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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Применить Всего найдено 4. Отображено 4.
18-04-2023 дата публикации

Organosilicon polyoxane composition as well as preparation method and application thereof

Номер: CN115975593A
Автор: XU SHAN, ZHANG YINHUA, WANG BING, YANG JIACHENG, DENG KAILUN, SUN MINGHUI
Принадлежит:

The invention discloses an organic silicon polyoxane composition as well as a preparation method and application thereof, and belongs to the field of organic silicon materials. The organic silicon polyoxane composition provided by the invention is prepared from the following components: organic silicon polyoxane, an alkoxy silane cross-linking agent, a tackifier and a first catalyst, the structural general formula of the organosilicone polyoxane is shown as a formula (I), wherein in the formula (I), R1-R12 are respectively and independently selected from C1-C5 alkyl groups; z is a divalent saturated alkyl group of C1 to C10; a is 1 to 3; p is 1 to 20; m is from 15 to 1200; n is 2 to 25; and q is 1 to 25. According to the present invention, by selecting the organosilicon polyoxane, the provided organosilicon polyoxane composition has good sulfur corrosion resistance, and can be used for protecting electronic and electrical components from the harm of corrosive gases such as hydrogen sulfide ...

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Номер записи: 1
23-05-2023 дата публикации

Contact chip blanking, forming and assembling device

Номер: CN116140681A
Автор: XUE LIWU, YU ZHENGJIE, DENG KAILUN, HAN XIAOBO, ZHANG BINSHE, LI MING
Принадлежит:

The invention provides a contact chip blanking, forming and assembling device, and belongs to the technical field of geophysical exploration detection instrument production. Comprising a contact piece press-fitting mechanism, a contact piece cutting mechanism, a substrate moving module, a contact piece taking and placing mechanism and a contact piece substrate. The substrate moving module is used for moving a contact chip substrate on which a contact chip is placed to a preset position below the contact chip cutting mechanism through a position sensor; the contact piece cutting mechanism is used for cutting a contact piece on the contact piece substrate; the contact piece taking and placing mechanism is used for taking the cut contact piece from the contact piece substrate and placing the cut contact piece in an upper cover of a to-be-assembled part; the contact piece press-fitting mechanism is used for conducting press-fitting on the cut contact piece and the upper cover of the part to ...

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Номер записи: 2
27-06-2023 дата публикации

Low-density high-modulus organic silicon composite material as well as preparation method and application thereof

Номер: CN116333500A
Автор: YANG JIACHENG, XU SHAN, WANG BING, DENG KAILUN, ZHANG YINHUA
Принадлежит:

The invention relates to the field of polymer composite materials, in particular to a low-density high-modulus organic silicon composite material and a preparation method and application thereof. The organic silicon composite material provided by the invention comprises the following components in parts by mass: 10-30 parts of vinyl-terminated polydimethylsiloxane; 40 to 120 parts of hollow glass beads; 1-10 parts of a cross-linking agent; 0 to 0.1 part of a catalyst; and 0-0.2 part of an inhibitor. According to the low-density and high-modulus organic silicon composite material disclosed by the invention, by adding a proper amount of hollow glass beads, the damping performance can be improved, and relatively low density and relatively high modulus can be kept, so that the defects of a damping material are overcome, the application field of the organic silicon damping material is widened, and the low-density and high-modulus organic silicon composite material has a good market prospect.

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Номер записи: 3
01-12-2017 дата публикации

Waterborne epoxy modified acrylic acid insulation varnish as well as preparation and application thereof

Номер: CN0107418355A
Автор: QU JINQING, DENG KAILUN, LI PEIXUAN
Принадлежит:

The invention discloses waterborne epoxy modified acrylic acid insulation varnish as well as a preparation method and an application thereof. The preparation method of the waterborne epoxy modified acrylic acid insulation varnish comprises steps as follows: epoxy resin and a solvent are added to a reaction kettle, the mixture is heated to 60-80 DEG C under the protection of nitrogen, stirred until epoxy resin is dissolved and heated to 90-135 DEG C, 20% of a mixture of acrylic acid monomers, acrylic ester monomers, hydroxyl acrylic monomers and an initiator is dropwise added, 80% of the mixture of the monomers and the initiator is dropwise added after 0.5-1 h, the components are completely dropwise added within 3-5 h, a proper quantity of imitators and solvents are supplemented, the mixture is kept at the temperature of 90-135 DEG C for 1.5-2 h, mixed with a neutralizer to be neutralized for 0.5-1 h, then cooled to 60-70 DEG C, mixed with a crosslinking age, pigment filler, an aid and deionized ...

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Номер записи: 4