Energy Saving Air Conditioning System And Air Conditioning Modes Thereof

The invention discloses an energy saving air conditioning system and air conditioning modes thereof. The energy saving air conditioning system provides different air conditioning modes, including a closed-loop mode, an open-loop mode, and a partial-loop mode, for controlling the environment in a high-density apparatus room. The energy saving air conditioning system uses a cloud operating center to monitor the temperature and the moisture inside and outside the high-density apparatus room. The cloud operating system dynamically selects the air conditioning mode in such a manner that energy can be saved and the environment in the high-density apparatus room can be optimally to managed.

Energy saving air conditioning system and air conditioning method thereof

An energy saving air conditioning system is disclosed which provides different air conditioning modes, including a closed-loop mode, an open-loop mode, and a partial-loop mode, for controlling the environment in a high-density apparatus room. The energy saving air conditioning system uses a cloud operating center to monitor the temperature and the moisture inside and outside the high-density apparatus room. The cloud operating system dynamically selects the air conditioning mode in such a manner that energy can be saved and the environment in the high-density apparatus room can be optimally managed.

ENERGY SAVING AIR CONDITIONING SYSTEM AND AIR CONDITIONING METHOD THEREOF

An energy saving air conditioning system is disclosed which provides different air conditioning modes, including a closed-loop mode, an open-loop mode, and a partial-loop mode, for controlling the environment in a high-density apparatus room. The energy saving air conditioning system uses a cloud operating center to monitor the temperature and the moisture inside and outside the high-density apparatus room. The cloud operating system dynamically selects the air conditioning mode in such a manner that energy can be saved and the environment in the high-density apparatus room can be optimally to managed. 1. An energy saving air conditioning system utilized in a high-density apparatus room , the high-density apparatus room having an air inlet , the energy saving air conditioning system comprising:an inlet gate for selectively opening or closing the air inlet;an air filter wall;a heat exchanger array comprising a plurality of heat exchangers and at least one water collector disposed under the heat exchangers;a fan array; a thermal flow outlet leading to a space outside the high-density apparatus room;', 'an outlet gate for selectively opening or closing the thermal flow outlet;', 'a return air outlet leading to a space between the air filter wall and the fan array; and', 'a return wall gate for selectively opening or closing the return air outlet; and, 'a thermal flow channel for collecting hot air in the high-density apparatus room, wherein the thermal flow channel comprisesa cloud operating center for controlling the inlet gate, the heat exchanger array, the fan array, the outlet gate, and the return air gate.2. The energy saving air conditioning system of claim 1 , wherein the fan array comprises a plurality of high-pressure centrifugal fans.3. The energy saving air conditioning system of claim 1 , further comprising a plurality of sensors connecting to the cloud operating center.4. The energy saving air conditioning system of claim 3 , wherein the sensors comprise:a ...

EXPANSION CARD WITH HOMOGENIZED LIGHT OUTPUT AND LIGHT-HOMOGENIZING DEVICE THEREOF

An expansion card with homogenized light outputs and light-homogenizing device thereof are disclosed. The expansion card includes a circuit board and a light-homogenizing device. The circuit board includes a light-emitting device disposed on a first side edge. The light-homogenizing device includes a light-guiding body, a light-diffusion element, and a light-turning element. The light-guiding body includes a light-input side and a light-output side opposite to each other, and the light-input side is adjacent to the first side edge. The light-diffusion element is disposed on the light-input side of the light-guiding body and opposite to the light-emitting device. The light-diffusion element and the light-out side are configured to diffuse the light beams entering into the light-guiding body from the light-emitting device and form a light-transmitting path. The light-turning element is disposed in the light-guiding body, located on the light-transmitting path and configured to turn the directions of portion of the light beams. 1. An expansion card with a homogenized light output comprising:a circuit board having at least one light-emitting device disposed on a first side edge thereof; and a light-guiding body having a light-input side and at least one light-output side, wherein the light-input side and the light-output side are disposed on two opposite sides of the light-guiding body respectively, and the light-input side is adjacent to the first side edge of the circuit board;', 'at least one light-diffusion element disposed on the light-input side of the light-guiding body and opposite to the light-emitting device of the circuit board, wherein the light-diffusion element and the light-output side are configured to form at least one light-transmitting path, and the light-diffusion element is configured to diffuse plural light beams entering into the light-guiding body from the light-emitting device; and', 'at least one light-turning element disposed in the light- ...

TEMPERATURE ADJUSTING APPARATUS FOR SERVER AND METHOD THEREOF

A temperature adjusting apparatus for a server and a temperature adjusting method thereof are provided. Rotation speeds and rotation directions of fans are controlled according to sensing results of temperature sensors, so as to adjust temperatures of server units by heat generated from the server units during operation. 1. A temperature adjusting apparatus for a server , the temperature adjusting apparatus comprising:a case, having at least an air inlet and at least an air outlet;a frame, disposed in the case to accommodate a plurality of server units;a plurality of temperature sensors, disposed on a side of the frame, which is close to the air inlet, corresponding to positions of the plurality of server units to sense temperatures;a plurality of fans, disposed on a side of the frame, which is close to the air outlet, corresponding to the positions of the plurality of server units; anda control unit, coupled to the plurality of temperature sensors and the plurality of fans and controlling a rotation speed and a rotation direction of each of the plurality of fans according to sensing results of the plurality of temperature sensors.2. The temperature adjusting apparatus according to claim 1 , wherein when the plurality of fans are controlled by the control unit to rotate in a first direction claim 1 , the plurality of fans generate an air flow flowing from the air outlet to the air inlet to increase the temperatures of the plurality of server units claim 1 , and when the plurality of fans are controlled by the control unit to rotate in a second direction claim 1 , the plurality of fans generate an air flow flowing from the air inlet to the air outlet to reduce the temperatures of the plurality of server units.3. The temperature adjusting apparatus according to claim 2 , wherein the control unit further determines whether the temperatures sensed by the plurality of temperature sensors are less than a first preset temperature claim 2 , and if any of the temperatures ...

SOLID-STATE DRIVE HEAT DISSIPATION DEVICE

A solid-state drive (SSD) heat dissipation device is disclosed. The SSD heat dissipation device comprises a solid-state drive substrate, a chip heat dissipation component, a memory heat dissipation component, and a spacer. A control IC and a flash memory are disposed on the solid-state drive substrate, the chip heat dissipation component is disposed on the control IC, and the memory heat dissipation component is disposed on the flash memory. The chip heat dissipation component and the memory heat dissipation component are disposed separately. 1. A solid-state drive heat dissipation device , comprising:a solid-state drive substrate comprising a control IC and a flash memory disposed on the solid-state drive substrate;a chip heat dissipation component disposed on the control IC; anda memory heat dissipation component disposed on the flash memory, whereinthe chip heat dissipation component and the memory heat dissipation component are disposed separately.2. The solid-state drive heat dissipation device of claim 1 , wherein the chip heat dissipation component comprises a chip heat dissipation sheet disposed on the control IC.3. The solid-state drive heat dissipation device of claim 2 , wherein the chip heat dissipation component comprises chip heat dissipation fins disposed on the chip heat dissipation sheet.4. The solid-state drive heat dissipation device of claim 3 , wherein the chip heat dissipation component comprises a chip fan disposed on the chip heat dissipation fins.5. The solid-state drive heat dissipation device of claim 1 , wherein the memory heat dissipation component comprises a memory heat dissipation sheet disposed on the flash memory.6. The solid-state drive heat dissipation device of claim 5 , wherein the memory heat dissipation component comprises memory heat dissipation fins disposed on the memory heat dissipation sheet.7. The solid-state drive heat dissipation device of claim 6 , wherein the memory heat dissipation component comprises a memory fan ...

Sata connector having dual fixing structure

Oculink electronic device having flexible circuit board

An oculink electronic device having a flexible circuit board includes an oculink connector, a first rigid circuit board, a second rigid circuit board and the flexible circuit board. The first rigid circuit board is connected with the oculink connector. The flexible circuit board is extended from the first rigid circuit board and the second rigid circuit board and disposed between the first rigid circuit board and the second rigid circuit board. Therefore, not only the assembling steps are reduced, but also the total length is significantly shortened. The rotatable characteristic is provided, and the space requirement of installation is reduced.

Electronic data access device with universal serial bus (USB) connector

具有卡掣結構的連接器及具有該連接器的電連接裝置

Digital storage device

觸控顯示裝置的除霧方法

一種觸控顯示裝置的除霧方法，其中觸控顯示裝置包括一顯示面板及一觸控面板，觸控面板配置於顯示面板上且包括多條感測串列。觸控顯示裝置的除霧方法包括供電至觸控面板的至少一條感測串列且持續一段預設時間，以升高在顯示面板與觸控面板之間的空間的溫度。

Flash disk having SATA interface

Stack structure of solid state drive module

介面卡之固定裝置

Temperature adjusting apparatus for server and method thereof

A temperature adjusting apparatus for a server and a temperature adjusting method thereof are provided. Rotation speeds and rotation directions of fans are controlled according to sensing results of temperature sensors, so as to adjust temperatures of server units by heat generated from the server units during operation.