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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Применить Всего найдено 26. Отображено 26.
12-10-2017 дата публикации

SEMICONDUCTOR WAFER SURFACE PROTECTING ADHESIVE FILM AND MANUFACTURING METHOD THEREOF

Номер: KR1020170110748A
Автор: KIM, EUN YEONG, SEO, KWANG SU, KIM, JANG SOON, PARK, SUNG CHAN, YOON, MI SEON
Принадлежит:

The present invention relates to an adhesive film which is attached to the surface of the semiconductor wafer to perform a role of protecting the surface of the semiconductor wafer when it is necessary to protect the surface of the semiconductor wafer during processing of a semiconductor wafer, and a manufacturing method of the adhesive film. An objective of the present invention is to provide a semiconductor wafer surface protecting adhesive film including a substrate layer which provides appropriate tensile strength, tear strength and elongation. The semiconductor wafer surface protecting adhesive film of the present invention includes a substrate layer, an intermediate layer and an adhesive layer, wherein the substrate layer is a cured film of a composition comprising: a resin which is modified to contain a carboxyl group; and a crosslinking agent. COPYRIGHT KIPO 2017 ...

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Номер записи: 1
31-08-2017 дата публикации

ADHESIVE FILM FOR PROTECTING SURFACE OF SEMICONDUCTOR WAFER AND METHOD OF PRODUCING SAME

Номер: KR1020170099269A
Автор: KIM, EUN YEONG, KIM, JANG SOON, KIM, SANG HWAN, PARK, SUNG CHAN, KIM, WON HO, YOON, MI SEON
Принадлежит:

Disclosed are an adhesive film for protecting the surface of a semiconductor wafer capable of preventing breaking of a wafer by focusing a stress on a bump in the process of polishing by having a bump absorption layer absorbing surface steps; and a method of producing the same. The adhesive film for protecting the surface of a semiconductor wafer according to the present invention has a multilayer structure in which a bump absorption layer, an adhesive agent layer, and a release film are formed on top of a substrate film, wherein the bump absorption layer comprises a cured product of a UV-curable resin composition formed by polymerization of a photocurable monomer having a benzophenone-based compound with an acrylate group, and an acrylic copolymer. COPYRIGHT KIPO 2017 ...

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Номер записи: 2
07-08-2017 дата публикации

셀룰러 통신 시스템에서 협력 통신을 위한 클러스터링 방법 및 장치

Номер: KR0101765127B1
Автор: 고은석, 이충용, 김명석, 윤미선, 김영수, 문준
Принадлежит: 삼성전자주식회사, 연세대학교 산학협력단

... 본 발명은 셀룰러 통신 시스템에서 협력 통신을 위한 클러스터링 방법 및 장치에 관한 것으로서, 중앙 처리기에서 협력 통신을 위해 기지국을 클러스터링하는 방법은, 다수의 기지국에 대한 채널 상태 정보를 수집하는 과정과, 소정 수의 기지국들이 협력 통신하는 경우에 대한 캐패시티와 상기 소정 수의 기지국들이 단일 셀 통신하는 경우에 대한 캐패시티 간의 차이를 고려하여 클러스터를 구성하는 과정을 포함하여 시간 흐름에 따라 변화하는 사용자의 환경을 효율적으로 반영하여 클러스터를 구성할 수 있다.

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Номер записи: 3
16-10-2017 дата публикации

SURFACE PROTECTION ADHESIVE FILM FOR SEMICONDUCTOR WAFERS

Номер: KR1020170114728A
Автор: KIM, EUN YEONG, PARK, SUNG CHAN, KIM, JANG SOON, KIM, SANG HWAN, YOON, MI SEON
Принадлежит:

Provided is a surface protection adhesive film for semiconductor wafers, comprising a base material layer, a middle layer, and an adhesive layer. The middle layer contains a photo-cured product of a composition for forming the middle layer, consisting of a photo-initiator, a diluted monomer, a thiol compound, and a rubber resin of a polymer of an isocyanate compound and a hydroxyl group-containing rubber-based resin. The storage modulus of the middle layer at 25 deg. C is 10 to 100 times greater than that of the middle layer at 80 deg. C. COPYRIGHT KIPO 2017 ...

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Номер записи: 4
10-10-2017 дата публикации

COVER FOR PROTECTING TREE

Номер: KR1020170109781A
Автор: YUN, MI SUN
Принадлежит:

The present invention relates to a cover for protecting a tree, which comprises a cover body (10) covering a lower portion of the tree (1), and guide arrays protruding from the outer surface of the cover body (10) and extending from the outer surface of the trees (1) toward the ground, wherein the guide arrays are spaced apart from each other, and guides water through neighboring guide arrays. In the present invention, since water flows through the guide arrays provided in the cover for protecting the tree, the water is guided to the outside of the tree (1), so that even when the water is excessively supplied, such as a rainy season, it is possible to prevent the water from permeating into a root portion (2) of the tree (1), thereby preventing the root (2) from being rotten due to excessive water remaining around the root (2) of the tree (1). COPYRIGHT KIPO 2017 ...

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Номер записи: 5
22-08-2019 дата публикации

BACK GRINDING TAPE

Номер: WO2019143076A8
Автор: YOON, Mi Seon, KIM, Sera, LEE, Kwang Joo, YEON, Bora, PARK, Sung Chan, KIM, Eun Yeong
Принадлежит:

The present invention relates to a back grinding tape comprising a polymer substrate and an adhesive layer, wherein the adhesive layer comprises a (meth)acrylate resin containing 30-60 wt% of repeating units derived from a monomer or an oligomer having a glass transition temperature of 0°C or higher and the glass transition temperature of the adhesive layer is -20 to 10°C, and to a method for grinding a wafer by using the back grinding tape.

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Номер записи: 6
14-09-2017 дата публикации

BASE FILM FOR PROCESSING SEMICONDUCTOR AND MANUFACTURING METHOD THEREOF

Номер: KR1020170104053A
Автор: YOON, MI SEON, SEO, KWANG SU, KIM, JANG SOON, KIM, SANG HWAN, PARK, SUNG CHAN, KIM, EUN YEONG
Принадлежит:

The present invention provides a base film for processing a semiconductor and a manufacturing method thereof which has a thermosetting material of a composite including thermosetting resin and solvent having 3 million to 15 million of weight average molecular weight, and which has total thickness variation (TTV) less than 5μm defined by difference of the maximum thickness and the minimum thickness. The base film for processing a semiconductor has uniform thickness, the strength and rigidity more than a predetermined level, and excellent stress relaxation properties and cutting properties, and therefore, when being used in a back-grinding process or a dicing process for a semiconductor wafer, can effectively protect material properties of the wafer, as well as being advantageous in being used in manufacturing a wafer having a large bore and the thin thickness. COPYRIGHT KIPO 2017 ...

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Номер записи: 7
01-09-2017 дата публикации

ADHESIVE FILM FOR PRODUCING SURFACES OF SEMICONDUCTOR WAFERS

Номер: KR1020170099696A
Автор: KIM, EUN YEONG, KIM, JANG SOON, KIM, SANG HWAN, PARK, SUNG CHAN, YOON, MI SEON, KIM, WOO YEON
Принадлежит:

Provided is an adhesive film for protecting surfaces of semiconductor wafers. To this end, the adhesive film comprises a base material layer, a middle layer, and an adhesive layer. The middle layer contains a monomeric component containing an alicyclic methacrylate monomer and an alkyl methacrylate monomer, a photopolymerizable polymer made of the monomeric component, and a photo-cured product of a composition for forming the middle layer containing diluted monomers. The diluted monomer contains a hydroxyl group-containing methacrylic monomer, and content of the diluted monomer is 25-400 parts by weight with respect to 100 parts by weight of the sum of the monomeric component and the photopolymerizable polymer made of the monomeric component. COPYRIGHT KIPO 2017 ...

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Номер записи: 8
26-09-2019 дата публикации

BACK-GRINDING TAPE

Номер: WO2019182271A1
Автор: KIM, Eun Yeong, KIM, Sera, LEE, Kwang Joo, KIM, Sang Hwan, PARK, Sung Chan, YOON, Mi Seon
Принадлежит:

A back-grinding tape according to the present invention has excellent water resistance so as to easily protect a pattern and has excellent adhesion between respective layers such that the respective layers are not separated during a tape removing process. Accordingly, the back-grinding tape is suitable for a back grinding process.

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Номер записи: 9
18-06-2020 дата публикации

LACTOBACILLUS FERMENTUM WIKIM0102 HAVING ANTICANCER ACTIVITY AND COMPOSITION COMPRISING SAME AS EFFECTIVE COMPONENT

Номер: WO2020122496A1
Автор: CHOI, Hak Jong, YUN, Mi Sun
Принадлежит:

The present invention relates to a novel Lactobacillus fermentum WiKim0102 (Accession No. KCCM12356P) isolated from kimchi, and to a composition comprising same as an effective component. The Lactobacillus fermentum WiKim0102 according to the present invention exhibits excellent anti-cancer activities in existing animal models and animal models with human tumor cells transplanted therein, and thus can be beneficially used as a composition for use in treatment, prevention, or alleviation of cancer in humans or animals.

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Номер записи: 10
10-10-2017 дата публикации

ADHESIVE FILM FOR PROTECTING SURFACES OF SEMICONDUCTOR WAFERS AND PRODUCTION METHOD THEREOF

Номер: KR1020170109897A
Автор: KIM, EUN YEONG, KIM, JANG SOON, KIM, SANG HWAN, PARK, SUNG CHAN, KIM, WON HO, YOON, MI SEON
Принадлежит:

Provided is an adhesive film for protecting surfaces of semiconductor wafers, which includes a base material layer, a middle layer, and an adhesive layer. The adhesive layer is a thermocurable adhesive layer capable of being additionally photocured by containing a photoinitiator, and the weight ratio of the total weight of the adhesive layer to the photoinitiator is 1000 to 3000 ppm. Moreover, provided is a method for producing the adhesive film for protecting surfaces of semiconductor wafers, comprising the following steps: producing the middle layer disposed on one side of the base material layer; producing an adhesive composition containing the photoinitiator, a thermosetting agent, and a thermosetting resin having a photocurable functional group; and applying the adhesive composition to one side of the middle layer, and thermosetting the same to produce the thermosetting adhesive layer whose weight ratio of the total weight of the adhesive layer to the photoinitiator is 1000 to 3000 ...

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Номер записи: 11
16-10-2017 дата публикации

ADHESIVE COMPOSITION FOR SEMICONDUCTOR, PRODUCTION METHOD FOR SAME, AND PROTECTIVE FILM FOR SEMICONDUCTOR

Номер: KR1020170114858A
Автор: YOON, MI SEON, PARK, SUNG CHAN, KIM, EUN YEONG, KIM, JANG SOON
Принадлежит:

Provided are an adhesive composition for a semiconductor which contains a (meth)acrylic copolymer with the glass transition temperature of -30 to -10 deg. C and a hydroxyl value of 0.15 mgKOH/g to 0.30 mg, and a production method for the same. Moreover, provided is a protective film for a semiconductor formed by thermally curing the adhesive composition for a semiconductor. COPYRIGHT KIPO 2017 ...

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Номер записи: 12
28-04-2017 дата публикации

반도체 메모리 장치 및 그 동작 방법

Номер: KR0101731033B1
Автор: 윤미선
Принадлежит: 에스케이하이닉스 주식회사

... 본 발명의 다른 실시 예에 따른 반도체 메모리 장치의 동작 방법은, 선택된 페이지에 프로그램할 제 1 내지 제 N 데이터 그룹을 입력받는 단계; 상기 제 1 데이터 그룹을 제 1 프리 델타 데이터 그룹으로 하고, 제 1 내지 제 N 데이터 그룹들을 제 k+1 데이터 그룹에서 제 k 데이터 그룹을 빼는 감산 연산을 실시하여 제 2 내지 제 N 프리 델타 데이터 그룹으로 만드는 단계; 상기 제 1 내지 제 N 프리 델타 데이터 그룹들 중 제 1 논리 로직을 갖는 비트의 수를 카운트하고, 설정된 숫자보다 상기 카운트된 비트의 수가 많은지를 판단하는 단계; 및 상기 설정된 숫자보다 상기 카운트된 비트의 수가 많은 경우, 반전 플래그 데이터를 설정하고 상기 제 1 내지 제 N 프리 델타 데이터 그룹을 비트단위로 반전하여 제 1 내지 제 N 델타 데이터 그룹으로 만들고, 상기 제 1 내지 제 N 델타 데이터 그룹을 상기 선택된 페이지에 프로그램하는 단계를 포함한다.

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Номер записи: 13
18-06-2020 дата публикации

PHARMACEUTICAL COMPOSITION FOR PREVENTING OR TREATING CANCER, COMPRISING WEISSELLA CIBARIA WIKIM28 AS ACTIVE INGREDIENT

Номер: WO2020122484A1
Автор: CHOI, Hak Jong, YUN, Mi Sun
Принадлежит:

The present invention relates to a novel Weissella cibaria WIKIM28 (accession number: KCCM11879P) and a composition comprising same as an active ingredient, the Weissella cibaria WIKIM28 being separated from kimchi. The Weissella cibaria WIKIM28, according to the present invention, exhibits excellent anticancer activity in a cancer cell-transplanted animal model, and thus may be usefully employed for a composition for the use of treating, preventing or improving cancer in humans or animals.

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Номер записи: 14
04-01-2018 дата публикации

수목보호용 덮개

Номер: KR0101815312B1
Автор: 윤미선
Принадлежит: 윤미선

... 본 발명은 수목보호용 덮개에 관한 것으로, 본 발명은 수목(1)의 하부를 둘러 덮는 덮개몸체(10)와, 상기 덮개몸체(10)의 외면에 돌출되되 수목(1)의 외면으로부터 지반을 향해 연장되어 구성되는 가이드어레이를 포함하고, 상기 가이드어레이는 다수개가 서로 이격되어 서로 이웃한 가이드어레이 사이를 통해 수분이 안내된다. 본 발명에서는 수목보호용 덮개에 구비된 가이드어레이 사이로 수분이 흘러 수목(1)의 바깥쪽으로 안내되므로, 장마철과 같이 수분이 과도하게 공급되는 기간에도 수목(1)의 뿌리(2) 부분에 수분이 스며드는 것을 방지할 수 있고, 이에 따라 수목(1)의 뿌리(2) 주변에 과도한 수분이 머물러 뿌리(2)를 썩게 만드는 현상이 방지된다.

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Номер записи: 15
25-01-2016 дата публикации

METHODS AND APPARATUS FOR PRECODING WITH LIMITED COORDINATION BETWEEN CELLS IN WIRELESS COMMUNICATION SYSTEM

Номер: KR0101585422B1
Автор: 고은석, 이충용, 김명석, 윤미선, 김영수, 문준
Принадлежит: 삼성전자주식회사, 연세대학교 산학협력단

... 본 발명은 무선통신 시스템에서 셀 간 제한적 협력을 통한 프리코딩 장치 및 방법에 관한 것이다. 본 발명에 따른 무선통신 시스템에서 데이터 프리코딩을 위한 기지국의 동작 방법은, 기지국과 기지국이 서비스 하는 단말 간 채널 크기 정보를 나타내는 CQI 파라미터를 결정하는 과정과, 백홀을 통해 중앙처리장치로 상기 결정된 기지국과 단말 간 CQI 파라미터를 전송하는 과정과, 상기 중앙처리장치로부터, 각 셀로부터의 CQI 파라미터를 이용하여 결정된 가중치 요소를 수신하는 과정과, 상기 가중치 요소를 기반으로 프리코딩 벡터를 결정하는 과정을 포함하며, 여기서, 상기 가중치 요소는 상기 기지국이 간섭을 미치게 될 셀 간 환경의 상대적인 비를 나타내는 것을 특징으로 한다.

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Номер записи: 16
12-10-2017 дата публикации

SEMICONDUCTOR WAFER SURFACE PROTECTING ADHESIVE FILM AND MANUFACTURING METHOD THEREOF

Номер: KR1020170110747A
Автор: KIM, EUN YEONG, SEO, KWANG SU, KIM, JANG SOON, PARK, SUNG CHAN, YOON, MI SEON
Принадлежит:

The present invention relates to an adhesive film which is attached to the surface of the semiconductor wafer to perform a role of protecting the surface of the semiconductor wafer when it is necessary to protect the surface of the semiconductor wafer during processing of a semiconductor wafer, and a manufacturing method of the adhesive film. An objective of the present invention is to provide a semiconductor wafer surface protecting adhesive film including a substrate layer which provides appropriate tensile strength, tear strength and elongation. The semiconductor wafer surface protecting adhesive film of the present invention includes a substrate layer, an intermediate layer and an adhesive layer, wherein the substrate layer is a cured film of a composition comprising: a resin which is modified to contain a silanol group; and a crosslinking agent. COPYRIGHT KIPO 2017 ...

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Номер записи: 17
18-06-2020 дата публикации

PHARMACEUTICAL COMPOSITION COMPRISING LACTOBACILLUS SAKEI WIKIM30 AS ACTIVE INGREDIENT FOR PREVENTION OR TREATMENT OF CANCER

Номер: WO2020122476A1
Автор: CHOI, Hak Jong, YUN, Mi Sun
Принадлежит:

The present invention relates to novel Lactobacillus sakei WIKIM30 (accession number KCCM11878P) isolated from Kimchi, and a composition comprising same as an active ingredient. Exhibiting excellent anticancer activity in animal models into which cancer cells have been transplanted and cancer cell lines, Lactobacillus sakei WIKIM30 according to the present invention can be advantageously used as a composition for treatment, prevention, or alleviation of cancer in humans or animals.

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Номер записи: 18
29-09-2017 дата публикации

ADHESIVE FILM FOR PROTECTING SURFACE OF SEMICONDUCTOR WAFER

Номер: KR1020170109390A
Автор: KIM, EUN YEONG, KIM, JANG SOON, KIM, SANG HWAN, PARK, SUNG CHAN, KIM, WON HO, YOON, MI SEON
Принадлежит:

An embodiment of the present invention provides an adhesive film for protecting the surface of a semiconductor wafer, the adhesive film which has excellent step absorbing power and is free from residues during peeling. The adhesive film of the present invention comprises a substrate layer, an intermediate layer, and an adhesive layer. The intermediate layer comprises a photocured product of an intermediate layer forming composition comprising: a first acrylic photocurable polymer of first monomer components including a C_1-C_14 alkyl group-containing first alkyl(meth)acrylate monomer, a C_15-C_25 alkyl group-containing second alkyl(meth)acrylate monomer, a first functional group-containing (meth)acrylic monomer, and an alicyclic (meth)acrylate monomer; a photoinitiator; and a photocuring agent. The intermediate layer has a storage modulus of 30,000 to 50,000 Pa at 25°C. The intermediate layer has a glass transition temperature of -35 to -25°C. The adhesive layer is a pressure-sensitive ...

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Номер записи: 19
20-02-2018 дата публикации

반도체 메모리 장치의 동작 방법

Номер: KR0101829208B1
Автор: 윤미선
Принадлежит: 에스케이하이닉스 주식회사

... 본 발명의 실시 예에 따른 반도체 메모리 장치의 동작 방법은, 독출 명령에 따라 제 1 워드라인의 하위 비트 페이지 및 상위 비트 페이지에 각각 저장된 데이터를 독출하여 페이지 버퍼의 제 1 및 제 2 래치에 각각 저장하는 제 1 독출 단계; 상기 제 1 래치에 저장된 데이터를 외부로 출력하고, 상기 제 2 래치에 저장된 데이터를 상기 페이지 버퍼의 제 3 래치에 저장하는 단계; 제 2 워드라인의 하위 비트 페이지 및 상위비트 페이지에 각각 저장된 데이 터를 독출하여 상기 제 1 및 제 2 래치에 각각 저장하는 제 2 독출 단계; 및 상기 제 1 래치에 저장된 데이터와 상기 제 3 래치에 저장된 데이터를 차례로 출력하고, 상기 제 2 래치에 저장된 데이터를 상기 제 3 래치에 저장하는 단계를 포함한다.

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Номер записи: 20
12-12-2019 дата публикации

BACK GRINDING TAPE

Номер: WO2019235805A1
Автор: YOON, Mi Seon, KIM, Sera, LEE, Kwang Joo, YEON, Bora, KIM, Sang Hwan, KIM, Eun Yeong
Принадлежит:

The present invention relates to: a back grinding tape comprising a polymer resin layer, which comprises a urethane (meth)acrylate resin having a glass transition temperature of 0°C or higher and comprising 10-40 wt% of a repeating unit derived from a (meth)acrylate monomer or oligomer, wherein the glass transition temperature of the polymer resin layer is -30°C to 0°C; and a method for grinding a wafer by using the back grinding tape.

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Номер записи: 21
01-09-2017 дата публикации

ADHESIVE FILM FOR PRODUCING SURFACES OF SEMICONDUCTOR WAFERS

Номер: KR1020170099695A
Автор: KIM, EUN YEONG, PARK, SUNG CHAN, KIM, JANG SOON, LEE, SLE, YOON, MI SEON, KIM, WOO YEON
Принадлежит:

Provided is an adhesive film for protecting surfaces of semiconductor wafers. To this end, the adhesive film comprises a base material layer, a middle layer, and an adhesive layer. The middle layer contains a photo-cured product of an acrylic photopolymerizable polymer made of monomeric components including an alicyclic methacrylate monomer and an alkyl methacrylate monomer. The storage modulus of the middle layer at 25°C is 4 × 10^4 Pa to 1 × 10^5 Pa, and glass transition temperature thereof ranges from -40°C to -10°C. In addition, a hydroxyl group is introduced on one side of the middle layer coming into contact with the adhesive layer. COPYRIGHT KIPO 2017 ...

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Номер записи: 22
31-08-2017 дата публикации

ADHESIVE FILM FOR PROTECTING SURFACE OF SEMICONDUCTOR WAFER AND METHOD OF PRODUCING SAME

Номер: KR1020170099264A
Автор: KIM, EUN YEONG, KIM, JANG SOON, KIM, SANG HWAN, PARK, SUNG CHAN, KIM, WON HO, YOON, MI SEON
Принадлежит:

Disclosed are an adhesive film for protecting the surface of a semiconductor wafer which does not leave an adhesive residue on the surface of the wafer when the adhesive film is peeled away from the semiconductor wafer; and a method of producing the same. The adhesive film for protecting the surface of a semiconductor wafer according to the present invention has a multilayer structure in which a bump absorption layer, an adhesive agent layer, and a release film are formed on top of a substrate film, wherein the bump absorption layer contains a cured product of a composition comprising an acrylic resin polymerized from monomers having alkyl(meth)acrylate having a branched alkyl group having 10-25 carbon atoms; and the adhesive agent layer contains a cured product of a composition comprising a heat-curable resin. COPYRIGHT KIPO 2017 ...

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Номер записи: 23
20-11-2015 дата публикации

SINK-INTEGRATED DISH WASHING APPARATUS

Номер: KR101570844B1
Автор: MOON, KUN HO, PARK, JUN HWA, YUN, ME SUN
Принадлежит: SUSEONG DEVELOPMENT CO., LTD., MOON, KUN HO, PARK, JUN HWA, YUN, ME SUN

The present invention relates to a sink-integrated dish washing apparatus and, more specifically, to a sink-integrated dish washing apparatus which enables a sink bowl to be used for dish-washing and a dishwasher together. The present invention provides the sink-integrated dish washing apparatus, comprising: a grill (200) accommodated in a washing chamber (101) of a sink bowl (100); a cover (300) installed in an opened upper side of the sink bowl (100) to open and close the washing chamber (101); and a water supply pipe installed to supply cold water or hot water to the washing chamber (101). COPYRIGHT KIPO 2016 ...

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Номер записи: 24
16-10-2017 дата публикации

ADHESIVE FILM FOR PROTECTING SURFACE OF SEMICONDUCTOR WAFER

Номер: KR1020170114727A
Автор: KIM, EUN YEONG, PARK, SUNG CHAN, SEO, KWANG SU, KIM, JANG SOON, YOON, MI SEON
Принадлежит:

The present invention comprises: a base layer; an intermediate layer; and an adhesive layer. The intermediate layer comprises a photocurable object of a composition for forming the intermediate layer comprising: a methacrylic resin; a rubber-based resin; a diluted monomer; a thiol compound; and a photoinitiator. Storage modulus at 25 °C of the intermediate layer is 5-100 times the storage modulus at 80 °C of the intermediate layer. COPYRIGHT KIPO 2017 ...

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Номер записи: 25
04-02-2016 дата публикации

DISHWASHER INTEGRATED WITH SINK

Номер: WO2016017868A1
Автор: MOON, Kun Ho, PARK, Jun Hwa, YUN, Me Sun
Принадлежит:

The present invention relates to a dishwasher integrated with a sink and, more specifically, to a dishwasher integrated with a sink for enabling a sink bowl to be used for both dish-washing and a dishwasher. The dishwasher integrated with a sink, according to the present invention, comprises: a grill (200) accommodated in a washing chamber (101) of a sink bowl (100) and holding dishes; a cover (300) provided to an open upper side of the sink bowl (100) so as to open/close the washing chamber (101); and a water supply pipe (400) provided so as to supply cold water or hot water to the washing chamber (101), wherein a plurality of spray nozzles (110) are provided to the side and lower surface of the sink bowl (100) so as to receive, through two or more separated washing water flow pipes (115), washing water stored in a storage tank (130) thereby spraying the washing water at dishes, a washing water discharging part (120) through which the washing water sprayed through the spray nozzles (110 ...

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Номер записи: 26