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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 22. Отображено 22.
27-06-2013 дата публикации

METHOD FOR MANUFACTURING A METAL PRINTED CIRCUIT BOARD

Номер: WO2013095075A1
Автор: CHUNG, Kwang-Choon, CHO, Nam Boo, HAN, Young-Koo, YOO, Myung Bong, ON, Woong Ku
Принадлежит:

The invention relates to a method for manufacturing a metal printed circuit board, comprising the steps of: printing a circuit pattern on a release film; applying a thermally conductive insulation layer onto the circuit pattern; placing a thermally conductive base layer onto the thermally conductive insulation layer and performing hot pressing; and removing the release film.

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Номер записи: 1
09-09-2016 дата публикации

전도성 패턴 형성 방법 및 전도성 패턴

Номер: KR0101656452B1
Автор: 정광춘, 유지훈, 성준기, 한대상, 조남부
Принадлежит: 주식회사 잉크테크

... 본 발명은 전도성 패턴 형성 방법에 관한 것이며, 본 발명의 전도성 패턴 형성 방법은 기판 상에 적어도 일부 구간이 표면으로부터 깊이방향을 따라서 폭이 감소하는 형태의 홈을 형성하는 홈 형성단계; 상기 홈의 내부에 전도성 잉크 조성물을 충진하는 충진단계; 상기 홈 내부의 전도성 잉크 조성물에 포함되는 용매가 휘발하도록 건조하는 건조단계;를 포함하는 것을 특징으로 한다. 따라서, 본 발명에 의하면, 기판에 형성되는 미세 홈의 형상을 변형하여 공정효율을 개선하는 동시에, 전도성 잉크 조성물의 성분을 조절하여 전기적 특성 및 광학적 특성을 용이하게 제어할 수 있는 전도성 패턴 형성 방법 및 전도성 패턴이 제공된다.

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Номер записи: 2
27-09-2012 дата публикации

METHOD FOR MANUFACTURING METAL THIN FILM

Номер: WO2012128570A2
Автор: CHUNG, Kwang-Choon, CHO, Hyun-Nam, CHO, Nam Boo, JIN, Seok Pil, PARK, Kwang-Jin, KWON, Hyuk Hwan, LIM, Tai Ho, JIN, Sun Mi, LEE, Don Sin
Принадлежит:

The present invention provides a method for manufacturing a metal thin film, which comprises the steps of: a) preparing a metal layer on a substrate layer; and b) forming an adhesive pattern layer by patterning an adhesive on the metal layer in a predetermined pattern.

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Номер записи: 3
27-09-2012 дата публикации

METHOD FOR PRODUCING A METAL THIN FILM

Номер: WO2012128571A2
Автор: CHUNG, Kwang-Choon, CHO, Hyun-Nam, CHO, Nam Boo, JIN, Seok Pil, PARK, Kwang-Jin, KWON, Hyuk Hwan, LIM, Tai Ho, JIN, Sun Mi, LEE, Don Sin
Принадлежит:

The present invention relates to a method for producing a metal thin film, comprising: a) a step of preparing a metal layer on a base layer; and b) a step of forming a surface treatment layer using a surface treatment agent, containing a silane coupling agent and/or an acid, on the metal layer.

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Номер записи: 4
05-12-2019 дата публикации

INSULATION FILM AND METHOD FOR MANUFACTURING INSULATION FILM

Номер: WO2019231028A1
Автор: CHO, Nam Bu, PARK, Kwang Jin, KU, Kyoung Mo, NAM, Mi Rae, CHO, Ha Na
Принадлежит:

The present invention relates to a thin film coated insulation film comprising a carrier film, an insulation layer formed by coating an insulation resin using the carrier film, and a B-stage adhesive layer which is on one surface of the insulation layer, and to a thin film coated insulation film having a resin solution that has insulation and adhesive functions coated on one surface of the carrier film, so that the filling ratio of a printed circuit wiring part is at least 75% and the elastic modulus is at most 15 g.f/㎠.

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Номер записи: 5
07-02-2013 дата публикации

METHOD FOR MANUFACTURING A REFLECTIVE FILM AND REFLECTIVE FILM MANUFACTURED THEREBY

Номер: WO2013019037A3
Автор: CHUNG, Kwang-Choon, CHO, Hyun-Nam, CHO, Nam Boo, JIN, Seok Pil, PARK, Kwang-Jin, KWON, Hyuk Hwan, LIM, Tai Ho, JIN, Sun Mi, LEE, Don Sin
Принадлежит:

The present invention relates to a method for manufacturing a reflective film and a reflective film manufactured thereby. The method for manufacturing the reflective film includes a step of forming an adhesive pattern layer by patterning an adhesive in a predetermined shape on a reflective layer.

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Номер записи: 6
27-09-2012 дата публикации

METHOD FOR PRODUCING A METAL THIN FILM

Номер: WO2012128571A3
Автор: CHUNG, Kwang-Choon, CHO, Hyun-Nam, CHO, Nam Boo, JIN, Seok Pil, PARK, Kwang-Jin, KWON, Hyuk Hwan, LIM, Tai Ho, JIN, Sun Mi, LEE, Don Sin
Принадлежит:

The present invention relates to a method for producing a metal thin film, comprising: a) a step of preparing a metal layer on a base layer; and b) a step of forming a surface treatment layer using a surface treatment agent, containing a silane coupling agent and/or an acid, on the metal layer.

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Номер записи: 7
27-06-2019 дата публикации

ELECTROMAGNETIC WAVE SHIELDING FILM, METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING ELECTROMAGNETIC WAVE SHIELDING FILM

Номер: WO2019124624A1
Автор: CHUNG, Kwang-Choon, CHO, Nam-Bu, PARK, Kwang Jin, YOON, Hee Keun
Принадлежит:

The present invention relates to an electromagnetic wave shielding film, a method for manufacturing a printed circuit board, and a method for manufacturing an electromagnetic wave shielding film. The electromagnetic wave shielding film according to the present invention comprises: a carrier film; a conductive metal layer formed on one surface of the carrier film; a conductive bonding layer formed on the metal layer; and a protection film formed on the conductive bonding layer.

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Номер записи: 8
12-09-2014 дата публикации

ELECTROMAGNETIC INTERFERENCE SHIELDING FILM AND METHOD FOR MANUFACTURING SAME

Номер: WO2014137162A1
Автор: CHUNG, Kwang Choon, YOO, Myung Bong, CHO, Nam Boo, YANG, Kyung Su, NOH, Seung Hoon
Принадлежит:

Disclosed are an electromagnetic interference (EMI) shielding film and a method for manufacturing the same, the EMI shielding film comprising: an insulation layer including a binder resin and at least one kind selected from the group consisting of a flame retardant and a filler; and a conductive adhesive layer including a binder resin and a conductive filler, wherein the binder resin comprises a reaction product obtained by a curing reaction between at least one selected from the group consisting of polyester and polyurethane and an epoxy group-containing curing agent. The EMI shielding adhesive film according to the present invention has excellent adhesive strength to electronic components, heat resistance, electrical conductivity, flexibility, chemical resistance, and flame retardancy. In particular, the EMI shielding adhesive film can be reliably applied to one or both sides of a FPCB where high flexibility, high adhesive strength, high heat resistance, and the like are required, and ...

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Номер записи: 9
21-03-2017 дата публикации

전도성 투명기판 제조방법 및 전도성 투명기판

Номер: KR0101717983B1
Автор: 정광춘, 유지훈, 성준기, 김병훈, 조남부, 유명봉
Принадлежит: 주식회사 잉크테크

... 본 발명은 전도성 투명기판 제조방법에 관한 것이며, 본 발명의 전도성 투명기판 제조방법은 기판 상에 상호 이격되도록 배열되는 복수개의 주전극을 형성하는 주전극 형성단계; 복수개의 주전극이 서로 전기적으로 단절되는 복수개의 그룹전극으로 그룹화되도록 둘 이상의 주전극을 전기적으로 연결하는 연결전극을 형성하는 연결전극 형성단계;를 포함하는 것을 특징으로 한다. 따라서, 본 발명에 의하면, 투과성이 우수한 전도성 투명기판을 높은 수율의 공정을 통하여 제작할 수 있는 전도성 투명기판 제조방법 및 전도성 투명기판이 제공된다.

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Номер записи: 10
07-10-2010 дата публикации

METHOD FOR MANUFACTURING THIN METAL LAMINATED FILM

Номер: WO2010114300A3
Автор: CHUNG, Kwang Choon, CHO, Hyun-Nam, CHO, Nam-Boo, YOO, Ji Hoon
Принадлежит:

The present invention relates to a method for manufacturing a thin metal laminated film. More specifically, the invention is a method for manufacturing thin metal laminated film, having a high-shield metal layer as its basic configuration material, by forming a resin layer on atypically processed film (separate film) or atypical paper. The thin metal laminated film according to the invention is able to improve heat-resistance, adhesive force and flexibility, and thus is able to obtain high frequency shielding properties for thin film. In addition, the thin metal laminated film enables mass production and cost reduction by reducing production time.

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Номер записи: 11
07-02-2013 дата публикации

METHOD FOR MANUFACTURING A REFLECTIVE FILM AND REFLECTIVE FILM MANUFACTURED THEREBY

Номер: WO2013019037A2
Автор: CHUNG, Kwang-Choon, CHO, Hyun-Nam, CHO, Nam Boo, JIN, Seok Pil, PARK, Kwang-Jin, KWON, Hyuk Hwan, LIM, Tai Ho, JIN, Sun Mi, LEE, Don Sin
Принадлежит:

The present invention relates to a method for manufacturing a reflective film and a reflective film manufactured thereby. The method for manufacturing the reflective film includes a step of forming an adhesive pattern layer by patterning an adhesive in a predetermined shape on a reflective layer.

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Номер записи: 12
07-10-2010 дата публикации

METHOD FOR FABRICATING THIN FILM CAPACITOR

Номер: KR2010114301A2
Автор: CHUNG, Kwang Choon, CHO, Hyun-Nam, CHO, Nam-Boo, YOO, Ji Hoon
Принадлежит:

The present invention relates to a method for fabricating a thin film capacitor. More particularly, the present invention relates to a thin film capacitor comprising a lower electric layer, a dielectric layer and an upper electric layer, wherein a metal ink imprint includes an organic metal complex, the lower electric layer, and the upper electric layer as essential components and is formed by being printed or coated. According to the present invention, a high quality thin film capacitor can be fabricated due to high improvement in the interface characteristics between an electric layer and a dielectric layer. Furthermore, mass production of a thin film capacitor can be accomplished with low costs because a roll-to-roll solution printing process can be applied to a manufacturing process.

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Номер записи: 13
17-01-2017 дата публикации

METHOD FOR MANUFACTURING ELECTROMAGNETIC INTERFERENCE SHIELDING FILM AND ELECTROMAGNETIC INTERFERENCE SHIELDING FILM MANUFACTURED THEREBY

Номер: KR1020170006301A
Автор: CHUNG, KWANG CHOON, CHO, NAM BU, KIM, DO HYUN, JIN, SEOK PIL, HUH, YOU SUNG, SONG, JUNG GEUN
Принадлежит:

The present invention relates to a method for manufacturing an electromagnetic interference shielding film and an electromagnetic interference shielding film manufactured thereby. The method includes: an insulation layer forming step of forming an insulation layer on a first release film; a metal pattern forming step of printing a metal pattern on the insulation layer; a conductive adhesive layer forming step of forming a conductive adhesive layer on a second release film; and a release film laminating step of forming an electromagnetic wave shielding film by laminating the first release film and the second release film to be faced with the metal pattern and the conductive adhesive layer. According to the manufacturing method of the electromagnetic wave shielding film, excellent durability can be obtained by improving adhesive force between layers constituting the shielding film, and the efficiency of a manufacturing process can be enhanced. COPYRIGHT KIPO 2017 ...

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Номер записи: 14
15-05-2014 дата публикации

METHOD FOR MANUFACTURING METAL PRINTED CIRCUIT BOARD

Номер: WO2014073876A1
Автор: CHUNG, Kwang Choon, YOON, Kwang Baek, AHN, Hee Yong, HAN, Young Koo, YOO, Myung Bong, CHO, Nam Boo, ON, Woong Ku
Принадлежит:

The present invention provides a method for manufacturing a metal printed circuit board, comprising the steps of: printing a light reflection layer on a release film; printing a circuit pattern on the light reflection layer; forming a thermal conductive insulation layer on the circuit pattern; and removing the release film.

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Номер записи: 15
06-10-2011 дата публикации

METHOD FOR MANUFACTURING A DOUBLE-SIDED PRINTED CIRCUIT BOARD

Номер: WO2011122723A1
Автор: CHUNG, Kwang Choon, HAN, Young-Koo, YOO, Myung-Bong, CHO, Nam-Boo, HAN, Young-Ho, LEE, Kyong-Min, YOON, Kwang-Baek, AHN, Hee-Yong, KIM, Su-Han
Принадлежит:

Disclosed is a method for manufacturing a double-sided printed circuit board (PCB) having a circuit pattern by printing a conductive paste. According to the method of the present invention, a circuit pattern that is precise and highly conductive can be formed, and a reduction in raw materials and the simplification of processes are made possible. Also, due to the printing of the conductive paste, short-circuiting can be prevented even when a conductive layer is bent or exposed to heat or physical impact.

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Номер записи: 16
29-12-2011 дата публикации

METHOD FOR MANUFACTURING ELECTROMAGNETIC SHIELDING FILM AND ELECTROMAGNETIC SHIELDING FILM MANUFACTURED THEREBY

Номер: KR2011162453A1
Автор: CHUNG, Kwang Choon, CHO, Hyun Nam, YOO, Myung Bong, CHO, Nam Boo, JIN, Seok Pil, NO, Seong Hoon, CHO, Dong Joon, JUNG, Yon Joong, LEE, Sang Rak
Принадлежит:

The present invention provides a method for manufacturing an electromagnetic shielding film and an electromagnetic shielding film manufactured thereby, the method comprising the steps of: a) providing a single insulating layer on a first protective film, during which the insulating layer is formed from an insulating layer composition comprising at least one type of resin selected from a thermoplastic resin and a thermosetting resin and at least one type of filler selected from a flame-resistant filler and an abrasion-resistant filler; b) providing a metal layer on the insulating layer; c) providing a conductive adhesive layer on the metal layer, during which the conductive adhesive layer is formed from a conductive adhesive layer composition comprising a conductive filler and at least one type of resin selected from a thermoplastic resin and a thermosetting resin; and d) providing a second protective film on the conductive adhesive layer.

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Номер записи: 17
08-01-2015 дата публикации

CONDUCTIVE TRANSPARENT SUBSTRATE MANUFACTURING METHOD, AND CONDUCTIVE TRANSPARENT SUBSTRATE

Номер: WO2015002515A1
Автор: CHUNG, Kwang-Choon, YOO, Ji Hoon, SEONG, Joonki, KIM, Byung Hun, CHO, Nam-Boo, YOO, Myung-Bong
Принадлежит:

The present invention relates to a conductive transparent substrate manufacturing method, and the conductive transparent substrate manufacturing method of the present invention comprises: a main electrode formation step for forming a plurality of main electrodes arranged on a substrate so as to be spaced from each other; and a connection electrode formation step for forming a connection electrode for electrically connecting two or more main electrodes such that the plurality of main electrodes are grouped into a plurality of group electrodes electrically cut off from each other. Thus, according to the present invention, provided are the conductive transparent substrate manufacturing method which is capable of manufacturing a conductive transparent substrate with excellent transmittance through a process at a high yield rate, and the conductive transparent substrate.

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Номер записи: 18
27-09-2012 дата публикации

METHOD FOR MANUFACTURING METAL THIN FILM

Номер: WO2012128570A3
Автор: CHUNG, Kwang-Choon, CHO, Hyun-Nam, CHO, Nam Boo, JIN, Seok Pil, PARK, Kwang-Jin, KWON, Hyuk Hwan, LIM, Tai Ho, JIN, Sun Mi, LEE, Don Sin
Принадлежит:

The present invention provides a method for manufacturing a metal thin film, which comprises the steps of: a) preparing a metal layer on a substrate layer; and b) forming an adhesive pattern layer by patterning an adhesive on the metal layer in a predetermined pattern.

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Номер записи: 19
06-07-2015 дата публикации

METHOD FOR MANUFACTURING ELECTROMAGNETIC INTERFERENCE SHIELDING FILM AND ELECTROMAGNETIC INTERFERENCE SHIELDING FILM MANUFACTURED THEREBY

Номер: KR1020150075912A
Автор: CHUNG, KWANG CHOON, CHO, NAM BU, KIM, DO HYUN, JIN, SEOK PIL, HUH, YOU SUNGL, SONG, JUNG GEUN
Принадлежит:

The present invention relates to a method for manufacturing an electromagnetic interference shielding film and an electromagnetic interference shielding film manufactured thereby. The method for manufacturing the electromagnetic interference shielding film includes an insulation layer forming step of forming an insulation layer on a first release film, a metal pattern forming step of printing a metal pattern on the insulation layer, a conductive adhesive forming step of forming a conductive adhesive layer on a second release film, and a release film bonding step of forming the electromagnetic interference shielding film by bonding the first release film to the second release film to make a contact between the metal pattern and the conductive adhesive layer. According to the method for manufacturing the electromagnetic interference shielding film, the efficiency of a manufacturing process is improved and high durability is obtained by improving an adhesion between the layers comprising the ...

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Номер записи: 20
07-10-2010 дата публикации

METHOD FOR MANUFACTURING THIN METAL LAMINATED FILM

Номер: KR2010114300A2
Автор: CHUNG, Kwang Choon, CHO, Hyun-Nam, CHO, Nam-Boo, YOO, Ji Hoon
Принадлежит:

The present invention relates to a method for manufacturing a thin metal laminated film. More specifically, the invention is a method for manufacturing thin metal laminated film, having a high-shield metal layer as its basic configuration material, by forming a resin layer on atypically processed film (separate film) or atypical paper. The thin metal laminated film according to the invention is able to improve heat-resistance, adhesive force and flexibility, and thus is able to obtain high frequency shielding properties for thin film. In addition, the thin metal laminated film enables mass production and cost reduction by reducing production time.

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Номер записи: 21
07-10-2010 дата публикации

METHOD FOR FABRICATING THIN FILM CAPACITOR

Номер: WO2010114301A3
Автор: CHUNG, Kwang Choon, CHO, Hyun-Nam, CHO, Nam-Boo, YOO, Ji Hoon
Принадлежит:

The present invention relates to a method for fabricating a thin film capacitor. More particularly, the present invention relates to a thin film capacitor comprising a lower electric layer, a dielectric layer and an upper electric layer, wherein a metal ink imprint includes an organic metal complex, the lower electric layer, and the upper electric layer as essential components and is formed by being printed or coated. According to the present invention, a high quality thin film capacitor can be fabricated due to high improvement in the interface characteristics between an electric layer and a dielectric layer. Furthermore, mass production of a thin film capacitor can be accomplished with low costs because a roll-to-roll solution printing process can be applied to a manufacturing process.

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Номер записи: 22