 수지 시트 및 이의 제조방법, 상기 절연 수지 시트를 포함하는 연성 인쇄회로기판에 관한 것이다. 본 발명에서는 양호한 접착성 확보, 내열성, 미세회로 패턴을 동시에 구현할 수 있는 절연 수지 시트 및 이를 이용하는 빌드업 인쇄회로기판을 제공할 수 있다.

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27-06-2018 дата публикации

METHOD FOR DIRECTLY BONDING PRINTED CIRCUIT BOARD AND FLEXIBLE FLAT CABLE, POWER SUPPLY DEVICE BONDED THEREBY, AND DISPLAY DEVICE

Номер: KR1020180071045A
Принадлежит:

The present invention relates to a method for directly bonding a printed circuit board and a flexible flat cable (FFC) which has excellent mechanical, thermal, and electrical characteristics under a high temperature and high humidity condition and can perform high-temperature solder bonding through a structural design, a connectorless power supply device electrically bonded thereby, and a display device having the same. COPYRIGHT KIPO 2018 ...

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14-11-2016 дата публикации

연성 인쇄회로기판 형성용 절연 수지 시트 및 이의 제조방법, 이를 포함하는 인쇄회로기판

Номер: KR0101676119B1
Принадлежит: 주식회사 두산

... 본 발명은 폴리이미드 필름; 상기 폴리이미드 필름의 일면 또는 양면 상에 형성된 저유전율 폴리페닐렌에테르(PPE) 수지 절연층; 상기 폴리페닐렌에테르(PPE) 수지 절연층 상에 형성되는 열가소성 폴리이미드층; 상기 열가소성 폴리이미드층 상에 형성되는 금속 시드층; 및 상기 금속 시드층 상에 마련되는 이형 필름을 포함하는 연성 인쇄회로기판(FPCB) 형성용 절연 수지 시트 및 이의 제조방법, 상기 절연 수지 시트를 포함하는 연성 회로 기판에 관한 것이다. 본 발명에서는 양호한 접착성 확보, 저유전율, 우수한 박리강도 특성, 및 미세회로 패턴을 동시에 구현할 수 있는 절연 수지 시트 및 이를 이용하는 빌드업 인쇄회로기판을 제공할 수 있다.

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27-06-2018 дата публикации

CONNECTION DEVICE FOR POWER SUPPLY AND DISPLAY DEVICE HAVING SAME

Номер: KR1020180070914A
Принадлежит:

The present invention relates to a connectorless connection device for power supply which has an enhanced coupling structure between a flexible flat cable (FFC) and a printed circuit board and has the significantly increased delamination strength in a diagonal direction, and a display device having the same. COPYRIGHT KIPO 2018 ...

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20-07-2016 дата публикации

연성 인쇄회로기판 형성용 절연 수지 시트 및 이의 제조방법, 이를 포함하는 인쇄회로기판

Номер: KR0101641405B1
Принадлежит: 주식회사 두산

... 본 발명은 폴리이미드 필름; 상기 폴리이미드 필름의 일면 또는 양면 상에 형성된 저유전율 폴리페닐렌에테르(PPE) 수지 절연층; 및 상기 폴리페닐렌에테르(PPE) 수지 절연층 상에 형성되고, 표면에 소정의 표면 조도가 형성되는 열가소성 폴리이미드층을 포함하는 연성 인쇄회로기판(FPCB) 형성용 절연 수지 시트 및 이의 제조방법, 상기 절연 수지 시트를 포함하는 연성 인쇄회로기판에 관한 것이다. 본 발명에서는 양호한 접착성 확보, 저유전율 및 미세회로 패턴을 동시에 구현할 수 있는 절연 수지 시트 및 이를 이용하는 빌드업 인쇄회로기판을 제공할 수 있다.

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27-08-2015 дата публикации

METAL INK COMPOSITION HAVING LOW VISCOSITY AND PRINTED CIRCUIT BOARD USING THE SAME

Номер: KR0101547622B1
Принадлежит: 주식회사 두산

... 본 발명은 기판의 표면 처리 공정 없이 기판과의 접착 특성이 우수하면서 전도도가 높은 박막 회로 패턴을 형성할 수 있는 금속 잉크 조성물 및 이를 이용하는 인쇄회로기판에 대한 것이다.

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03-01-2019 дата публикации

전원공급용 접속장치 및 이를 구비하는 디스플레이 장치

Номер: KR0101935107B1
Принадлежит: 주식회사 두산

... 본 발명은 플렉서블 플랫 케이블(flexible flat cable, FFC)과 인쇄회로기판과의 결합 구조가 개선되고, 사선방향에서의 박리강도가 유의적으로 증대된 커넥터리스 (connectorless)형 전원공급용 접속장치 및 이를 구비하는 디스플레이 장치에 관한 것이다.

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28-12-2017 дата публикации

ANTENNA MODULE AND MOBILE TERMINAL HAVING SAME

Номер: KR1020170142651A
Принадлежит:

The present invention relates to an antenna module and a mobile terminal having the same. According to the present invention, the antenna module comprises: a magnetic sheet; a non-magnetic substrate placed on one surface of the magnetic sheet to have a first antenna pattern unit; and a flexible flat cable placed on the other surface of the magnetic sheet to have a second antenna pattern unit wherein a plurality of conductor lines are arranged in a straight line on a flat surface. The first antenna pattern unit and the second antenna pattern unit are electrically connected. The present invention is able to provide functions of wireless charging, MST, and NFC at the same time, to simplify a process, and to reduce costs, providing a slim design and a grip of metallic materials. COPYRIGHT KIPO 2018 ...

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28-06-2018 дата публикации

ADHESIVE COMPOSITION AND FLEXIBLE FLAT CABLE USING SAME

Номер: WO2018117607A1
Принадлежит:

The present invention relates to an adhesive composition having excellent heat resistance and a flexible flat cable using the same, and the adhesive composition comprises: (a) a urethane modified polyester resin having a carboxyl group at a side chain thereof; (b) an epoxy resin; and (c) an isocyanate group-containing curing agent.

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03-07-2014 дата публикации

LOW-VISCOSITY METAL INK COMPOSITION, AND PRINTED CIRCUIT BOARD USING SAME

Номер: WO2014104737A1
Принадлежит:

The present invention relates to a metal ink composition and to a printed circuit board using same, wherein the metal ink composition can form a thin film circuit pattern having an excellent property of adhering to a substrate and high conductivity without performing a surface treating process on the substrate.

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19-09-2017 дата публикации

METAL LAMINATOR AND PRINTED CIRCUIT BOARD WITH SAME

Номер: KR1020170105275A
Принадлежит:

The present invention relates to a metal laminator including a resin layer composed of a polyimide resin composite and a printed circuit board (PCB) with the same. A withstanding voltage of the metal laminator is excellent, thus the present invention is able to provide the PCB with improved bendability. The metal laminator includes a metal layer and the resin layer equipped in the metal layer. The metal layer is formed of the polyimide resin composite including a first inorganic filler, a second inorganic filler, and a third inorganic filler. The first inorganic filler is aluminum oxide, the second inorganic filler is boron nitride, and the third inorganic filler is aluminum nitride. COPYRIGHT KIPO 2017 ...

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