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Применить Всего найдено 3. Отображено 3.
07-07-2016 дата публикации

CIRCUIT BOARD ASSEMBLY WITH HIGH AND LOW FREQUENCY SUBSTRATES

Номер: US20160197400A1
Автор: DELHEIMER CHARLES I., SEARCY JAMES F., Zimmerman David W.
Принадлежит:

A circuit board assembly includes a low-frequency (LF) substrate, a monolithic microwave integrated circuit (MMIC), electrical components, a high-frequency (HF) substrate, and an antenna. The LF substrate is formed of FR-4 type material. The LF substrate defines a waveguide through the LF substrate. The MMIC is attached to the top-side of the LF substrate and outputs the radio-frequency signal. The electrical components are electrically attached to the LF substrate. The HF substrate is soldered to the top side of the LF substrate. An opening through the HF substrate surrounds the MMIC. A vertical transition guides the radio-frequency signal output by the MMIC to the waveguide. A plurality of wire bonds electrically connects the MMIC to the HF substrate and couple the radio-frequency signal from the MMIC to the vertical transition. The antenna is attached to the LF substrate and configured to radiate the radio-frequency signal from the waveguide. 1. A circuit board assembly comprising:{'b': '4', 'a low-frequency (LF) substrate formed of FR- type material, wherein the LF substrate defines a top-side, a bottom-side, and a waveguide through the LF substrate configured to guide a radio-frequency signal from the top-side to the bottom-side;'}a monolithic microwave integrated circuit (MMIC) attached to the top-side and configured to output the radio-frequency signal;a plurality of electrical components electrically attached to the LF substrate and configured to process a low-frequency signal;a high-frequency (HF) substrate attached to the top-side, wherein the HF substrate is configured to define a solder pad configured to couple the low-frequency signal from the LF substrate to the HF substrate, an opening through the HF substrate configured to surround the MMIC, and a vertical transition configured to guide the radio-frequency signal output by the MMIC to the waveguide;a plurality of wire bonds to electrically connect the MMIC to the HF substrate and couple the radio- ...

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Номер записи: 1
17-07-2001 дата публикации

Flip chip with backside electrical contact and assembly and method therefor

Номер: US6262489B1
Автор: Charles I Delheimer, Gary Eugene Oberlin, Mark Anthony Koors, Robert Vajagich, Scott David Brandenburg
Принадлежит: Delphi Technologies Inc

A method and assembly for mounting an IC semiconductor device to a substrate using flip chip technology. The assembly generally entails a flip chip having a first surface, an oppositely-disposed second surface, an integrated circuit that includes a vertical device on the first surface, and an electrical contact for the vertical device on the second surface. The flip chip is bonded with first solder connections to a first conductor pattern on a substrate, so that the first solder connections electrically and mechanically connect the flip chip to the substrate. The assembly further includes an electrical contact member that is positioned so that the flip chip is between the contact member and the substrate. The contact member is electrically and mechanically connected to a second conductor pattern on the substrate with second solder connections. A third solder connection electrically and mechanically connects the contact member to the electrical contact on the second surface of the flip chip.

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Номер записи: 2
15-11-2006 дата публикации

Technique for defining a wettable solder joint area for an electronic assembly substrate

Номер: EP1722616A2
Автор: Charles I. Delheimer, Rick B. Snyder
Принадлежит: Delphi Technologies Inc

A technique for defining a wettable solder joint area for an electronic assembly reduces and/or dispenses with the use of polymer solder masks. According to the technique, a substrate (112) is provided that includes at least one conductive trace (116). A nickel layer (118) is provided on the conductive trace (116) and gold is selectively applied on the nickel layer (118) in a desired pattern to form a gold layer (120). An exposed portion of the nickel layer (118) that does not include the gold in the desired pattern is then oxidized. Finally, a solder (122) is applied to the gold layer (120), with the oxidized nickel layer (118) providing a solder stop and defining a wettable solder joint area.

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Номер записи: 3