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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Применить Всего найдено 2. Отображено 2.
27-07-2011 дата публикации

Silicon crystal cutting auxiliary tool

Номер: CN0102133778A
Автор: CHANGSHENG QIU, CHENGYONG ZHANG, ZHIGANG GU, QIU CHANGSHENG, ZHANG CHENGYONG, GU ZHIGANG
Принадлежит:

The invention discloses a silicon crystal cutting auxiliary tool. The silicon crystal cutting auxiliary tool has a bilaterally symmetric structure, wherein a straight tube, a tube hole, a plug, a circular tube and a hanging hook are arranged on one side of the tool; the straight tube is formed by sleeving an inner tube and an outer tube with hollow circular tube structures in a concentric circle form; the tube hole is formed on the inner tube; a tube seam is reverse to the direction of the tube hole and is relatively arranged on the outer tube; the tube hole can be closed or opened through a screw; the plug is connected with one end of the straight tube; the circular tube is arranged in the plug and is communicated with the inner tube; the hanging hook is fixed on the side face of the plug; a connection part of the plug and the inner tube is right-angled; and thus the bilaterally symmetric U-shaped silicon crystal cutting auxiliary tool is constructed. The flow and uniformity of mortar ...

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Номер записи: 1
24-08-2011 дата публикации

Pre-flushing method for silicon chip subjected to multi-wire cutting

Номер: CN0102163645A
Автор: WEI LIU, CHANGSHENG QIU, MING YU, LIU WEI, QIU CHANGSHENG, YU MING
Принадлежит:

The invention belongs to the technical field of processing of a silicon chip for a solar cell, in particular to a pre-flushing method for a silicon chip subjected to multi-wire cutting. The method comprises the following steps of: 1) pressurizing an organic cleaning agent, and spraying the organic cleaning agent to the surface of the silicon chip for flushing through a nozzle; 2) after most mortar on the surface of the silicon chip is flushed off, impregnating the silicon chip in impregnation liquid of which the component is the organic cleaning agent, and performing ultrasonic cleaning for ten minutes; 3) blowing off the residual impregnation liquid on the surface of the silicon chip which is subjected to ultrasonic cleaning by adopting an air knife; and 4) cleaning the surface of the silicon chip by using a small amount of water. According to the similar compatibility principle, the residual mortar attached to the surface of the silicon chip is flushed off by utilizing a water-soluble ...

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Номер записи: 2