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Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Применить Всего найдено 25. Отображено 25.
04-04-2017 дата публикации

EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE SEALED BY USING SAME

Номер: KR1020170036975A
Автор: EOM, TAE SHIN, IM, SU MI
Принадлежит:

The present invention relates to an epoxy resin composition for sealing semiconductor devices, and to a semiconductor device sealed by using the same. The epoxy resin composition comprises: an epoxy resin; a curing agent; an inorganic filler; and a coloring agent containing Ti_nO_(2n-1), wherein n is an integer of 4-6. The value of the total weight of the curing agent over the number of aromatic groups included in the curing agent is greater than or equal to 70. COPYRIGHT KIPO 2017 ...

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Номер записи: 1
14-04-2017 дата публикации

반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자

Номер: KR0101726926B1
Автор: 양승용, 엄태신, 이은정, 임수미
Принадлежит: 삼성에스디아이 주식회사

... 본 발명의 반도체 소자 밀봉용 에폭시 수지 조성물은 에폭시수지, 경화제, 무기충전제 및 실리콘고무를 포함하고, 상기 실리콘고무와 무기충전제의 중량비가 1 : 2.5 내지 1 : 15이다.

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Номер записи: 2
01-07-2010 дата публикации

DUAL-LAYER ADHESIVE FILM FOR SEMICONDUCTOR AND DIE BONDING FILM INCLUDING THE SAME

Номер: WO2010074518A3
Автор: SONG, Ki Tae, CHOI, Han Nim, JEONG, Chul, IM, Su Mi, KIM, Sang Jin, HONG, Yong Woo, PARK, Baek Soung
Принадлежит:

The present invention relates to an adhesive layer for a semiconductor and a dual-layer adhesive film prepared by using the same, wherein in order to solve the problem of deteriorating reliability of a semiconductor chip caused by migration of transition metals and transition metal ions, bonding with transition metal ions is used or transition metal ions are oxidized or reduced, and an adhesive layer including a functional group that can remarkably reduce the mobility of a transition method is used; an adhesive film is further formed that enables the flow properties to be assured, taking the subsequent wire bonding process into consideration, so that stability of semiconductor operation may be enhanced, dimensional stability of the adhesive film assured, tensile strength increased, and reliability of the semiconductor chip bonding process enhanced.

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Номер записи: 3
30-05-2016 дата публикации

EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE SEALED BY USING SAME

Номер: KR1020160060261A
Автор: YANG, SEUNG YONG, EOM, TAE SHIN, LEE, EUN JUNG, IM, SU MI
Принадлежит:

The present invention relates to an epoxy resin composition for sealing a semiconductor device and a semiconductor device sealed by using the same. The epoxy resin composition for sealing a semiconductor device comprises: an epoxy resin; a curing agent; inorganic fillers; and a silicone rubber, wherein the weight ratio of the silicone rubber and the inorganic fillers is 1 : 2.5 to 1 : 15. The epoxy resin composition for sealing a semiconductor device has high expansion coefficient and can prevent soldering errors. COPYRIGHT KIPO 2016 ...

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Номер записи: 4
20-08-2015 дата публикации

ANTIMICROBIAL COMPOSITION CONTAINING ACER GINNALA MAXIM. EXTRACT AS ACTIVE INGREDIENT TO BE USED AGAINST SALMONELLA TYPHIMURIUM

Номер: KR1020150094979A
Автор: CHOI, SUN EUN, HAN, JIN SEOP, PARK, CHUL HO, PARK, KWANG HYUN, LIM, SOO MI
Принадлежит:

The present invention relates to an antimicrobial composition containing an Acer ginnala Maxim. extract as an active ingredient. The Acer ginnala Maxim. extract exhibits an excellent antibacterial activity against Salmonella typhimurium which is a zoonosis virus causing salmonellosis, sepsis, cute gastroenteritis, typhoid fever syndrome, typhoid fever, etc. The extract can accordingly be developed as an active ingredient for an antimicrobial functional food product or medicine. COPYRIGHT KIPO 2015 ...

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Номер записи: 5
14-04-2017 дата публикации

반도체 소자 밀봉용 에폭시수지 조성물 및 이를 사용하여 밀봉된 반도체 소자

Номер: KR0101726923B1
Автор: 엄태신, 양승용, 이은정, 임수미
Принадлежит: 삼성에스디아이 주식회사

... 본 발명의 반도체 소자 밀봉용 에폭시 수지 조성물은 에폭시수지, 경화제, 무기충전제 및 착색제를 포함하고, 상기 착색제는 금속옥살레이트수화물을 포함한다.

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Номер записи: 6
26-11-2018 дата публикации

반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 소자

Номер: KR0101922295B1
Автор: 이윤만, 김재현, 엄태신, 이은정, 임수미
Принадлежит: 삼성에스디아이 주식회사

... 본 발명은, 에폭시 수지, 경화제, 무기 충전제, 및 경화촉진제, 커플링제, 이형제 및 착색제로 이루어진 군으로부터 선택된 1종 이상의 첨가제를 포함하고, 겔 함량이 1ppm 이하인 반도체 밀봉용 에폭시 수지 조성물, 그 제조 방법 및 이를 이용해 밀봉된 반도체 소자에 관한 것이다.

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Номер записи: 7
21-12-2017 дата публикации

EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE SEALED USING SAME

Номер: WO2017217638A1
Автор: LEE, Yoon Man, KIM, Jae Hyun, EOM, Tae Shin, LEE, Eun Jung, IM, Su Mi
Принадлежит:

The present invention relates to an epoxy resin composition for sealing a semiconductor device, a preparation method therefor, and a semiconductor device sealed by using the same, the epoxy resin composition, which comprises an epoxy resin, a curing agent, an inorganic filler, and one or more additives selected from the group consisting of a curing accelerator, a coupling agent, a release agent, and a colorant, and has a gel content of approximately 1 ppm or less.

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Номер записи: 8
26-05-2016 дата публикации

반도체 소자 밀봉용 에폭시수지 조성물 및 이를 사용하여 밀봉된 반도체 소자

Номер: KR1020160059089A
Автор: 엄태신, 양승용, 이은정, 임수미
Принадлежит:

... 본 발명의 반도체 소자 밀봉용 에폭시 수지 조성물은 에폭시수지, 경화제, 무기충전제 및 착색제를 포함하고, 상기 착색제는 금속옥살레이트수화물을 포함한다.

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Номер записи: 9
24-07-2017 дата публикации

FOLDABLE LUGGAGE ENSURING EASY STORABILITY

Номер: KR1020170085269A
Автор: SONG, BO RAM, LIM, SU MI, YU, YOUNG SUN, YUN, SEO KYEONG, LEE, SA RANG, KIM, MIN HEE, HAN, HYO MIN, PARK, SEUNG HEE
Принадлежит:

The present invention relates to a foldable luggage ensuring easy storability. Existing hard-type luggage can protect items from external shock as a main body consists of strong solid materials, but requires wide spaces for storage due to being unfoldable. The foldable luggage of the present invention can have spare spaces by folding up in multistages for storage even when the main body is made up of hard solid materials. To this end, a folding line, which is made of durable and stretchable materials, on a border which is folded up in polygonal shapes including rectangular shapes, thereby being easily folded. In addition, the foldable luggage ensuring easy storability includes wheels for movement as a moving unit at the bottom part. COPYRIGHT KIPO 2017 ...

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Номер записи: 10
04-07-2013 дата публикации

DICING DIE BONDING FILM AND METHOD FOR FORMING GROOVE IN DICING DIE BONDING FILM

Номер: WO2013100477A1
Автор: PARK, Baek Soung, CHOI, Jae Won, KIM, Sung Min, KIM, In Hwan, LEE, Jun Woo, IM, Su Mi
Принадлежит:

The present invention relates to a dicing die bonding film in which separation between an adhesion layer and a ring frame is prevented to improve processability, and more particularly, to a dicing die bonding film in which a groove is formed in an attachment area of an adhesion layer attached to a ring frame to prevent an adhesion force from being weakened between a film and the ring frame, and prevent the film and the ring frame from being separated from each other by removing the water and/or air injected during a semiconductor manufacturing process through the groove.

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Номер записи: 11
09-01-2017 дата публикации

GRANULE TYPE EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED BY USING SAME

Номер: KR1020170003379A
Автор: IM, SU MI, YANG, SEUNG YONG, EOM, TAE SHIN, LEE, EUN JUNG
Принадлежит:

The present invention relates to a granule type epoxy resin composition for encapsulating a semiconductor device, which has an average particle size of 500-1,200 μm, as determined according to formula 1 after introducing 200 g of an epoxy resin composition to a sieve vibration system having sieves stacked successively and having a mesh size of 150 μm, 250 μm, 355 μm, 500 μm, 600 μm, 850 μm, 1000 μm, 1700 μm and 2000 μm, and carrying out classification under 80 rpm for 10 minutes. In formula 1, I_i means the weight (g) of the epoxy resin composition remaining on the i^th stacked sieve; D_i is the mesh size of the i^th stacked sieve; and D_i+1 means the mesh size of the i+1^th stacked sieve. COPYRIGHT KIPO 2017 ...

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Номер записи: 12
03-09-2015 дата публикации

ADHESIVE FILM FOR SEMICONDUCTOR DIVICE, AND SEMICONDUCTOR DIVICE USING THE SAME

Номер: KR0101549942B1
Автор: 송규석, 김조균, 박백성, 임수미, 최재원
Принадлежит: 제일모직주식회사

... 본원 발명은 미반응 저분자 물질의 함량이 낮고 내열성이 강하여 고온에서의 조성물의 열분해가 억제된 반도체용 접착 필름으로서 고온 본딩 조건에서도 우수한 신뢰성으로 사용 가능한 반도체용 접착 필름에 관한 것이다. 구체적으로, 본원 발명은 아크릴 바인더, 에폭시 수지, 페놀 수지 및 폴리페닐렌 에테르를 함유하며, 열 중량 분석에 의한 300℃에서의 중량 감소율이 1% 이하인 접착층을 포함하는 반도체용 접착 필름, 및 상기 접착 필름을 이용하여 접착된 신뢰성이 우수한 반도체 장치에 관한 것이다.

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Номер записи: 13
30-03-2017 дата публикации

EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE SEALED USING SAME

Номер: WO2017052243A1
Автор: EOM, Tae Shin, IM, Su Mi
Принадлежит:

The present invention relates to: an epoxy resin composition for sealing a semiconductor device, the composition containing an epoxy resin, a curing agent, an inorganic filler, and a colorant containing TinO2n-1 (here, n is an integer of 4-6), wherein the total weight of the curing agent divided by the number of aromatic groups contained in the curing agent is 70 or greater; and a semiconductor device sealed using the same.

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Номер записи: 14
28-12-2017 дата публикации

EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED BY USING SAME

Номер: KR1020170142977A
Автор: EOM TAE SHIN, IM SU MI
Принадлежит:

The present invention relates to an epoxy resin composition for encapsulating a semiconductor device, comprising an epoxy resin, a curing agent, an inorganic filler and a colorant including Ti_nO_(2n-1), wherein n is an integer of 4-6 and a value obtained by dividing the total weight of the curing agent by the number of aromatic groups contained in the curing agent is 70 or more, and to a semiconductor device encapsulated by using the same. According to the present invention, enough visibility can be secured even when laser marking is performed with low depth. COPYRIGHT KIPO 2018 ...

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Номер записи: 15
08-06-2016 дата публикации

Anti-Bacterial Composition Against Salmonella spp. Comprising Extract from Acer ginnala Max as Active Ingredient

Номер: KR0101628180B1
Автор: 최선은, 한진섭, 박철호, 박광현, 임수미
Принадлежит: 남부대학교산학협력단

... 본 발명은 신나무(Acer ginnala Maxim.) 추출물을 유효성분으로 포함하는 항균용 조성물에 관한 것이다. 본 발명의 신나무 추출물은 살모넬라증(salmonellosis), 패혈증, 급성 위장염, 장티푸스증, 장티푸스성 발열 등을 일으키는 인수공통 전염병균인 살모넬라균(Salmonella spp.)에 대해 우수한 항균활성을 나타내어, 항균용 기능성 식품 또는 의약품의 활성성분으로 개발될 수 있다.

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Номер записи: 16
28-12-2017 дата публикации

EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED USING SAME

Номер: KR1020170142486A
Автор: LEE, YOON MAN, KIM, JAE HYUN, EOM, TAE SHIN, LEE, EUN JUNG, IM, SU MI
Принадлежит:

The present invention relates to an epoxy resin composition for encapsulating a semiconductor device which comprises an epoxy resin, a curing agent, an inorganic filler, and at least one additive selected from a group consisting of a curing accelerator, a coupling agent, a releasing agent and a colorant, and has a gel content of 1 ppm or less; and to a semiconductor device encapsulated using the same. COPYRIGHT KIPO 2018 ...

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Номер записи: 17
01-07-2010 дата публикации

DUAL-LAYER ADHESIVE FILM FOR SEMICONDUCTOR AND DIE BONDING FILM INCLUDING THE SAME

Номер: KR2010074518A2
Автор: SONG, Ki Tae, CHOI, Han Nim, JEONG, Chul, IM, Su Mi, KIM, Sang Jin, HONG, Yong Woo, PARK, Baek Soung
Принадлежит:

The present invention relates to an adhesive layer for a semiconductor and a dual-layer adhesive film prepared by using the same, wherein in order to solve the problem of deteriorating reliability of a semiconductor chip caused by migration of transition metals and transition metal ions, bonding with transition metal ions is used or transition metal ions are oxidized or reduced, and an adhesive layer including a functional group that can remarkably reduce the mobility of a transition method is used; an adhesive film is further formed that enables the flow properties to be assured, taking the subsequent wire bonding process into consideration, so that stability of semiconductor operation may be enhanced, dimensional stability of the adhesive film assured, tensile strength increased, and reliability of the semiconductor chip bonding process enhanced.

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Номер записи: 18
15-06-2016 дата публикации

EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE SEALED USING SAME

Номер: KR1020160068127A
Автор: IM, SU MI, EOM, TAE SHIN, PARK, SUNG JUN, YANG, SEUNG YONG, LEE, EUN JUNG
Принадлежит:

The present invention relates to an epoxy resin composition for sealing a semiconductor device wherein the epoxy resin composition contains an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, and sulfonic ester represented by chemical formula 1. In the chemical formula 1, R refers to an alkyl group having 1-6 carbon atoms, k and m are integers from 1 to 10, whereas n is an integer of 0-6. COPYRIGHT KIPO 2016 ...

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Номер записи: 19
30-01-2023 дата публикации

조직 수복용 분말 제형 및 이의 제조 방법, 및 이를 포함하는 조직 수복용 주사제 조성물

Номер: KR20230014665A
Автор: 박지훈, 윤혜성, 임수미
Принадлежит:

... 본 발명은 조직 수복용 분말 제형 및 이의 제조 방법, 및 이를 포함하는 조직 수복용 주사제 조성물에 관한 것으로, 보다 구체적으로는, 친수성 생체적합성 고분자와 소수성 생체적합성 고분자의 공중합체로서, 수성 매질 내에서 특정 범위의 평균 직경을 나타내는 미셀(micelle) 형태의 나노입자를 형성하고/하거나, 상기 친수성 고분자의 분자량 대 상기 소수성 고분자의 분자량 비율이 특정 수준 이하인, 생체적합성 공중합체를 포함하며, 분말 형태로서 운반, 보관 및 취급이 용이하고, 실온의 수성 매질에서 쉽게 용해되어 안정한 나노입자를 형성하며, 체내에 도입된 이후에는 대식세포에 탐식되지 않고 콜라겐을 유도하여 우수한 조직 수복 효과를 나타내는, 분말 제형 및 이의 제조 방법, 및 이를 포함하는 조직 수복용 주사제 조성물에 관한 것이다.

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Номер записи: 20
14-04-2017 дата публикации

반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자

Номер: KR0101726929B1
Автор: 임수미, 엄태신, 박성준, 양승용, 이은정
Принадлежит: 삼성에스디아이 주식회사

... 본 발명은 에폭시 수지, 경화제, 경화 촉진제, 무기 충전제 및 하기 화학식1로 표시되는 설포닉 에스테르를 포함하는 반도체 소자 밀봉용 에폭시 수지 조성물에 관한 것이다. [화학식1] (상기 화학식1에서 R은 탄소수 1 내지 6의 알킬기이고, k는 1 내지 10의 정수이고, m은 1 내지 10의 정수이고, n은 0 내지 6의 정수 이다) ...

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Номер записи: 21
19-09-2018 дата публикации

과립상 반도체 소자 봉지용 에폭시 수지 조성물 및 이를 사용하여 봉지된 반도체 소자

Номер: KR0101900549B1
Автор: 임수미, 양승용, 엄태신, 이은정
Принадлежит: 삼성에스디아이 주식회사

... 본 발명은 에폭시 수지 조성물 200g을 격자눈의 크기가 각각 150㎛, 250㎛, 355㎛, 500㎛, 600㎛, 850㎛, 1000㎛, 1700㎛, 및 2000㎛인 체(sieve)들이 상기 순서대로 적층되어 있는 체진동기에 투입한 후, 80rpm으로 10분간 분급시킨 다음, 하기 식 1에 따라 측정한 에폭시 수지 조성물의 평균 입도가 500 내지 1,200㎛인 과립상 반도체 소자 봉지용 에폭시 수지 조성물에 관한 것이다. <식 1> 상기 식 1에서, Ii는 i번째로 적층된 체 상에 남은 에폭시 수지 조성물의 중량(g)이며, Di는 i번째로 적층된 체의 격자눈의 크기(㎛)이며, Di+1는 i+1번째로 적층된 체의 격자눈의 크기(㎛)임.

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Номер записи: 22
05-01-2017 дата публикации

GRANULAR EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR DEVICE ENCAPSULATION, AND SEMICONDUCTOR DEVICE ENCAPSULATED BY USING SAME

Номер: WO2017003087A1
Автор: IM, Su Mi, YANG, Seung Yong, EOM, Tae Shin, LEE, Eun Jung
Принадлежит:

The present invention relates to a granular epoxy resin composition for semiconductor device encapsulation, wherein the average particle size of the epoxy resin composition is approximately 500-1,200 μm when the average particle size is measured according to formula 1 after injecting 200 g of the epoxy resin composition into a sieve shaker having sieves, which respectively have mesh sizes of 150 μm, 250 μm, 355 μm, 500 μm, 600 μm, 850 μm, 1,000 μm, 1,700 μm and 2,000 μm and are layered in this order, and then classifying the same at 80 rpm for 10 minutes.

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Номер записи: 23
27-06-2013 дата публикации

ADHESIVE COMPOSITION FOR SEMICONDUCTOR, AND ADHESIVE FILM COMPRISING SAME

Номер: WO2013094998A1
Автор: LEE, Jun Woo, KIM, Sung Min, KIM, In Hwan, PARK, Baek Soung, IM, Su Mi, CHOI, Jae Won
Принадлежит:

The present invention relates to a semiconductor adhesive film, wherein the curing rate by DSC at the first step is 40% or less on the basis of the total curing rate 100%, the curing rate by DSC at the fourth step is higher by 30-60 % than the curing rate at the third step, and the curing rates at the second step and the third step are higher by 5% or more than the curing rate of the previous step during a curing process comprising the first step at 120-130 ℃ for 1-20 minutes, the second step at 140-150 ℃ for 1-10 minutes, the third step at 160-180 ℃ for 30 seconds to 10 minutes, and the fourth step at 160-180 ℃ for 10 minutes to 2 hours.

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Номер записи: 24
27-05-2016 дата публикации

An adhesive film for radiating heat, a semiconductor device comprising the same, and a method for producing the device

Номер: KR0101625264B1
Автор: 박백성, 최재원, 김인환, 송규석, 임수미
Принадлежит: 제일모직주식회사

... 본 발명은 열전도성 입자를 포함하고, 반도체 소자를 몰딩하는 보호층 및 상기 보호층 상에 형성된 방열 금속층 사이에 위치하여 상기 보호층과 방열 금속층을 접착시키고, 상기 보호층 및 상기 방열 금속층과의 접착력이 각각 3kgf/25mm2이상인 방열 접착 필름, 이를 포함하는 반도체 장치 및 상기 반도체 장치의 제조 방법에 관한 것이다.

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Номер записи: 25