11-10-2023 дата публикации
Номер: GB0002617521A
Принадлежит:
A method of manufacturing an electrode arrangement 10/10’ comprises: mechanically coupling an RF electrode 12a/12b/12a’/12b to a dielectric material 11, e.g. a PCB, using a plurality of separators 13 that are spaced apart such that a gap is defined between the RF electrode and the dielectric; and cutting the RF electrode, e.g. using a wire erosion process, while it is coupled to the dielectric so as to reshape the RF electrode. Each of the separators 13 may comprise a projecting portion 13b which is received by a corresponding receiving portion 11a in the dielectric material. A head portion 13b of the separators may additionally include a receptacle (13d, Fig. 16) for receiving a portion (12c) protruding from the RF electrode. Alternatively, the separators (13’’, Fig. 15) may simply project through an opening (12d) in the RF electrode. DC electrodes 14 provided on the dielectric shield it from RF fields generated by the RF electrodes, thereby reducing the effects of dielectric heating.
Подробнее