Force measurement device for measuring low-frequency force and high-frequency force

The disclosure relates to a force measurement device including central portion, fixing portion, first and second sensing portions, and first and second electromechanical elements. The first sensing portion has first natural frequency. The first sensing portion is connected to the central portion. The second sensing portion has a second natural frequency. The second sensing portion is connected to the first sensing portion and the fixing portion. The first electromechanical element is disposed on the first sensing portion to measure a first vibration amplitude. The second electromechanical element is disposed on the second sensing portion to measure a second vibration amplitude. When the central portion is subjected to a first force, the first vibration amplitude is larger than the second vibration amplitude. When the central portion is subjected to a second force, the first vibration amplitude is smaller than the second vibration amplitude.

MEMORY CONTROL CIRCUIT UNIT, MEMORY STORAGE DEVICE AND CONTROL METHOD THEREOF

A control method of a memory storage device is provided and includes: detecting a first signal stream controlled by a host system; executing a boot code according to the first signal stream and entering a boot code mode; and receiving a command from the host system in the boot code mode and not executing a firmware code stored in a rewritable non-volatile memory module in the memory storage device. According, operational flexibility of the memory storage device may be enhanced. 1. A memory control circuit unit configured to control a memory storage device , the memory control circuit unit comprising:a host interface, configured to be coupled to a host system;a memory interface, configured to be coupled to a rewritable non-volatile memory module of the memory storage device;a signal detection circuit; anda memory management circuit, coupled to the host interface, the memory interface, and the signal detection circuit,wherein the signal detection circuit is configured to detect a first signal stream controlled by the host system,wherein the memory management circuit is configured to execute a boot code according to the first signal stream and enter a boot code mode,wherein the memory management circuit is further configured to receive a command from the host system in the boot code mode and not to execute a firmware code stored in the rewritable non-volatile memory module after entering the boot code mode.2. The memory control circuit unit as claimed in claim 1 , wherein the memory management circuit is further configured to establish a connection with the host system in the boot code mode after entering the boot code mode.3. The memory control circuit unit as claimed in claim 1 , wherein the memory management circuit is further configured to load the firmware code from the rewritable non-volatile memory module and attempt to establish a connection with the host system based on an execution of the firmware code before the signal detection circuit detects the first ...

MICRO-ELECTROMECHANICAL APPARATUS FOR THERMAL ENERGY CONTROL

A MEMS apparatus for thermal energy control including a sensor and an IC chip is provided. The sensor includes a heating device for heating a sensing element and a detecting device for detecting a physical quantity. The IC chip includes a memory unit for storing a target value of the sensing element and a data processing unit for convert the physical quantity to a converted value, where a gap value is defined by subtracting the converted value from the target value. Besides, a control unit of the IC chip sets a parameter value according to the gap value, and a driving unit adjusts a quantity of thermal energy generated by the heating device according to the parameter value to reduce heating time and frequency of the heating device thereby reducing electrical power consumption. The MEMS apparatus is applicable to MEMS sensors requiring controlled operating temperature, such as a gas sensor.

Calibration system for pressure sensor

A calibration system for calibrating pressure sensor comprises communication pipe, base, inlet valve, outlet valve, pump, inlet pipe, heater and reference pressure sensor. The communication pipe has first and second openings. The base comprises chamber body and outlet being disposed at the chamber body. The inlet valve is disposed at the first opening. The chamber body is connected to the second opening so as to define a space between the inlet valve and the outlet valve. The heater is to heat a fluid in the space. The reference pressure sensor is configured to measure a pressure of the fluid. The at least one target pressure sensor is detachably mounted on the chamber body via the base so as to measure the pressure of the fluid in the space.

BALL SCREW WITH FORCE SENSOR IN RADIAL DIRECTION

A ball screw with force sensor in radial direction including a screw rod, a screw nut, a plurality of balls, and a force sensor is provided. The screw nut has a cavity. The cavity is extended along a radial direction from an outer surface of the screw nut. The force sensor is disposed in the cavity of the screw nut, and the force sensor includes a stationary base and an elastic component. The stationary base includes a displacement restraint, and the elastic component includes a contact end and a fixed end. The displacement restraint is coupled to the cavity to prevent the stationary base from being displaced in the radial direction for fixing stationary base firmly in the cavity. The fixed end is connected to the stationary base, and the contact end contacts a bottom surface of the cavity in order to sense a force along the radial direction. 1. A ball screw with force sensor in radial direction , comprising:a screw rod, an outer surface of the screw rod having an outer groove and the screw rod extending along an axial direction;a screw nut, an inner surface of the screw nut having an inner groove and the screw nut having a cavity, wherein the cavity extends along a radial direction from an outer surface of the screw nut, the screw nut being sleeved on the screw rod such that the screw nut is movable along the axial direction;a plurality of balls, disposed between the outer groove and the inner groove; and [ 'a displacement restraint; and', 'a stationary base, comprising, a contact end, contacting a bottom surface of the cavity; and', 'a fixed end, connected to the stationary base;, 'an elastic component, comprising, 'at least one strain sensor, disposed on the elastic component;, 'a force sensor, disposed in the cavity and comprisingwherein the displacement restraint is coupled to the cavity to prevent the stationary base from being displaced in the radial direction.2. The ball screw with force sensor in radial direction according to claim 1 , wherein a stiffness ...

Micro-electro mechanical apparatus with PN-junction

A micro-electro mechanical apparatus having a PN-junction is provided. The micro-electro mechanical apparatus includes a movable mass, a conductive layer, and an electrode. The movable mass includes a P-type semiconductor layer and an N-type semiconductor layer. The PN-junction is formed between the P-type semiconductor layer and the N-type semiconductor layer. The micro-electro mechanical apparatus is capable of eliminating abnormal voltage signal when an alternating current passes through the conductive layer. The micro-electro mechanical apparatus is adapted to measure acceleration and magnetic field. The micro-electro mechanical apparatus can be other types of micro-electro mechanical apparatus such as micro-electro mechanical scanning micro-mirror.

MEMS microphone package

An MEMS microphone package includes a substrate, an MEMS microphone, an IC chip and an electrically conductive cover. The substrate includes a first hole, an upper surface, a bottom surface, a side surface, a first electrically conductive layer and a second electrically conductive layer. The side surface has two sides connected to the upper surface and the bottom surface, respectively. The first electrically conductive layer is disposed on the upper surface. The second electrically conductive layer is disposed on the bottom surface. The MEMS microphone is electrically coupled to the substrate. The IC chip is electrically coupled to the substrate. The electrically conductive cover includes a second hole. The electrically conductive cover is bonded to the substrate to form a chamber for accommodating the MEMS microphone and the IC chip. The first hole and the second hole together form an acoustic hole.

Memory storage device and management method thereof

A management method for managing a memory storage device compatible with a PCIe (PCI Express) standard is disclosed. The memory storage device has a plurality of pins configured to couple to a host system. The management method includes: transmitting a first command to the memory storage device through at least one first pin among the pins to control the memory storage device to enter a target link status; and when the memory storage device is in the target link status, transmitting a second command to the memory storage device through a second pin among the pins to control the memory storage device to leave the target link status. The second pin is not a pin dedicated to control the memory storage device to enter or leave the target link status.

Piezoelectric sensing system and piezoelectric sensing circuit

A piezoelectric system comprises a piezoelectric sensor, a voltage stabilizer, a discharger and an operation sensor. The piezoelectric sensor outputs a sensing signal through a sensor output terminal according to a rate of change of pressure. The voltage stabilizer has a positive terminal electrically connecting with the sensor output terminal. The voltage stabilizer receives the sensing signal, stores the energy of the sensing signal, and keeps the voltage of the sensing signal as a constant when the rate of change of pressure is zero. The discharger has a first terminal connecting with the positive terminal, a second terminal coupled to ground, and a control terminal receiving a trigger signal to control the first terminal to conduct with or not conduct with the second terminal. The operation sensor electrically connects to the control terminal for sensing an operation generating the pressure and outputs the trigger signal accordingly.

Temperature control circuit, memory storage device and temperature control method

A temperature control circuit for an electronic device is provided. The temperature control circuit includes a temperature detector, a status detection circuit and a control circuit. The temperature detector is configured to detect a temperature of the electronic device and generate first evaluation information. The status detection circuit is configured to detect a work status of at least one circuit module in the electronic device and generate second evaluation information. The control circuit is configured to adjust at least one electronic parameter of the electronic device according to the first evaluation parameter and the second evaluation parameter to control the temperature of the electronic device.

Pressure sensor with calibration device and calibration method thereof

A pressure sensor with calibration device includes a casing, a diaphragm, a sensing element, a medium, and at least one calibration element. The diaphragm is disposed on the casing, wherein the casing and the diaphragm define an accommodating space. The sensing element is disposed in the casing. The medium is filled in the accommodating space and in contact with the sensing element. The at least one calibration element is adjustably disposed at the casing and extended into the accommodating space to be in contact with the medium, wherein when the at least one calibration element is moved relative to the casing in a direction toward the accommodating space or in a direction away from the accommodating space, the at least one calibration element changes the pressure applied to the medium. The pressure sensor with calibration device adjusts the pressure value sensed by the sensing element via the calibration element.

PACKAGE AND PACKAGING ASSEMBLY OF MICROELECTROMECHANICAL SYSYEM MICROPHONE

A package of a MEMS microphone is suitable for being mounted on a printed circuit board. The package includes a substrate, at least one MEMS microphone, and a conductive sealing element. The MEMS microphone is arranged on the substrate, and electrically connected to a conductive layer on a bottom surface of the substrate. The conductive sealing element is arranged on the substrate and around the MEMS microphone for connecting the printed circuit board, and constructs an acoustic housing with the printed circuit board and the substrate. The acoustic housing has at least one acoustic hole passing through the substrate. The acoustic hole has a metal layer on the inner wall thereof for connecting the conductive layer on the bottom surface of the substrate to another conductive layer on the top surface of the substrate.

Micro-electromechanical apparatus utilizing folded spring for rotary element

A micro-electromechanical apparatus includes a rotary element, at least one restraint and at least two folded springs. The rotary element is capable of rotating with respect to an axis. The folded springs are symmetrically disposed about the axis. Each folded spring has a moving end and a fixed end, the moving end is connected to the rotary element, and the fixed end is connected to the at least one restraint. The moving end is not located on the axis, and the fixed end is not located on the axis. A moving distance is defined as a distance between the moving end and the axis, a fixed distance is defined as a distance between the fixed end and the axis. A spring length is defined as a distance between the moving end and the fixed end. The spring length is varied according to the rotation of the rotary element.

Adjustable sensing capacitance microelectromechanical system (MEMS) apparatus

An adjustable sensing capacitance microelectromechanical system (MEMS) apparatus includes an ASIC and a sensing component. The ASIC includes a top surface, a readout circuit and a plurality of electrical switches. The sensing component, configured to sensing physical quantity, includes a fixed electrode and a movable electrode. The fixed electrode includes a plurality of electrode units. The movable electrode is able to be moved relative to the fixed electrode. The electrical switches are respectively and electrically coupled to the electrode units so as to control a working status of each of the electrode units, thereby changing a sensing capacitance of the MEMS sensor.

MEMS apparatus having impact absorber

A MEMS apparatus includes a substrate, a cover disposed on the substrate, a movable mass disposed on the substrate, and an impact absorber disposed on the cover. The impact absorber includes a restraint, a stationary stopper disposed on a lower surface of the cover, a movable stopper, elastic elements connecting the restraint and the movable stopper, a supporting element connecting the restraint and the stationary stopper, and a space disposed between the stationary stopper and the movable stopper. The impact absorber is adapted to prevent the movable mass from impacting the cover. In addition, the supporting element may be made of an electrical insulation material to reduce electrostatic interaction between the movable mass and the movable stopper.

CAPACITIVE TRANSDUCER AND FABRICATION METHOD

A capacitive transducer and fabrication method are disclosed. The capacitive transducer includes a substrate, a first electrode mounted on the substrate, a cap having a through-hole and a cavity beside the through-hole, a second electrode mounted on the cap across the through-hole. The second electrode is deformable in response to pressure fluctuations applied thereto via the through-hole and defines, together with the first electrode, as a capacitor. The capacitor includes a capacitance variable with the pressure fluctuations and the cavity defines a back chamber for the deformable second electrode.

Crystal oscillator and method for manufacturing the same

A crystal oscillator includes a cover, a crystal blank and an Integrated Circuit (IC) chip. The cover has a surface, a cavity formed in the surface, a plurality of conductive contacts and a conductive sealing ring. The conductive contacts are disposed on the surface, and the conductive sealing ring is disposed on the surface and surrounds the conductive contacts. The IC chip is connected to the conductive contacts and the conductive sealing ring, and forms a hermetic chamber with the cover and the conductive sealing ring. The crystal blank is located in the hermetic chamber, and is electrically connected to the IC chip. Furthermore, a method for manufacturing a crystal oscillator is also provided.

Microelectromechanical apparatus having a measuring range selector

A MEMS apparatus having measuring range selector including a sensor and an IC chip is provided. The sensor includes a sensing device. The IC chip includes a voltage range selector, an analog front end, a control device and an A/D converter. The sensing device is configured to detect the physical quantity and generate a sensing voltage. The voltage range selector is configured to select a sub-voltage range having a first upper-bound and a first lower-bound. The analog front end is configured to receive the sensing voltage and output a first voltage. The A/D converter has a full scale voltage range having a second lower-bound and a second upper-bound. A ratio of the full scale voltage range to the sub-voltage range is defined as a gain factor. A difference obtained by subtracting the first lower-bound from the first voltage is defined as a shift factor. The control device is configured to adjust the first voltage to the second voltage according to the gain factor and the shift factor.

APPARATUS WITH TWO ANCHORS

An apparatus with two anchors including a housing, a movable element, and a rotary element is provided. The housing includes a first expansion unit, a second expansion unit, and a linkage. First alignment structures are disposed in the movable element and anti-rotation structures are disposed in the linkage. When the movable element and the rotary element enter the housing from two ends and are coupled along an axis, the movable element and the rotary element can approach each other to expand the first expansion unit and the second expansion unit to fonn two anchors. The apparatus :with two anchors secures a sensor in a variety of environments such as walls or machines. When the apparatus with two anchors fixes a sensor in a hole of a stamping machine, the impact force does not cause stress concentration on the sensor so as to improve the reliability of the sensor.

Micro-electromechanical apparatus with multiple chambers and method for manufacturing the same

A micro-electromechanical apparatus with multiple chambers and a method for manufacturing the same are provided, wherein various micro-electromechanical sensors are integrated into a single apparatus. For example, the micro-electromechanical apparatus in this disclosure may have two independent hermetically sealed chambers with different pressures, such that a micro-electromechanical barometer and a micro-electromechanical accelerometer can be operated in an optimal pressure circumstance.

MEMORY STORAGE DEVICE AND MANAGEMENT METHOD THEREOF

A management method for managing a memory storage device compatible with a PCIe (PCI Express) standard is disclosed. The memory storage device has a plurality of pins configured to couple to a host system. The management method includes: transmitting a first command to the memory storage device through at least one first pin among the pins to control the memory storage device to enter a target link status; and when the memory storage device is in the target link status, transmitting a second command to the memory storage device through a second pin among the pins to control the memory storage device to leave the target link status. The second pin is not a pin dedicated to control the memory storage device to enter or leave the target link status.

MICROELECTROMECHANICAL SYSTEM DEVICE WITH ELECTRICAL INTERCONNECTIONS AND METHOD FOR FABRICATING THE SAME

A microelectromechanical system device including anchors and mass is provided. Electrical interconnections are formed on the mass by using a insulation layer of mass, an electrical insulation trench and conductive through hole. The electrical interconnections replace the cross-line structure without adding additional processing steps, thereby reducing the use of the conductive layer and the electrical insulation layer. A method for fabricating the microelectromechanical system device is also provided. 1. A microelectromechanical system device with electrical interconnections comprising: a insulation layer of mass dividing the mass into a base conductive layer and a target conductive layer ;', 'a trench of mass disposed in the target conductive layer, the trench of mass passing through the target conductive layer to the insulation layer of mass and dividing the target conductive layer into a first conductive portion and a second conductive portion which are insulated electrically from each other ;, 'a mass includinga conductive through hole of mass passing through the insulation layer of mass and connecting the base conductive layer and the first conductive portion; and 'at least one electrode disposed on an upper surface of the substrate;', 'a substrate including wherein, in a working status, an electrical current flows through the base conductive layer, the conductive through hole of mass and the first conductive portion and an electrical potential difference exists between the second conductive portion and the electrode.2. The microelectromechanical system device with electrical interconnections according to claim 1 , further comprising: a first insulation layer dividing the first anchor into an upper conductive layer of the first anchor and a lower conductive layer of the first anchor ; and', 'a first trench disposed in the lower conductive layer of the first anchor, the first trench passing through the lower conductive layer of the first anchor to the first ...

Interaction force detection apparatus

An interaction force detection apparatus includes a sensor, a driving element, a moving element, and a connecting element. The connecting element is connected to the driving element and the sensor. The driving element is adapted to interact with the moving element, so as to generate a pair of forces. The pair of forces includes a first force and a second force, and a magnitude of the first force is equal to that of the second force. The sensor detects the first force exerted on the driving element, and the second force is exerted on the moving element to generate a movement.

Apparatus with two anchors

An apparatus with two anchors including a housing, a movable element, and a rotary element is provided. The housing includes a first expansion unit, a second expansion unit, and a linkage. First alignment structures are disposed in the movable element and anti-rotation structures are disposed in the linkage. When the movable element and the rotary element enter the housing from two ends and are coupled along an axis, the movable element and the rotary element can approach each other to expand the first expansion unit and the second expansion unit to form two anchors. The apparatus with two anchors secures a sensor in a variety of environments such as walls or machines. When the apparatus with two anchors fixes a sensor in a hole of a stamping machine, the impact force does not cause stress concentration on the sensor so as to improve the reliability of the sensor.

Linear guideway with embedded sensor

A linear guideway with an embedded sensor includes a track, a slider, a plurality of rolling members, and a sensing module. The track extends in a first direction and has a first recess. The slider can move in the first direction and include a second recess, a channel, at least one hole, and a deforming region. The channel is formed by coupling the first recess and the second recess, and extends in the first direction. The hole extends from the surface of the slider along the insertion axis and into the slider. The rolling members are disposed in the channel. The sensing module is disposed in the hole, and contacts the deforming region to detect the amount of deformation.

MICRO-ELECTRO-MECHANICAL-SYSTEM DEVICE WITH OSCILLATING ASSEMBLY

A micro-electro-mechanical-system (MEMS) device comprising two proof masses disposed in the first frame, such that the MEMS device with oscillating assemblies senses the angular velocity in the two axes, respectively. The MEMS device with oscillating assemblies further comprises a lever structure and two oscillating assemblies connecting at two opposite ends of the lever structure, such that the oscillating assemblies move in opposite directions synchronously. The MEMS device with oscillating assemblies further comprises a spring assembly connected between the proof mass and a movable electrode, restricting the proof mass to drive the movable electrode to only move in a specific direction. 1. A micro-electro-mechanical-system (MEMS) device , being adapted to sense angular velocities in two orthogonal axes , comprising: a first frame having an oscillating direction along a second axis;', 'a third frame, disposed within the first frame;', 'a first proof mass, disposed within the third frame;', 'a plurality of torsional beams, connecting the first proof mass and the third frame; and', 'a plurality of first springs, connecting the first frame and the third frame along a first axis, wherein the first axis is orthogonal to the second axis., 'at least one oscillating assembly including2. The MEMS device of claim 1 , further comprising:at least one lever, wherein one end of the at least one lever is connected to one oscillating assembly, and the other end of the at least one lever is connected to another oscillating assembly, and the lever leads the two oscillating assemblies oscillating in opposite directions along the second axis.3. The MEMS device of claim 2 , further comprising:a plurality of buffer springs, wherein each oscillating assembly is connected to a corresponding end of the lever by one buffer spring.4. The MEMS device of claim 1 , further comprising:at least one lever;at least one base; a plurality of elastic members, each of the elastic members connecting ...

Vibration sensor with monitoring function and vibration signal monitoring method thereof

A vibration sensor with monitoring function is provided, which includes a substrate, a microelectromechanical vibration sensor chip and an application-specific integrated circuit chip. The microelectromechanical vibration sensor chip is disposed on the substrate and detects a vibration applied to an object to generate a plurality of vibration signals. The application-specific integrated circuit chip is disposed on the substrate and electrically connected to the microelectromechanical vibration sensor chip, which includes a sampling module, a transform module and an analysis module. The sampling module receives and converts the vibration signals into a plurality of digital signals, and filters the digital signals to generate a plurality of time-domain data. The transform module transforms the time-domain data into a frequency-domain data according to a predetermined number. The analysis module executes a comparison process to compare the frequency-domain data with a predetermined spectrum ...

MICRO-ELECTROMECHANICAL APPARATUS HAVING CENTRAL ANCHOR

A micro-electromechanical (MEMS) apparatus includes a substrate, two first anchors, a frame, and two elastic members. The substrate is provided with a reference point thereon. The frame surrounds the two first anchors, and each of the elastic members connects the corresponding first anchor and the frame. Each of the first anchors is disposed near the center of the MEMS apparatus to decrease an effect caused by warpage of the substrate. The MEMS apparatus can be applied to an MEMS sensor having a rotatable mass, such as a three-axis accelerometer or a magnetometer, to improve process yield, reliability, and measurement accuracy. 1. A micro-electromechanical apparatus , comprising:a substrate;two first anchors disposed on the substrate, wherein a distance from each of the first anchors to a reference point of the substrate is equal;a frame surrounding the two first anchors; andtwo elastic members wherein each of the two first anchors is connected to the frame through corresponding one of the two elastic members,wherein the distance from each of the first anchors to the reference point is less than a distance from each of the first anchors to the frame.2. The micro-electromechanical apparatus as recited in claim 1 , wherein a distance from an inner side of the frame to another inner side of the frame is L claim 1 , and a distance between the two first anchors is less than L/4.3. The micro-electromechanical apparatus as recited in claim 1 , wherein each of the elastic members comprises:a fixed end connected to the corresponding first anchor;a movable end connected to the frame; anda connecting portion connected to the fixed end and the movable end, wherein a width of the fixed end is greater than a width of the connecting portion.4. The micro-electromechanical apparatus as recited in claim 3 , wherein a width of the movable end is greater than the width of the connecting portion.5. The micro-electromechanical apparatus as recited in claim 1 , further comprising at least ...

PACKAGE AND PACKAGING ASSEMBLY OF MICROELECTROMECHANICAL SYSYEM MICROPHONE

A package of microelectromechanical system (MEMS) microphone is suitable for being mounted on a printed circuit board. The package has a cover and at least one MEMS microphone. The cover has an inner surface and a conductive trace disposed thereon. The MEMS microphone is mounted on the inner surface of the cover and electrically connected to the conductive trace, and has an acoustic pressure receiving surface. When the cover is mounted on the printed circuit board, the cover and the printed circuit board construct an acoustic housing which has at least one acoustic hole passing through the cover or the printed circuit board, and the conductive trace on the inner surface of the cover is electrically connected to the printed circuit board.

MICRO-ELECTROMECHANICAL APPARATUS WITH PIVOT ELEMENT

A micro-electromechanical apparatus may include a substrate, a first frame, a plurality of first anchors, a region and a plurality of pivot elements. The plurality of first anchors and the region is disposed on the substrate. The region is surrounded by the plurality of first anchors. Each of the pivot elements includes a pivot end and a rotary end. Each of the pivot ends is connected to a corresponding first anchor and each of the rotary ends is connected to the first frame such that the first frame is able to rotate with respect to an axis passing the region. The micro-electromechanical apparatus having the pivot elements and the region is adapted for detecting multi-degree physical quantities such as angular velocities in at least two axes, angular velocities and accelerations, angular velocities and Earth's magnetic field.

Package and packaging assembly of microelectromechanical system microphone

A package of microelectromechanical system (MEMS) microphone is suitable for being mounted on a printed circuit board. The package has a cover and at least one MEMS microphone. The cover has an inner surface and a conductive trace disposed thereon. The MEMS microphone is mounted on the inner surface of the cover and electrically connected to the conductive trace, and has an acoustic pressure receiving surface. When the cover is mounted on the printed circuit board, the cover and the printed circuit board construct an acoustic housing which has at least one acoustic hole passing through the cover or the printed circuit board, and the conductive trace on the inner surface of the cover is electrically connected to the printed circuit board.

MEMS device with movable stage

A MEMS device includes a substrate, at least one anchor disposed on the substrate, a movable stage, a sensing chip disposed on the movable stage, and at least one elastic member connected with the movable stage and the anchor. The movable stage includes at least one electrode and at least one conductive connecting layer. The sensing chip includes at least one electrical interconnection connected with the conductive connecting layer. The elastic member includes at least one first electrical channel, a second electrical channel and an electrical insulation layer disposed between the first electrical channel and the second electrical channel. The first electrical channel is electrically connected with the electrical interconnection, and the second electrical channel is electrically connected with the electrode.

Microelectromechanical infrared sensing apparatus having stoppers

A microelectromechanical infrared sensing apparatus includes a substrate, a sensing plate, a plurality of supporting elements and a plurality of stoppers. The substrate includes an infrared reflecting layer. The sensing plate includes an infrared absorbing layer. The supporting elements are disposed on the substrate, and each of the supporting elements is connected to the sensing plate, such that the sensing plate is suspended above the infrared reflecting layer. The stoppers are disposed between the substrate and the sensing plate. When the sensing plate moves toward the infrared reflecting layer and the stoppers contact both the substrate and the sensing plate, the distance between the sensing plate and the infrared reflecting layer is substantially equal to the height of at least one of the stoppers.

Multi-axis force sensor capable of reducing influence on the other when measuring one of the axial force and torque

A multi-axis force sensor including a central portion, an outer ring portion, and at least one sensing portion disposed along an axial direction of an axis is provided. The sensing portion includes a first and a second elements connected with each other, and at least one first and at least one second strain gauges. A first end surface of the first element is connected to the central portion, and a second end surface of the second element is connected to the outer ring portion. A normal vector of the first end surface is parallel to the axis and the axis passes through a centroid of the first end surface. When the first end surface is subjected to an axial force, a first strain of a first sensing region of the first element in the axial direction is smaller than a second strain of a second sensing region of the second element in the axial direction. When the first end surface is subjected to a first torque with respect to the axis, a first twist angle of the first sensing region with respect ...

CRYSTAL OSCILLATOR AND METHOD FOR MANUFACTURING THE SAME

A crystal oscillator includes a cover, a crystal blank and an Integrated Circuit (IC) chip. The cover has a surface, a cavity formed in the surface, a plurality of conductive contacts and a conductive sealing ring. The conductive contacts are disposed on the surface, and the conductive sealing ring is disposed on the surface and surrounds the conductive contacts. The IC chip is connected to the conductive contacts and the conductive sealing ring, and forms a hermetic chamber with the cover and the conductive sealing ring. The crystal blank is located in the hermetic chamber, and is electrically connected to the IC chip. Furthermore, a method for manufacturing a crystal oscillator is also provided.

TEMPERATURE CONTROL CIRCUIT, MEMORY STORAGE DEVICE AND TEMPERATURE CONTROL METHOD

A temperature control circuit for an electronic device is provided. The temperature control circuit includes a temperature detector, a status detection circuit and a control circuit. The temperature detector is configured to detect a temperature of the electronic device and generate first evaluation information. The status detection circuit is configured to detect a work status of at least one circuit module in the electronic device and generate second evaluation information. The control circuit is configured to adjust at least one electronic parameter of the electronic device according to the first evaluation parameter and the second evaluation parameter to control the temperature of the electronic device. 1. A temperature control circuit for an electronic device , comprising:a temperature detector, configured to detect a temperature of the electronic device and generate first evaluation information;a status detection circuit, configured to detect a work status of at least one circuit module in the electronic device and generate second evaluation information; anda control circuit, coupled to the temperature detector and the status detection circuit and configured to adjust at least one electronic parameter of the electronic device according to the first evaluation parameter and the second evaluation parameter to control the temperature of the electronic device.2. The temperature control circuit according to claim 1 , wherein the at least one circuit module comprises a first circuit module and a second circuit module claim 1 , and an operation that the status detection circuit detects the work status of the at least one circuit module in the electronic device and generates the second evaluation information comprises:detecting a first work status of the first circuit module;detecting a second work status of the second circuit module; andgenerating the second evaluation information according to the first work status, the second work status, first weight information of ...

Microelectromechanical system (MEMS) apparatus with adjustable spring

A MEMS apparatus with adjustable spring includes a central portion, a peripheral portion and at least one spring. The peripheral portion surrounds the central portion and is spaced apart from the central portion. The spring includes a peripheral section, an outward extension section and a central section. The peripheral section is connected to the outward extension section. An amount of thermal expansion per unit temperature change of the outward extension section is greater than that of the peripheral section or greater than that of the central section.

Tunable passive device

A tunable passive device is disclosed. It includes a plurality of passive elements and at least a switch. The passive elements are stacked along the same direction, and connected with each other via the switch. By changing open/close conditions of the switch(es) and selecting specific passive elements that a current can pass, a responsive value of the tunable passive device is obtained.

MICROELECTROMECHANICAL APPARATUS HAVING A MEASURING RANGE SELECTOR

A MEMS apparatus having measuring range selector including a sensor and an IC chip is provided. The sensor includes a sensing device. The IC chip includes a voltage range selector, an analog front end, a control device and an A/D converter. The sensing device is configured to detect the physical quantity and generate a sensing voltage. The voltage range selector is configured to select a sub-voltage range having a first upper-bound and a first lower-bound. The analog front end is configured to receive the sensing voltage and output a first voltage. The A/D converter has a full scale voltage range having a second lower-bound and a second upper-bound. A ratio of the full scale voltage range to the sub-voltage range is defined as a gain factor. A difference obtained by subtracting the first lower-bound from the first voltage is defined as a shift factor. The control device is configured to adjust the first voltage to the second voltage according to the gain factor and the shift factor. 1. A MEMS apparatus , comprising: 'a sensing device, configured to detect a physical quantity and generate a sensing voltage;', 'a sensor, comprising a voltage range selector, configured to select a sub-voltage range, wherein the sub-voltage range has a first lower-bound and a first upper-bound;', 'an analog front end, configured to receive the sensing voltage and output a first voltage;', 'a control device, configured to adjust the first voltage to a second voltage; and', 'an A/D converter, configured to receive the second voltage, wherein the A/D converter has a full scale voltage range, and the full scale voltage range has a second lower-bound and a second upper-bound,, 'an IC chip, comprisingwherein the first voltage is between the first lower-bound and the first upper-bound, a ratio of the full scale voltage range to the sub-voltage range is defined as a gain factor, a difference obtained by subtracting the first lower-bound from the first voltage is defined as a shift factor, and ...

MICRO-ELECTRO MECHANICAL APPARATUS WITH PN-JUNCTION

A micro-electro mechanical apparatus having a PN-junction is provided. The micro-electro mechanical apparatus includes a movable mass, a conductive layer, and an electrode. The movable mass includes a P-type semiconductor layer and an N-type semiconductor layer. The PN-junction is formed between the P-type semiconductor layer and the N-type semiconductor layer. The micro-electro mechanical apparatus is capable of eliminating abnormal voltage signal when an alternating current passes through the conductive layer. The micro-electro mechanical apparatus is adapted to measure acceleration and magnetic field. The micro-electro mechanical apparatus can be other types of micro-electro mechanical apparatus such as micro-electro mechanical scanning micro-mirror. 1. A micro-electro mechanical apparatus , comprising:a substrate including an electrode disposed on a top surface of the substrate; a first P-type semiconductor layer;', 'a first N-type semiconductor layer connected to the first P-type semiconductor layer;', 'a first PN-junction formed between the first P-type semiconductor layer and the first N-type semiconductor layer;, 'a movable mass, being disposed above the electrode, includinga first conductive layer; anda first electrical insulation layer disposed between the movable mass and the first conductive layer.2. The micro-electro mechanical apparatus according to claim 1 , further comprising a first anchor including:a second P-type semiconductor layer;a second N-type semiconductor layer connected to the second P-type semiconductor layer; anda second PN-junction formed between the second P-type semiconductor layer and the second N-type semiconductor layer.3. The micro-electro mechanical apparatus according to claim 2 , further comprising a first spring including:a third P-type semiconductor layer;a third N-type semiconductor layer connected to the third P-type semiconductor layer; anda third PN-junction formed between the third P-type semiconductor layer and the ...

Micro-electromechanical apparatus for thermal energy control

A MEMS apparatus for thermal energy control including a sensor and an IC chip is provided. The sensor includes a heating device for heating a sensing element and a detecting device for detecting a physical quantity. The IC chip includes a memory unit for storing a target value of the sensing element and a data processing unit for convert the physical quantity to a converted value, where a gap value is defined by subtracting the converted value from the target value. Besides, a control unit of the IC chip sets a parameter value according to the gap value, and a driving unit adjusts a quantity of thermal energy generated by the heating device according to the parameter value to reduce heating time and frequency of the heating device thereby reducing electrical power consumption. The MEMS apparatus is applicable to MEMS sensors requiring controlled operating temperature, such as a gas sensor.

Environment-friendly carry device

An environment-friendly carry device is provided, including: a main body, including at least one through hole, the at least one through hole being configured for receiving and holding at least one object; at least one handle portion, connected with the main body and configured for gripping; and at least two wing portions, connected with the main body.

MEMS APPARATUS HAVING IMPACT ABSORBER

A MEMS apparatus includes a substrate, a cover disposed on the substrate, a movable mass disposed on the substrate, and an impact absorber disposed on the cover. The impact absorber includes a restraint, a stationary stopper disposed on a lower surface of the cover, a movable stopper, elastic elements connecting the restraint and the movable stopper, a supporting element connecting the restraint and the stationary stopper, and a space disposed between the stationary stopper and the movable stopper. The impact absorber is adapted to prevent the movable mass from impacting the cover. In addition, the supporting element may be made of an electrical insulation material to reduce electrostatic interaction between the movable mass and the movable stopper.

Micro-electromechanical temperature control system with thermal reservoir

A micro-electromechanical temperature control system including a micro-electromechanical apparatus is provided. The micro-electromechanical apparatus includes a heater and a thermal reservoir. A specific heat capacity of the thermal reservoir is greater than a specific heat capacity of the heater, so that a heating time and a heating frequency of the heater are reduced to save electrical power consumption. The micro-electromechanical temperature control system is adapted for a micro-electromechanical sensor that is required to be controlled at an operating temperature, such as a gas sensor.

Memory control circuit unit, memory storage device and control method thereof

A control method of a memory storage device is provided and includes: detecting a first signal stream controlled by a host system; executing a boot code according to the first signal stream and entering a boot code mode; and receiving a command from the host system in the boot code mode and not executing a firmware code stored in a rewritable non-volatile memory module in the memory storage device. According, operational flexibility of the memory storage device may be enhanced.

Ball screw with force sensor in radial direction

A ball screw with force sensor in radial direction including a screw rod, a screw nut, a plurality of balls, and a force sensor is provided. The screw nut has a cavity. The cavity is extended along a radial direction from an outer surface of the screw nut. The force sensor is disposed in the cavity of the screw nut, and the force sensor includes a stationary base and an elastic component. The stationary base includes a displacement restraint, and the elastic component includes a contact end and a fixed end. The displacement restraint is coupled to the cavity to prevent the stationary base from being displaced in the radial direction for fixing stationary base firmly in the cavity. The fixed end is connected to the stationary base, and the contact end contacts a bottom surface of the cavity in order to sense a force along the radial direction.

Microelectromechanical apparatus having hermitic chamber

The disclosure relates to a microelectromechanical apparatus including a substrate, a stationary electrode, a movable electrode, and a heater. The substrate includes an upper surface, an inner bottom surface, and an inner side surface. The inner side surface surrounds and connects with the inner bottom surface. The inner side surface and the inner bottom surface define a recess. The stationary electrode is disposed on the inner bottom surface. The movable electrode covers the recess. The movable electrode, the inner bottom surface, and the inner side surface define a hermetic chamber. The heater is disposed on the movable electrode and located above the hermetic chamber.

Micro-electromechanical apparatus with pivot element

A micro-electromechanical apparatus may include a substrate, a first frame, a plurality of first anchors, a region and a plurality of pivot elements. The plurality of first anchors and the region is disposed on the substrate. The region is surrounded by the plurality of first anchors. Each of the pivot elements includes a pivot end and a rotary end. Each of the pivot ends is connected to a corresponding first anchor and each of the rotary ends is connected to the first frame such that the first frame is able to rotate with respect to an axis passing the region. The micro-electromechanical apparatus having the pivot elements and the region is adapted for detecting multi-degree physical quantities such as angular velocities in at least two axes, angular velocities and accelerations, angular velocities and Earth's magnetic field.

Ball screw with tilt detector

A ball screw with tilt detector includes a screw rod, two screw nuts, a channel, a plurality of balls, and a tilt detector. The screw rod is extended along a direction of an axis. The two screw nuts are installed on the screw rod and capable of moving along the axis. The tilt detector is disposed between the two screw nuts to detect a tilt angle and a preload of the two screw nuts. The tilt detector includes a force receiving element, at least one first strain sensor, and at least one second strain sensor. The force receiving element includes a point symmetric ring-type structure, and the ring-type structure has two planes which are parallel to each other and respectively contact the two screw nuts.

MICRO-ELECTROMECHANICAL TEMPERATURE CONTROL SYSTEM WITH THERMAL RESERVOIR

A micro-electromechanical temperature control system including a micro-electromechanical apparatus is provided. The micro-electromechanical apparatus includes a heater and a thermal reservoir. A specific heat capacity of the thermal reservoir is greater than a specific heat capacity of the heater, so that a heating time and a heating frequency of the heater are reduced to save electrical power consumption. The micro-electromechanical temperature control system is adapted for a micro-electromechanical sensor that is required to be controlled at an operating temperature, such as a gas sensor.

Composite micro-electro-mechanical-system apparatus and manufacturing method thereof

A MEMS apparatus comprising composite vibrating unit and the manufacturing method thereof are disclosed. The vibrating unit includes a stiffness element on which a first material is disposed. A second material being a conductive material is disposed on the first material and is extended to the stiffness element to remove electric charge on first material. When a temperature is changed, a variation direction of a Young's modulus of the first material is opposite to a variation direction of a Young's modulus of the stiffness element. The unique attributes above allow vibrating unit of the MEMS apparatus such as resonator and gyroscope to have stable resonance frequency against the change of temperature.

INTERACTION FORCE DETECTION APPARATUS

An interaction force detection apparatus includes a sensor, a driving element, a moving element, and a connecting element. The connecting element is connected to the driving element and the sensor. The driving element is adapted to interact with the moving element, so as to generate a pair of forces. The pair of forces includes a first force and a second force, and a magnitude of the first force is equal to that of the second force. The sensor detects the first force exerted on the driving element, and the second force is exerted on the moving element to generate a movement. 1. An interaction force detection apparatus , comprising:a sensor;a driving element;a moving element; anda connecting element connecting the driving element and the sensor, wherein the sensor is fixed to the driving element through the connecting element, wherein the sensor is separated from the moving element by the driving element, the driving element is adapted to interact with the moving element to generate a pair of forces comprising a first force and a second force, a magnitude of the first force is equal to that of the second force, the sensor detects the first force exerted on the driving element, and the second force is exerted on the moving element to generate a movement.2. The interaction force detection apparatus of claim 1 , wherein the sensor comprises at least one elastic element claim 1 , a stiffness of the at least one elastic element is less than a stiffness of the connecting element and is less than a stiffness of the driving element.3. The interaction force detection apparatus of claim 1 , further comprising a fixed base claim 1 , wherein the sensor connects the fixed base and the connecting element claim 1 , wherein the sensor is between the fixed base and the driving element.4. The interaction force detection apparatus of claim 3 , further comprising an integrated circuit chip disposed in an accommodating space of the sensor.5. The interaction force detection apparatus of ...

PRESSURE SENSOR WITH CALIBRATION FUNCTION AND CALIBRATION METHOD THEREOF

A pressure sensor with calibration function includes a casing, a diaphragm, a sensing element, a medium, and at least one calibration element. The diaphragm is disposed on the casing, wherein the casing and the diaphragm define an accommodating space. The sensing element is disposed in the casing. The medium is filled in the accommodating space and in contact with the sensing element. The at least one calibration element is adjustably disposed at the casing and extended into the accommodating space to be in contact with the medium, wherein when the at least one calibration element is moved relative to the casing, the at least one calibration element changes the pressure applied to the medium.

Capacitive transducer and fabrication method

A capacitive transducer and fabrication method are disclosed. The capacitive transducer includes a substrate, a first electrode mounted on the substrate, a cap having a through-hole and a cavity beside the through-hole, a second electrode mounted on the cap across the through-hole. The second electrode is deformable in response to pressure fluctuations applied thereto via the through-hole and defines, together with the first electrode, as a capacitor. The capacitor includes a capacitance variable with the pressure fluctuations and the cavity defines a back chamber for the deformable second electrode.

Micro-electro-mechanical-system device with oscillating assembly

A micro-electro-mechanical-system (MEMS) device comprising two proof masses disposed in the first frame, such that the MEMS device with oscillating assemblies senses the angular velocity in the two axes, respectively. The MEMS device with oscillating assemblies further comprises a lever structure and two oscillating assemblies connecting at two opposite ends of the lever structure, such that the oscillating assemblies move in opposite directions synchronously. The MEMS device with oscillating assemblies further comprises a spring assembly connected between the proof mass and a movable electrode, restricting the proof mass to drive the movable electrode to only move in a specific direction.

ENVIRONMENT-FRIENDLY CARRY DEVICE

An environment-friendly carry device is provided, including: a main body, including at least one through hole, the at least one through hole being configured for receiving and holding at least one object; at least one handle portion, connected with the main body and configured for gripping; and at least two wing portions, connected with the main body.

MICRO-ELECTROMECHANICAL APPARATUS WITH MULTIPLE CHAMBERS AND METHOD FOR MANUFACTURING THE SAME

A micro-electromechanical apparatus with multiple chambers and a method for manufacturing the same are provided, wherein various micro-electromechanical sensors are integrated into a single apparatus. For example, the micro-electromechanical apparatus in this disclosure may have two independent hermetically sealed chambers with different pressures, such that a micro-electromechanical barometer and a micro-electromechanical accelerometer can be operated in an optimal pressure circumstance. 1. A micro-electromechanical apparatus , being adapted to measuring a pressure and an inertial physical quantity , the micro-electromechanical apparatus comprising:a substrate, having a first surface;a first cover, disposed on the substrate, wherein the first cover and the substrate define a first hermetically sealed chamber;a sensing unit, comprising a movable mass suspended over the substrate; anda second cover, disposed on the substrate, wherein the second cover and the substrate define a second hermetically sealed chamber, wherein the sensing unit is enclosed by the first hermetically sealed chamber and is disposed outside the second hermetically sealed chamber.2. The micro-electromechanical apparatus of claim 1 , wherein a gas pressure of the first hermetically sealed chamber is different from a gas pressure of the second hermetically sealed chamber.3. The micro-electromechanical apparatus of claim 2 , wherein a distance from a lower surface of the movable mass to the first surface is substantially equal to a distance from a lower surface of a top wall of the second cover to the first surface claim 2 , and a thickness of the movable mass is substantially equal to a thickness of the second cover.4. The micro-electromechanical apparatus of claim 3 , wherein the substrate further comprises a film and a through hole claim 3 , an upper surface of the film is electrical conductive and exposed in the second hermetically sealed chamber claim 3 , and a lower surface of the film covers ...

Microelectromechanical system apparatus with heater

A MEMS apparatus with heater includes central part, periphery part, gap and first connecting part. Central part includes center of mass, heater and first joint. Heater is disposed inside central part. First joint is located on boundary of central part. Displacement of first joint is produced when central part is heated by heater. Periphery part surrounds central part. Gap surrounds central part, and is located between central part and periphery part. First connecting part connects central part and periphery part along first reference line and includes first inner connecting portion and first outer connecting portion. First inner connecting portion is connected to first joint. First outer connecting portion is connected to periphery part. First reference line passes through first joint, and first reference line is not parallel to line connecting center of mass and first joint.

MULTI-AXIS FORCE SENSOR

A multi-axis force sensor including a central portion, an outer ring portion, and at least one sensing portion disposed along an axial direction of an axis is provided. The sensing portion includes a first and a second elements connected with each other, and at least one first and at least one second strain gauges. A first end surface of the first element is connected to the central portion, and a second end surface of the second element is connected to the outer ring portion. A normal vector of the first end surface is parallel to the axis and the axis passes through a centroid of the first end surface. When the first end surface is subjected to an axial force, a first strain of a first sensing region of the first element in the axial direction is smaller than a second strain of a second sensing region of the second element in the axial direction. When the first end surface is subjected to a first torque with respect to the axis, a first twist angle of the first sensing region with respect to the axis is greater than a second twist angle of the second sensing region with respect to the axis. 1. A multi-axis force sensor , comprising:a central portion, comprising a plurality of through holes;an outer ring portion, surrounding the central portion and connected to the central portion through at least one support element; and a first element, comprising a first sensing region and a first end surface;', 'a second element, comprising a second sensing region and a second end surface, wherein the first element is connected to the second element, the first end surface is connected to the central portion, and the second end surface is connected to the outer ring portion, a normal vector of the first end surface is parallel to the axis, and the axis passes through a centroid of the first end surface;', 'at least one first strain gauge, disposed in the first sensing region; and', 'at least one second strain gauge, disposed in the second sensing region,, 'at least one sensing ...

Package and packaging assembly of microelectromechanical system microphone

A package of a MEMS microphone is suitable for being mounted on a printed circuit board. The package includes a substrate, at least one MEMS microphone, and a conductive sealing element. The MEMS microphone is arranged on the substrate, and electrically connected to a conductive layer on a bottom surface of the substrate. The conductive sealing element is arranged on the substrate and around the MEMS microphone for connecting the printed circuit board, and constructs an acoustic housing with the printed circuit board and the substrate. The acoustic housing has at least one acoustic hole passing through the substrate. The acoustic hole has a metal layer on the inner wall thereof for connecting the conductive layer on the bottom surface of the substrate to another conductive layer on the top surface of the substrate.

Microelectromechanical system device with electrical interconnections and method for fabricating the same

A microelectromechanical system device including anchors and mass is provided. Electrical interconnections are formed on the mass by using a insulation layer of mass, an electrical insulation trench and conductive through hole. The electrical interconnections replace the cross-line structure without adding additional processing steps, thereby reducing the use of the conductive layer and the electrical insulation layer. A method for fabricating the microelectromechanical system device is also provided.

Spindle shaft device with torque sensor

A spindle shaft device including a shaft, a first torque sensor, and a second torque sensor. The shaft extends along an axial direction and comprises a first side portion, a second side portion, and a central portion located between the first side portion and the second side portion. The central portion has a central torsional rigidity with respect to the axial direction. The first side portion has a first torsional rigidity with respect to the axial direction. The second side portion has a second torsional rigidity with respect to the axial direction. The first torsional rigidity is smaller than the central torsional rigidity. The second torsional rigidity is smaller than the central torsional rigidity. The first torque sensor is disposed on the first side portion. The second torque sensor is disposed on the second side portion.

Linear guideway with embedded sensor

A linear guideway with an embedded sensor includes a track, a slider, a plurality of rolling members, and a sensing module. The track extends in a first direction and has a first recess. The slider can move in the first direction and include a second recess, a channel, at least one hole, and a deforming region. The channel is formed by coupling the first recess and the second recess, and extends in the first direction. The hole extends from the surface of the slider along the insertion axis and into the slider. The rolling members are disposed in the channel. The sensing module is disposed in the hole, and contacts the deforming region to detect the amount of deformation.

Mems device with multiple electrodes and fabricating method thereof

A MEMS device with a first electrode, a second electrode and a third electrode is disclosed. These electrodes are disposed on a substrate in such a manner that (1) a pointing direction of the first electrode is in parallel with a normal direction of the substrate, (2) a pointing direction of the third electrode is perpendicular to the pointing direction of the first electrode, (3) the second electrode includes a sensing portion and a stationary portion, (4) the first electrode and the sensing portion are configured to define a sensing capacitor, and (5) the third electrode and the stationary portion are configured to define a reference capacitor. This arrangement facilitates the MEMS device such as a differential pressure sensor, differential barometer, differential microphone and decoupling capacitor to be miniaturized.

MANUFACTURING METHODS FOR MICRO-ELECTROMECHANICAL SYSTEM DEVICE HAVING ELECTRICAL INSULATING STRUCTURE

The disclosure relates to a micro-electromechanical system (MEMS) device having an electrical insulating structure. The MEMS device includes at least one moving part, at least one anchor, at least one spring and an insulating layer. The spring is connected to the anchor and to the moving part. The insulating layer is disposed in the moving part and the anchor. Each of the moving part and the anchor is divided into two conductive portions by the insulating layer. Whereby, the electrical signals of different moving parts are transmitted through the insulated electrical paths which are not electrically connected. 1. A method for manufacturing a MEMS device , comprising:providing a Silicon on Insulator (SOI) wafer, wherein the SOI wafer includes a device layer, an insulating layer and a handle layer;etching the device layer to form a recess and at least one annular protrusion surrounding the recess;etching at least one first trench on the annular protrusion, wherein the at least one first trench extends to the insulating layer;bonding the annular protrusion with a substrate;etching a plurality of first holes on a portion of the handle layer corresponding to the at least one first trench, wherein the plurality of first holes extend through the insulating layer to the device layer;filling the plurality of first holes with a conductive material to create a plurality of first conductive pillar which connects the device layer and the handle layer.2. The manufacturing method of claim 1 , further including the step of etching a second trench on the recess claim 1 , wherein the second trench extends to the insulating layer.3. The manufacturing method of claim 1 , further including the step of etching the device layer claim 1 , the insulating layer and the handle layer to form at least one moving part claim 1 , at least one anchor and at least one spring claim 1 , wherein the at least one moving part is divided into a first conductive portion and a second conductive portion by ...

MEMS MICROPHONE PACKAGE

An MEMS microphone package includes a substrate, an MEMS microphone, an IC chip and an electrically conductive cover. The substrate includes a first hole, an upper surface, a bottom surface, a side surface, a first electrically conductive layer and a second electrically conductive layer. The side surface has two sides connected to the upper surface and the bottom surface, respectively. The first electrically conductive layer is disposed on the upper surface. The second electrically conductive layer is disposed on the bottom surface. The MEMS microphone is electrically coupled to the substrate. The IC chip is electrically coupled to the substrate. The electrically conductive cover includes a second hole. The electrically conductive cover is bonded to the substrate to form a chamber for accommodating the MEMS microphone and the IC chip. The first hole and the second hole together form an acoustic hole. 1. A microelectromechanical system (MEMS) microphone package , comprising: at least one first hole;', 'an upper surface;', 'a bottom surface;', 'a side surface with two sides connected to the upper surface and the bottom surface, respectively, and the two sides being opposite to each other;', 'at least one first electrically conductive layer disposed on the upper surface; and', 'at least one second electrically conductive layer disposed on the bottom surface;, 'a substrate, comprisingat least one MEMS microphone electrically coupled to the substrate;at least one IC chip electrically coupled to the substrate; andan electrically conductive cover comprising at least one second hole;wherein, the electrically conductive cover is bonded to the substrate to form a chamber for accommodating the MEMS microphone and the IC chip, the at least one first hole and the at least one second hole together form at least one acoustic hole, the at least one acoustic hole has an opening on an outer surface of the MEMS microphone package, the opening has a first boundary and a second boundary ...

MICRO-ELECTRO MECHANICAL APPARATUS WITH INTERDIGITATED SPRING

A micro-electro mechanical apparatus with interdigitated spring including a substrate, at least one first mass, a movable electrode, a stationary electrode, an anchor and an interdigitated spring is provided. The movable electrode is disposed on the mass along an axial direction. The stationary electrode is disposed on the substrate along the axial direction, and the movable electrode and the stationary electrode have a critical gap there between. The interdigitated springs connects the mass and the anchor along the axial direction. The interdigitated spring includes first folded portions, first connecting portions, second folded portions, and second connecting portions. Each first folded portion includes two first spans and a first head portion. Each second folded portion includes two second spans and a second head portion. A width of the first span and a width of the second span are greater than the critical gap respectively. 1. A micro-electro mechanical apparatus , adapted to sense an acceleration , comprising:a substrate;a first mass;a movable electrode, disposed on the first mass along a first axial direction;a stationary electrode, disposed on the substrate along the first axial direction, wherein the movable electrode and the stationary electrode have a critical gap there between;an anchor; and a plurality of first folded portions, wherein each of the first folded portions comprising two first spans and a first head portion configured to connect the two first spans;', 'a plurality of first connecting portions, wherein each of the first connecting portions is respectively connected to the first spans of two adjacent first folded portions to define a first space;', 'a plurality of second folded portions, wherein each of the second folding portions comprising two second spans and a second head portion configured to connect the two second spans; and', 'a plurality of second connecting portions, wherein each of the second connecting portions is respectively ...

MICROELECTROMECHANICAL INFRARED SENSING APPARATUS HAVING STOPPERS

A microelectromechanical infrared sensing apparatus includes a substrate, a sensing plate, a plurality of supporting elements and a plurality of stoppers. The substrate includes an infrared reflecting layer. The sensing plate includes an infrared absorbing layer. The supporting elements are disposed on the substrate, and each of the supporting elements is connected to the sensing plate, such that the sensing plate is suspended above the infrared reflecting layer. The stoppers are disposed between the substrate and the sensing plate. When the sensing plate moves toward the infrared reflecting layer and the stoppers contact both the substrate and the sensing plate, the distance between the sensing plate and the infrared reflecting layer is substantially equal to the height of at least one of the stoppers. 2. The microelectromechanical infrared sensing apparatus of claim 1 , wherein a stiffness of the supporting elements in a direction of a normal vector of the substrate is less than a stiffness of the sensing plate in the direction of the normal vector of the substrate.3. The microelectromechanical infrared sensing apparatus of claim 1 , wherein the stoppers are disposed on the sensing plate.4. The microelectromechanical infrared sensing apparatus of claim 3 , wherein line segments connecting each of the two adjacent the stoppers form a polygon claim 3 , and the polygon is axial-symmetrical or central-symmetrical.5. The microelectromechanical infrared sensing apparatus of claim 1 , wherein the stoppers are disposed on the supporting elements.6. The microelectromechanical infrared sensing apparatus of claim 1 , wherein the stoppers are disposed on the substrate.7. The microelectromechanical infrared sensing apparatus of claim 1 , further comprising a voltage source electrically connected to the infrared reflecting layer and the sensing plate so as to establish a voltage difference between the infrared reflecting layer and the sensing plate.8. The microelectromechanical ...

APPARATUS INTEGRATING MICROELECTROMECHANICAL SYSTEM DEVICE WITH CIRCUIT CHIP AND METHODS FOR FABRICATING THE SAME

One embodiment discloses an apparatus integrating a microelectromechanical system device with a circuit chip which includes a circuit chip, a microelectromechanical system device, a sealing ring, and a lid. The circuit chip comprises a substrate and a plurality of metal bonding areas. The substrate has an active surface with electrical circuit area, and the metal bonding areas are disposed on the active surface and electrically connected to the electrical circuits. The microelectromechanical system device comprises a plurality of bases and at least one sensing element. The bases are connected to at least one of the metal bonding areas. The at least one sensing element is elastically connected to the bases. The sealing ring surrounds the bases, and is connected to at least one of the metal bonding areas. The lid is opposite to the active surface of the circuit chip, and is connected to the sealing ring to have a hermetic chamber which seals the sensing element and the active surface of the circuit chip. 1. A method for fabricating an apparatus integrating a microelectromechanical system device with a circuit chip , comprising:providing an SOI (Silicon on Insulator) wafer, wherein the SOI wafer comprises a device layer, an insulating layer and a handle layer stacked in order;etching from the device layer through the insulating layer so as to form a plurality of ring grooves and a plurality of pillars disposed at the center of the ring grooves;forming a plurality of first holes at the center of each of the pillars, wherein the first holes penetrate the insulating layer and are filled with the conductive material;etching the surface of the device layer so as to form a bottom of sealing ring, a plurality of bottoms of a plurality of supporting bases and a plurality of bottoms of a plurality of bases;etching the device layer to the insulating layer so as to form an etched pattern;integrating the above-mentioned device layer having etched pattern with a circuit chip, ...

Microelectromechanical apparatus having hermitic chamber

The disclosure relates to a microelectromechanical apparatus including a substrate, a stationary electrode, a movable electrode, and a heater. The substrate includes an upper surface, an inner bottom surface, and an inner side surface. The inner side surface surrounds and connects with the inner bottom surface. The inner side surface and the inner bottom surface define a recess. The stationary electrode is disposed on the inner bottom surface. The movable electrode covers the recess. The movable electrode, the inner bottom surface, and the inner side surface define a hermetic chamber. The heater is disposed on the movable electrode and located above the hermetic chamber.

Force measurement device for measuring low-frequency force and high-frequency force

The disclosure relates to a force measurement device including central portion, fixing portion, first and second sensing portions, and first and second electromechanical elements. The first sensing portion has first natural frequency. The first sensing portion is connected to the central portion. The second sensing portion has a second natural frequency. The second sensing portion is connected to the first sensing portion and the fixing portion. The first electromechanical element is disposed on the first sensing portion to measure a first vibration amplitude. The second electromechanical element is disposed on the second sensing portion to measure a second vibration amplitude. When the central portion is subjected to a first force, the first vibration amplitude is larger than the second vibration amplitude. When the central portion is subjected to a second force, the first vibration amplitude is smaller than the second vibration amplitude.

Piezoelectric sensing system and piezoelectric sensing circuit

A piezoelectric system comprises a piezoelectric sensor, a voltage stabilizer, a discharger and an operation sensor. The piezoelectric sensor outputs a sensing signal through a sensor output terminal according to a rate of change of pressure. The voltage stabilizer has a positive terminal electrically connecting with the sensor output terminal. The voltage stabilizer receives the sensing signal, stores the energy of the sensing signal, and keeps the voltage of the sensing signal as a constant when the rate of change of pressure is zero. The discharger has a first terminal connecting with the positive terminal, a second terminal coupled to ground, and a control terminal receiving a trigger signal to control the first terminal to conduct with or not conduct with the second terminal. The operation sensor electrically connects to the control terminal for sensing an operation generating the pressure and outputs the trigger signal accordingly.

COMPOSITE MICRO-ELECTRO-MECHANICAL-SYSTEM APPARATUS AND MANUFACTURING METHOD THEREOF

A MEMS apparatus comprising composite vibrating unit and the manufacturing method thereof are disclosed. The vibrating unit includes a stiffness element on which a first material is disposed. A second material being a conductive material is disposed on the first material and is extended to the stiffness element to remove electric charge on first material. When a temperature is changed, a variation direction of a Young's modulus of the first material is opposite to a variation direction of a Young's modulus of the stiffness element. The unique attributes above allow vibrating unit of the MEMS apparatus such as resonator and gyroscope to have stable resonance frequency against the change of temperature. 1. A composite micro-electro-mechanical-system (MEMS) apparatus , comprising: 'a stiffness element comprising a first surface, a second surface, and a third surface, wherein the first surface faces toward a first direction of the first axis and the second surface faces toward a second direction of the first axis, wherein the first direction is opposite to the second direction, and the third surface connects the first surface and the second surface;', 'a vibrating unit oscillating along a first axis, wherein the vibrating unit comprisesa first material disposed on the first surface and the second surface of the stiffness element; anda second material being a conductive material disposed on the first material and extending to the stiffness element, wherein the second material is electrically connected to the stiffness element,wherein, when a temperature changes, a variation direction of a Young's modulus of the first material is opposite to a variation direction of a Young's modulus of the stiffness element.2. The composite MEMS apparatus according to claim 1 , wherein the second material extends to the third surface of the stiffness element claim 1 , wherein the second material is electrically connected to the third surface of the stiffness element.3. The composite MEMS ...

Vibration sensor with monitoring function and vibration signal monitoring method thereof

A vibration sensor with monitoring function is provided, which includes a substrate, a microelectromechanical vibration sensor chip and an application-specific integrated circuit chip. The microelectromechanical vibration sensor chip is disposed on the substrate and detects a vibration applied to an object to generate a plurality of vibration signals. The application-specific integrated circuit chip is disposed on the substrate and electrically connected to the microelectromechanical vibration sensor chip, which includes a sampling module, a transform module and an analysis module. The sampling module receives and converts the vibration signals into a plurality of digital signals, and filters the digital signals to generate a plurality of time-domain data. The transform module transforms the time-domain data into a frequency-domain data according to a predetermined number. The analysis module executes a comparison process to compare the frequency-domain data with a predetermined spectrum feature table and generates a notification signal according to the comparison result.

BALL SCREW WITH TILT DETECTOR

A ball screw with tilt detector includes a screw rod, two screw nuts, a channel, a plurality of balls, and a tilt detector. The screw rod is extended along a direction of an axis. The two screw nuts are installed on the screw rod and capable of moving along the axis. The tilt detector is disposed between the two screw nuts to detect a tilt angle and a preload of the two screw nuts. The tilt detector includes a force receiving element, at least one first strain sensor, and at least one second strain sensor. The force receiving element includes a point symmetric ring-type structure, and the ring-type structure has two planes which are parallel to each other and respectively contact the two screw nuts. 1. A ball screw , comprising:a screw rod, wherein the screw rod has a first groove on an outer surface of the screw rod and is extended along a direction of an axis;two screw nuts, wherein each of the two screw nuts has a second groove on an inner surface of the screw nut, the two screw nuts are installed on the screw rod such that the two screw nuts can move along the axis;a channel formed by the first groove and the second groove,a plurality of balls disposed in the channel; and [ 'at least one ring-type structure having two planes, wherein a normal vector on a first sectional plane where the at least one ring-type structure is located is parallel to the direction of the axis, and the first sectional plane and the axis are intersected at a first intersection;', 'a force-receiving element comprising, 'at least one first strain sensor; and', 'at least one second strain sensor,, 'a tilt detector disposed between the two screw nuts to detect a tilt angle of the two screw nuts, comprisingwherein the two planes are parallel to each other and the two planes are respectively in contact with the two screw nuts, the at least one ring-type structure is a point-symmetric with respect to the first intersection.2. The ball screw of claim 1 , wherein a normal vector on a second ...

Microelectromechanical system apparatus with heater

A MEMS apparatus with heater includes central part, periphery part, gap and first connecting part. Central part includes center of mass, heater and first joint. Heater is disposed inside central part. First joint is located on boundary of central part. Displacement of first joint is produced when central part is heated by heater. Periphery part surrounds central part. Gap surrounds central part, and is located between central part and periphery part. First connecting part connects central part and periphery part along first reference line and includes first inner connecting portion and first outer connecting portion. First inner connecting portion is connected to first joint. First outer connecting portion is connected to periphery part. First reference line passes through first joint, and first reference line is not parallel to line connecting center of mass and first joint.

Mems device with movable stage

A MEMS device includes a substrate, at least one anchor disposed on the substrate, a movable stage, a sensing chip disposed on the movable stage, and at least one elastic member connected with the movable stage and the anchor. The movable stage includes at least one electrode and at least one conductive connecting layer. The sensing chip includes at least one electrical interconnection connected with the conductive connecting layer. The elastic member includes at least one first electrical channel, a second electrical channel and an electrical insulation layer disposed between the first electrical channel and the second electrical channel. The first electrical channel is electrically connected with the electrical interconnection, and the second electrical channel is electrically connected with the electrode.

MICRO-ELECTROMECHANICAL APPARATUS UTILIZING FOLDED SPRING FOR ROTARY ELEMENT

A micro-electromechanical apparatus includes a rotary element, at least one restraint and at least two folded springs. The rotary element is capable of rotating with respect to an axis. The folded springs are symmetrically disposed about the axis. Each folded spring has a moving end and a fixed end, the moving end is connected to the rotary element, and the fixed end is connected to the at least one restraint. The moving end is not located on the axis, and the fixed end is not located on the axis. A moving distance is defined as a distance between the moving end and the axis, a fixed distance is defined as a distance between the fixed end and the axis. A spring length is defined as a distance between the moving end and the fixed end. The spring length is varied according to the rotation of the rotary element. 1. A micro-electromechanical apparatus , comprising:a rotary element, being capable of rotating with respect to an axis;at least one restraint; andat least two folded springs disposed symmetrically about the axis, wherein each of the at least two folded spring has a moving end and a fixed end, the moving end is connected to the rotary element and the fixed end is connected to the at least one restraint, the moving end is not located on the axis and the fixed end is not located on the axis;wherein a moving distance is defined as a distance between the moving end and the axis, a fixed distance is defined as a distance between the fixed end and the axis, a spring length is defined as a distance between the moving end and a reference point of the fixed end, and the spring length is varied according to rotation of the rotary element.2. The micro-electromechanical apparatus according to claim 1 , wherein the fixed distance is less than or equal to the moving distance and the spring length is less than or equal to the moving distance.3. The micro-electromechanical apparatus according to claim 2 , wherein each of the at least two folded springs includes a plurality of ...

Capacitive sensor and manufacturing method thereof

A capacitive sensor includes a substrate, at least one first electrode, at least one second electrode, a sensing device, at least one anchor base, at least one movable frame, and a plurality of spring members. The first and second electrodes are disposed on the substrate, and the anchor base surrounds the first and second electrodes and is disposed on the substrate. The movable frame surrounds the sensing device. Some of the spring members connect the movable frame and the sensing device, and the other spring members connect the movable frame and the anchor base. The sensing device and the first electrode are both sensing electrodes. The movable frame is disposed above the second electrode, and cooperates with the second electrode to act as a capacitive driver.

具多重氣密空腔的微機電裝置及其製作方法

Micro electro mechanical apparatus with interdigiated spring

Micro-electro mechanical apparatus with interdigitated spring

A micro-electro mechanical apparatus with interdigitated spring including a substrate, at least one first mass, a movable electrode, a stationary electrode, an anchor and an interdigitated spring is provided. The movable electrode is disposed on the mass along an axial direction. The stationary electrode is disposed on the substrate along the axial direction, and the movable electrode and the stationary electrode have a critical gap there between. The interdigitated springs connects the mass and the anchor along the axial direction. The interdigitated spring includes first folded portions, first connecting portions, second folded portions, and second connecting portions. Each first folded portion includes two first spans and a first head portion. Each second folded portion includes two second spans and a second head portion. A width of the first span and a width of the second span are greater than the critical gap respectively.

Apparatus integrating microelectromechanical system device with circuit chip and methods for fabricating the same

One embodiment discloses an apparatus integrating a microelectromechanical system device with a circuit chip which includes a circuit chip, a microelectromechanical system device, a sealing ring, and a lid. The circuit chip comprises a substrate and a plurality of metal bonding areas. The substrate has an active surface with electrical circuit area, and the metal bonding areas are disposed on the active surface and electrically connected to the electrical circuits. The microelectromechanical system device comprises a plurality of bases and at least one sensing element. The bases are connected to at least one of the metal bonding areas. The at least one sensing element is elastically connected to the bases. The sealing ring surrounds the bases, and is connected to at least one of the metal bonding areas. The lid is opposite to the active surface of the circuit chip, and is connected to the sealing ring to have a hermetic chamber which seals the sensing element and the active surface of the circuit chip.

Capacitive transducer and fabrication method

Apparatus integrating microelectromechanical system device with circuit chip and methods for fabricating the same

Crystal oscillator and method for manufacturing the same

Apparatus and method for detecting defect between conducting wires and dielectric material of wafer semiconductor and circuit board

具多重電性通道的微機電裝置及其製作方法

一種具多重電性通道的微機電裝置，包括支撐座與質量塊。支撐座的絕緣層將其分成上、下導電層。隔絕溝槽設置於支撐座的下導電層且貫穿至絕緣層，將下導電層分成電性絕緣的內、外導電部。導電通孔設置於支撐座且貫穿絕緣層，並連接上導電層及外導電部。質量塊的絕緣層將其分成上、下導電層。隔絕溝槽設置於質量塊的下導電層且貫穿至絕緣層，並將下導電層分成電性絕緣的兩個導電部。質量塊的兩個導電部分別電性連接兩個支撐座的內導電部。導電通孔貫穿絕緣層且連接質量塊的上導電層及二個導電部之一。上述的微機電裝置的製作方法也被提出。

Apparatus and method for detecting defect between conducting wires and dielectric material of wafer semiconductor and circuit board

Force measurement apparatus for pile

A force measurement apparatus adapted to be installed on a pile includes at least one pressing ring and a plurality of force sensors. The pressing ring includes a ring body and at least one pressing part. The ring body has at least one end and an inner surface facing the pile. The pressing part is disposed at the end. The force sensor is disposed between the inner surface of the ring body and the pile so as to sense a radial deformation and the degree of eccentricity of the pile.

Spindle shaft device with torque sensor

A spindle shaft device including a shaft, a first torque sensor, and a second torque sensor. The shaft extends along an axial direction and comprises a first side portion, a second side portion, and a central portion located between the first side portion and the second side portion. The central portion has a central torsional rigidity with respect to the axial direction. The first side portion has a first torsional rigidity with respect to the axial direction. The second side portion has a second torsional rigidity with respect to the axial direction. The first torsional rigidity is smaller than the central torsional rigidity. The second torsional rigidity is smaller than the central torsional rigidity. The first torque sensor is disposed on the first side portion. The second torque sensor is disposed on the second side portion.

Vertically integrated micro-bolometer and manufacturing method thereof

A vertically integrated micro-bolometer includes an integrated circuit chip, an infrared sensing film, and a metal bonding layer. The integrated circuit chip includes a silicon substrate, a circuit element, and a dielectric layer disposed on the silicon substrate. The infrared sensing film includes a top absorbing layer, a sensing layer, and a bottom absorbing layer. The sensing layer is disposed between the top absorbing layer and the bottom absorbing layer. Materials of the top absorbing layer, the sensing layer, and the bottom absorbing layer are materials compatible with a semiconductor manufacturing process. The metal bonding layer connects the dielectric layer on the silicon substrate in the integrated circuit chip and the bottom absorbing layer of the infrared sensing film to form a vertically integrated micro-bolometer. In one embodiment, the infrared sensing film is divided into a central sensing film, a surrounding sensing film, and a plurality of connecting portions by a plurality of slots. The surrounding sensing film surrounds the central sensing film. Each of the connecting portions connects the surrounding sensing film and the central sensing film. A central distance from the bottom absorbing layer of the central sensing film to the silicon substrate is substantially equal to a surrounding distance from the bottom absorbing layer of the surrounding sensing film to the silicon substrate.

Tool holder having force sensors

A tool holder having force sensors includes a first connection portion, a second connection portion, a first sensing portion, a second sensing portion, at least one first force sensor and at least one second force sensor. The first connection portion connects a cutting tool along an axis. The second connection portion connects a spindle along the axis. The first sensing portion having at least one first hole connects the first connection portion along the axis. The second sensing portion having at least one second hole connects the second connection portion and the first sensing portion. The first force sensor disposed in the first hole is to sense a torsional force. The second force sensor disposed in the second hole is to sense a bending force. The first sensing portion has a bending stiffness greater than that of the second sensing portion.

Microelectromechanical sensing apparatus with calibration function

A microelectromechanical sensing apparatus with calibration function comprises a microelectromechanical sensor and an IC chip. The microelectromechanical sensor comprises a proof mass, a movable driving electrode and a movable sensing electrode disposed on the proof mass, and a stationary driving electrode and stationary sensing electrode disposed on a substrate, wherein the sensing electrodes output a sensing signal when the proof mass vibrates. The IC chip comprises a conversion module electrically connected to the microelectromechanical sensor, wherein the conversion module converts the sensing signal into an input spectrum signal, and a calibration module electrically connected to the conversion module, wherein the calibration module receives the input spectrum signal and transforms the input spectrum signal into an output spectrum signal; wherein, the output spectrum signal is equal amplitude spectrum signal when the microelectromechanical sensor is subjected to an equal amplitude vibration and the input spectrum signal is an unequal amplitude spectrum signal.

Electric signal reconstruction system and method

An electric signal reconstruction system includes a signal generator and a computing element. The signal generator has a time constant and is configured to generate a plurality of signal value corresponding to a plurality of time points within a time period, wherein the signal values include a designated value, the time points include a designated time point, and the designated value corresponds to the designated time point. The computing element is electrically connected to the signal generator and is configured to perform operations including: performing a differential calculation or an integral calculation according to the time points and the signal values to generate a fundamental value; calculating a correction constant associated with the time constant; calculating a product of the correction constant and the fundamental value as a correction value; calculating a sum of the correction value and the designated value as a reconstruction value; and outputting the reconstruction value.

Force sensing apparatus with bridge portion

A force sensing apparatus with bridge portion comprises a first case, a second case, and a force sensing module. The first case comprises a first annular portion, a first bridge portion, and an inner wall portion. The first bridge portion is connected to an outer periphery of the first annular portion. The inner wall portion is connected to an inner periphery of the first annular portion. The second case comprises a second annular portion, a second bridge portion, and an outer wall portion. The second bridge portion is connected to an inner periphery of the second annular portion. The outer wall portion is connected to an outer periphery of the second annular portion. A stiffness of the second annular portion along an axial direction is greater than a stiffness of the second bridge portion along the axial direction. The second case is disposed on the first case along the axial direction to form a space. The force sensing module is disposed in the space.