Copper electroplating device

The invention discloses a copper electroplating device and belongs to the technical field of copper electroplating manufacturing. Comprising an electroplating bath module, a cathode frame, an additive monitoring module and an additive dropwise adding module, wherein the electroplating bath module comprises a cuboid electroplating bath, two inflating pipes, four fixed pulleys, an anode titanium basket and a water outlet, the cathode frame comprises a cathode frame, a cathode handrail, four sliding rods, a cathode plate, a convex frame, a motor knob, a motor rotating rod, a motor and a motor cushion block, and the additive monitoring module comprises a monitoring device, two electrodes and a fixing support. And the additive dropwise adding module comprises a dropwise adding device and a dropwise adding pipeline. The additive monitoring module and the additive dropwise adding module are introduced into the copper electroplating device, the automation degree of the device is improved, the test ...