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Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Применить Всего найдено 34. Отображено 34.
26-02-2018 дата публикации

레지스트막 패터닝 방법 및 이의 구현을 위한 노광기

Номер: KR0101832503B1
Автор: 최운철, 이환수, 차혜연
Принадлежит: 삼성전기주식회사

... 본 발명은 레지스트막 패터닝 방법에 관한 것으로, 본 발명의 실시예에 따른 레지스트막 패터닝 방법은 레지스트막이 형성된 기판을 준비하는 단계, 상기 레지스트막의 노광 영역 및 비노광 영역을 정의하는 단계, 그리고 상기 노광 영역에 대해 영역별로 상이한 파장의 광을 조사하여, 상기 레지스트막에 수직한 측벽 프로파일을 갖는 레지스트 패턴을 형성하는 단계를 포함한다.

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03-08-2015 дата публикации

INDUCTOR AND MANUFACTURING METHOD OF THE INDUCTOR

Номер: KR0101541581B1
Принадлежит: 삼성전기주식회사

... 본 발명은 인덕터용 금속-폴리머 복합체 필름 및 인덕터 제조방법에 관한 것으로, 금속분말; 및 비정질 에폭시 수지;를 포함하되, 상기 금속분말의 중량비가 75~98wt%인 혼합물이 필름 형상으로 이루어진 인덕터용 금속-폴리머 복합체 필름을 이용하여 인덕터를 제조함으로써, 복수 개의 인덕터를 동시에 제조할 수 있게 되어 생산효율이 향상되며, 인덕터의 특성값 또한 개선될 수 있다.

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31-05-2018 дата публикации

COIL COMPONENT AND MANUFACTURING METHOD THEREOF

Номер: KR101863280B1
Принадлежит: SAMSUNG ELECTRO-MECHANICS CO., LTD.

The present disclosure relates to a coil component capable of maintaining excellent hardness and a manufacturing method thereof. The coil component comprises: a body unit including a magnetic substance; and a coil unit disposed in the body unit. The coil unit includes a first coil pattern layer having a flat spiral pattern, an insulating layer for embedding at least a part of the first coil pattern layer, and a second coil pattern layer disposed on the insulating layer and having the flat spiral pattern. The insulating layer includes a core material and has thickness of a lower region of the insulating layer larger than thickness of an upper region of the insulating layer with respect to the core material. COPYRIGHT KIPO 2018 (AA) Fourth direction (BB) Second direction ...

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28-03-2018 дата публикации

CHIP ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

Номер: KR1020180031653A
Принадлежит:

The present invention relates to a chip electronic component and a manufacturing method thereof wherein the chip electronic component comprises: a magnetic body in which a coil conductor pattern unit is buried; and an oxide film formed on a surface of the coil conductor pattern unit. According to an embodiment of the present invention, the chip electronic component prevents exposure of the coil conductor pattern unit while forming an insulation film thinner than an existing insulation film so as to block a magnetic material from directly contacting the coil conductor pattern unit, thereby preventing waveform defects at a high frequency. COPYRIGHT KIPO 2018 ...

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28-12-2015 дата публикации

Chip inductor

Номер: KR0101580709B1
Принадлежит: 삼성전기주식회사

... 본 발명은 칩 인덕터에 관한 것이다. 본 발명에 따른 칩 인덕터는, 관통구가 형성된 기판; 상기 기판 상에 형성된 도전체 코일; 상기 기판의 중앙부에 코어가 형성되게 상기 도전체 코일을 둘러싸도록 충진된 상부 수지복합 자성층; 상기 기판의 하부에 형성된 하부 수지복합 자성층; 및 상기 상, 하부 수지복합 자성층의 양측에 형성된 외부전극;을 포함한다.

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13-06-2016 дата публикации

METHOD FOR MANUFACTURING CHIP ELECTRONIC COMPONENT

Номер: KR101630092B1
Принадлежит: SAMSUNG ELECTRO-MECHANICS CO., LTD.

The present invention relates to a method for manufacturing a chip electronic component which has high inductance (L), excellent Q properties (quality factor), and DC-bias properties (inductance variation properties by applying current). The method for manufacturing a chip electronic component comprises the following steps of: forming a magnetic material main body having an inner coil unit embedded therein; and forming a cover unit including a metal magnetic plate in at least one of upper and lower parts of the magnetic material main body. COPYRIGHT KIPO 2016 ...

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23-08-2016 дата публикации

COIL ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

Номер: KR1020160099882A
Принадлежит:

The present invention relates to a coil electronic component which can implement high inductance and an excellent quality factor. The coil electronic component comprises: a magnetic material body including a magnetic material, and a coil unit embedded in the magnetic material body. A magnetic layer is formed on a surface of the magnetic material body. COPYRIGHT KIPO 2016 ...

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03-11-2015 дата публикации

Chip electronic component and manufacturing method thereof

Номер: KR0101565703B1
Принадлежит: 삼성전기주식회사

... 본 발명은 코일 도체 패턴부가 매설된 자성체 본체; 및 상기 코일 도체 패턴부의 표면에 형성된 산화 절연막;을 포함하는 칩 전자부품 및 그 제조방법에 관한 것이다. 본 발명의 일 실시형태의 칩 전자부품 및 그 제조방법에 의하면 종래의 절연막보다 박막의 절연막이 형성되면서도 코일 도체 패턴부의 노출을 방지하여 자성체 재료와 코일 도체 패턴부가 직접 접촉하지 않으며, 이에 따라 고주파에서의 파형 불량을 방지할 수 있다.

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29-11-2016 дата публикации

COIL ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

Номер: KR1020160136049A
Принадлежит:

The present invention relates to a coil electronic component which comprises a magnetic body including a core unit and a coil wound around the core unit. The core unit includes a metal flake and a resin. The core unit is formed by injection molding. The coil electronic component can maximize a magnetic filling rate, and can implement high magnetic permeability. COPYRIGHT KIPO 2016 ...

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18-06-2018 дата публикации

INDUCTOR

Номер: KR1020180065801A
Принадлежит:

The present disclosure relates to an inductor which comprises: a body; and an external electrode arranged on an external surface of the body, and electrically connected to a coil extraction unit of a coil pattern in the body. The body includes: a support member including at least one protrusion which supports the coil extraction unit and has a through unit passing through the support member arranged therein; the coil pattern supported by the support member and including the coil extraction unit; and an encapsulant. By reducing a height deviation of the coil pattern in the inductor, the reliability of the inductor is improved. COPYRIGHT KIPO 2018 ...

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06-10-2015 дата публикации

CHIP ELECTRONIC COMPONENT AND MOUNTING BOARD THEREOF

Номер: KR101558092B1
Принадлежит: SAMSUNG ELECTRO-MECHANICS CO., LTD.

The present invention provides a chip electronic component which includes: a magnetic material main body comprising an insulating substrate, and a coil conductive pattern formed at least one surface of the insulating substrate; and an external electrode formed on both end units of the magnetic material main body to be connected to an end unit of the coil conductive pattern. The coil conductive pattern is formed by metal plating. In a cross section of the magnetic material main body in a longitudinal direction, a ratio of an outermost coil conductive pattern compared to an inner coil conductive pattern of the coil conductive pattern satisfies 1.0 to 1.5. COPYRIGHT KIPO 2016 ...

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11-10-2016 дата публикации

COIL ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

Номер: KR1020160118052A
Принадлежит:

The present invention relates to a coil electronic component having a coil unit surrounded by a magnetic material. A metal magnetic plate is arranged in the magnetic material, and is arranged toward a flow direction of magnetic flux. The coil electronic component has high inductance (L), and excellent Q properties (quality factor) and DC-bias properties (change properties of the inductance by current application). COPYRIGHT KIPO 2016 ...

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26-06-2015 дата публикации

CHIP ELECTRONIC COMPONENT AND MOUNTING SUBSTRATE THEREOF

Номер: KR101532172B1
Принадлежит: SAMSUNG ELECTRO-MECHANICS CO., LTD.

The present invention provides a chip electronic component which includes a magnetic body which includes an insulation substrate and a coil conductive pattern which is formed on at least one side of the insulation substrate and an external electrode which is formed on both ends of the magnetic body to be connected to the end of the coil conductive pattern. The coil conductive pattern includes a pattern plating layer, an electroplating layer which is formed on the pattern plating layer, and an anisotropic plating layer which is formed on the electroplating layer. In the cross section of the length-thickness direction of the magnetic body, the length of the lower side of the electroplating layer near the insulation substrate is longer than the length of the upper side of the electroplating layer. COPYRIGHT KIPO 2015 ...

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01-12-2015 дата публикации

CHIP ELECTRONIC COMPONENT AND MOUNT BOARD THEREOF

Номер: KR1020150134014A
Принадлежит:

The present invention provides a chip electronic component which comprises: a magnetic material body including an insulating substrate and coil conductor patterns formed on at least one surface of the insulating substrate; and external electrodes formed on both end portions of the magnetic material body so as to be connected to end portions of the coil conductor patterns, respectively. In a cross section of the magnetic material body in a length direction, a thickness of the innermost coil conductor pattern is thinner than thicknesses of the other coil conductor patterns. COPYRIGHT KIPO 2016 ...

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29-10-2018 дата публикации

코일 전자부품 및 그 제조방법

Номер: KR0101912275B1
Принадлежит: 삼성전기 주식회사

... 본 발명은 코일 전자부품 및 그 제조방법에 관한 것으로, 보다 상세하게는 코일 패턴이 노출되는 절연층 미형성부 없이 코일 패턴의 하부까지도 절연층을 형성하도록 하여 외부 자성체 재료와 코일 패턴이 직접 접촉하지 않으면서도, 절연층의 폭을 감소시킨 박막의 절연층을 형성하여 고주파에서의 파형 불량을 방지하고, 인덕터의 용량 등을 향상시킬 수 있는 코일 전자부품 및 그 제조방법에 관한 것이다.

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22-06-2015 дата публикации

COIL ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

Номер: KR1020150068940A
Принадлежит:

The present invention relates to a coil electronic component and a manufacturing method thereof, and more specifically, to a coil electronic component and a manufacturing method thereof for preventing a defect in waveform at a high frequency and enhancing the capacity of an inductor, etc. by forming an insulation layer even at the bottom of a coil pattern without a part with no insulation layer formed to which the coil pattern is exposed and forming an insulation layer of a thin film wherein an external magnetic body material and the coil pattern do not contact each other directly and the width of the insulation layer is reduced. COPYRIGHT KIPO 2015 ...

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02-12-2015 дата публикации

CHIP ELECTRONIC COMPONENT AND MOUNTING BOARD THEREOF

Номер: KR1020150134858A
Принадлежит:

The present invention provides a chip electronic component which comprises: a main body of a magnetic material including an insulating substrate and a coil conductive pattern formed at least one surface of the insulating substrate; and an external electrode formed in both end units of the main body of the magnetic material to connect to an end unit of the coil conductive pattern. The coil conductive pattern is formed by plating. A cross section in the lengthwise direction of the main body of the magnetic material has an angle θ between an upper surface of the coil conductive pattern and a tangent line of a side surface, which satisfies 90.5° <= θ <= 103°. COPYRIGHT KIPO 2016 ...

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12-06-2015 дата публикации

CHIP ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

Номер: KR1020150065075A
Принадлежит:

The present invention relates to a chip electronic component and a manufacturing method thereof, and more specifically, to a chip electronic component which forms a thin film insulation layer that an outer magnetic material and a coil pattern are not directly touched by making the insulation layer even at the bottom of the coil pattern without insulation non-formation unit in which the coil pattern is exposed, prevents waveform failure in high frequency, and can improve capacity of an inductor or the like, and to a manufacturing method thereof. COPYRIGHT KIPO 2015 ...

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24-05-2018 дата публикации

THIN FILM INDUCTOR AND MANUFACTURING METHOD THEREOF

Номер: KR1020180054264A
Принадлежит:

The present disclosure relates to a thin film inductor for equalizing the thickness of an insulating layer and a manufacturing method thereof. The thin film inductor includes a body including a support member, a coil disposed on at least one surface of a support member, and a filling material embedded with the support member on which a coil is disposed; and an outer electrode disposed on an outer surface of the body. An insulating layer is not disposed on the edge unit of a support member, so the insulating layer is in direct contact with a filling material. The insulating layer is disposed only on an upper surface of a coil along a surface of the coil. COPYRIGHT KIPO 2018 ...

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20-09-2018 дата публикации

THIN FILM-TYPE INDUCTOR AND MANUFACTURING METHOD THEREOF

Номер: KR1020180104277A
Принадлежит:

The present disclosure relates to a thin film-type inductor including a body including a support member, a coil arranged on at least one side of the support member and a filling material filling the support member on which the coil is arranged, and an external electrode arranged on the outer side of the body, and a manufacturing method thereof. An insulation layer is not arranged on an edge part of the support member, so the filling material is directly touched. The insulation layer is arranged on only the upper side of the coil along the surface of the coil. Accordingly, the present invention can improve the permeability and reliability of the inductor. COPYRIGHT KIPO 2018 ...

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07-03-2016 дата публикации

Chip electronic component and manufacturing method thereof

Номер: KR0101598256B1
Принадлежит: 삼성전기주식회사

... 본 발명은 칩 전자부품 및 그 제조방법에 관한 것으로, 보다 상세하게는 코일 패턴이 노출되는 절연층 미형성부 없이 코일 패턴의 하부까지도 절연층을 형성하도록 하여 외부 자성체 재료와 코일 패턴이 직접 접촉하지 않으면서도, 절연층의 폭을 감소시킨 박막의 절연층을 형성하여 고주파에서의 파형 불량을 방지하고, 인덕터의 용량 등을 향상시킬 수 있는 칩 전자부품 및 그 제조방법에 관한 것이다.

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13-05-2015 дата публикации

CHIP INDUCTOR

Номер: KR1020150051983A
Принадлежит:

The present invention relates to a chip inductor. The chip inductor according to the present invention includes a substrate on which a through hole is formed, a conductive coil which is formed on the substrate, a top resin complex magnetic layer which is filled to surround the conductive coil to form a core on the center of the substrate, a bottom resin complex magnetic layer which is formed on the lower side of the substrate, and an external electrode which is formed on both sides of the top and bottom resin complex magnetic layers. COPYRIGHT KIPO 2015 ...

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01-10-2018 дата публикации

COIL COMPONENT AND MANUFACTURING METHOD THEREOF

Номер: KR1020180107019A
Принадлежит:

The present invention relates to a coil component capable of maintaining excellent rigidity, and a manufacturing method thereof. The coil component comprises: a body unit including a magnetic material; and a coil unit arranged in the body unit. The coil unit includes: a first coil pattern layer having a plane spiral-shaped pattern; an insulating layer embedding at least a part of the first coil pattern layer; and a second coil pattern layer arranged on the insulating layer, and having a plan spiral-shaped pattern. The insulating layer includes a core material, and the thickness in a lower region of the insulating layer is thicker than that of an upper region of the insulating layer based on the core material. COPYRIGHT KIPO 2018 (AA) Second direction (BB) Third direction ...

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01-07-2015 дата публикации

CHIP ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

Номер: KR1020150073900A
Принадлежит:

The present invention relates to a chip electronic component which includes a magnetic body having a coil conductive pattern part buried; and an oxidative film formed on a surface of the coil conductive pattern part, and to a manufacturing method thereof. According to the chip electronic component and the manufacturing method thereof of an embodiment of the present invention, an insulation film which is thinner than an existing insulation film is formed, while preventing exposure of the coil conductive pattern part, so that the magnetic material and the coil conductive pattern part do not directly contact, thereby preventing wave form defect in high frequency. COPYRIGHT KIPO 2015 ...

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30-09-2015 дата публикации

CHIP ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

Номер: KR1020150108518A
Принадлежит:

The present invention relates to a chip electronic component and a manufacturing method thereof and, more specifically, to a chip electronic component which can increase a height-to-width ratio of a coil while preventing the occurrence of a short circuit between coils to realize an internal coil structure having a high aspect ratio (AR), and to a manufacturing method thereof. COPYRIGHT KIPO 2015 ...

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28-08-2018 дата публикации

코일 부품 및 그 제조방법

Номер: KR0101892822B1
Принадлежит: 삼성전기주식회사

... 본 발명의 일 실시 예에 따른 코일 부품은 내부에 코일부가 배치된 바디를 포함하며, 코일부는 절연층, 절연층의 일면에 형성된 제1 코일 패턴, 및 절연층의 타면에 형성된 제2 코일 패턴을 포함하며, 제2 코일 패턴은 절연층에 매립된 매립 패턴 및 상기 매립 패턴 상에 형성된 외부 패턴을 포함함으로써, 낮은 직류저항 특성과 인덕턴스를 향상시킬 수 있다.

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10-07-2015 дата публикации

CHIP ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

Номер: KR1020150080717A
Принадлежит:

The present invention relates to a chip electronic component and a manufacturing method thereof and, more specifically, to a chip electronic component which prevents magnetization around a coil by blocking magnetic flux flowing around the coil so that properties of changes in inductance (L) upon current application is improved, while achieving maximum inductance by obtaining enough filling magnetic volume, and to a manufacturing method thereof. COPYRIGHT KIPO 2015 ...

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28-02-2019 дата публикации

칩 전자부품 및 그 제조방법

Номер: KR0101952859B1
Принадлежит: 삼성전기주식회사

... 본 발명은 코일 도체 패턴부가 매설된 자성체 본체; 및 상기 코일 도체 패턴부의 표면에 형성된 산화막;을 포함하는 칩 전자부품 및 그 제조방법에 관한 것이다. 본 발명의 일 실시형태의 칩 전자부품 및 그 제조방법에 의하면 종래의 절연막보다 박막의 절연막이 형성되면서도 코일 도체 패턴부의 노출을 방지하여 자성체 재료와 코일 도체 패턴부가 직접 접촉하지 않으며, 이에 따라 고주파에서의 파형 불량을 방지할 수 있다.

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01-08-2018 дата публикации

COIL COMPONENT AND MANUFACTURING METHOD THEREOF

Номер: KR1020180086713A
Принадлежит:

The present disclosure relates to a coil component and a manufacturing method thereof. The coil component includes a body including a magnetic material, a support member disposed within the body, and a coil pattern disposed on the support member within the body. The coil pattern comprises a first conductor layer of a planar spatial shape, and a second conductor covering the first conductor layer and having a thickness greater than a line width. When viewed in the thickness direction and the width direction cutting surface of the body, the linewidths of the outermost and innermost corner patterns of the first conductor layer are different from the linewidth of at least one inner pattern disposed between the outermost and innermost corner patterns. It is possible to secure high performance and reliability. COPYRIGHT KIPO 2018 ...

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31-08-2016 дата публикации

CHIP ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

Номер: KR1020160102657A
Принадлежит:

The present invention relates to a chip electronic component which comprises: a magnetic body including a magnetic material; a coil unit buried in the magnetic body and formed by connecting first and second coil conductors arranged on one surface and the other surface of a substrate; an insulation film configured to cover the first and second coil conductors; and a magnetic film formed on the insulation film. Therefore, the chip electronic component can realize high inductance and a superior quality factor. COPYRIGHT KIPO 2016 ...

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29-11-2016 дата публикации

COIL ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

Номер: KR1020160136127A
Принадлежит:

The present invention relates to a coil electronic component to cover a coil unit with magnetic material. The magnetic material includes shape anisotropy metal powder and shape isotropy metal powder, wherein the shape anisotropy metal powder has one shaft of a plane surface arranged to face a flow direction of magnetic flux, and the shape isotropy metal powder is included in an upper area and a lower area of the coil unit formed inside the coil unit among a first cover unit and a second cover unit arranged across the coil unit. COPYRIGHT KIPO 2016 ...

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12-06-2018 дата публикации

COIL COMPONENT AND MANUFACTURING METHOD THEREOF

Номер: KR1020180063575A
Принадлежит:

According to an embodiment of the present invention, a coil component comprises a body in which a coil part is located therein. The coil part includes: an insulating layer; a first coil pattern formed on one surface of the insulating layer; and a second coil pattern formed on the other surface of the insulating layer. The second coil pattern includes an embedding pattern embedded in the insulating layer and an external pattern formed on the embedding pattern. Therefore, the present invention can improve a low direct current resistance property and an inductance. COPYRIGHT KIPO 2018 ...

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09-05-2018 дата публикации

COIL COMPONENT

Номер: KR1020180046826A
Принадлежит:

The present disclosure is a coil component capable of increasing inductance comprising a body including a coil and a support member for supporting a coil and an external electrode disposed on an outer surface of a body. The coil component comprises a machined surface on an interface between the remaining support member and a removed support member by removing a part of the support member near a junction connecting an external electrode and a coil among the support members, and further fills a magnetic material or disposes an insulating film in a cavity from which the support member is removed. COPYRIGHT KIPO 2018 ...

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05-07-2018 дата публикации

칩 인덕터 및 칩 인덕터 제조방법

Номер: KR0101862409B1
Принадлежит: 삼성전기주식회사

... 본 발명은 칩 인덕터 및 칩 인덕터 제조방법에 관한 것으로, 금속입자와 폴리머가 혼합된 금속-폴리머 복합체; 상기 금속-폴리머 복합체의 내부에 구비되어 코일을 형성하는 배선패턴; 상기 금속-폴리머 복합체의 외주면 일부에 구비되는 외부전극; 및 상기 금속-폴리머 복합체와 상기 배선패턴사이 및 상기 금속-폴리머 복합체와 상기 외부전극 사이에 구비되는 절연부;를 포함할 수 있다.

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