ADHESIVE COMPOSITION, THERMOSETTING ADHESIVE SHEET, AND PRINTED WIRING BOARD

An adhesive composition having a low dielectric constant, low dielectric loss tangent, excellent folding endurance, and excellent heat resistance. The adhesive composition includes: with respect to the total of 100 parts by mass of the adhesive composition, 70 to 90 parts by mass of the styrene elastomer; 5 to 25 parts by mass of a modified polyphenyleneether resin having a polymerizable group at an end; totally 10 parts by mass or less of an epoxy resin and an epoxy resin curing agent, wherein the styrene ratio of the styrene elastomer is less than 42%. 1. An adhesive composition , comprising: with respect to the total of 100 parts by mass of the adhesive composition ,70 to 90 parts by mass of the styrene elastomer;5 to 25 parts by mass of a modified polyphenyleneether resin having a radical polymerizable group at an end;totally 10 parts by mass or less of an epoxy resin, an epoxy resin curing agent, and a peroxide,wherein the styrene ratio of the styrene elastomer is less than 42%.2. The adhesive composition according to claim 1 , wherein the glass transition temperature after curing is 80 to 170° C.3. The adhesive composition according to claim 1 , wherein the styrene ratio of the styrene elastomer is 10 to 30%.4. The adhesive composition according to claim 1 , wherein the peroxide is an organic peroxide having a decomposition temperature of 170° C. or higher to achieve a half-life of 1 minute.5. The adhesive composition according to claim 1 , wherein the content of the modified polyphenyleneether resin is 10 to 20 parts by mass.6. The adhesive composition according to claim 1 , wherein the modified polyphenyleneether resin has an ethylenically unsaturated bond at an end.7. The adhesive composition according to claim 1 , wherein the epoxy resin curing agent is a latent epoxy resin curing agent.8. An adhesive composition claim 1 , comprising: with respect to the total of 100 parts by mass of the adhesive composition claim 1 ,70 to 90 parts by mass of the styrene ...

ADHESIVE COMPOSITION, THERMOSETTING ADHESIVE SHEET, AND PRINTED WIRING BOARD

An adhesive composition has a low dielectric constant, a low dielectric loss tangent, and an excellent folding endurance. The adhesive composition includes: with respect to the total of 100 parts by mass of the adhesive composition, 75 to 90 parts by mass of a styrene elastomer; 3 to 25 parts by mass of a modified polyphenyleneether resin having a polymerizable group at an end; and totally 10 parts by mass or less of an epoxy resin and an epoxy resin curing agent, wherein the styrene ratio of the styrene elastomer is less than 30%. 1. An adhesive composition , comprising: with respect to the total of 100 parts by mass of the adhesive composition ,75 to 90 parts by mass of a styrene elastomer,3 to 25 parts by mass of a modified polyphenyleneether resin having a polymerizable group at an end; andtotally 10 parts by mass or less of an epoxy resin and an epoxy resin curing agent,wherein the styrene ratio of the styrene elastomer is less than 30%.2. The adhesive composition according to claim 1 , wherein the glass transition temperature after curing is −40 to 40° C.3. The adhesive composition according to claim 1 , wherein the styrene ratio of the styrene elastomer is 5 to 25%.4. The adhesive composition according to claim 1 , wherein the styrene elastomer has a weight average molecular weight of 100 claim 1 ,000 or more.5. The adhesive composition according to claim 1 , wherein the content of the modified polyphenyleneether resin is 5 to 20 parts by mass.6. The adhesive composition according to claim 1 , wherein the modified polyphenyleneether resin has at least one of an epoxy group and an ethylenically unsaturated bond at an end.7. The adhesive composition according to claim 1 , wherein the adhesive composition comprises substantially no peroxide.8. The adhesive composition according to claim 1 , wherein the epoxy resin curing agent is a latent epoxy resin curing agent.9. A thermosetting adhesive sheet comprising a base material and a thermosetting adhesive layer ...

Detection of solid surface and internal defect by photoelasticity method

Method and apparatus for visualizing ultrasonic waves in liquid-solid systems

The sound field of ultrasonic pulses emitted in a liquid-solid system is irradiated with polarized light, and the ultrasonic pulses in the liquid and in the solid are visualized simultaneously by detecting deflected light arising from a change in refractive index of the liquid caused by presence of the ultrasonic pulses, and polarized light arising from the birefringence in the solid caused by presence of the ultrasonic pulses. By quantitatively measuring the sound field, waveform, etc. of the ultrasonic pulses from an ultrasonic probe in the liquid by the schlieren method and in the solid by the photoelastic method simultaneously, it is possible to visualize the ultrasonic pulses in the liquid and solid at the same time. This enables ready measurement of the direction of emission of the ultrasonic pulses from the probe, the ultrasonic wavelength, the propagation velocity, etc., thus making it possible to perform a comprehensive performance evaluation and examination of sound field for various types of probes, inclusive of the water-submersible type.

Adhesive composition, thermosetting adhesive sheet, and printed wiring board

An adhesive composition having a low dielectric constant and dielectric loss tangent and an excellent folding endurance is provided. The adhesive composition includes: with respect to the total of 100 parts by mass of the adhesive composition, 75 to 90 parts by mass of a styrene elastomer; 3 to 25 parts by mass of a modified polyphenyleneether resin having a polymerizable group at an end; and totally 10 parts by mass or less of an epoxy resin and an epoxy resin curing agent.

録音再生装置

【課題】ノイズキャンセル機能と録音機能を1つの機器に共存させようとした場合、それぞれの機能用に各1つずつマイクが必要となり、計2つのマイクが必要となる。また、スピーカー近傍に録音用マイクのある環境で再生/録音を同時に行おうとすると録音したい音に再生音がノイズとして乗ってしまう。そのため、録音時には再生音楽をOFFする必要がある。 【解決手段】ノイズキャンセル用マイクと録音用マイクを共用することにより、通常2つ必要となるマイクを1つで共用する。さらに、録音時には再生音を逆位相に変換し録音マイクからの出力と足し合わせることによって、近傍のスピーカーから録音マイクに乗ってくる再生音を相殺する。これにより、再生音楽をOFFしなくてもスピーカーからのノイズを気にせず周囲の音を録音することができる。 【選択図】図１