MICROWAVE MINIATURE HOUSING AND PROCEDURE FOR THE PRODUCTION OF THIS HOUSING

MINIATURE MICROWAVE PACKAGE AND PROCESS FOR FABRICATING THE PACKAGE

The invention relates to a miniature microwave package comprising a microwave chip (60) having an active face (62). The chip includes a protective lid (72) fixed to the active face, at least partially covering it, the lid including at least one recess forming, with the active face of the chip, a cavity (94, 96, 98). The invention is used in miniature microwave packages.

MINIATURE CASE ULTRA HIGH FREQUENCY FOR ASSEMBLY ON THE SURFACE AND PROCESS DEFABRICATION OF THE CASE

L'invention concerne un boîtier miniature hyperfréquence pour montage en surface sur un circuit d'accueil.Le boîtier comporte :- une puce électronique (100) ayant une face active (102) et une face arrière opposée à la face active, la face active ayant des éléments actifs (108), des conducteurs électriques de la face active (110), la face arrière ayant des conducteurs électriques de la face arrière (112) ;- des plots électriques (112), de report du boîtier sur le circuit d'accueil ;Les plots électriques de report du boîtier sont reliés aux conducteurs électriques de la face arrière de la puce, les conducteurs électriques de la face active de la puce et ceux de la face arrière de la puce étant reliés par des trous métallisés (116). Le boîtier est t fermé par un matériau diélectrique (118) enrobant au moins la face active de la puce.Applications : Boîtiers miniature hyperfréquences pour montage en surface. The invention relates to a miniature microwave housing for surface mounting on a reception circuit. The housing comprises: an electronic chip (100) having an active face (102) and a rear face opposite to the active face, the active face; having active elements (108), electrical conductors of the active face (110), the rear face having electrical conductors of the rear face (112), electrical pads (112), carrying the housing on the circuit The electrical transfer pins of the housing are connected to the electrical conductors of the rear face of the chip, the electrical conductors of the active face of the chip and those of the rear face of the chip being connected by metallized holes. ). The housing is t closed by a dielectric material (118) coating at least the active face of the chip.Applications: Miniature microwave enclosures for surface mounting.

SURFACE-MOUNTED MICROWAVE MINIATURE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Miniature hyperfrequency power box contains electronic chip with metal layer separated from active face by dielectric layer, and electrical and thermal conductors

The box has an electronic chip (70) with an active face (72) having active power elements (76), and a rear face (74) opposite the active face. The active face is covered by a metal layer (88) that is separated from it by at least one dielectric layer (82), with electrical and thermal conductors (96, 100) forming a drain between the active elements and metal layer. In addition, the metal layer forms a micro-ribbon hyperfrequency line (81) between the metal layer and at least one of the conductors. The different dielectric layers can be e.g. of silicon oxide, silicon nitride, polymer film or diamond epitaxy.

MICROWAVE MINIATURE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

CASE MINIATURE ULTRA HIGH FREQUENCY AND MANUFACTORING PROCESS OF THE CASE

L'invention concerne un boîtier miniature hyperfréquences comportant une puce hyperfréquence (60) ayant une face active (62). La puce comporte un capot (72) de protection fixé sur la face active la recouvrant au moins partiellement, le capot comportant au moins un évidement formant une cavité (94, 96, 98) avec la face active de la puce.Applications : boîtiers miniatures hyperfréquences. The invention relates to a miniature microwave package comprising a microwave chip (60) having an active face (62). The chip comprises a cover (72) of protection fixed on the active face covering at least partially, the cover having at least one recess forming a cavity (94, 96, 98) with the active face of the chip.Applications: miniature housings microwave.

MINIATURE CASE ULTRA HIGH FREQUENCY OF POWER AND MANUFACTORING PROCESS OF THE CASE

MIKROWELLEN-MINIATURGEHÄUSE UND VERFAHREN ZUR HERSTELLUNG DIESES GEHÄUSES

Electrically measurable on-chip ic serial identifier and methods for producing the same

An apparatus comprising an integrated circuit, an interconnect layer within said integrated circuit, and one or more connections. The integrated circuit may be configured to provide an electrically measurable interconnect pattern by enabling one or more of a plurality of components. The one or more connections may each configured to enable a respective one of the components. The connections may be programmable while the apparatus is part of a wafer. The interconnect pattern may be configured to identify the apparatus after the apparatus has been manufactured.

Mikrowellen-miniaturgehäuse und verfahren zur herstellung dieses gehäuses