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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 15. Отображено 15.
27-06-2023 дата публикации

Wafer cleaning device controlled by multi-channel flow field

Номер: CN116329222A
Автор: ZHOU QIAN, ZHANG JING, CHEN XINLAI, TANG BAOGUO, DENG XINFU, LIAO SHIBAO
Принадлежит:

The invention provides a wafer cleaning device controlled by a multi-channel flow field. The wafer cleaning device comprises a wafer bearing platform, and a plurality of supporting assemblies for supporting wafers are arranged on the edge of the wafer bearing platform; a flow guide groove is formed in the flow guide plate; the downward-pressing flow guide cover covers the flow guide plate, an air flow passage is formed in a gap between the downward-pressing flow guide cover and the flow guide groove, and air flow input from the outside is sprayed to the edge part of the wafer through the air flow passage; airflow pipelines in one-to-one correspondence with the supporting assemblies are arranged on the flow guide plate; the air outlets of the airflow pipelines are close to the corresponding supporting assemblies, and airflow input from the outside is blown to the supporting assemblies through the air outlets of the airflow pipelines. And through the multi-channel design, airflow enhancement ...

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Номер записи: 1
11-08-2023 дата публикации

Sectional type flow field control non-contact wafer edge cleaning device

Номер: CN116581076A
Автор: TANG BAOGUO, ZHANG JING, CHEN XINLAI, ZHOU QIAN, DENG XINFU, LU ZHENGKAI
Принадлежит:

The invention provides a sectional type flow field control non-contact wafer edge cleaning device, which is characterized in that a plurality of aerodynamic components are arranged on the periphery of the edge of a wafer bearing platform, so that a wafer is in a suspended state, the wafer bearing platform is provided with a flow guide groove, a jet flow pipe component and a fixing groove, the jet flow pipe component is fixed in the fixing groove, and the flow guide groove surrounds the fixing groove; a first airflow channel is formed by the downward-pressing flow guide cover, the flow guide groove and a gap between the flow guide cover and the jet flow pipe assembly, airflow sprayed out of the jet flow pipe assembly is sprayed out towards the edge part of the wafer along the first airflow channel, a plurality of airflow holes are formed in the bottom of the flow guide groove, and the airflow sprayed out of the airflow holes reinforces the airflow sprayed out of the jet flow pipe assembly ...

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Номер записи: 2
23-06-2023 дата публикации

Drying groove body structure for optimizing swing type Marangei drying flow field

Номер: CN116294548A
Автор: JIANG FENG, JIANG YUAN, LI PANPAN, DENG XINFU, LU ZHENGKAI
Принадлежит:

The invention relates to a drying tank body structure for optimizing a swing type Marangei drying flow field, which comprises a main body tank which is a funnel-shaped main body structure with a gentle slope for discharging liquid; the sunken channel is located in the center of the bottom of the main body groove, and a discharge hole is formed in the lowest end of the slope of the sunken channel; the overflow tanks are respectively arranged on two sides of the main body tank and are used for discharging overflowed ultrapure water and isopropanol; the negative pressure cavity is arranged in the overflow groove to form a negative pressure exhaust cavity; and the water injection pipeline is arranged in the sunken channel, and an injection pipe discharge hole is formed in the water injection pipeline. According to the drying tank body structure, uniform ultrapure water infiltration of the front and back faces of a batch of wafers can be achieved, vertical downstream traction is formed, disordered ...

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Номер записи: 3
05-05-2023 дата публикации

Integrated module of special IPA wafer drying method

Номер: CN116072568A
Автор: CHEN XINLAI, ZHANG JING, LI PANPAN, DENG XINFU, LU ZHENGKAI
Принадлежит:

The invention relates to an integrated module of a special IPA wafer drying method, the integrated module comprises an isopropyl alcohol input pipeline (202), a circulating ultrapure water input pipeline (205), a circulating ultrapure water output pipeline (206), a heating nitrogen input pipeline (203), a mixing tank body (201) and a mixed gas-liquid coexisting liquid output pipeline (204), the mixing tank body (201) comprises a shell and a mixing tank (207), at least one mixing tank (207) is arranged in the shell, a mixed gas-liquid coexistence body output port (215) is further formed in the mixing tank (201), and a mixture of isopropanol and heated nitrogen is conveyed into the drying tank body (101) through a mixed gas-liquid coexistence liquid output pipeline (204). The integrated module provided by the invention stably and controllably provides mixed liquid formed by liquid isopropanol and heated nitrogen for wafer cleaning and drying equipment, and provides gas and liquid atmosphere ...

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Номер записи: 4
10-12-2014 дата публикации

Semi-processed non-oriented silicon steel and manufacturing method thereof

Номер: CN104195426A
Автор: PAN XIAOCHENG, HUANG AIJUN, ZHU HAIRONG, DENG XINFU
Принадлежит:

The invention provides semi-processed non-oriented silicon steel. The silicon steel comprises following chemical components by mass: not more than 0.005% and not less than 0 of C, not more than 0.8% and not less than 0.15% of Si, not more than 0.4% and not less than 0.2% of Mn, more than 0.02% and less than 0.1% of P, more than 0% and less than 0.01% of S and not more than 0.1% and not less than 0.03% of Al, with the balance being Fe. The thickness of the silicon steel is 0.35-0.65 mm, the width is 1000-1250 mm, and the surface roughness Ra is 0.4-1.0 [mu]m. Through a plurality of tests and trials, the silicon steel fully meets quality requirements on iron loss and magnetic induction for motors. After secondary annealing and blueing, the performance can be improved by two levels. The silicon steel is favored by users at present. As the development prospect of the motor industry is wide, the silicon steel is high in popularization and application value and has a wide prospect.

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Номер записи: 5
26-05-2023 дата публикации

Wafer detection module and method

Номер: CN116169061A
Автор: JIANG YUAN, DENG XINFU, LYU FANGYI, LIU CHUANLONG, LU ZHENGKAI
Принадлежит:

The invention discloses a wafer detection module, and the module comprises a wafer box bearing platform which is provided with a plurality of wafer box bearing positions which are hollow in the middle, and is used for bearing wafer boxes; the wafer detection device comprises a receiving integration assembly and a light source integration assembly, and the receiving integration assembly and the light source integration assembly are located at the bottom of the wafer box bearing platform and located on the two sides, corresponding to the hollowed-out position, of the wafer box bearing platform respectively; wherein the receiving integrated assembly integrally ascends and descends and/or rotates and swings so as to receive, turn and conduct light rays, and the light source integrated assembly integrally ascends and descends and/or rotates and swings so as to integrate the light rays conducted by the receiving integrated assembly and perform optical scanning on wafers in the wafer box through ...

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Номер записи: 6
23-06-2023 дата публикации

Wafer detection system and method

Номер: CN116313900A
Автор: LIAO SHIBAO, DENG XINFU, LI PANPAN, LU ZHENGKAI, LYU FANGYI, CHEN XINLAI
Принадлежит:

The invention discloses a wafer detection system. Omnibearing optical and millimeter wave noise scanning imaging is established by combining optics and wave band spectrum waves; comprising an optical detection unit which is arranged at a first position relative to a wafer moving path and is used for carrying out optical imaging on a wafer; the optical detection unit is arranged at a first position relative to the moving path of the wafer and is used for carrying out optical imaging on the wafer, the wave band detection unit is arranged at a second position relative to the moving path of the wafer and is used for carrying out wave spectrum imaging on the wafer, and the detection analysis unit is in signal connection with the optical detection unit and the wave band detection unit and is used for carrying out detection and operational analysis on optical imaging information and wave spectrum imaging information so as to detect the wafer. The invention further provides a wafer detection method ...

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Номер записи: 7
13-06-2023 дата публикации

Wafer cleaning device capable of preventing backflow

Номер: CN116251785A
Автор: ZHOU QIAN, JIANG YUAN, TANG BAOGUO, DENG XINFU, CHEN XINLAI
Принадлежит:

The invention provides an anti-backflow wafer cleaning device which is characterized in that a wafer bearing assembly is provided with a plurality of clamping assemblies and is provided with a diversion trench; pressing down the flow guide cover to cover the flow guide groove to form an airflow diffusion channel and a first annular gap; a gap between the edge part of the downward pressing flow guide cover and the wafer bearing assembly forms a buffer air channel; a plurality of air holes are formed in the edge part of the downward-pressing flow guide cover; air flow input from the outside sequentially passes through the air flow diffusion channel, the first annular gap and the buffering air channel and then is sprayed out from the air holes. The buffering air channel is arranged between the first annular gap and the air hole to serve as an auxiliary air chamber, and the auxiliary air chamber contains output air flow, has the pressure holding function and has the possibility of blocking ...

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Номер записи: 8
23-07-2008 дата публикации

Elastic fluorocarbon exterior wall coatings related system and production technology thereof

Номер: CN0101225270A
Автор: HUANG JIANBO, YANG JIANBIN, DENG XINFU, HUANG SHIGANG, JIANBO HUANG, JIANBIN YANG, XINFU DENG, SHIGANG HUANG
Принадлежит:

The invention relates to an elastic fluorocarbon paint for exterior walls and a preparation method. The elastic fluorocarbon paint for exterior walls comprises an insulation layer and a putty layer and also comprises middle paint and elastic fluorocarbon paint; wherein, the middle paint comprises the following components with different weight percentages: 0.5 to 1 percent aqueous coating wetting dispersant, 0.2 to 0.6 percent defoamer, 1 to 3 percent film forming additive, 0.2 to 0.5 percent hydroxyl cellulose, 15 to 30 percent pigment and filler, 0.2 to 1 percent aqueous coating antimold agent, 0.2 to 1 percent thickening flow agent, 0.05 to 3 percent germicide, 0.1 to 1 percent pH value regulator, 1.5 to 3 percent antifreeze, 30 to 40 percent flexible compound resin and the balance is water. The elastic fluorocarbon paint is divided into A and B components and put separately, and when used, a proper amount of thinner can be added into according to requirements. The elastic fluorocarbon ...

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Номер записи: 9
30-06-2023 дата публикации

Wafer box conveying device

Номер: CN116364618A
Автор: DENG XINFU, KONG HAO, LU ZHENGKAI, CHEN XINLAI, YANG FU
Принадлежит:

The invention discloses a wafer box conveying device. The wafer box conveying device comprises a standby loading area, a transfer area, a wafer guide area and a wafer detection module which are arranged in a U shape. The wafer detection module comprises an optical detection unit and a wave band detection unit, the optical detection unit comprises at least one group of receiving integrated assembly and light source integrated assembly, and each group of receiving integrated assembly and light source integrated assembly are respectively located at the bottom of the wafer box bearing position and on two sides corresponding to the hollow position; the wafer box conveying device comprises a receiving integrated assembly and a light source integrated assembly, the receiving integrated assembly integrally ascends and descends and/or rotates and swings so as to receive, turn and transmit light rays, and the light source integrated assembly integrally ascends and descends and/or rotates and swings ...

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Номер записи: 10
23-06-2023 дата публикации

Liquid tension control method capable of improving wafer drying efficiency

Номер: CN116313882A
Автор: JIANG YUAN, LIAO SHIBAO, DENG XINFU, LI PANPAN, LU ZHENGKAI
Принадлежит:

The invention relates to a liquid tension control method capable of improving wafer drying efficiency, which comprises the following steps of: 1, connecting a wafer box with a swinging mechanism, putting the wafer box into a drying groove body, loading wafers in the wafer box, combining the drying groove body with an upper cover dome, keeping the tightness, and evacuating trace gas; 2, injecting normal-temperature nitrogen from the dome of the upper cover, and injecting ultrapure water into the drying tank body to wet the surface of the wafer; and step 3, completing infiltration of the surface of the wafer, and carrying out the following operations: S1, injecting a mixture of isopropanol and heated nitrogen into the drying tank body by using a special integrated module, and discharging ultrapure water from the bottom of the drying tank body at a controlled speed; s2, in the ultrapure water discharging process, operating a swinging mechanism to carry the wafer to form planetary swinging, ...

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Номер записи: 11
27-08-2021 дата публикации

FFU system linkage circulation structure suitable for wet process equipment

Номер: CN214068702U
Автор: ZHANG JING, FANG CHAO, DENG XINFU, LIU DAWEI, CHEN DINGKUN, 张静, 方超, 邓信甫, 刘大威, 陈丁堃
Принадлежит: PNC PROCESS SYSTEMS CO LTD, ZHIWEI SEMICONDUCTOR SHANGHAI CO LTD, PNC PROCESS SYSTEMS CO., LTD., ZHIWEI SEMICONDUCTOR (SHANGHAI) CO., LTD., 上海至纯洁净系统科技股份有限公司, 至微半导体(上海)有限公司

The utility model discloses an FFU (Fan Filter Unit) system linkage circulation structure suitable for wet process equipment, which is characterized by comprising a shell, an airflow space is divided into a first space and a second space by arranging a separation assembly in the shell, and two ventilation assemblies are arranged on a third separation plate, so that the airflow space is separated into the first space and the second space. A containing assembly is arranged on a third partition plate to prevent acid gas from flowing back, a blocking assembly is arranged on a second partition plate to prevent condensation liquid from entering a ventilation assembly, and an adjusting assembly is arranged in an exhaust pipe to adjust the size of an opening of the exhaust pipe. The flow guide assembly is arranged on the air flow space to accelerate the flow rate of the air in the air flow space, the hidden assembly is arranged on the shell to accommodate the electric wire of the FFU shell, the ...

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Номер записи: 12
11-07-2023 дата публикации

Wafer cleaning method

Номер: CN116417330A
Автор: LIAO SHIBAO, XU MING, DENG XINFU
Принадлежит:

The invention relates to a wafer cleaning method, which comprises the following steps that a wafer to be cleaned is cleaned by using a first cleaning solution, the first cleaning solution is a mixed solution of hydrofluoric acid and nitric acid, and the treatment time of the wafer in the first cleaning solution is 10-60 minutes; washing the wafer treated by the first cleaning solution, and then cleaning the wafer by using a second cleaning solution which is a mixed solution of ammonia water and hydrogen peroxide, and treating the wafer in the second cleaning solution for 5-15 minutes; heating the wafer treated by the second cleaning solution in a furnace tube to form an oxide layer, cooling and then cleaning by using a third cleaning solution which is a mixed solution of hydrofluoric acid and hydrochloric acid, and treating the wafer in the third cleaning solution for 10-20 minutes; and cleaning the wafer treated by the third cleaning solution with water, drying, and finishing cleaning.

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Номер записи: 13
07-07-2023 дата публикации

Wafer cleaning device for improving cleaning agent residue

Номер: CN116393476A
Автор: ZHANG HUI, CHEN XINLAI, DENG XINFU, WANG KUI, LIAO SHIBAO
Принадлежит:

The invention provides a wafer cleaning device capable of improving cleaning agent residues. The wafer cleaning device comprises a wafer bearing platform, and the edge of the wafer bearing platform is provided with a clamping assembly; the guide plate is provided with a guide groove; the downward-pressing flow guide cover covers the flow guide groove, a gap between the downward-pressing flow guide cover and the flow guide groove forms an airflow diffusion channel and a first annular gap, and the air outlet end of the first annular gap faces the edge area of the wafer; the guide plate is provided with a through hole and a first airflow channel; the clamping assembly penetrates through the through hole and exposes the clamping head, and a gap between the clamping assembly and the through hole forms a second annular gap. The first airflow channel communicates with the airflow diffusion channel and the second annular gap. The airflow of the area, close to the wafer, of the clamping assembly ...

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Номер записи: 14
06-06-2023 дата публикации

Optimization device for solving particle pollution caused by vibration of Marangei drying module

Номер: CN116222199A
Автор: DENG XINFU, LU LEI, LYU FANGYI, LI PANPAN, LU ZHENGKAI
Принадлежит:

The invention relates to an optimization device for solving particle pollution caused by vibration of a Marangei drying module, the optimization device comprises an overall stability control system and a movement control system of a drying cavity (1), the overall stability control system comprises two groups of combination blocks arranged at the bottom of a dewatering tank (3); the two groups of combination blocks are adjustably fixed on a framework (001) of the machine table (0) by using giant bolts, and fulcrums corresponding to the combination blocks are arranged on the framework (001); the moving control system comprises a cover opening mechanism (2) and an adjusting rod combination (4), the cover opening mechanism (2) is arranged between the drying cavity (1) and the dewatering tank (3) to achieve phase movement, and the adjusting rod combination (4) is arranged between the cover opening mechanism (2) and the drying cavity (1). According to the optimizing device, the supporting stability ...

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Номер записи: 15