SIMULTANEOUS BONDING OF MULTIPLE WORKPIECES

BONDING WITH A COMPLIANT MEDIUM

METHOD OF FORMING AN INTEGRATED CIRCUIT ASSEMBLY

A METHOD OF FORMING AN INTEGRATED CIRCUIT ASSEMBLY A method of forming an integrated circuit assembly is disclosed. The method comprises selectively treating a surface of a carrier to delineate a pattern thereon capable of receiving a metal deposit. The pattern is contacted with a conductive lead of an integrated circuit. The pattern is also contacted with a conductive external element and a metal is then deposited on the pattern to form an assembly having a continuous conductive metal pattern joining the lead and the external element. The resultant metal-deposited assembly may then be encapsulated and removed from the carrier.

METHODS AND APPARATUS FOR EXTRUDING ARTICLES

METHODS AND APPARATUS FOR EXTRUDING ARTICLES A fused silica glass tube (26) is extruded from a melt (21) in a chamber (11) pressurized with an inert gas. A shield (for example 29) is placed in close, spaced, relation to the melt (21) surface during the gas pressure extrusion process to substantially eliminate losses from the melt due to vaporization.

VERFAHREN UND VORRICHTUNG ZUR EXTRUDIERUNG VON ROHREN AUS EINER GLASSCHMELZE

VERFAHREN ZUM VERBINDEN EINES ERSTEN, VERLUSTARMEN DIELEKTRISCHEN WERKSTUECKES MIT EINEM ZWEITEN WERKSTUECK

Improvements in or relating to ultrasonic bonding

... 1,126,038. Welding by pressure. WESTERN ELECTRIC CO. Inc. 23 Dec., 1965 [6 Jan., 1965], No. 54529/65. Heading B3R. In bonding a first body to a second body the intended bond areas are held in contact, at least the bond region, i.e. the region to undergo deformation, of one of the bodies is maintained at a temperature within its hot working temperature range i.e. the temperature range within which plastic deformation is not accompanied by strain hardening, but below the melting point of either body and applying ultrasonic vibratory energy to the bodies to effect a bond. A glass plate 11, Fig. 1, having a tantalum film 12 sputtered thereon is clamped on an anvil 10 and an aluminium lead 13 is positioned under the tip 27 of an ultrasonic welder 26 and over the film 12. The tip 27 holds the workpieces together and the lead 13 is resistance heated by means of a first conductor 31 attached to the lead and a second conductor 32 attached to the welder 26 or is heated by gas passed through a resistance ...

ULTRASONIC BONDING METHOD

METHOD OF DEPOSITING A METAL ON A SURFACE COMPRISING AN ELECTRICALLY NON-CONDUCTIVE FERRITE

A METHOD OF DEPOSITING A METAL ON A SURFACE COMPRISING AN ELECTRICALLY NON-CONDUCTIVE FERRITE A method of depositing a metal on a surface comprising an electrically non-conductive ferrite is disclosed. The method comprises contacting the surface with a cathodically charged element. The element is then electroplated to deposit a metal thereon and on the contacted surface.

ULTRASONIC BONDING METHOD

Befestigungsverfahren für Glasfasern

Verfahren zum luftdichten Abschliessen von elektronischen Geräten

BONDING WITH A COMPLIANT MEDIUM

METHOD FOR GENERATING CIRCUIT ELEMENTS AND BONDING SAME TO A SUBSTRATE

Improvements in or relating to Ultrasonic Bonding

... 1,181,280. Welding by pressure. WESTERN ELECTRIC CO. Inc. 5 July, 1967 [31 Aug., 1966], No. 30935/67. Addition to 1,126,038. Heading B3R. In bonding a first body to a second body of copper by ultrasonic bonding at least the bond region of the second body is maintained at a temperature at which plastic deformation is not accompanied by strain hardening and below the melting point of either body. A copper lead or wire 13 to be bonded to a tantalium film 12 sputtered on a glass substrate 11 is positioned under the bonding tip 27 of an ultrasonic bonding horn 26 with its bond area placed on top of the tantalium film 12 on the substrate 11 clamped on an anvil 10. The wire 13 is heated by resistance heating, the current being supplied by conductors 31, 32 attached by clips to the wire and horn 26 respectively. The wire may alternatively be heated by gas passed through a resistance heating gun and directed through a nozzle 50. An inert gas, e.g. argon or hydrogen or forming gas (90% nitrogen 10% ...

Verbinden von Werkstuecken mit Hilfe eines nachgiebigen Stoffes

Ultraschall-Schweissverfahren

Gleichzeitige Verbindung vielfacher Werkstuecke

Verfahren zum Schweissen mit Ultraschall

VERFAHREN ZUM VERBINDEN VON WERKSTUECKEN MIT EINER UNTERLAGE

Verfahren zum luftdichten Abschliessen von elektronischen Geräten

Befestigungsverfahren für Glasfasern

VERFAHREN ZUM VERBINDEN WENIGSTENS ZWEIER ELEKTRISCHER LEITER

MANUFACTURE OF AIRTIGHT SEALING PACKAGE FOR ELECTRONIC ELEMENT

PURPOSE: To provide a method by which a package which can surely airtightly seal an electronic element from the external environment can be manufactured inexpensively. CONSTITUTION: Firstly, a closed loop-like hole 12 which surrounds the inner part 13 of a stencil member 11 is formed in the stencil member 11. The closed loop-like hole is a continuous hole except a plurality of web members and each web member is elongated across the hole 12 so as to fixe the inner part of the stencil 11 to the remaining part of the stencil 11. After glass slurry is formed on a substrate in the form of a closed loop, a glass loop 32 coupled with a first substrate is formed by glazing the slurry. The first substrate is used as a cover plate and put on a second substrate 24 containing an electronic element 23. Then the first and second substrate are similarly heated so that the glass loop can be softened and the substrates can be coupled with each other with the softened glass loop. When the glass loop is cooled ...

BONDING METHOD

PURPOSE: To perform effective soldering without giving any damages to a substrate when the substrate is heated by transmitting heat to a first member and a second member from a third member by radiation while the third member is isolated form the first and second members. CONSTITUTION: When a laser beam 16 is projected upon a heating member 17, a solder element 15 melts and a lead 14 is soldered to a bonding pad 11. The heating member 17 is formed of a material which is selected so as to absorb the laser beam 16 and convert the laser beam 16 into heat without being damaged. The heat is radiated to a surrounded area 18 formed of the heating member 17 and a substrate 12 and sufficiently raises the temperature of the lead 14 until the solder 15 melts. It is preferable to separate the heating member 17 from the substrate 12 by forming a gap 20 between the member 17 and substrate 12 or to thermally insulate the member 17 from the substrate 12. COPYRIGHT: (C)1989,JPO ...

METHOD FOR CONTACT BONDING OF MEMBER TO SUBSTRATE

PURPOSE: To form a package capable of preventing an element such as a semiconductor from being contaminated. CONSTITUTION: When pressure is applied to a boundary between an element such as a glass sphere and an optical fiber and alminium together with energy, the element can be permanently joined with the aluminium surface 13 of a substrate 12. For instance, a glass sphere 11 can be joined by pressing the sphere 11 to an aluminium surface 13 while heating the aluminium 13. Sound wave energy also can be impressed to the sphere 11 instead of heating. A glass fiber also can be joined with an aluminum surface by a similar method. COPYRIGHT: (C)1993,JPO ...

METHOD FOR JOINING OPTICAL FIBER COATED WITH ALUMINUM

PURPOSE: To precisely a position an optical fiber and to avoid use of an adhesive which causes pollution with respect to the method for joining the optical fiber coated with aluminum. CONSTITUTION: A junction tool 18 heated by a heat source 19 applies both heat and a pressure to an optical fiber 11 coated with an aluminum layer 15. Thus, it can be permanently joined to the surface of a silicon substrate 12. This method very precisely aligns the axis of the optical fiber 11 in a V groove 16 as prescribed and avoids use of an adhesive which can be a pollution source. COPYRIGHT: (C)1995,JPO ...

OPTICAL FIBER CONNECTION METHOD

PURPOSE: To provide reliable connection between an optical fiber and an aluminium coated substrate. CONSTITUTION: First and second V grooves 14 and 15 are respectively formed in first and second single crystal semiconductor elements 11 and 12 and aluminium layers 17 and 18 are formed only in a part in a longitudinal direction in the first and second V grooves. The optical fiber 13 is placed between the first and second grooves and heated and compressed by heat and pressure sufficient for connecting the aluminium layer and the optical fiber between the first and second single crystal element facing each other. By turning not the entire groove but only a part to aluminium, compression force added to the first and second single crystal elements is concentrated to a boundary between the aluminium layer and the optical fiber. Thus, the pressure between the optical fiber and the aluminium is increased more than the pressure generated when the entire length of the V-shaped groove is made into ...

SURFACE-MOUNTING METHOD FOR ELECTRONIC DEVICE

PURPOSE: To provide a mounting method for exactly arraying and connecting leads to a bonding pad, even with high density. CONSTITUTION: An electronic device 10 is surface-mounted on the bonding pad of a substrate 12, by initially mounting a device in an opening 24 of a glass plate 17. A lead 14 for the electronic device is coated with soldering, and pressurized on the bonding pad by the reusable glass plate 17. While the glass plate is pressurized on the lead, the glass plate is directly scanned by a laser beam 16 from the upper part of each column of the bonding pad. The laser light beam is a light beam with wavelength which is suitable for converting the laser light beam into heat by the glass plate. The solder is melted by this heat, and the lead is connected with the bonding pad. COPYRIGHT: (C)1992,JPO ...

PROCESS FOR JOINT WELDING OF SMALL COMPONENTS

Bonding with a compliant medium

A plurality of independently displaceable pins are employed to apply bonding pressure to a compliant medium at widely spaced bonding sites. The pins permit compensation for workpiece irregularities between the bonding sites such as substrate waviness, warpage, lack of parallelism, etc., while the compliant medium compensates for localized workpiece irregularities such as variations in the thickness of leads and/or land areas.

Method for producing an electrical circuit arrangement

Ultrasonic bonding method

Bonding of optical fibers

METHOD AND INSTALLATION FOR EXTRUDING ARTICLES, IN PARTICULAR FROM A VISCOUS GLASS MASS MASS

PROCEDE ET INSTALLATION POUR EXTRUDER DES ARTICLES. UN TUBE 26 DE VERRE FONDU EN SILICE EST EXTRUDE A PARTIR D'UNE MASSE FONDUE 21 CONTENUE DANS UNE CHAMBRE 11 MISE SOUS PRESSION PAR UN GAZ INERTE. UN ECRAN 29 EST PLACE A PROXIMITE DE LA SURFACE DE LA MASSE 21 FONDUE PENDANT L'EXTRUSION AFIN D'ELIMINER PRATIQUEMENT TOUTE PERTE DE MASSE FONDUE PAR VAPORISATION. INDUSTRIE DU VERRE. METHOD AND INSTALLATION FOR EXTRUDING ARTICLES. A TUBE 26 OF MELTED GLASS IN SILICA IS EXTRUDED FROM A MOLTEN MASS 21 CONTAINED IN A CHAMBER 11 PRESSURIZED BY AN INERT GAS. A SCREEN 29 IS PLACED NEAR THE SURFACE OF MELTED MASS 21 DURING EXTRUSION IN ORDER TO PRACTICALLY ELIMINATE ANY LOSS OF MELT MASS BY VAPORIZATION. GLASS INDUSTRY.

Bonding of optical fibers

Method for hermetically sealing electronic devices

Metodo para sellar hermeticamente dispositivos electronicos.

UN EMPAQUETADO DE DISPOSITIVO ELECTRONICO SE REALIZA HACIENDO PRIMERO EN UN ELEMENTO ESTARCIDOR (11) UNA ABERTURA (12) EN FORMA DE CURVA CERRADA QUE RODEA UNA PARTE INTERIOR (13) DEL ELEMENTO ESTARCIDOR. LA CURVA CERRADA ES UNA ABERTURA CONTINUA EXCEPTO EN VARIOS ELEMENTOS INTERMEDIOS (15), CADA UNO DE LOS CUALES SE EXTIENDE CRUZANDO LA ABERTURA PARA ASEGURAR LA ZONA ESTARCIDORA INTERIOR AL RESTO DEL ELEMENTO ESTARCIDOR. UNA MEZCLA DE CRISTAL (17) SE EMPUJA A TRAVES DE LA ABERTURA DEL ELEMENTO ESTARCIDOR SOBRE UN PRIMER SUSTRATO (18) PARA FORMAR EN EL SUSTRATO UNA CURVA CERRADA DE MEZCLA DE CRISTAL, QUE DESPUES SE HACE VIDRIO PARA FORMAR UNA CURVA CERRADA (32) UNIDA AL PRIMER SUSTRATO. EL PRIMER SUSTRATO SE UTILIZA COMO PLACA DE CUBIERTA Y SE COLOCA SOBRE UN SEGUNDO SUSTRATO (24) QUE CONTIENE UN DISPOSITIVO ELECTRONICO (23) DE TAL FORMA QUE EL CIRCULO CERRADO DE VIDRIO RODEA EL DISPOSITIVO ELECTRONICO Y PONE EN CONTACTO EL SEGUNDO SUSTRATO EN TODA SU LONGITUD. EL VIDRIO SE CALIENTA LO SUFICIENTE PARA ABLANDARLO Y HACE QUE SE UNA AL SEGUNDO SUSTRATO ASI COMO EL PRIMER SUSTRATO. EL ENFRIAMIENTO DEL CIRCULO CERRADO DE CRISTAL DESARROLLA CIERRES HERMETICOS CONTINUOS TANTO AL PRIMER COMO AL SEGUNDO SUSTRATO, DE ESTA MANERA SE AISLA EL DISPOSITIVO ELECTRONICO DEL AMBIENTE EXTERNO

Verfahren zum gleichzeitigen verbinden einer mehrzahl elektrischer leiter

Simultaneous bonding of multiple workpieces