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Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Применить Всего найдено 2. Отображено 2.
25-04-2023 дата публикации

Wafer surface shape prediction model establishment method based on Abbe principle and Bladen principle

Номер: CN116009478A
Автор: CAI YINDI, GAO YINGHAO, FU QING, YIN KEDI, ZHU XIANGLONG, KANG RENKE
Принадлежит:

The invention belongs to the technical field of numerical control machine tool processing, and provides a wafer surface shape prediction model establishment method based on the Abbe principle and the Bladen principle, and the method explores the influence of measurement errors caused by measurement positions in the geometric error measurement process on the wafer surface shape precision based on the precision measurement principles, namely the Abbe principle and the Bladen principle. And establishing a mapping relation between the geometric error and the wafer surface shape. The model not only considers the influence of each shafting of the grinding machine tool and geometric errors among the shafting on the wafer surface shape, but also considers the influence of measurement errors caused by geometric error measurement positions on the wafer surface shape, and provides a theoretical basis for optimizing the grinding machine tool and improving the wafer surface shape precision.

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Номер записи: 1
18-04-2023 дата публикации

Double-sided polishing method for quartz hemispherical harmonic oscillator

Номер: CN115972073A
Автор: GUO JIANG, PAN BO, HOU CHENYI, JING ZHAO, CAI YINDI
Принадлежит:

The invention discloses a double-sided polishing method for a quartz hemispherical harmonic oscillator. The double-sided polishing method comprises the following steps: preparing a non-Newtonian fluid polishing solution with a shear thickening effect; the hemispherical harmonic oscillator is installed on a machine tool rotary table through a clamp; the position of the current hemispherical harmonic oscillator is measured through a sensor; designing and manufacturing an inner surface polisher and an outer surface polisher; and the outer surface and the inner surface of the hemispherical harmonic oscillator are polished at the same time. By the adoption of the designed polisher, the polishing contact area is increased, and the overall machining efficiency is improved; through the design of the polisher, the inner surface and the outer surface of the hemispherical harmonic oscillator are machined at the same time, stress on the hemispherical harmonic oscillator is balanced, it is guaranteed ...

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Номер записи: 2