An optical element

DISPLAY PANEL

A display panel comprises a first substrate and a shading layer. The first substrate comprises a plurality of pixel zones arranging in an array form. Each of the pixel zones comprises a first color LED and a second color LED. The first color LED comprise a first light-emitting surface in a display direction. The second color LED comprise a second light-emitting surface in the display direction. An area of the first light-emitting surface is larger than an area of the second light-emitting surface. The shading layer is disposed in the plurality of pixel zones, and the shading layer overlaps some of the first light-emitting surfaces at the display direction. 1. A Micro LED display panel comprising:a first substrate having a plurality of pixel zones arranged in an array form, wherein each of the pixel zones comprises a first color LED and a second color LED, the first color LED comprises a first light-emitting surface facing to a display direction, the second color LED comprise a second light-emitting surface facing to the display direction, and an area of the first light-emitting surface is larger than an area of the second light-emitting surface; and;a shading layer disposed in the plurality of pixel zones, wherein the shading layer covers part of the first light-emitting surfaces.2. The display panel according to claim 1 , wherein each of the pixel zones further comprises a third color LED with a third light-emitting surface claim 1 , and the third light-emitting surface facing to the display direction.3. The display panel according to claim 2 , wherein the third light-emitting surface is not covered by the shading layer.4. The display panel according to claim 3 , wherein the area of the second light-emitting surface is larger than an area of the third light-emitting surface claim 3 , and the shading layer overlaps part of the second light-emitting surfaces.5. The display panel according to claim 4 , wherein an area of the first light-emitting surface covered by the ...

Micro light-emitting device module

A micro light-emitting device module includes a circuit substrate, a planarization layer and a micro light-emitting device. The planarization layer is disposed on an upper surface of the circuit substrate and has a first surface and a second surface opposite to each other. The second surface is in contact with the upper surface of the circuit substrate. The micro light-emitting device is disposed on the first surface of the planarization layer. A maximum height difference of the second surface of the planarization layer is greater than a thickness of the micro light-emitting device.

MICRO-LED DISPLAY PANEL

A micro-LED display panel including a substrate, a plurality of micro-LEDs, and a plurality of reinforced structures is provided. The micro-LEDs are disposed at a side of the substrate, wherein each of the micro-LEDs comprises an epitaxial layer and an electrode layer electrically connected to the epitaxial layer, and the electrode layer are located between the epitaxial layers and the substrate. Each of the micro-LEDs is electrically connected to the substrate through the corresponding electrode layer. Each of electrode layers includes a first electrode and a second electrode. The reinforced structures are disposed between the micro-LEDs and the substrate respectively, and each of the reinforced structures is located between the corresponding the first electrode and the second electrode. A Young's modulus of each of reinforced structures is smaller than a Young's modulus of the corresponding electrode layer.

ELECTRODE STRUCTURE, MICRO LIGHT EMITTING DEVICE, AND DISPLAY PANEL

An electrode structure includes a first electrode and a second electrode disposed opposite to each other. The first electrode has a first side and a second side. The second side is located between the first side and the second electrode. The first electrode has a maximum vertical length and a minimum vertical length from the first side to the second side, and a ratio of the minimum vertical length to the maximum vertical length is less than 0.8. The second electrode and the first electrode are separated by a first vertical gap and a second vertical gap, and the second vertical gap is greater than the first vertical gap.

Method for fabricating micro light emitting diode display

A method for fabricating a micro light emitting diode (LED) display is provided. The method includes disposing a plurality of micro light emitting diodes on a carrier; transferring the micro light emitting diodes from the carrier to a display substrate; subjecting the micro light emitting diodes to a pre-bonding process to connect the micro light emitting diodes with the display substrate; subjecting the micro light emitting diodes pre-bonded on the display substrate to a first detection, thereby identifying whether a faulty micro light emitting diode is existed or not; and, subjecting the micro light emitting diodes to a main-bonding process after the first detection.

Method of transferring micro devices

A method of transferring micro devices is provided. A carrier substrate including a buffer layer and a plurality of micro devices is provided. The buffer layer is located between the carrier substrate and the micro devices. The micro devices are separated from one another and positioned on the carrier substrate through the buffer layer. A receiving substrate contacts the micro devices disposed on the carrier substrate. A temperature of at least one of the carrier substrate and the receiving substrate is changed, so that at least a portion of the micro devices are released from the carrier substrate and transferred onto the receiving substrate. A number of the at least a portion of the micro devices is between 1000 and 2000000.

DISPLAY PANEL OF MICRO LIGHT EMITTING DIODE

A display panel of micro light emitting diode comprises a substrate, a plurality of micro light emitting diodes, a plurality of driving chips and a shading layer. The substrate having a first surface and a display area. The plurality of micro light emitting diodes is disposed on the first surface of the substrate and is located in the display area, with each of the micro light emitting diodes having a light emitting surface while the light emitting surface is away from the first surface of the substrate. The plurality of driving chips is disposed on the first surface of the substrate and is located in the display area, with each driving chip electrically connecting to at least one of the micro light emitting diodes. The shading layer is disposed on the first surface of the substrate and covering the driving chips while exposing the light emitting surfaces. 1. A display panel of micro light emitting diode , comprising:a substrate having a first surface and a display area;a plurality of micro light emitting diodes disposed on the first surface of the substrate and located in the display area, wherein each of the micro light emitting diodes has a bottom surface and a light emitting surface located at two opposite sides of the corresponding micro light emitting diode respectively, wherein the bottom surface of the micro light emitting diode is close to the first surface of the substrate while the light emitting surface is away from the first surface of the substrate;a plurality of driving chips disposed on the first surface of the substrate and located in the display area and separated from the micro light emitting diodes, wherein each of the driving chips electrically connects to at least one of the micro light emitting diodes; anda shading layer disposed on the first surface of the substrate and covering the driving chips, wherein the light emitting surfaces of the micro light emitting diodes are exposed by the shading layer, wherein a thickness of the micro light ...

Display apparatus

A display apparatus includes a driving substrate and a plurality of micro light-emitting devices (LEDs). The driving substrate has a plurality of pixel regions. The plurality micro LEDs are disposed in in each of the pixel regions and electrically connected to the driving substrate. Orthogonal projection areas of the micro LEDs in each of the pixel regions on the driving substrate are equal. At least two micro LEDs in each of the pixel regions have different effective light-emitting areas.

MICRO LIGHT EMITTING DIODE DISPLAY PANEL

CARRIER STRUCTURE AND MICRO DEVICE STRUCTURE

A carrier structure suitable for transferring or supporting a plurality of micro devices including a carrier and a plurality of transfer units is provided. The transfer units are disposed on the carrier. Each of the transfer units includes a plurality of transfer parts. Each of the transfer parts has a transfer surface. Each of the micro devices has a device surface. The transfer surfaces of the transfer parts of each of the transfer units are connected to the device surface of corresponding micro device. The area of each of the transfer surfaces is smaller than the area of the device surface of the corresponding micro device. A micro device structure using the carrier structure is also provided. 1. A micro device structure , comprising:a carrier structure, comprising:a carrier; anda plurality of transfer units disposed on the carrier, wherein each of the transfer units comprises a plurality of transfer parts, and each of the transfer parts has a transfer surface; anda plurality of micro devices, wherein each of the micro devices has a device surface, the transfer surfaces of the transfer parts of each of the transfer units are connected to the device surface of the corresponding micro device, and an area of each of the transfer surfaces is smaller than an area of the device surface of the corresponding micro device.2. The micro device structure of claim 1 , wherein a ratio of the area of each of the transfer surfaces to the area of the device surface of the corresponding micro device is between 0.2 and 0.8.3. The micro device structure of claim 1 , wherein a Young's modulus of each of the transfer parts is less than a Young's modulus of the carrier and a Young's modulus of the corresponding micro device.4. The micro device structure of claim 1 , wherein an overlapped area of the transfer surface of one of the transfer parts of each of the transfer units and the device surface of the corresponding micro device is greater than an overlapped area of the transfer ...

Micro-LED display panel

A micro-LED display panel including a substrate, a plurality of micro-LEDs, and a plurality of reinforced structures is provided. The micro-LEDs are disposed at a side of the substrate, wherein each of the micro-LEDs comprises an epitaxial layer and an electrode layer electrically connected to the epitaxial layer, and each of the electrode layers is located between the substrate and the corresponding epitaxial layer. Each of the micro-LEDs is electrically connected to the substrate through the corresponding electrode layer. Each of electrode layers comprise a first electrode and a second electrode. The reinforced structures are disposed between the micro-LEDs and the substrate respectively, and each of the reinforced structures is located between the corresponding the first electrode and the second electrode. A Young's modulus of each of reinforced structures is smaller than a Young's modulus of the corresponding electrode layer.

Display apparatus

A display apparatus includes a driving substrate and a plurality of micro light-emitting devices (LEDs). The driving substrate has a plurality of pixel regions. The micro LEDs are disposed in the pixel regions and electrically connected to the driving substrate. Each of the pixel regions is provided with a plurality of the micro LEDs. Orthogonal projection areas of the micro LEDs on the driving substrate in each of the pixel regions are the same. At least two micro LEDs in each of the pixel regions have different effective light emitting areas.

Micro led display device and manufacturing method thereof

Transparent display panel

A transparent display panel includes a transparent substrate, a plurality of top-emitting micro light emitting diodes (top-emitting [mu]LEDs), a plurality of bottom-emitting micro light emitting diodes (bottom-emitting [mu]LEDs) and a light shielding layer. The transparent substrate includes a surface. The top-emitting [mu]LEDs and the bottom-emitting [mu]LEDs are disposed on the surface. A epitaxial structure of each bottom-emitting [mu]LED includes an upper surface and a lower surface which are opposed to each other. The lower surface faces to the surface of the transparent substrate. Each of the bottom-emitting [mu]LEDs includes a light shield piece. The light shield piece covers the upper surface. The light shielding layer is disposed on the surface of the transparent substrate. A part of the light shielding layer is between the top-emitting [mu]LEDs and the surface of the transparent substrate.

Composite optical film

The present invention relates to a composite optical film, which comprises a substrate having diffusion micro-structures and a structured surface on one side of the substrate wherein said composite optical film has an internal diffusion haze of no less than 5% as measured according to JIS K7136 standard method. The composite optical film of the present invention has both light-diffusion and light-enhancement properties. The composite optical film of the present invention, when utilized in a liquid crystal display (LCD), can not only effectively enhance the luminance of the LCD panel but also avoid light dispersion and Moire phenomena that may occur when said composite optical film is stacked with other material films.

MICRO-COMPONENT TRANSFER HEAD, MICRO-COMPONENT TRANSFER DEVICE, AND MICRO-COMPONENT DISPLAY

Herein disclosed are a micro-component transfer head, a micro-component transfer device, and a micro-component display. Said micro-component transfer head comprises a carrying surface that corresponds to a micro-component extraction area. Said extraction area conforms with a first geometric object, which comprises at least an acute angle. A second geometric object comprises at least a right angle and is constituted of n copies of the first geometric object, n being an integer greater than 1. The shape of the first geometric object differs from that of the second.

Micro-LED display panel and manufacturing method thereof

A micro-LED display panel including a substrate, an anisotropic conductive film, and a plurality of micro-LEDs is provided. The anisotropic conductive film is disposed on the substrate. The micro-LEDs and the anisotropic conductive film are disposed at the same side of the substrate, and the micro-LEDs are electrically connected to the substrate through the anisotropic conductive film. Each of the micro-LEDs includes an epitaxial layer and an electrode layer electrically connected to the epitaxial layer, and the electrode layers comprises a first electrode and a second electrode which are located between the substrate and the corresponding epitaxial layer. A ratio of a thickness of each of the electrode layers to a thickness of the corresponding epitaxial layer ranges from 0.1 to 0.5, and a gap between the first electrode and the second electrode of each of the micro-LEDs is in a range of 1 μm to 30 μm.

DISPLAY SUBSTRATE AND DISPLAY PANEL

SUBSTRATE AND DISPLAY DEVICE

Micro LED display device and manufacturing method thereof

A micro LED display device including a display substrate, a plurality of conductive pad pairs and a plurality of micro light emitting elements is provided. The display substrate has a first arranging area, a splicing area connected to the first arranging area, and a second arranging area connected to the splicing area, wherein the splicing area is located between the first arranging area and the second arranging area. The conductive pad pairs are disposed on the display substrate in an array with the same pitch. The micro light emitting elements are disposed on the display substrate and are electrically bonded to the conductive pad pairs. A manufacturing method of the micro LED display device is also provided.

Transparent display panel

A transparent display panel with a light-transmitting substrate, a plurality of top-emitting micro light emitting diodes, a plurality of bottom-emitting micro light emitting diodes, and a light shielding layer. The light transmissive substrate has a surface. These top-emitting micro light emitting diodes and these bottom-emitting micro light emitting diodes are disposed on the surface of the light transmissive substrate. The bottom-emitting micro light emitting diodes has an epitaxial structure and a light shielding member, the epitaxial structure has a pair of upper and lower surfaces on the opposite sides, the lower surface faces toward the light transmissive substrate, and the light shielding member is disposed on the upper surface to shield the light emitted by the bottom-emitting micro light emitting diodes towards the upper surface.

LED display panel and manufacture method thereof

A LED display panel includes a substrate, a plurality of light emitting components, an insulating layer and a plurality of electronic components. The substrate includes a first surface. The light emitting components are disposed on the first surface. The insulating layer is on the light emitting components and includes a second surface and a third surface. The second surface and the third surface are opposite to each other. The second surface is faced the first surface. The electronic components are disposed on the third surface and are electrically connected to the light emitting components. The number of the electronic component is less than the number of the light emitting components. The flatness of the first surface is better than the flatness of the third surface.

Micro light-emitting device and display apparatus

A micro light-emitting device includes an epitaxial structure, a first type pad, a second type pad, and a current commanding structure. The epitaxial structure includes a first type semiconductor layer, a light-emitting layer, and a second type semiconductor layer. The first type pad is electrically connected to the first type semiconductor layer. The second type pad is electrically connected to the second type semiconductor layer. The current commanding structure is disposed between the second type semiconductor layer and the second type pad. A contact resistance between the second type semiconductor layer and the current commanding structure is smaller than a contact resistance between the second type semiconductor layer and the second type pad. An orthogonal projection area of the current commanding structure on the second type semiconductor layer is smaller than an orthogonal projection area of the second type pad on the second type semiconductor layer.

PACKAGE CARRIER

A package carrier is suitable for carrying at least one light emitting unit. The package carrier includes an annular shell and a transparent light guiding stage. The annular shell has a cavity. The transparent light guiding stage is disposed in the cavity of the annular shell. The light emitting unit is adapted to be disposed on the transparent light guiding stage, and a horizontal projection area of the transparent light guiding stage is greater than that of the light emitting unit. The light emitting unit emits a light beam to enter the transparent light guiding stage, and the light beam emits from a surface of the transparent light guiding stage relatively distant from the cavity.

DISPLAY PANEL

A display panel includes a first substrate, a plurality of first color micro light emitting diodes (LEDs), a plurality of second color LEDs and a shading layer. The first substrate has a plurality of pixel zones arranged in an array form. Each of the first color LEDs has a first light emitting surface facing to a display direction. Each of the second color LEDs has a second light emitting surface facing to the display direction. Each of the pixel zones is provided with one of the first color micro LEDs and one of the second color LEDs. The shading layer is disposed in the pixel zones. The shading layer overlaps part of the first light emitting surface and part of the second light emitting surface in the display direction.

PROTECTIVE COVER

A protective cover is detachably assembled to and electrically connected to an electronic device having an image capturing unit and a lens. The protective cover includes a base portion, at least one bending portion, and a plurality of light-emitting units. The electronic device is disposed on the base portion. The bending portion is foldably connected to at least one side of the base portion. There is at least one included angle between a side of the electronic device and the bending portion. The light-emitting units are disposed on the bending portion, and the light-emitting units are not coplanar with the lens.

Digital flash charger controller

MICRO LIGHT-EMITTING DIODE DISPLAY PANEL HAVING A CONTROL ELEMENT FOR THE CONTROL OF MULTIPLE MICRO LEDS EMITTING THE SAME COLOR

A micro LED display panel includes a display area, a plurality of micro light-emitting elements and a plurality of micro control elements. The plurality of micro light-emitting elements is disposed in the display area and include a plurality of first color micro LEDs and a plurality of second color micro LEDs. A light wavelength of each of the first color micro LEDs is different from a light wavelength of each of the second color micro LEDs. The plurality of micro control elements is disposed in the display area, and include a plurality of first color micro circuit-chips and a plurality of second color micro circuit-chips. The plurality of first color micro circuit-chips control the plurality of first color micro LEDs, and the plurality of second color micro circuit-chips control the plurality of second color micro LEDs.

MICRO LED CARRIER BOARD

MICRO LIGHT-EMITTING DIODE DEVICE

Micro-LED display panel and manufacturing method thereof

A micro-LED display panel including a substrate, a anisotropic conductive adhesive film, and a plurality of micro-LEDs is provided. The anisotropic conductive adhesive film is disposed at a side of the substrate. The plurality of micro-LEDs and the anisotropic conductive adhesive film are disposed at the same side of the substrate, and the plurality of micro-LEDs are electrically connected to the substrate through the anisotropic conductive adhesive film. Each of the plurality of micro-LEDs comprises an epitaxial layer and an electrode layer electrically connected to the epitaxial layer, and each of the electrode layers is located between the substrate and the corresponding epitaxial layer. A ratio of a depth of each of the electrode layer and a depth of the corresponding epitaxial layer ranges from 0.1 to 0.5.

Micro component transfer head, micro component transfer device, and micro component display

The present invention discloses a micro component transfer head, a micro component transfer device, and a micro component display. The micro component transfer head comprise a carrying surface corresponded to a micro component extracting area. The micro component extracting area has a first geometric figure comprising an acute angle. Wherein a second geometric figure is composed of n pieces of the first geometric figure, and the second geometric figure comprises at least one right angle. The shapes of the first geometric figure and the second geometric figure are different, and n is a positive integer larger than 1.

Method for transferring light-emitting elements onto a package substrate

A method for transferring light-emitting elements onto a package substrate includes: providing a light-emitting unit including a temporary substrate and light-emitting elements; disconnecting the light-emitting elements from the temporary substrate to allow the light-emitting elements to float on a fluid; adjusting spacings between the light-emitting elements to have a predetermined size by controlling flow of the fluid; placing a package substrate into the fluid, followed by aligning the light-emitting elements with connecting pads of the package substrate so as to correspondingly place the light-emitting elements on the connecting pads; and removing the package substrate with the light-emitting elements from the fluid.

Micro light-emitting diode device

A micro light-emitting diode device includes a substrate, a micro semiconductor unit, a first protection layer and a second protection layer. The micro semiconductor unit is adapted to be disposed on the substrate. The first protection layer is disposed on a first portion of an outer surface of the micro semiconductor unit and has an interval from the substrate. The second protection layer is disposed on a second portion of the outer surface and in the interval and covers a part of the first protection layer. A maximum thickness of the first protection layer on the outer surface is less than a maximum thickness of the second protection layer on the outer surface.

Structure with micro light-emitting device

A structure with micro light-emitting device includes a substrate, at least one micro light-emitting device, a plurality of holding structures and a buffer layer. The micro light-emitting device is disposed on the substrate. The holding structures are dispersedly arranged at edges of the micro light-emitting device, and are located between the substrate and the micro light-emitting device and directly contact with the substrate. The buffer layer is disposed between the micro light-emitting device, the holding structures and the substrate.

Micro light emitting diode display panel

A micro light emitting diode display panel including a substrate, a plurality of control elements, and a plurality of light emitting units is provided. The control elements and the light emitting units are disposed on the substrate. Each of the light emitting units is electrically connected to one of the control elements, and each of the light emitting units includes a plurality of micro light emitting diodes. The micro light emitting diodes at least have a red micro light emitting diode, a green micro light emitting diode, and a blue micro light emitting diode. A shortest distance between the green micro light emitting diode and the one of the control elements is less than a shortest distance between the blue micro light emitting diode and the one of the control elements.

Carrier structure and micro device structure

Display panel with micro light emitting diode

A display panel with micro light emitting diode is disclosed in the present invention. The display panel includes a substrate, a plurality of micro light emitting diode (micro LED), a plurality of driving chip and a shading layer. The substrate includes a first surface and an display area. The micro LEDs are disposed on the first surface of the substrate and are located in the display area. Each micro LED includes a bottom surface and a forward light emitting surface opposite the bottom surface. The bottom surface neighbors the first surface while the forward light emitting surface is far from the first surface. The driving chips are disposed on the first surface of the substrate and are located in the display area. One of the driving chips is electrically connected to at least one of the micro LEDs. The shading layer is disposed on the substrate and covers the driving chips. The forward light emitting surface is exposed by the shading layer.

MICRO LIGHT-EMITTING DEVICE AND DISPLAY APPARATUS

A micro light-emitting device includes an epitaxial structure, a first type pad, a second type pad, and a current commanding structure. The epitaxial structure includes a first type semiconductor layer, a light-emitting layer, and a second type semiconductor layer. The first type pad is electrically connected to the first type semiconductor layer. The second type pad is electrically connected to the second type semiconductor layer. The current commanding structure is disposed between the second type semiconductor layer and the second type pad. A contact resistance between the second type semiconductor layer and the current commanding structure is smaller than a contact resistance between the second type semiconductor layer and the second type pad. An orthogonal projection area of the current commanding structure on the second type semiconductor layer is smaller than an orthogonal projection area of the second type pad on the second type semiconductor layer.

TRANSPARENT DISPLAY PANEL

A transparent display panel with a light-transmitting substrate, a plurality of top-emitting micro light emitting diodes, a plurality of bottom-emitting micro light emitting diodes, and a light shielding layer. The light transmissive substrate has a surface. These top-emitting micro light emitting diodes and these bottom-emitting micro light emitting diodes are disposed on the surface of the light transmissive substrate. The bottom-emitting micro light emitting diodes has an epitaxial structure and a light shielding member, the epitaxial structure has a pair of upper and lower surfaces on the opposite sides, the lower surface faces toward the light transmissive substrate, and the light shielding member is disposed on the upper surface to shield the light emitted by the bottom-emitting micro light emitting diodes towards the upper surface. 1. A transparent display panel comprising:a light transmissive substrate, with a surface;a plurality of top-emitting micro light emitting diodes for emitting rays upwards, disposed on the surface of the light transmissive substrate;a plurality of bottom-emitting micro light emitting diodes for emitting rays downwards, disposed on the surface of the light transmissive substrate, wherein each of the bottom-emitting micro light emitting diodes has an epitaxial structure and a light shielding component, the epitaxial structure has a upper surface and a lower surface, the lower surface faces the light transmissive substrate, and the light shielding component is disposed on the upper surface to shield the light emitted from the bottom-emitting micro light emitting diode towards the upper surface; anda light shielding layer, disposed on the surface of the light transmissive substrate, wherein a portion of the light shielding layer is disposed between the top-emitting micro light emitting diode and the light transmissive substrate to shield the light emitted from the top-emitting micro light emitting diode towards the direction of the ...

Display panel

A display panel comprises a first substrate and a shading layer. The first substrate comprises a plurality of pixel zones arranging in an array form. Each of the pixel zones comprises a first color LED and a second color LED. The first color LED comprise a first light-emitting surface in a display direction. The second color LED comprise a second light-emitting surface in the display direction. An area of the first light-emitting surface is larger than an area of the second light-emitting surface. The shading layer is disposed in the plurality of pixel zones, and the shading layer overlaps some of the first light-emitting surfaces at the display direction.

Structure with micro light-emitting device

MICRO LIGHT EMITTING DIODE DISPLAY PANEL

A micro light emitting diode display panel including a substrate, a plurality of control elements, and a plurality of light emitting units is provided. The control elements and the light emitting units are disposed on the substrate. Each of the light emitting units is electrically connected to one of the control elements, and each of the light emitting units includes a plurality of micro light emitting diodes. The micro light emitting diodes at least have a red micro light emitting diode, a green micro light emitting diode, and a blue micro light emitting diode. A shortest distance between the green micro light emitting diode and the one of the control elements is less than a shortest distance between the blue micro light emitting diode and the one of the control elements. 1. A micro light emitting diode display panel , comprising:a substrate including a plurality of pixel regions arranged in a display area;a plurality of control elements, disposed on the substrate and in the display area; anda plurality of light emitting units, disposed on the substrate and in the display area, wherein each of the light emitting units is electrically connected to one of the control elements, and each of the light emitting units comprises a plurality of micro light emitting diodes, wherein the micro light emitting diodes at least have a red micro light emitting diode, a green micro light emitting diode and a blue micro light emitting diode, and a shortest distance between the green micro light emitting diode and the one of the control elements is less than a shortest distance between the blue micro light emitting diode and the one of the control elements.2. The micro light emitting diode display panel according to claim 1 , wherein each of the control elements is a circuit chip electrically bonded to the substrate.3. The micro light emitting diode display panel according to claim 1 , wherein a shortest distance between the red micro light emitting diode and the one of the control ...

MICRO LIGHT-EMITTING DIODE DEVICE

A micro light-emitting diode device includes a substrate, a micro light-emitting diode, a first protection layer and a second protection layer. The micro light-emitting diode is adapted to be disposed on the substrate. The first protection layer is disposed on a first portion of an outer side wall of the micro light-emitting diode and has a gap from the substrate. The second protection layer is disposed on a second portion of the outer side wall of the micro light-emitting diode. The second protection layer is located in the gap between the first protection layer and the substrate and covers a part of the first protection layer. A maximum thickness of the first protection layer on the outer side wall is less than a maximum thickness of the second protection layer on the outer side wall. 1. A micro light-emitting diode device , comprising:a substrate;a micro light-emitting diode, disposed on the substrate;a first protection layer, disposed on a first portion of an outer side wall of the micro light-emitting diode and having a gap from the substrate; anda second protection layer, disposed on a second portion of the outer side wall of the micro light-emitting diode, wherein the second protection layer is located in the gap between the first protection layer and the substrate and covers a part of the first protection layer, and a maximum thickness of the first protection layer on the outer side wall is less than a maximum thickness of the second protection layer on the outer side wall.2. The micro light-emitting diode device according to claim 1 , wherein a ratio of the maximum thickness of the first protection layer on the outer side wall to the maximum thickness of the second protection layer on the outer side wall is less than or equal to 0.2.3. The micro light-emitting diode device according to claim 2 , wherein a thickness of the second protection layer on the substrate is gradually increased along a direction away from the first protection layer.4. The micro light ...

Method of transferring micro devices

A method of transferring micro devices is provided. A carrier substrate including a buffer layer and a plurality of micro devices is provided. The buffer layer is located between the carrier substrate and the micro devices. The micro devices are separated from each other and positioned on the carrier substrate by the buffer layer. A receiving substrate is in contact with the micro devices disposed on the carrier substrate. At least one of a temperature of the carrier substrate and the receiving substrate is changed, so that at least a portion of the micro devices is released from the carrier substrate and transferred to the receiving substrate. At least part of the number of micro devices is between 1000 and 2000000.

Display apparatus

MICRO LIGHT-EMITTING DIODE DISPLAY PANEL

A micro LED display panel includes a display area, a plurality of micro light-emitting elements and a plurality of micro control elements. The plurality of micro light-emitting elements is disposed in the display area and include a plurality of first color micro LEDs and a plurality of second color micro LEDs. A light wavelength of each of the first color micro LEDs is different from a light wavelength of each of the second color micro LEDs. The plurality of micro control elements is disposed in the display area, and include a plurality of first color micro circuit-chips and a plurality of second color micro circuit-chips. The plurality of first color micro circuit-chips control the plurality of first color micro LEDs, and the plurality of second color micro circuit-chips control the plurality of second color micro LEDs.

Method of transferring micro devices

A method of transferring micro devices is provided. A carrier substrate including a buffer layer and a plurality of micro devices is provided. The buffer layer is located between the carrier substrate and the micro devices. The micro devices are separated from one another and positioned on the carrier substrate through the buffer layer. A receiving substrate contacts the micro devices disposed on the carrier substrate. A temperature of at least one of the carrier substrate and the receiving substrate is changed after the micro devices contact the receiving substrate. At least a portion of the micro devices are transferred from the carrier substrate onto the receiving substrate after changing the temperature of at least one of the carrier substrate and the receiving substrate.

Micro semiconductor structure

A micro semiconductor structure is provided. The micro semiconductor structure includes a substrate, a plurality of micro semiconductor devices disposed on the substrate, and a first supporting layer disposed between the substrate and the micro semiconductor devices. Each of the micro semiconductor devices has a first electrode and a second electrode disposed on a lower surface of the micro semiconductor devices. The lower surface includes a region, wherein the region is between the first electrode and the second electrode. An orthographic projection of the first supporting layer on the substrate at least overlaps an orthographic projection of a portion of the region on the substrate. The first supporting layer directly contacts the region.

Protective cover

一種保護套，可拆卸地與一電子裝置組裝在一起且與電子裝置電性連接。電子裝置具有一影像擷取單元與一鏡頭。保護套包括一基部、至少一彎折部及多個發光單元。電子裝置配置於基部上。彎折部可折地連接基部的至少一側邊。電子裝置的一側面與彎折部之間具有至少一夾角。發光單元配置於彎折部上，且發光單元與鏡頭不共平面。

Micro semiconductor device structure

The disclosure provides a micro semiconductor device structure. According to embodiments of the disclosure, the micro semiconductor device structure includes a substrate, at least one supporting layer, and at least one micro semiconductor device. The supporting layer includes at least one top portion and a bottom portion, wherein the top portion extends alone a first direction. The length of the top portion along the first direction (L1) is larger than that of the bottom portion along the first direction (L2). Furthermore, a bottom surface of the micro semiconductor device directly contacts the top portion of the supporting layer.

MICRO LIGHT-EMITTING DIODE DEVICE

A micro light-emitting diode device includes a substrate, a micro light-emitting diode, a first protection layer and a second protection layer. The micro light-emitting diode is disposed on the substrate. The first protection layer is disposed on a first portion of an outer side wall of the micro light-emitting diode and has a gap from the substrate. The second protection layer is at least disposed on a second portion of the outer side wall and is located in the gap between the first protection layer and the substrate. A height of the second protection layer on the substrate is less than or equal to a height of the micro light-emitting diode on the substrate. 1. A micro light-emitting diode device , comprising:a substrate;a micro light-emitting diode, disposed on the substrate;a first protection layer, disposed on a first portion of an outer side wall of the micro light-emitting diode and having a gap from the substrate; anda second protection layer, at least disposed on a second portion of the outer side wall of the micro light-emitting diode and located in the gap between the first protection layer and the substrate, wherein a height of the second protection layer on the substrate is less than or equal to a height of the micro light-emitting diode on the substrate.2. The micro light-emitting diode device according to claim 1 , wherein the height of the second protection layer on the substrate is less than or equal to 0.5 time the height of the micro light-emitting diode on the substrate.3. The micro light-emitting diode device according to claim 1 , wherein a material of the first protection layer is different from a material of the second protection layer.4. The micro light-emitting diode device according to claim 3 , wherein a Young's modulus of the first protection layer is greater than a Young's modulus of the second protection layer.5. The micro light-emitting diode device according to claim 1 , wherein the micro light-emitting diode comprises a light- ...

MICRO LIGHT-EMITTING DEVICE MODULE

Structure with micro light-emitting device

A structure with micro light-emitting device includes a substrate, at least one micro light-emitting device, at least one holding structure and a buffer layer. The micro light-emitting device is disposed on the substrate. The holding structure is arranged at an edge of the micro light-emitting device, and is located between the substrate and the micro light-emitting device and directly contacts with the substrate. The buffer layer is disposed between the micro light-emitting device, the holding structures and the substrate.

Micro-led display panel

Hose reinforced pipe

A hose reinforced pipe is provided which includes a pipe and a plurality of reinforcing ribs. The plurality of reinforcing ribs is circular embedded in the inner wall of the pipe. The pipe is provided with a cut in a cross-section, so that the pipe can open or close via the tension of the reinforcing ribs, whereby the hose reinforced pipe can package the object through the cut, and the hose reinforced pipe is fixed on the object via the tension of the reinforcing ribs.

Micro LED display device and manufacturing method thereof

A micro LED display device including a display substrate, a plurality of pairs of conductive pads and a plurality of micro light emitting elements is provided. The display substrate has a first arranging area, a splicing area connected to the first arranging area, and a second arranging area connected to the splicing area, wherein the splicing area is located between the first arranging area and the second arranging area. The conductive pad pairs are disposed on the display substrate in array with the same width. The micro light emitting elements are disposed on the display substrate and are electrically bonded to the conductive pad pairs. A manufacturing method of a micro LED display device is also provided.

Display substrate and display panel

A display substrate comprises a base board and a first pad. A first connection area is defined on a first surface of the base board. The first pad is disposed on the first surface. A part of the first pad is located in the first connection area. The first pad is configured to be electrically connected to a first electrode of a light emitting component in the first connection area. The first pad includes a main connection part and an auxiliary part. At least part of the projection of the main connection part on the base board is located in of the first connection area. There is a gap between the main connection part and the auxiliary connection part.

Charger calibrating device and calibrating method thereof

The present invention discloses a charger calibrating device and a calibrating method thereof. The device comprises a control module and a processing module. The control module controls a charger to be calibrated to perform a first stage charging and a second stage charging on an electronic device. The processing module performs an adjusting process according to the second stage charging time for adjusting the high level period of the PWM signal in the charging circuit of the charger. The adjusting process is that the processing module adds up a preset high level period and a preset adjusting amplitude or subtracts the preset adjusting amplitude from the preset high level period to obtain an updated high level period and decreases the preset adjusting amplitude to obtain an updated adjusting amplitude. The processing module terminates the calibrating process after repeating the aforementioned calibrating loop a preset number of times.

METHOD OF TRANSFERRING MICRO DEVICES

A method of transferring micro devices is provided. A carrier substrate including a buffer layer and a plurality of micro devices is provided. The buffer layer is located between the carrier substrate and the micro devices. The micro devices are separated from one another and positioned on the carrier substrate through the buffer layer. A receiving substrate contacts the micro devices disposed on the carrier substrate. A temperature of at least one of the carrier substrate and the receiving substrate is changed after the micro devices contact the receiving substrate. At least a portion of the micro devices are transferred from the carrier substrate onto the receiving substrate after changing the temperature of at least one of the carrier substrate and the receiving substrate. 1. A method of transferring micro devices , comprising:providing a carrier substrate, on which a buffer layer and a plurality of micro devices are disposed, the buffer layer being located between the carrier substrate and the micro devices, the micro devices being separated from one another and positioned on the carrier substrate through the buffer layer;making a receiving substrate contact the micro devices on the carrier substrate; andchanging a temperature of at least one of the carrier substrate and the receiving substrate after the micro devices contact the receiving substrate, wherein at least a portion of the micro devices are transferred from the carrier substrate onto the receiving substrate after changing the temperature of at least one of the carrier substrate and the receiving substrate.2. The method of transferring micro devices as recited in claim 1 , wherein changing the temperature of at least one of the carrier substrate and the receiving substrate comprises:changing the temperature of the carrier substrate to reduce bonding force between the at least a portion of the micro devices and the carrier substrate.3. The method of transferring micro devices as recited in claim 2 , ...

Package carrier

A package carrier suitable for carrying at least one light emitting unit is provided. The package carrier includes an annular shell and a transparent light guiding stage. The annular shell has a cavity. The transparent light guiding stage is disposed in the cavity of the annular shell. The light emitting unit is adapted to be disposed on the transparent light guiding stage, and a horizontal projection area of the transparent light guiding stage is greater than that of the light emitting unit. The light emitting unit emits a light beam to enter the transparent light guiding stage and emit from a surface of the transparent light guiding stage away from the cavity.

Micro light-emitting device display apparatus

Micro led display panel

MICRO SEMICONDUCTOR STRUCTURE

A micro semiconductor structure is provided. The micro semiconductor structure includes a substrate, a plurality of micro semiconductor devices disposed on the substrate, and a first supporting layer disposed between the substrate and the micro semiconductor devices. Each of the micro semiconductor devices has a first electrode and a second electrode disposed on a lower surface of the micro semiconductor devices. The lower surface includes a region, wherein the region is between the first electrode and the second electrode. An orthographic projection of the first supporting layer on the substrate at least overlaps an orthographic projection of a portion of the region on the substrate. The first supporting layer directly contacts the region. 1. A micro semiconductor structure , comprising:a substrate;a plurality of micro semiconductor devices disposed on the substrate, wherein each of the micro semiconductor devices has a first electrode and a second electrode disposed on a lower surface of the micro semiconductor devices, the lower surface includes a region, wherein the region is between the first electrode and the second electrode; anda plurality of first supporting layers disposed between the substrate and the micro semiconductor devices, wherein an orthographic projection of the first supporting layers on the substrate at least overlaps an orthographic projection of a portion of the region on the substrate, and the first supporting layers directly contacts the region.2. The micro semiconductor structure as claimed in claim 1 , wherein the orthographic projection of the first supporting layer on the substrate is located within an orthographic projection of the region on the substrate.3. The micro semiconductor structure as claimed in claim 1 , wherein the orthographic projection of the first supporting layer extends outward along the first direction from the orthographic projection of the region to the outside of the orthographic projection of the region.4. The ...

Substrate and display device

The present invention discloses a substrate and a display device. The substrate is configured to receive a plurality of micro elements on a carrier. The substrate comprises a substrate body, a first conductive bump, and a second conductive bump. The substrate body has a first surface, and a transfer area is defined within the first surface. A central portion and a peripheral portion is defined within the transfer area. The first conductive bump, disposed on the central portion, has a first volume. The second conductive bump, disposed on the peripheral portion, has a second volume. Wherein the first volume is different from the second volume.

Carrier structure and micro device structure

A carrier structure suitable for transferring or bearing a plurality of micro devices including a carrier and a plurality of transfer units. The carrier includes a carrier surface and a plurality of recesses disposed on the carrier surface. The transfer units are respectively disposed in the recesses and a plurality of transferring surface are exposed. Each micro device has a component surface. The transferring surface of each transfer unit is used for connecting the component surface of the micro device. A micro device structure including the carrier structure is also provided.

Micro semiconductor structure

A micro semiconductor structure is provided. The micro semiconductor structure includes a substrate, at least one supporting layer, and at least one micro semiconductor device. The supporting layer includes at least one upper portion and a bottom portion, wherein the upper portion extends in a first direction. The length L1 of the upper portion in the first direction is greater than the length L2 of the bottom portion in the first direction. Furthermore, the bottom surface of the micro semiconductor device is in direct contact with the upper portion of the supporting layer.

Method for fabricating micro light emitting diode display

Transparent display panel

MICRO LIGHT-EMITTING DEVICE AND DISPLAY APPARATUS

A micro light-emitting device includes an epitaxial structure, a first type pad, a current commanding structure and an insulating layer. The epitaxial structure includes a first type semiconductor layer, a light-emitting layer and a second type semiconductor layer. The first type pad is disposed on the epitaxial structure and electrically connected to the first type semiconductor layer. The current commanding structure is disposed on the epitaxial structure and electrically connected to the second type semiconductor layer. An orthogonal projection area of the current commanding structure on the second type semiconductor layer is smaller than a surface area of a surface of the second type semiconductor layer. The insulating layer contacts a portion of the current commanding structure and a portion of the surface of the second type semiconductor layer. The insulating layer has an opening exposing at least a portion of the portion of the current commanding structure. 1. A micro light-emitting device , comprising: a first type semiconductor layer;', 'a light-emitting layer disposed on the first type semiconductor layer; and', 'a second type semiconductor layer disposed on the light-emitting layer;, 'an epitaxial structure, comprisinga first type pad disposed on the epitaxial structure and electrically connected to the first type semiconductor layer;a current commanding structure disposed on the epitaxial structure and electrically connected to the second type semiconductor layer, wherein an orthogonal projection area of the current commanding structure on the second type semiconductor layer is smaller than a surface area of a surface of the second type semiconductor layer; andan insulating layer contacting a portion of the current commanding structure and a portion of the surface of the second type semiconductor layer, wherein the insulating layer has an opening exposing at least a portion of the portion of the current commanding structure.2. The micro light-emitting ...

MICRO LED DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

A micro LED display device including a display substrate, a plurality of conductive pad pairs and a plurality of micro light emitting elements is provided. The display substrate has a first arranging area, a splicing area connected to the first arranging area, and a second arranging area connected to the splicing area, wherein the splicing area is located between the first arranging area and the second arranging area. The conductive pad pairs are disposed on the display substrate in an array with the same pitch. The micro light emitting elements are disposed on the display substrate and are electrically bonded to the conductive pad pairs. A manufacturing method of the micro LED display device is also provided.

Display substrate and display panel

A display substrate comprises a base board and a first bonding pad. The base board comprises a first surface having a first bonding district. The first bonding pad is disposed on the first surface. The first bonding pad is configured to electrically connect to a first electrode of a light emitting component in the first bonding district. The first bonding pad comprises a main bonding portion and an auxiliary bonding portion, wherein at least a part of an orthogonal projection of the main bonding portion on the base board is in the first bonding district. The auxiliary bonding portion electrically connects to the main bonding portion, wherein at least a part of an orthogonal projection of the auxiliary bonding portion on the base board is outside the first bonding district. There is a gap between the main bonding portion and the auxiliary bonding portion.

Micro light-emitting device module

A micro light-emitting device module includes a circuit board, a flat layer and a micro light-emitting device. The flat layer is disposed on an upper surface of the circuit board and has a first surface and a second surface opposite to each other. The second surface contacts the upper surface of the circuit board. The micro light-emitting device is disposed on the first surface of the flat surface. A maximum height difference of the second surface of the flat layer is greater than a thickness of the micro light-emitting device.

Micro-led display panel and manufacturing method thereof

LIGHT EMITTING DIODE DISPLAY

A light emitting diode display includes a plurality of display units and a plurality of auxiliary display units. The display units are arranged in an array and connected to each other. Each of the display units has a device arrangement region, a peripheral region surrounding the device arrangement region, and a plurality of first light emitting devices disposed on the device arrangement region and arranged in an array. The auxiliary display units are disposed on the peripheral regions of the display units. Each of the auxiliary display units includes an auxiliary substrate and a plurality of second light emitting devices arranged in an array. The second light emitting devices are disposed on the auxiliary substrate and located at a level different from a level of the first light emitting devices. Each of the auxiliary substrates is across adjacent two of the display units. 1. A light emitting diode display , comprising:a plurality of display units arranged in an array and connected to each other, each of the display units having a device arrangement region, a peripheral region surrounding the device arrangement region, and a plurality of first light emitting devices disposed on the device arrangement region and arranged in an array; anda plurality of auxiliary display units disposed on the peripheral regions of the display units, each of the auxiliary display units comprising an auxiliary substrate and a plurality of second light emitting devices arranged in an array, wherein the second light emitting devices are disposed on the auxiliary substrate and located at a level different from a level of the first light emitting devices, and each of the auxiliary substrates is across adjacent two of the display units.2. The light emitting diode display as recited in claim 1 , wherein a first horizontal spacing exists between adjacent two of the first light emitting devices on one of the display units claim 1 , a second horizontal spacing exists between adjacent two of the ...

Micro light-emitting device and display apparatus

A micro light-emitting device includes an epitaxial structure, a first type pad, a current commanding structure and an insulating layer. The epitaxial structure includes a first type semiconductor layer, a light-emitting layer and a second type semiconductor layer. The first type pad is disposed on the epitaxial structure and electrically connected to the first type semiconductor layer. The current commanding structure is disposed on the epitaxial structure and electrically connected to the second type semiconductor layer. An orthogonal projection area of the current commanding structure on the second type semiconductor layer is smaller than a surface area of a surface of the second type semiconductor layer. The insulating layer contacts a portion of the current commanding structure and a portion of the surface of the second type semiconductor layer. The insulating layer has an opening exposing at least a portion of the portion of the current commanding structure.

Electrode structure, micro light emitting device, and display panel

An electrode structure includes a first electrode and a second electrode disposed opposite to each other. The first electrode has a first side and a second side. The second side is located between the first side and the second electrode. The first electrode has a maximum vertical length and a minimum vertical length from the first side to the second side, and a ratio of the minimum vertical length to the maximum vertical length is less than 0.8. The second electrode and the first electrode are separated by a first vertical gap and a second vertical gap, and the second vertical gap is greater than the first vertical gap.

Micro LED carrier board

A micro LED carrier board is provided. The micro LED carrier board includes a substrate structure having a first surface and a second surface and having a central region and a peripheral region on the outside of the central region. The micro LED carrier board includes a plurality of micro LED elements forming an array and on the second surface of the substrate structure. The micro LED carrier board includes a patterned structure formed on the first surface and the second surface. The patterned structure has a first pattern density in the central region and a second pattern density in the peripheral region, and the first pattern density is different from the second pattern density.

Light emitting diode display

A light emitting diode display includes a plurality of display units and a plurality of auxiliary display units. The display units are arranged in an array and connected to each other. Each of the display units has a device arrangement region, a peripheral region surrounding the device arrangement region and a plurality of first light emitting devices disposed on the device arrangement region and arranged in an array. The auxiliary display units are disposed on the peripheral regions of the any two adjacent display unis. Each of the auxiliary display units includes an auxiliary substrate and a plurality of second light emitting devices arranged in an array. The second light emitting devices are disposed on the auxiliary substrate and located at a different level with the first light emitting devices. The auxiliary substrate is connected across two adjacent display units.

Micro light-emitting diode display panel having control element for controlling multiple micro light-emitting diodes emitting the same color

A micro LED display panel includes a display area, a plurality of micro light-emitting elements and a plurality of micro control elements. The plurality of micro light-emitting elements is disposed in the display area and include a plurality of first color micro LEDs and a plurality of second color micro LEDs. A light wavelength of each of the first color micro LEDs is different from a light wavelength of each of the second color micro LEDs. The plurality of micro control elements is disposed in the display area, and include a plurality of first color micro circuit-chips and a plurality of second color micro circuit-chips. The plurality of first color micro circuit-chips control the plurality of first color micro LEDs, and the plurality of second color micro circuit-chips control the plurality of second color micro LEDs.

Micro-LED display panel

A micro-LED display panel including a substrate, a plurality of micro-LEDs, and a plurality of reinforced structures is provided. The micro-LEDs are disposed at a side of the substrate, wherein each of the micro-LEDs comprises an epitaxial layer and an electrode layer electrically connected to the epitaxial layer, and the electrode layer are located between the epitaxial layers and the substrate. Each of the micro-LEDs is electrically connected to the substrate through the corresponding electrode layer. Each of electrode layers includes a first electrode and a second electrode. The reinforced structures are disposed between the micro-LEDs and the substrate respectively, and each of the reinforced structures is located between the corresponding the first electrode and the second electrode. A Young's modulus of each of reinforced structures is smaller than a Young's modulus of the corresponding electrode layer.

Multifunctional self-generation mobile power shoes

Injection needle

An injection needle connected to a syringe includes a tip and a tail, the tail is connected to an injection hole of the syringe, wherein a plurality of colored blocks are disposed on a surface of the injection needle from 1mm near the tip toward the tail. The injection needle of the utility model may help operators to determine the depth of the injection needle inserted into skin or affected regions.

Electrode structure, micro light emitting device, and display panel

An electrode structure includes a first electrode and a second electrode disposed opposite to each other. The first electrode has a first side and a second side. The second side is located between the first side and the second electrode. The first side to the second side have a maximum vertical length and a minimum vertical length, and a ratio of the minimum vertical length to the maximum vertical length is less than 0.8. The second electrode has a first vertical gap and a second vertical gap from the first electrode, and the second vertical gap is greater than the first vertical gap.

CARRIER STRUCTURE AND MICRO DEVICE STRUCTURE

DISPLAY APPARATUS

A display apparatus includes a driving substrate and a plurality of micro light-emitting devices (LEDs). The driving substrate has a plurality of pixel regions. The plurality micro LEDs are disposed in in each of the pixel regions and electrically connected to the driving substrate. Orthogonal projection areas of the micro LEDs in each of the pixel regions on the driving substrate are equal. At least two micro LEDs in each of the pixel regions have different effective light-emitting areas.

COMPOSITE OPTICAL FILM

The present invention relates to a composite optical film, which comprises a substrate having diffusion micro-structures and a structured surface on one side of the substrate wherein said composite optical film has an internal diffusion haze of no less than 5% as measured according to JIS K7136 standard method. The composite optical film of the present invention has both light-diffusion and light-converging properties. The composite optical film of the present invention, when utilized in a liquid crystal display (LCD), can not only effectively enhance the luminance of the LCD panel but also avoid light dispersion and Moiré phenomena that may occur when said composite optical film is stacked with other material films.

Micro LED display panel

A micro LED display panel includes a display area, a plurality of micro light-emitting elements and a plurality of micro control elements. The plurality of micro light-emitting elements are disposed in the display area and include a plurality of first color micro LEDs and a plurality of second color micro LEDs. A light wavelength of each of the first color micro LEDs is different from a light wavelength of each of the second color micro LEDs. The plurality of micro control elements are disposed in the display area, and includes a plurality of first color micro circuit chips and a plurality of second color micro circuit chips. The plurality of first color micro circuit chips control the plurality of first color micro LEDs, and the plurality of second color micro circuit chips control the plurality of second color micro LEDs.

Micro LED carrier board

A micro LED carrier board is provided. The micro LED carrier board includes a substrate structure having a first surface and a second surface and having a central region and a peripheral region on the outside of the central region. The micro LED carrier board includes a plurality of micro LED elements forming an array and on the second surface of the substrate structure. The micro LED carrier board includes a patterned structure formed on the first surface and the second surface. The patterned structure has a first pattern density in the central region and a second pattern density in the peripheral region, and the first pattern density is different from the second pattern density.

Carrier structure and micro device structure

A carrier structure suitable for transferring or supporting a plurality of micro devices including a carrier and a plurality of transfer units is provided. The transfer units are disposed on the carrier. Each of the transfer units includes a plurality of transfer parts. Each of the transfer parts has a transfer surface. Each of the micro devices has a device surface. The transfer surfaces of the transfer parts of each of the transfer units are connected to the device surface of corresponding micro device. The area of each of the transfer surfaces is smaller than the area of the device surface of the corresponding micro device. A micro device structure using the carrier structure is also provided.

Light emitting diode display

Micro light-emitting device and display apparatus

A light-emitting device includes an epitaxial structure layer, a first type pad, a second type pad and a current commanding structure. The epitaxial structure layer includes a first type semiconductor layer, a light-emitting layer and a second type semiconductor layer. The first type pad is electrically connected to the first type semiconductor layer. The second type pad is electrically connected to the second type semiconductor layer. The current commanding structure is disposed between the second type semiconductor layer and the second type pad. The contact resistance between the second type semiconductor layer and the current commanding structure is smaller than the contact resistance between the second type semiconductor layer and the second type pad. An orthogonal projection area of the current commanding structure on the second type semiconductor layer is smaller than an orthogonal projection area of the second type pad on the second type semiconductor layer.

METHOD FOR TRANSFERRING LIGHT-EMITTING ELEMENTS ONTO A PACKAGE SUBSTRATE

A method for transferring light-emitting elements onto a package substrate includes: providing a light-emitting unit including a temporary substrate and light-emitting elements; disconnecting the light-emitting elements from the temporary substrate to allow the light-emitting elements to float on a fluid; adjusting spacings between the light-emitting elements to have a predetermined size by controlling flow of the fluid; placing a package substrate into the fluid, followed by aligning the light-emitting elements with connecting pads of the package substrate so as to correspondingly place the light-emitting elements on the connecting pads; and removing the package substrate with the light-emitting elements from the fluid. 1. A method for transferring light-emitting elements onto a package substrate , comprising:providing a light-emitting unit including a temporary substrate and a plurality of light-emitting elements, each of the light-emitting elements being removably connected to the temporary substrate;disconnecting the light-emitting elements from the temporary substrate to allow the light-emitting elements to float on a fluid;adjusting spacings between the light-emitting elements to have a predetermined size by controlling flow of the fluid;providing a package substrate including a plurality of connecting pads arranged to have spacings of the predetermined size;placing the package substrate into the fluid, followed by aligning the light-emitting elements with the connecting pads of the package substrate so as to correspondingly place the light-emitting elements on the connecting pads of the package substrate; andremoving the package substrate together with the light-emitting elements from the fluid.2. The method of claim 1 , wherein the step of adjusting the spacings between the light-emitting elements is conducted by controlling a flow rate and a flow direction of the fluid.3. The method of claim 2 , wherein the light-emitting elements are arranged in a two- ...

METHOD FOR FABRICATING MICRO LIGHT-EMITTING DIODE DISPLAY

A method for fabricating a micro light-emitting diode display is provided. The method includes disposing a plurality of micro light-emitting diodes on a carrier; transferring the micro light-emitting diodes from the carrier to a display substrate and disposing the micro light-emitting diodes in a plurality of pixels of the display substrate; subjecting the micro light-emitting diodes to a pre-bonding process to electrically connect the micro light-emitting diodes to the display substrate; subjecting the micro light-emitting diodes pre-bonded to the display substrate to a first detection process, thereby identifying whether a faulty micro light-emitting diode is present or not; and, subjecting the micro light-emitting diodes to the main bonding process after the first detection process.

COMPOSITE OPTICAL FILM

【課題】光学現象を除去することができかつより経済的な光学フィルムを提供する。 【解決手段】本発明は、拡散微細構造を有する基板と基板の片面上の構造化面とを含む複合光学フィルムに関し、上記複合光学フィルムは、ＪＩＳ Ｋ７１３６規格の方法に従って測定されると５％以上の内部拡散ヘーズを有する。本発明の複合光学フィルムは、光拡散特性と集光特性の両方を有する。本発明の複合光学フィルムは、液晶ディスプレイ（ＬＣＤ）に利用されたとき、ＬＣＤパネルの輝度を効果的に高めることができるだけでなく、上記複合光学フィルムが他の材料のフィルムと共に積層されたときに起こりうる光分散現象およびモアレ現象を回避することもできる。 【選択図】 図４

Display panel and head mounted device

MICRO LED DISPLAY PANEL AND MANUFACTURING METHOD THEREOF

A micro LED display panel comprises a substrate, a plurality of light emitting components, an insulating layer and a plurality of electrical components. The substrate comprises a first surface. The light emitting components are disposed on the first surface. The insulating layer is on the plurality of light emitting components and has a second surface and a third surface opposite to each other. The second surface faces the first surface. The electrical components are disposed on the third surface and electrically connect to the light emitting components. The number of the electrical components is less than the number of the light emitting components. The roughness of the third surface is greater than the roughness of the first surface.

Display panel

A display panel includes a first substrate and a light shielding layer. The first substrate includes a plurality of pixel areas which are arranged in an array. Each pixel area includes a first color light emitting diode and a second color light emitting diode. The first color light emitting diode includes a first main light emitting surface which is toward a display direction. The second color light emitting diode includes a second main emitting surface which is toward the display direction. An area of the first main light emitting surface is larger than an area of the second main light emitting surface. The light shielding layer is disposed in the pixel areas and overlaps the partial first main light emitting surface in one of the pixel areas at the display direction.

Display panel with micro light emitting diode

Micro light-emitting device module

A micro light-emitting device module includes a circuit substrate, a planarization layer and a micro light-emitting device. The planarization layer is disposed on an upper surface of the circuit substrate and has a first surface and a second surface opposite to each other. The second surface is in contact with the upper surface of the circuit substrate. The micro light-emitting device is disposed on the first surface of the planarization layer. A maximum height difference of the second surface of the planarization layer is greater than a thickness of the micro light-emitting device.

Structure with micro light-emitting device

A structure with micro light-emitting device includes a substrate, at least one micro light-emitting device, at least one holding structure and a buffer layer. The micro light-emitting device is disposed on the substrate. The holding structure is arranged at an edge of the micro light-emitting device, and is located between the substrate and the micro light-emitting device and directly contacts with the substrate. The buffer layer is disposed between the micro light-emitting device, the holding structures and the substrate.

Micro-led display panel and manufacturing method thereof

A micro-LED display panel including a substrate, an anisotropic conductive film, and a plurality of micro-LEDs is provided. The anisotropic conductive film is disposed on the substrate. The micro-LEDs and the anisotropic conductive film are disposed at the same side of the substrate, and the micro-LEDs are electrically connected to the substrate through the anisotropic conductive film. Each of the micro-LEDs includes an epitaxial layer and an electrode layer electrically connected to the epitaxial layer, and the electrode layers comprises a first electrode and a second electrode which are located between the substrate and the corresponding epitaxial layer. A ratio of a thickness of each of the electrode layers to a thickness of the corresponding epitaxial layer ranges from 0.1 to 0.5, and a gap between the first electrode and the second electrode of each of the micro-LEDs is in a range of 1 μm to 30 μm.

Micro semiconductor device and micro semiconductor display

A micro semiconductor device and a micro semiconductor display are provided. The micro semiconductor device includes an epitaxial structure, a first electrode, a second electrode and a supporting layer. The epitaxial structure has a bottom surface and a top surface, wherein the bottom surface is defined as a central region and a peripheral region. A first electrode and a second electrode are disposed on the central region of the bottom surface of the epitaxial structure, or the first electrode is disposed on the central region of the bottom surface of the epitaxial structure and the second electrode is disposed on the top surface of the epitaxial structure. The supporting layer is disposed on the peripheral region of the bottom surface of the epitaxial structure.

SUBSTRATE AND DISPLAY DEVICE

The present invention discloses a substrate configured to receive a plurality of micro elements on a carrier board. The substrate comprises a body, a first conductive bump, and a second conductive bump. The body has a first surface, a transfer area is defined within the first surface, and a central portion and a peripheral portion is defined within the transfer area. The first conductive bump, disposed on the central portion, has a first volume. The second conductive bump, disposed on the peripheral portion, has a second volume. Wherein the first volume is different from the second volume. 1. A substrate , configured to receive a plurality of micro elements on a carrier board , comprising:a body having a first surface;a first conductive bump, disposed on a central portion, having a first volume; anda second conductive bump, disposed on a peripheral portion, having a second volume;wherein a transfer area is defined within the first surface, and the central portion and the peripheral portion is defined within the transfer area;wherein the first volume is different from the second volume.2. The substrate according to claim 1 , wherein the first conductive bump has a first thickness claim 1 , the second conductive bump has a second thickness claim 1 , and when the first volume is smaller than the second volume claim 1 , the first thickness is smaller than the second thickness.3. The substrate according to claim 2 , wherein the first conductive bump has a first contact area on the first surface claim 2 , the second conductive bump has a second contact area on the first surface claim 2 , and the first contact area and the second contact area are the same.4. The substrate according to claim 1 , wherein the first conductive bump has a first contact area on the first surface claim 1 , the second conductive bump has a second contact area on the first surface claim 1 , and when the first volume is smaller than the second volume claim 1 , the first contact area is smaller than ...

Micro semiconductor structure

A micro semiconductor structure is provided. The micro semiconductor structure includes a substrate, at least one supporting layer, and at least one micro semiconductor device. The supporting layer includes at least one upper portion and a bottom portion, wherein the upper portion extends in a first direction. The length L 1 of the upper portion in the first direction is greater than the length L 2 of the bottom portion in the first direction. Furthermore, the bottom surface of the micro semiconductor device is in direct contact with the upper portion of the supporting layer.

CARRIER STRUCTURE AND MICRO DEVICE STRUCTURE

A carrier structure suitable for transferring or supporting a plurality of micro devices includes a carrier and a plurality of transfer units. The carrier has a carrier surface and a plurality of recesses disposed on the carrier surface. The transfer units are respectively disposed in the recesses and a plurality of transferring surfaces are exposed. Each micro device has a device surface. The transferring surface of each transfer unit is configured to be connected to the device surface of the corresponding micro device. A micro device structure including the carrier structure is also provided. 1. A micro device structure , comprising: a carrier having a carrier surface and a plurality of recesses, the recesses being located on the carrier surface of the carrier; and', 'a plurality of transfer units, wherein the transfer units are respectively disposed in the recesses; and, 'a carrier structure, comprisinga plurality of micro devices, wherein each of the micro devices has a device surface, and a transferring surface of each of the transfer units is connected to the device surface of the corresponding micro device.2. The micro device structure according to claim 1 , wherein the transferring surface is aligned with the carrier surface.3. The micro device structure according to claim 1 , wherein the transferring surface protrudes from the carrier surface.4. The micro device structure according to claim 3 , wherein a ratio of a height by which the transferring surface protrudes from the carrier surface to a height of the each of the transfer units is less than or equal to 0.8.5. The micro device structure according to claim 1 , wherein a Young's modulus of the each of the transfer units is less than a Young's modulus of the carrier and a Young's modulus of the corresponding micro device.6. The micro device structure according to claim 1 , wherein a ratio of area of the transferring surface of the each of the transfer units to area of the device surface of the ...

Micro light-emitting device display apparatus

A micro light-emitting device display apparatus includes a circuit substrate, at least one micro light-emitting device, and at least one conductive bump. The circuit substrate includes at least one pad. The micro light-emitting device is disposed on the circuit substrate and includes at least one electrode. At least one of the pad and the electrode has at least one closed opening. The conductive bump is disposed between the circuit substrate and the micro light-emitting device. The conductive bump extends into the closed opening and defines at least one void with the closed opening. The electrode of the micro light-emitting device is electrically connected to the pad of the circuit substrate with the conductive bump.

Micro led carrier board

A micro LED carrier board is provided. The micro LED carrier board includes a substrate structure having a first surface and a second surface and having a central region and a peripheral region on the outside of the central region. The micro LED carrier board includes a plurality of micro LED elements forming an array and on the second surface of the substrate structure. The micro LED carrier board includes a patterned structure formed on the first surface and the second surface. The patterned structure has a first pattern density in the central region and a second pattern density in the peripheral region, and the first pattern density is different from the second pattern density.

METHOD OF TRANSFERRING MICRO DEVICES

A method of transferring micro devices is provided. A carrier substrate including a buffer layer and a plurality of micro devices is provided. The buffer layer is located between the carrier substrate and the micro devices. The micro devices are separated from one another and positioned on the carrier substrate through the buffer layer. A receiving substrate contacts the micro devices disposed on the carrier substrate. A temperature of at least one of the carrier substrate and the receiving substrate is changed, so that at least a portion of the micro devices are released from the carrier substrate and transferred onto the receiving substrate. A number of the at least a portion of the micro devices is between 1000 and 2000000. 1. A method of transferring micro devices , comprising:providing a carrier substrate, on which a buffer layer and a plurality of micro devices are disposed, the buffer layer being located between the carrier substrate and the micro devices, the micro devices being separated from one another and positioned on the carrier substrate through the buffer layer;making a receiving substrate contact the micro devices on the carrier substrate; andchanging a temperature of at least one of the carrier substrate and the receiving substrate after the micro devices contact the receiving substrate, so that at least a portion of the micro devices are released from the carrier substrate and transferred onto the receiving substrate, wherein a number of the at least a portion of the micro devices is in a range from 1000 to 2000000.2. The method of transferring micro devices as recited in claim 1 , wherein the buffer layer covers a lower surface of the carrier substrate and the micro devices expose a portion of the buffer layer.3. The method of transferring micro devices as recited in claim 1 , wherein the buffer layer comprises a plurality of buffer parts corresponding to the micro devices claim 1 , and the buffer parts are separated from one another and expose a ...

DISPLAY SUBSTRATE AND DISPLAY PANEL

A display substrate comprises a base board and a first bonding pad. The base board comprises a first surface having a first bonding district. The first bonding pad is disposed on the first surface. The first bonding pad is configured to electrically connect to a first electrode of a light emitting component in the first bonding district. The first bonding pad comprises a main bonding portion and an auxiliary bonding portion, wherein at least a part of an orthogonal projection of the main bonding portion on the base board is in the first bonding district. The auxiliary bonding portion electrically connects to the main bonding portion, wherein at least a part of an orthogonal projection of the auxiliary bonding portion on the base board is outside the first bonding district. There is a gap between the main bonding portion and the auxiliary bonding portion. 1. A display substrate comprising: a main bonding portion, wherein at least a part of an orthogonal projection of the main bonding portion on the base board is in the first bonding district; and', 'an auxiliary bonding portion electrically connecting to the main bonding portion, wherein at least a part of an orthogonal projection of the auxiliary bonding portion on the base board is outside the first bonding district, and there is a gap between the main bonding portion and the auxiliary bonding portion., 'a first bonding pad disposed on the first surface, wherein a part of the first bonding pad is in the first bonding district, the first bonding pad is configured to electrically connect to a first electrode of a light emitting component at the first bonding district, and the first bonding pad comprises, 'a base board with a first surface, wherein the first surface comprises a first bonding district; and'}2. The display substrate according to claim 1 , wherein the auxiliary bonding portion comprises a plurality of auxiliary bonding blocks claim 1 , the plurality of auxiliary bonding blocks electrically connect to ...

MANUFACTURING METHOD OF MICRO-LED DISPLAY PANEL

A micro-LED display panel including a substrate, an anisotropic conductive film, and a plurality of micro-LEDs is provided. The anisotropic conductive film is disposed on the substrate. The micro-LEDs and the anisotropic conductive film are disposed at the same side of the substrate, and the micro-LEDs are electrically connected to the substrate through the anisotropic conductive film. Each of the micro-LEDs includes an epitaxial layer and an electrode layer electrically connected to the epitaxial layer, and the electrode layers comprises a first electrode and a second electrode which are located between the substrate and the corresponding epitaxial layer. A ratio of a thickness of each of the electrode layers to a thickness of the corresponding epitaxial layer ranges from 0.1 to 0.5, and a gap between the first electrode and the second electrode of each of the micro-LEDs is in a range of 1 μm to 30 μm. 1. A manufacturing method of a micro-LED display panel , comprising:(A) providing a substrate with an anisotropic conductive film;(B) transferring a plurality of micro-LEDs to the substrate and disposing the micro-LEDs on the anisotropic conductive film;(C) repeating the step (B) to dispose a required number of the micro-LEDs on the substrate; and(D) processing by heating and pressuring to electrically bond the micro-LEDs to the substrate.2. The manufacturing method of the micro-LED display panel according to claim 1 , wherein in the step (B) claim 1 , the micro-LEDs are aligned with a plurality of pads of the substrate respectively.3. The manufacturing method of the micro-LED display panel according to claim 1 , wherein in the step (D) claim 1 , a bonding layer is formed between one of the micro-LEDs and one of the pads to electrically connect the one of the micro-LEDs and the substrate.4. The manufacturing method of the micro-LED display panel according to claim 1 , wherein in the step (D) claim 1 , a first electrode and a second electrode of each micro-LED are ...

Display apparatus

A display apparatus includes a driving substrate and a plurality of micro light-emitting devices (LEDs). The driving substrate has a plurality of pixel regions. The plurality micro LEDs are disposed in in each of the pixel regions and electrically connected to the driving substrate. Orthogonal projection areas of the micro LEDs in each of the pixel regions on the driving substrate are equal. At least two micro LEDs in each of the pixel regions have different effective light-emitting areas.

Optical film composite

Optical film composite

The present invention relates to an optical film composite, which comprises a brightness enhancement element and a light diffusion element, wherein the light diffusion element comprises a substrate with a light diffusion layer on at least one side thereof, wherein the light diffusion element has a haze of no less than 98% as measured according to JIS K7136 standard method.

Micro light-emitting diode display panel having control element for controlling multiple micro light-emitting diodes emitting the same color

A micro LED display panel includes a display area, a plurality of micro light-emitting elements and a plurality of micro control elements. The plurality of micro light-emitting elements is disposed in the display area and include a plurality of first color micro LEDs and a plurality of second color micro LEDs. A light wavelength of each of the first color micro LEDs is different from a light wavelength of each of the second color micro LEDs. The plurality of micro control elements is disposed in the display area, and include a plurality of first color micro circuit-chips and a plurality of second color micro circuit-chips. The plurality of first color micro circuit-chips control the plurality of first color micro LEDs, and the plurality of second color micro circuit-chips control the plurality of second color micro LEDs.

Manufacturing method of micro led display device

A micro LED display device including a display substrate, a plurality of conductive pad pairs and a plurality of micro light emitting elements is provided. The display substrate has a first arranging area, a splicing area connected to the first arranging area, and a second arranging area connected to the splicing area, wherein the splicing area is located between the first arranging area and the second arranging area. The conductive pad pairs are disposed on the display substrate in an array with the same pitch. The micro light emitting elements are disposed on the display substrate and are electrically bonded to the conductive pad pairs. A manufacturing method of the micro LED display device is also provided.

Transparent display panel

A transparent display panel with a light-transmitting substrate, a plurality of top-emitting micro light emitting diodes, a plurality of bottom-emitting micro light emitting diodes, and a light shielding layer. The light transmissive substrate has a surface. These top-emitting micro light emitting diodes and these bottom-emitting micro light emitting diodes are disposed on the surface of the light transmissive substrate. The bottom-emitting micro light emitting diodes has an epitaxial structure and a light shielding member, the epitaxial structure has a pair of upper and lower surfaces on the opposite sides, the lower surface faces toward the light transmissive substrate, and the light shielding member is disposed on the upper surface to shield the light emitted by the bottom-emitting micro light emitting diodes towards the upper surface.

Micro LED display device and manufacturing method thereof

A micro LED display device includes a substrate, micro LED units and a transparent insulation layer. The substrate includes conductive pads and conductive connecting portions. The conductive pads are disposed on the substrate. Each of the micro LED units includes a semiconductor epitaxial structure and electrodes. The electrodes are disposed on the semiconductor epitaxial structure, and each of the electrodes is connected to one of the conductive connecting portions adjacent to each other. The transparent insulation layer is disposed on the substrate and covers the conductive pads, the conductive connecting portions and the micro LED units, and the transparent insulation layer is filled between the electrodes of each of the micro LED units. The transparent insulation layer relative to a surface on each of the semiconductor epitaxial structures is of a first thickness and a second thickness, and the first thickness is different from the second thickness.

Micro led display device and manufacturing method thereof

A micro LED display device includes a substrate, micro LED units and a transparent insulation layer. The substrate includes conductive pads and conductive connecting portions. The conductive pads are disposed on the substrate. Each of the micro LED units includes a semiconductor epitaxial structure and electrodes. The electrodes are disposed on the semiconductor epitaxial structure, and each of the electrodes is connected to one of the conductive connecting portions adjacent to each other. The transparent insulation layer is disposed on the substrate and covers the conductive pads, the conductive connecting portions and the micro LED units, and the transparent insulation layer is filled between the electrodes of each of the micro LED units. The transparent insulation layer relative to a surface on each of the semiconductor epitaxial structures is of a first thickness and a second thickness, and the first thickness is different from the second thickness.

Micro light emitting diode

A micro light emitting diode includes an epitaxial structure, a first electrode, a second electrode, at least one via and an insulating layer. The epitaxial structure has a surface and includes a first-type semiconductor layer, a light emitting layer and a second-type semiconductor layer. The first electrode and the second electrode are respectively disposed on the surface of the epitaxial structure. The second electrode is located outside around the first electrode and symmetrically disposed with respect to a geometric center of a bonding surface of the epitaxial structure. The via extends from the second-type semiconductor layer to the first-type semiconductor layer. The insulating layer is disposed on the second-type semiconductor layer together with the first electrode. The insulating layer extends to cover an inner wall of the via, and the via is non-symmetrically disposed with respect to the geometric center of the bonding surface of the epitaxial structure.

數位式閃光燈充電電路

Manufacturing method of micro LED display device

A micro LED display device including a display substrate, a plurality of conductive pad pairs and a plurality of micro light emitting elements is provided. The display substrate has a first arranging area, a splicing area connected to the first arranging area, and a second arranging area connected to the splicing area, wherein the splicing area is located between the first arranging area and the second arranging area. The conductive pad pairs are disposed on the display substrate in an array with the same pitch. The micro light emitting elements are disposed on the display substrate and are electrically bonded to the conductive pad pairs. A manufacturing method of the micro LED display device is also provided.

Method and system for evaluating risk of subject getting specific disease

A method for evaluating a risk of a subject getting a specific disease includes steps of: storing a reference database that contains original parameter sets; selecting target alleles from an SNP profile derived from genome sequencing data of a subject; selecting target parameter sets from among the original parameter sets; calculating, for each of the target parameter sets, a race factor based on a global risk allele frequency and a group-specific risk allele frequency included in the target parameter set; calculating a genetic factor based on statistics, global reference allele frequencies, the race factors for the target parameter sets, and numbers of chromosomes in homologous chromosome pairs included in the target parameter sets; calculating a citation factor based on numbers of citation times included in the target parameter sets; and calculating a risk score based on the genetic factor and the citation factor.