28-02-2013 дата публикации
Номер: WO2013027880A1
Принадлежит:
The present invention enables the sequential cutting, chamfering, and grinding of both side surfaces of a silicon ingot in order to achieve the objectives of improving the workability of the ingot and rationalizing the processing degree and processing time of the ingot in order to easily maintain a certain level of quality. The multi-tasking machine for a silicon ingot according to the present invention cuts and grinds a silicon ingot, and comprises: an aligning apparatus, installed on one side of a mainframe, for aligning a silicon ingot; an auto-loading apparatus for grasping and moving the silicon ingot aligned by the aligning apparatus; a clamping apparatus, installed in the top central portion of the mainframe, for grasping the silicon ingot moved by the auto-loading apparatus, moving the ingot in the lengthwise direction of the mainframe, and then rotating the silicon ingot; a pair of cutting apparatuses, respectively installed at both sides of the mainframe with respect to the center ...
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