Water cooling system for providing water with constant temperature

A water cooling system includes a temperature control device which is connected with a first heat exchanger. A second heat exchanger includes a water temperature control path and a constant temperature water path. The water of the first heat exchanger is controlled by the temperature control device and flows to the water temperature control path. The water in the constant temperature water path tows through the second heat exchanger to proceed heat exchange with the water in the water temperature control path, and then flows to the target equipment. The temperature difference of the water flowing to the target equipment is smaller than that of conventional water cooling system.

Supporting Device

A supporting device includes a holding module and a locating module. The holding module includes a rear shell and a front shell which have a bottom positioning shell and a top positioning shell covered to define a receiving chamber therebetween. The locating module is movably disposed in the receiving chamber and includes a supporting part, a slide part mounted on the supporting part and slidable forward and backward, a locating part fixed on the slide part and projecting out of the top positioning shell, and an elastic part clamped between the supporting part and the bottom positioning shell. The locating part is located in front of the front shell with a distance therebetween being adjustable by the locating part along with the slide part sliding forward and backward. The supporting part together with the slide part and the locating part can move upward and downward by the elastic part. 1. A supporting device , comprising:a holding module including a rear shell and a front shell covered on the rear shell, a bottom end of the rear shell extending to form a bottom positioning shell projecting in front of the rear shell, a bottom end of the front shell extending to form a top positioning shell projecting in front of the front shell, the top positioning shell and the bottom positioning shell being matched with and covered with each other to define a receiving chamber therebetween; anda locating module movably disposed in the receiving chamber of the holding module, the locating module including a supporting part, a slide part mounted on the supporting part and capable of sliding forward and backward with respect to the supporting part, a locating part fixed on the slide part and projecting upward out of the top positioning shell, and an elastic part elastically clamped between the supporting part and the bottom positioning shell;wherein the locating part is apart located in front of the front shell, a distance between the locating part and the front shell can be ...

Stack module for chips has chips on top and bottom of stacked substrates enclosed by connections between substrates

The stack module has at least one substrate (20a) on both sides of which at least one chip (21a,21b) is attached, and encapsulated to protect them from the environment. The underside of the substrate can be stacked on the upper side of a similar substrate (20b). The chips are encapsulated by connections (23a,23b) between the substrates.

Method for structuring wafers or substrates using UBM layer technology, involves adhering plastics strip to surface of wafer and punching holes using laser through plastic band, above UBM layer

Method for forming metal structures on a wafer, involves forming a substructure metal layer (UBM) (12) on an electrode terminal face (11) on the surface of a wafer (1). A plastic strip is adhered to the surface of the wafer (1) and holes are stamped through the plastic strip above the UBM using a laser, to form a blind-hole in the plastic strip above the UBM (12), followed by filling a solder paste (5) into the blind-hole with a slider. The solder paste is subsequently melted and cooled to form a solder block (6), and the plastic strip is removed to release the solder block (6), and then the solder block is melted to form a solder ball (7).

Improvement of the heat-dissipative structure of a flip chip module involves covering the module completely with an epoxy resin to provide direct contact between the module and resin

A heat-dissipative structure for a flip-chip module (1) comprises an epoxy resin (41) which completely surrounds the module (1). Direct contact is thus achieved between the epoxy resin (41) and the module (1) so that heat transfer is improved. The heat-dissipative structure of a flip-chip module (1) uses an epoxy resin (41) for completely surrounding the module (1). The module (1) is encased on the topside of a substrate (11) having solder balls (111) on its underside. Solder beads (211) between the chip (21) and the substrate (11) are completely surrounded by a filling material (31). The module (1) is covered with an epoxy resin (41) having conducting particles so that direct contact between the epoxy resin (41) and the module (1) is able to reduce the length of the heat transfer path, thus improving the efficiency of heat transfer. The substrate can be replaced by a lead frame.

Mobile phone charger holder

Capsule construction for flip-chip connected to chip and base has chip stuck onto base using surface adhesive flat encapsulation method, auxiliary chip stuck on to form housing

The construction uses flip-chip technology to stick the chip to the base and encapsulate it, which increases signal transmission speed and reduces housing height. A main chip (22) is stuck onto the base (21) using a surface adhesive flat encapsulation method. An auxiliary chip (23) with protruding blocks is used to stick onto a chip and simultaneously to the base by the flip-chip method to form a housing.

集積回路基板の柱状突起植付け方法

(57)【要約】 【課題】 集積回路基板の柱状突起植付け方法を提供す る。 【解決手段】 まず基板１の親板１１に先行技術（例え ばメッキ法）をもって銅線回路１２をメッキする。親板 １１上に一層の接合遮蔽物１３を覆い被せ、それの高 （厚）さはちょうど後述の柱状突起１７が必要とする高 さである。接合遮蔽物１３の銅線回路１２に相対する位 置に開口１４を開ける。メッキ技術をもって銅線回路１ ２の位置に純銅１５をメッキし、その純銅１５は開口１ ４の位置から柱状になる。柱状純銅１５の頂部にさらに 一層の錫鉛合金の溶接金属１６をメッキし、高さは接合 遮蔽物１３と同じにする。接合遮蔽物１３を取り除き、 柱状突起１７を残す。これにより、柱状突起１７にダイ をフリップチップ接合する。純銅１５メッキによって高 さを増しているので、極めていい厚さが得られ、精密性 を制御することができる。

無線充電器

【物品用途】;本創作係關於一種無線充電器，用於給手機或其他電子產品充電。;【設計說明】;如附圖所示，本創作無線充電器包括一主體部和一支架。所述主體部大致呈矩形狀，主體部的頂面為一平面，主體部的四側面和底面皆由不規則的傾斜面組合而成，所述支架具有一大致呈三角形且呈弧形彎折的第一支板，第一支板上開設有一呈前後延伸的開孔，第一支板的前端緣連接有一先向後彎折再向後並向上延伸的第二支板，第二支板的後端穿過開孔並固設於主體部的底面。

Taillight assembly of a bicycle

A taillight assembly of a bicycle includes a seat, a seat tube and a clamping element. A bottom of the seat is provided with a seat post. An inside of the seat tube defines an inner space for holding the seat post. A rear of the seat tube defines a wire slot which is disposed for holding a signal wire. The clamping element is fastened to a top of the seat tube. The clamping element includes a taillight fastener, a taillight unit and a wire tunnel. The taillight unit has an indicator surface and an assembling surface. The assembling surface is combined with the taillight fastener. An inside of the clamping element defines the wire tunnel. The wire tunnel is connected to the wire slot. The signal wire passes through the wire tunnel, and then the signal wire enters the wire slot.

Taillight assembly of a bicycle

A taillight assembly of a bicycle includes a seat, a seat tube and a clamping element. A bottom of the seat is provided with a seat post. An inside of the seat tube defines an inner space for holding the seat post. A rear of the seat tube defines a wire slot which is disposed for holding a signal wire. The clamping element is fastened to a top of the seat tube. The clamping element includes a taillight fastener, a taillight unit and a wire tunnel. The taillight unit has an indicator surface and an assembling surface. The assembling surface is combined with the taillight fastener. An inside of the clamping element defines the wire tunnel. The wire tunnel is connected to the wire slot. The signal wire passes through the wire tunnel, and then the signal wire enters the wire slot.

Verfahren und Vorrichtung zur Herstellung eines metallischen Bondhügels mit vergrößerter Höhe

Ein Verfahren und eine Vorrichtung zur Herstellung eines metallischen Bondhügels mit vergrößerter Höhe und insbesondere ein Verfahren und eine Vorrichtung, die die Zuverlässigkeit der Verbindung zwischen dem metallischen Bondhügels (32) und dem Chip (1) vergrößern und die Kontaktfläche zwischen dem metallischen Bondhügel (32) und der Metall- oder Lötkugel (4) vergrößern können.

薄型球柵陣列基板の製造方法

(57)【要約】 【課題】 大きな電気特性を有し、厚いメッキ層が形成 できる薄型球柵陣列基板の製造法を提供する。 【解決手段】 キャリアであるポリイミドフイルム２１ の上面に薄い銅層および厚い銅層２３がメッキされる。 キャリアの上下層に塗布される上積層感光塗料層および 下積層感光塗料層は回路軌跡が形成されているマスクを 介して感光処理され、凹入した回路パターンが形成され る。キャリアの上層の凹入した回路パターンの底面の銅 層はさらに銅層がメッキされ、下層の凹入した回路パタ ーンの底面のポリイミドフイルムは除去される。銅層は 金属材料でメッキされ、上積層感光塗料層と下積層感光 塗料層は洗浄除去される。厚い銅層２３の余剰部分が除 去され、回路線および溶接材料が接続される金属材料が 残存される。

除油健康餐具組

手機充電座

【物品用途】;本創作係關於一種手機充電座，用於收容手機以方便對其進行充電。;【創作特點】;如附圖所示，本創作手機充電座具有一主體部，在主體部的左右兩側分別設有向內傾斜的斜面。在主體部的頂部設有一蓋子，該蓋子中間設有向內凹陷的收容槽，在收容槽的後壁上設有向上凸伸的抵靠部。

Packaging structure for flip-chip bonding chip and base

Manufacturing method for multilayer high density substrate

The present invention relates to a manufacturing method for multilayer high density substrate. The circuit layout of the first layer substrate of the multilayer board requires a high demand of pitch density, and therefore polyimide layer is used to make into polyimide substrate (or other high density polymeric film substrate), and combines with the non-high density multilayer board formed from second layer board (or more layer boards) made of organic substrate. In making the organic multilayer board, the adjacent surface of the first layer polyimide substrate (or high density polymeric film substrate), corresponding to appropriate solder pad position of the first layer polyimide substrate (or high density polymeric film substrate), is formed with a solder bump. Thus, when the individual layer board and the first layer substrate are combined, direct heating and compression are applied, such that the bump and the solder pad are bound and electrically connected.

Procede de fabrication pour substrat multicouche haute densite

La présente invention concerne globalement un procédé de fabrication de substrat multicouche haute densité, et en particulier, un procédé employant une couche de polyimide, ou autre matériau sous forme de film polymérique haute densité, pour former un substrat de polyimide, ou substrat de film polymérique haute densité, pour former une première couche (11) d'une carte multicouche.