Laser cutting system and cutting method

The invention relates to a laser cutting system and a cutting method that use the laser cutting system to cut brittle material base plate. The laser cutting system comprises a first bearing platform and a second bearing platform used to bear the brittle material base plate, both the first bearing platform and the second bearing platform can make reciprocating movement on the first direction and the second direction which is perpendicular to the first direction; a laser generation device which is arranged between the first bearing platform and the second bearing platform is used to generate laser beam; a first cooling device and a second cooling device which are respectively arranged at both opposite sides of the laser generation device are used to spray the cooling fluid; a first marking tool and a second marking tool are respectively arranged at the side where the second cooling device opposites to the laser generation device and at the side where the first cooling device opposites to ...

Laser processing method and corresponding laser machining apparatus

The present invention relates to laser machining process and equipment. The laser machining process includes the following steps; setting the workpiece onto the working bench, heating the machined area of the workpiece to preset temperature, and machining the heated machined area with laser beam. The laser machining equipment includes one working bench for bearing the workpiece, one laser source to emit laser beam, and one heating source to preheat the machined area of the workpiece to preset temperature and reduce the temperature difference between the temperature of the machined area and the high temperature the laser beam generates.

Laser cutting method

The invention discloses a laser cutting method to cut fragile material base, which comprises the following steps: utilizing a cracker to form pre-cutting line on the fragile material base; using laser beam to heat the fragile material base along the pre-cutting line; adopting gas lower than zero deg. c to cool the heat fragile material base without penetrating water among bases to influence the normal work to improve the cutting standard rate; cracking the fragile material base along the pre-cutting line. The invention uses gas not to remain residual drip on the surface of base, which needn't clean the base after cutting due to using gas as cooling flow, therefore reducing the manufacturing cost.

Medication record information managing method and system

Provided are a medication record information managing method and system. The managing method comprises the steps of prescription obtaining, wherein an acceptance end reader is used for obtaining an original digital prescription through a carrier; encryption, wherein according to a secret key generated by at least one hardware identifier of an acceptance terminal, the original digital prescription is encrypted, so that an encrypted digital prescription is generated; prescription transmission, wherein the encrypted digital prescription is transmitted to a medication record database through the acceptance terminal, and then the encrypted digital prescription is transmitted to an objective terminal through the medication record database; and decryption, wherein the secret key is used for decrypting the encrypted digital prescription, so that the original digital prescription is obtained.

Odd time learning system and odd time learning method

The invention discloses an odd time learning system and an odd time learning method and relates to a snooze alarm system aiming to solve the problem that interactivity is lacked during odd time learning in the prior art. The odd time learning method is characterized by comprising the following steps: triggering learning time points; selecting learning or not by users; selecting and arranging learning contents which are expected to be loaded according to a regulation system or an algorithm of the odd time learning system; and loading the learning contents to a playing device to be received by the users. The odd time learning system can be used for a computer system or an electric device, such as a mobile phone, an MP3, a PDA or a personal computer, and the like.

Laser device for cutting and method thereof

The invention discloses a laser cutting device, which is used for cutting brittle material base board along the preset direction. The laser cutting device comprises: a load device, which is used for loading the brittle material base board; a breakage tool, which is used for forming a pre-cutting line along the preset direction on the brittle material base board; a laser generating device, which is used for producing laser bean to heat the brittle material base board along the pre-cutting line; a cooling device, which is used for providing cooling liquid to cool the heated brittle material base board, to make the brittle base board break along the pre-cutting line; a clamp device, which comprises at least one pair of clamp components, which is used to clamp the brittle material base board from the two corresponding sides of the preset direction. The invention also provides a method of using the laser cutting device to cut brittle material baseboard.

Laser cutting method

Laser cutting system and cutting method

The invention relates to a laser cutting system and a cutting method that use the laser cutting system to cut brittle material base plate. The laser cutting system comprises a first bearing platform and a second bearing platform used to bear the brittle material base plate, both the first bearing platform and the second bearing platform can make reciprocating movement on the first direction and the second direction which is perpendicular to the first direction; a laser generation device which is arranged between the first bearing platform and the second bearing platform is used to generate laser beam; a first cooling device and a second cooling device which are respectively arranged at both opposite sides of the laser generation device are used to spray the cooling fluid; a first marking tool and a second marking tool are respectively arranged at the side where the second cooling device opposites to the laser generation device and at the side where the first cooling device opposites to ...

Laser cutting device

Laser cutting method and apparatus

Method for cutting crisp material substrate