Spin dispenser module substrate surface protection system

A spin dispenser module and methods for using the same is disclosed. The spin dispenser module includes a cup having a basin with sidewalls and an exhaust, a rotatable platform situated inside the cup adapted for holding and rotating a substrate, a liquid dispenser disposed over the rotatable platform for dispensing a liquid coating material on top of the substrate, one or more ejector inlets disposed over the rotatable platform, the one or more ejectors connected to a negative pressure source, and a motor coupled to the rotatable platform to rate the rotatable platform at different rotational speeds. The one or more ejector inlets may be translatable and/or rotatable with optionally adjustable suction pressure. The ejector inlets operate after a liquid coating material is dispensed to avoid deposition of suspended organic compounds after a coating is formed.

Spin Dispenser Module Substrate Surface Protection System

A spin dispenser module and methods for using the same is disclosed. The spin dispenser module includes a cup having a basin with sidewalls and an exhaust, a rotatable platform situated inside the cup adapted for holding and rotating a substrate, a liquid dispenser disposed over the rotatable platform for dispensing a liquid coating material on top of the substrate, one or more ejector inlets disposed over the rotatable platform, the one or more ejectors connected to a negative pressure source, and a motor coupled to the rotatable platform to rate the rotatable platform at different rotational speeds. The one or more ejector inlets may be translatable and/or rotatable with optionally adjustable suction pressure. The ejector inlets operate after a liquid coating material is dispensed to avoid deposition of suspended organic compounds after a coating is formed. 1. A method , comprising:placing a substrate into a spin dispenser module on a rotatable platform in a cup;chucking the substrate on the rotatable platform;rotating the rotatable platform;dispensing a liquid coating material onto the substrate;controlling a vacuum source connected to one or more ejector inlets, removing particles over the substrate through the one or more ejector inlets without altering the liquid coating material on the substrate;rinsing a backside of the substrate;removing the liquid coating material from an edge of the substrate; andremoving the substrate from the spin dispenser module.2. The method of claim 1 , wherein removing particles over the substrate through one or more ejector inlets is performed during rinsing a backside and removing the liquid coating material from an edge of the substrate.3. The method of claim 1 , wherein removing particles over the substrate through one or more ejector inlets is performed while scanning the one or more ejector inlets across the substrate.4. The method of claim 1 , wherein removing particles over the substrate through one or more ejector inlets ...

ELECTRONIC DEVICE

An electronic device includes a first body, a second body, two hinges, and at least one electronic assembly. The two hinges are connected between the first body and the second body, and the first body and the second body are adapted to rotate relatively through the two hinges. The electronic assembly is connected to the second body and is located between the two hinges. 1. An electronic device , comprising:a first body;a second body, comprising a display panel, a back cover and a front frame,wherein the display panel is disposed between the back cover and the front frame and is exposed by the front frame;two hinges, connected between the first body and the second body,wherein the first body and the second body are adapted to rotate relatively through the two hinges; andat least one electronic assembly, electronically connected to the display panel in the second body and located between the two hinges.2. The electronic device according to claim 1 , wherein the front frame includes an extension portion claim 1 , and the at least one electronic assembly is at least partially located in the extension portion.3. The electronic device according to claim 1 , wherein an edge of the back cover extends beyond an edge of the display panel in a first direction.4. The electronic device according to claim 3 , wherein the edge of the back cover extends beyond an edge of the front frame in the first direction.5. The electronic device according to claim 3 , wherein the at least one electronic assembly comprises an L-shaped control circuit board.6. The electronic device according to claim 5 , wherein the L-shaped control circuit board extends in a second direction substantially perpendicular to the first direction.7. The electronic device according to claim 1 , further comprising a hinge cover comprises a substantially U-shaped receiving groove to recess the two hinges on both ends of the receiving groove.8. The electronic device according to claim 7 , wherein opposing edges of the ...

SPIN DISPENSER MODULE SUBSTRATE SURFACE PROTECTION SYSTEM

A spin dispenser module and methods for using the same is disclosed. The spin dispenser module includes a cup having a basin with sidewalls and an exhaust, a rotatable platform situated inside the cup adapted for holding and rotating a substrate, a liquid dispenser disposed over the rotatable platform for dispensing a liquid coating material on top of the substrate, one or more ejector inlets disposed over the rotatable platform, the one or more ejectors connected to a negative pressure source, and a motor coupled to the rotatable platform to rate the rotatable platform at different rotational speeds. The one or more ejector inlets may be translatable and/or rotatable with optionally adjustable suction pressure. The ejector inlets operate after a liquid coating material is dispensed to avoid deposition of suspended organic compounds after a coating is formed. 1. A method comprising:placing a wafer onto a rotatable platform disposed inside a cup of a spin coating apparatus, the cup including a basin with sidewalls;rotating the wafer by the rotatable platform;while rotating the wafer, dispensing a liquid coating material on an upper surface of the wafer by a liquid dispenser nozzle disposed over the rotatable platform;activating an ejector device, the ejector device comprising an ejector inlet disposed over the rotatable platform, and a negative pressure source; andcontrolling the negative pressure source to remove gaseous or particulate organic material suspended over the wafer by the ejector inlet without disturbing a surface of the liquid coating material.2. The method of claim 1 , wherein the liquid dispenser nozzle extends from a liquid dispenser body claim 1 , wherein the ejector inlet is fixed to the liquid dispenser body.3. The method of claim 2 , wherein the ejector device further comprises ejector lines between the ejector inlet and the negative pressure source claim 2 , the ejector lines mounted alongside the liquid dispenser body claim 2 , and the ejector ...

Spin Dispenser Module Substrate Surface Protection System

A spin dispenser module and methods for using the same is disclosed. The spin dispenser module includes a cup having a basin with sidewalls and an exhaust, a rotatable platform situated inside the cup adapted for holding and rotating a substrate, a liquid dispenser disposed over the rotatable platform for dispensing a liquid coating material on top of the substrate, one or more ejector inlets disposed over the rotatable platform, the one or more ejectors connected to a negative pressure source, and a motor coupled to the rotatable platform to rate the rotatable platform at different rotational speeds. The one or more ejector inlets may be translatable and/or rotatable with optionally adjustable suction pressure. The ejector inlets operate after a liquid coating material is dispensed to avoid deposition of suspended organic compounds after a coating is formed.

Pet grooming device

A pet grooming device includes a first positioning member and a second positioning member. The second positioning member includes one or more assembling hole. The assembling hole includes a grooming brush. The first positioning member and the second positioning member are combined with each other.

Electronic device

An electronic device includes a first body, a second body, two hinges, and at least one electronic assembly. The two hinges are connected between the first body and the second body, and the first body and the second body are adapted to rotate relatively through the two hinges. The electronic assembly is connected to the second body and is located between the two hinges.

Strip light

A strip light includes one or more light assemblies each having a transparent, flexible, and elongated member including a plurality of enclosures with LEDs enclosed therein. A base having a plurality of enlargements is fitted in bottoms of the enclosures. A wire is electrically coupled to terminals of the LEDs. A connecting member is formed at both ends of the elongated member, with each connecting member having two opposite recesses on its surface. In assembly, one connecting member of a first light assembly is cut. The other connecting member of a second light assembly is pressed onto the enclosure of the first light assembly adjacent the cut connecting member until the recesses of the other connecting member of the second light assembly are seated on the connecting elements of the first light assembly. Then, the first and second light assemblies are electrically coupled together.

Strip light

A strip light including one or more light assemblies each comprises a transparent, flexible, and elongated member including a plurality of enclosures with LEDs enclosed therein, a base having a plurality of enlargements fitted in bottoms of the enclosures, a wire electrically coupled to terminals of the LEDs, and a connecting member formed at either end of the elongated member, the connecting member having two opposite recesses on its surface. In assembly, one connecting member of a first light assembly is cut, the other connecting member of a second light assembly is pressed onto the enclosure of the first light assembly adjacent the cut connecting member until the recesses of the other connecting member of the second light assembly are seated on the connecting elements of the first light assembly, and the first and second light assemblies are electrically coupled together.

Method for manufacturing an optical disk comprising forming a substrate that includes an internal support section of greater thickness than an external registration section, and forming UV-curable paste vibration suppressor layer distributed at 90% w / w in a region circular with a diameter of 90 to 110 mm; and optical disk.

Método para fabricar disco óptico que comprende formar sustrato con sección de soporte interna y sección de registro de información externa y formar capa supresora de vibraciones imprimiendo pasta curable por uv en la sección de registro, la pasta tiene al menos 90% del peso distribuido en la región circular; y disco óptico. Method for manufacturing an optical disk comprising forming a substrate with an internal support section and an external information recording section and forming a vibration suppressing layer by printing UV-curable paste in the registration section, the paste has at least 90% of the weight distributed in the circular region; and optical disk.

Spin dispenser module substrate surface protection system

A spin dispenser module and methods for using the same is disclosed. The spin dispenser module includes a cup having a basin with sidewalls and an exhaust, a rotatable platform situated inside the cup adapted for holding and rotating a substrate, a liquid dispenser disposed over the rotatable platform for dispensing a liquid coating material on top of the substrate, one or more ejector inlets disposed over the rotatable platform, the one or more ejectors connected to a negative pressure source, and a motor coupled to the rotatable platform to rate the rotatable platform at different rotational speeds. The one or more ejector inlets may be translatable and/or rotatable with optionally adjustable suction pressure. The ejector inlets operate after a liquid coating material is dispensed to avoid deposition of suspended organic compounds after a coating is formed.

記憶卡彩色圖層成形方法

一種記憶卡彩色圖層成形方法，係包含：提供一記憶卡基材；將該記憶卡基材置於一容室中，該容室之壓力係小於0.01大氣壓力；將氧氣通入該容室，使該容室之每單位體積之氧氣含量為1~13L/m3；對通入該容室之氧氣施予一電漿，該電漿之單位面積功率為2.5~6kw/m2，使該電漿解離氧氣，以形成氧自由基，並轟擊該記憶卡基材之表面；及以一UV油墨於該記憶卡基材之表面成形一固化之彩色圖層。

Ornamental lamp

Ornamental lamp