21-04-2010 дата публикации
Номер: CN0101697001A
Принадлежит:
The invention discloses a method for detecting positional deviation among layers of a multilayer printed circuit board, which comprises the following steps: A, selecting an even layer or an odd layer in the printed circuit board, and setting a plurality of circular alignment marks of which the diameters are in equidifferent and progressive increase on the selected layers; B, etching the circular alignment marks on the layers to form substrates, and overlying and pressing the layers in the printed circuit board into a whole according to the circular alignment marks; C, drilling holes on the circular alignment marks from the outermost layer of the printed circuit board, wherein the bore diameters of drilling holes are the minimum bore diameter in the circular alignment marks; D, etching copper materials around the drilling holes at the outermost layer of the printed circuit board to form circular rings so as to enable the drilling holes to be independent mutually; and E, measuring the short-circuit ...
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