METHOD FOR FILLING CAVITIES IN WAFERS, CORRESPONDINGLY FILLED BLIND HOLE AND WAFER HAVING CORRESPONDINGLY FILLED INSULATION TRENCHES

A method is described for filling cavities in wafers, the cavities being open to a predetermined surface of the wafer, including the following steps: applying a lacquer-like filling material to the predetermined surface of the wafer; heating the wafer at a first temperature; driving out gas bubbles enclosed in the filling material by heating the wafer under vacuum at a second temperature which is equal to or higher than the first temperature; and curing the filling material by heating the wafer at a third temperature which is higher than the second temperature. Furthermore, also described is a blind hole filled using such a method and general 3D cavities as well as a wafer having insulation trenches of a silicon via filled using such a method. 1. A method for filling cavities in wafers , the cavities being open to a predetermined surface of the wafer , the method comprising:applying a lacquer-like filling material to the predetermined surface of the wafer;heating the wafer at a first temperature;driving out gas bubbles enclosed in the filling material by heating the wafer under vacuum at a second temperature which is equal to or higher than the first temperature;curing the filling material by heating the wafer at a third temperature which is higher than the second temperature.2. The method of claim 1 , wherein the filling material is a material which is liquid at the second temperature.3. The method of claim 1 , wherein the filling material is a. polymer claim 1 , which is one of a polyimide and a benzocyclobutene compound.4. The method of claim 1 , wherein the third temperature is lower than 250° C.5. The method of claim 1 , wherein the cavity has at least one undercut.6. The method of claim 1 , wherein the cavity is one of a metallic hollow via and an insulation trench of a silicon via.7. The method of claim 6 , further comprising:structuring the filling material applied to the predetermined surface of the wafer for exposing terminal contacts of the metallic ...

Method for Producing an Electrical Circuit and Electrical Circuit

A method for producing an electrical circuit having at least one semiconductor chip is disclosed. The method includes forming a wiring layer at a contact side of the at least one semiconductor chip, which is encapsulated with a potting compound apart from the contact side. The wiring layer has at least one conductor loop for the purpose of forming an electrical coil. 1. A method for producing an electrical circuit having at least one semiconductor chip , comprising:forming a wiring layer at a contact side of the at least one semiconductor chip, which is encapsulated with a potting compound apart from the contact side, wherein the wiring layer has at least one conductor loop configured to form an electrical coil.2. The method according to claim 1 , wherein the wiring layer is formed with the at least one conductor loop in a manner directly adjoining the contact side of the at least one semiconductor chip.3. The method according to claim 1 , wherein an intervening wiring layer is formed in a manner directly adjoining the contact side of the at least one semiconductor chip and the wiring layer with the at least one conductor loop is formed on the intervening wiring layer.4. The method according to claim 2 , wherein an intermediate plane is formed in a manner directly adjoining the contact side of the at least one semiconductor chip and the wiring layer is formed with the at least one conductor loop on the intermediate plane claim 2 , wherein a thickness of the intermediate plane is set depending on a predetermined distance between the at least one conductor loop and the contact side.5. The method according to claim 1 , wherein the at least one conductor loop extends in the wiring layer beyond a region covered by the at least one semiconductor chip.6. The method according to claim 1 , further comprising:fitting the at least one semiconductor chip by the contact side to a carrier substrate;encapsulating the at least one semiconductor chip on the carrier substrate with ...

PROCESS FOR COATING METALLIC SURFACES WITH AN ANTI-CORROSIVE COATING

A process for coating metallic surfaces with an anti-corrosive composition that contains a conductive polymer and is a dispersion that contains the at least one conductive polymer mainly or entirely in particulate form, as well as a binder system. The conductive polymer is at least one polymer based on polyphenylene, polyfuran, polyimidazole, polyphenanthrene, polypyrrole, polythiophene and polythiophenylene charged with anti-corrosive mobile anions. Alternatively, the metallic surfaces can be first coated with a dispersion based on conductive polymers in particulate form, then coated with a composition which contains a binder system. 130-. (canceled)31. A process comprising coating a metallic surface with an anti-corrosive composition that is a dispersion , Wherein the anti-corrosive composition comprises conductive particles of a conductive polymer and a binder system , wherein the conductive polymer is at least one member selected from the group consisting of polyphenylene , polyfuran , polyphenanthrene , polypyrrole , polythiophene and polythiophenylene , wherein the conductive polymer is charged with anti-corrosive mobile anions , wherein the conductive particles of conductive polymer comprise inorganic core-shell particles that are partially or completely coated with conductive polymer , wherein the anti-corrosive mobile anion is selected from the group consisting of a hydroxycarboxylic acid , an oxycarboxylic acid , a dicarboxylic acid , a tricarboxylic acid , a di-substituted or tri-substituted arenecarboxylic acid , a meta- ortho- or para-substituted arenecarboxylic acid , an arene acid containing an amino group , a nitro group or an OH group , a sulfonic acid , a mineral oxyacid , a manganese-containing acid , a fluorosilicic acid , a silicic acid , an acid with a content of at least one element from a rare earth or yttrium , a sulphur-containing acid , a titanium-containing acid , a vanadium-containing acid , a tungsten-containing acid , a tin-containing ...

Method for Constructing an Electrical Circuit, and Electrical Circuit

A method for constructing an electrical circuit that includes at least one semiconductor chip encapsulated with a potting compound is disclosed. The method includes applying a galvanic layer arrangement for forming an electrochemical element on an element of the electrical circuit including the at least one semiconductor chip. 1. A method for constructing an electrical circuit comprising at least one semiconductor chip encapsulated with a potting compound , comprising:applying a galvanic layer arrangement for forming an electrochemical element on an element of the electrical circuit having the at least one semiconductor chip.2. The method according to claim 1 , wherein claim 1 , in the applying step claim 1 , a plurality of thin layers are applied temporally successively in order to form the galvanic layer arrangement.3. The method according to claim 1 , wherein the applying step is carried out before claim 1 , after or in parallel with a step of fitting the at least one semiconductor chip by a contact side thereof to a carrier substrate claim 1 , a step of encapsulating the at least one semiconductor chip on the carrier substrate with a potting compound claim 1 , a step of detaching the carrier substrate from the at least one semiconductor chip claim 1 , wherein the contact side of the at least one semiconductor chip is uncovered claim 1 , and/or a step of forming a wiring layer on a contact side of the at least one semiconductor chip.4. The method according to claim 1 , wherein the element is a wiring layer of the electrical circuit claim 1 , wherein claim 1 , in the applying step claim 1 , the galvanic layer arrangement is applied on a region of the wiring layer.5. The method according to claim 1 , wherein the element is the potting compound into which the at least one semiconductor chip is encapsulated claim 1 , wherein claim 1 , in the applying step claim 1 , the galvanic layer arrangement is applied on a region of the potting compound.6. The method according ...

PROCESS FOR COATING FINE PARTICLES WITH CONDUCTIVE POLYMERS

A process for coating fine particles, in which the feed mixture contains: a monomer and/or an oligomer of aromatic compounds or unsaturated hydrocarbon compounds suitable for forming an electroconductive oligomer, polymer, copolymer, block copolymer or graft copolymer; at least one type of anions which (1) are and/or can be incorporated as doping ions into the structure of the conductive polymer; (2) can be discharged from said structure in the event of a potential fall of the conductive polymer (reduction); and (3) can have an anti-corrosive effect in the presence of a metallic surface; at least one type of particles; if necessary, at least one oxidising agent and water and/or at least another solvent. A coating is formed from the feed mixture on the particle surface, the feed mixture being converted by oxidation into a conductive polymer in the presence of at least one type a of mobile anti-corrosive anion. 159-. (canceled)60. Coated particles comprising:an inorganic or organic particle coated with a conductive polymer,wherein the particles are prepared by a process comprising coating the inorganic or organic particles, wherein the inorganic or organic particles are present in an educt mixture or are initially formed in the educt mixture,wherein the educt mixture is at least one of a dispersion, a flowable a kneadable mass, a sol or a gel, wherein the educt mixture comprises:at least one of a monomer or an oligomer which is an educt of a conductive polymer, wherein the monomer or oligomer imsubstituted or substituted compounds based on pyrrol, thiophene or thiophenol;at least one anion, optionally at least one salt, one ester or at least one acid as a carrier of the anion; wherein the at least one anion can be incorporated or is incorporated into the structure of the conductive polymer as a doping ion, and wherein the anion can also be released from this conductive polymer in the event of a drop in a potential of the conductive polymers, and have a corrosion- ...

METHOD FOR MANUFACTURING A MICROMECHANICAL STRUCTURE, AND MICROMECHANICAL STRUCTURE

A method for manufacturing a micromechanical structure includes: forming a first insulation layer above a substrate; forming a first micromechanical functional layer on the first insulation layer; forming multiple first trenches in the first micromechanical functional layer, which trenches extend as far as the first insulation layer; forming a second insulation layer on the first micromechanical functional layer, which second insulation layer fills up the first trenches; forming etch accesses in the second insulation layer, which etch accesses locally expose the first micromechanical functional layer; and etching the first micromechanical functional layer through the etch accesses, the filled first trenches and the first insulation layer acting as an etch stop. 1. A method for manufacturing a micromechanical structure , comprising:forming a first insulation layer above a substrate;forming a first micromechanical functional layer on the first insulation layer;forming a plurality of first trenches in the first micromechanical functional layer, wherein the first trenches extend as far as the first insulation layer;forming a second insulation layer on the first micromechanical functional layer, wherein the second insulation layer fills up the first trenches;forming a plurality of first etch accesses in the second insulation layer, wherein the first etch accesses locally expose the first micromechanical functional layer; andetching the first micromechanical functional layer through the etch accesses, wherein the filled first trenches and the first insulation layer act as an etch stop.2. The method as recited in claim 1 , further comprising:forming a third insulation layer on the second insulation layer after the etching, wherein the third insulation layer closes off the etching accesses.3. The method as recited in claim 2 , further comprising:forming a second micromechanical functional layer above the third insulation layer;forming a plurality of second etch accesses in ...

Component Having a Via and Method for Manufacturing It

An advantageous method and system for realizing electrically very reliable and mechanically extremely stable vias for components whose functionality is realized in a layer construction on a conductive substrate. The via (Vertical Interconnect Access), which is led to the back side of the component and which is used for the electrical contacting of functional elements realized in the layer construction, includes a connection area in the substrate that extends over the entire thickness of the substrate and is electrically insulated from the adjoining substrate by a trench-like insulating frame likewise extending over the entire substrate thickness. According to the present system, the trench-like insulating frame is filled up with an electrically insulating polymer. 114-. (canceled)15. A component , whose functionality is realized in a layer construction on a conductive substrate , comprising:a component arrangement having at least one via (Vertical Interconnect Access), led to a back side of the component arrangement, for electrically contacting functional elements realized in the layer construction,wherein the at least one via includes a connection area in the substrate that extends over the entire thickness of the substrate, and is electrically insulated from the adjoining substrate by a trench-like insulating frame likewise extending over the entire substrate thickness, andwherein the trench-like insulating frame is filled up with an electrically insulating polymer.16. A component , comprising:functional elements, which are realized in a layer construction on a substrate;a conductive cap substrate on the layer construction; andat least one via (Vertical Interconnect Access), led through the cap substrate, for electrically contacting the functional elements, the via including a connection area that extends over the entire thickness of the cap substrate up to a connecting conductor track in the layer construction on the substrate, and being electrically insulated ...

METHOD FOR BONDING TWO SILICON SUBSTRATES, AND A CORRESPONDEING SYSTEM OF TWO SILICON SUBSTRATES

A method for bonding two silicon substrates and a corresponding system of two silicon substrates. The method includes: providing first and second silicon substrates; depositing a first bonding layer of pure aluminum or of aluminum-copper having a copper component between 0.1 and 5% on a first bonding surface of the first silicon substrate; depositing a second bonding layer of germanium above the first bonding surface or above a second bonding surface of the second silicon substrate; subsequently joining the first and second silicon substrates, so that the first and the second bonding surfaces lie opposite each other; and implementing a thermal treatment step to form an eutectic bonding layer of aluminum-germanium or containing aluminum-germanium as the main component, between the first silicon substrate and the second silicon substrate, spikes which contain aluminum as a minimum and extend into the first silicon substrate, forming at least on the first bonding surface. 1. A method for bonding two silicon substrates , the method comprising:providing a first silicon substrate and a second silicon substrate;depositing a first bonding layer of pure aluminum or of aluminum-copper having a copper component between 0.1% and 5% on a first bonding surface of the first silicon substrate;depositing a second bonding layer of germanium above the first bonding surface or above a second bonding surface of the second silicon substrate;subsequently bonding the first silicon substrate and the second silicon substrate, so that the first bonding surface and the second bonding surface lie opposite each other; andimplementing a thermal treatment step to form a eutectic bonding layer of aluminum-germanium or containing aluminum-germanium as main component, between the first silicon substrate and the second silicon substrate, spikes, which contain aluminum as a minimum and extend into the first silicon substrate, forming at least on the first bonding surface.2. The method of claim 1 , ...

METHOD FOR COATING METALLIC SURFACES WITH A COATING AGENT CONTAINING A POLYMER, THE COATING AGENT, AND USE THEREOF

The invention relates to a method for coating metallic surfaces with an aqueous composition as a solution or as a dispersion, wherein the composition contains a) at least one phosphate, b) at least 0.1 g/L of at least one titanium and/or zirconium compound, c) at least one complexing agent, d) cations of aluminum, chromium(III), and/or zinc and/or at least one compound containing aluminum, chromium(III), and/or zinc, and e) 1 to 500 g/L of at least one acid-tolerant cationic or nonionic organic polymer/copolymer, relative to the content of the solids and active substances in these additives. 121.-. (canceled)22. A method for coating a metallic surface comprising the steps of:applying to a metallic surface an aqueous composition having a pH in the range of 1 to 4, wherein the aqueous composition comprises:{'sub': '4', 'at least 1 g/L phosphate, calculated as PO,'}b) at least 0.1 g/L of at least one member selected from the group consisting of a titanium compound and a zirconium compound, calculated as Ti metal,c) at least 0.1 g/L of at least one complexing agent,d) at least 0.5 g/L of a member selected from the group consisting of an aluminum cation, a chromium(III) cation, a zinc cation, an aluminum compound, a chromium(III) compound and a zinc compound; ande) 1 to 500 g/L of a cationic polyurethane-rich dispersion, having a content of polycarbonate and/or an acid-tolerant dispersion based on acrylate and/or styrene which is/are present in stable form in the aqueous composition, or of at least one dispersion of acid-tolerant cationic or nonionic organic polymer/copolymer composed of acid-tolerant cationic copolymer based on cationic polyurethane and/or based on polyester-polyurethane, polyester-polyurethane-poly(meth)acrylate, polycarbonate-polyurethane, or polycarbonate-polyurethane-poly(meth)acrylate, relative to the content of solids and active substances in the additives to organic polymer/copolymer,in which no precipitation occurs in the aqueous composition ...

COMPONENT HAVING A THROUGH-CONNECTION

A method for manufacturing a component having a through-connection. The method includes providing a semiconductor substrate, forming a recess in the semiconductor substrate, and introducing into the recess a pourable starting material which has a metal. The method furthermore includes carrying out a heating process, an electrically conductive structure forming the through-connection being developed from the pourable starting material. 1. A method for manufacturing a component having a through-connection , comprising:providing a semiconductor substrate;forming a recess in the semiconductor substrate;introducing into the recess a pourable starting material which has a metal; andcarrying out a heating process, an electrically conductive structure forming the through-connection being developed from the pourable starting material.2. The method as recited in claim 1 , wherein the semiconductor substrate is a silicon substrate.3. The method as recited in claim 1 , wherein the pourable starting material has metal particles.4. The method as recited in claim 1 , wherein the pourable starting material is an ink or a paste.5. The method as recited in claim 1 , wherein the introducing the pourable starting material into the recess is carried out with the aid of a printing process.6. The method as recited in claim 6 , wherein an insulating layer is formed in the recess.7. The method as recited in claim 1 , further comprising:providing a non-adhesive layer on the semiconductor substrate before the pourable starting material is introduced into the recess.8. The method as recited in claim 1 , wherein the recess into which the pourable starting material is introduced is formed as a through hole in the semiconductor substrate.9. The method as recited in claim 1 , wherein the recess into which the pourable starting material is introduced is formed as a blind hole in the semiconductor substrate and claim 1 , after carrying out the heating process claim 1 , a thinning of the ...

METHOD FOR MANUFACTURING A HYBRID INTEGRATED COMPONENT

A manufacturing method for hybrid integrated components having a very high degree of miniaturization is provided, which hybrid integrated components each have at least two MEMS elements each having at least one assigned ASIC element. Two MEMS/ASIC wafer stacks are initially created independently of one another in that two ASIC substrates are processed independently of one another; a semiconductor substrate is mounted on the processed surface of each of the two ASIC substrates, and a micromechanical structure is subsequently created in each of the two semiconductor substrates. The two MEMS/ASIC wafer stacks are mounted on top of each other, MEMS on MEMS. Only subsequently are the components separated. 1. A method for manufacturing hybrid integrated components each having at least two MEMS elements , at least one ASIC element being assigned to each MEMS element , the method comprising: processing two ASIC substrates independently of one another;', 'mounting a semiconductor substrate on the processed surface of each of the two ASIC substrates; and', 'subsequently creating a micromechanical structure in each of the two semiconductor substrates;, 'initially creating two MEMS/ASIC wafer stacks independently of one another, by performing the followingmounting the two MEMS/ASIC wafer stacks on top of each other, MEMS on MEMS; andsubsequently separating the components.2. The method as recited in claim 1 , wherein the processed surface of at least one of the two ASIC substrates is structured by at least one of (i) creating at least one recess in an area beneath the micromechanical structure of the MEMS element to be created claim 1 , and (ii) creating a pedestal structure for mounting an assigned MEMS substrate.3. The method as recited in claim 2 , wherein at least one of the two MEMS substrates is bonded to the assigned ASIC substrate.4. The method as recited in claim 2 , wherein at least one of the two MEMS substrates is thinned down to a predefined structural height of the ...

HYBRID INTEGRATED COMPONENT AND METHOD FOR THE MANUFACTURE THEREOF

A component system includes at least one MEMS element, a cap for a micromechanical structure of the MEMS element, and at least one ASIC substrate. The micromechanical structure of the MEMS element is implemented in the functional layer of an SOI wafer. The MEMS element is mounted face down, with the structured functional layer on the ASIC substrate, and the cap is implemented in the substrate of the SOI wafer. The ASIC substrate includes a starting substrate provided with a layered structure on both sides. At least one circuit level is implemented in each case both in the MEMS-side layered structure and in the rear-side layered structure of the ASIC substrate. In the ASIC substrate, at least one ASIC through contact is implemented which electrically contacts at least one circuit level of the rear-side layered structure and/or at least one circuit level of the MEMS-side layered structure. 1. A component , comprising:at least one MEMS element having a micromechanical structure;a cap for the micromechanical structure of the MEMS element; andat least one ASIC substrate; the micromechanical structure of the MEMS element is implemented in a functional layer of an SOI wafer functioning as the MEMS substrate;', 'the MEMS element is mounted face down, with the structured functional layer on the ASIC substrate;', 'the cap is implemented in the substrate of the SOI wafer;', 'the ASIC substrate includes a starting substrate, which is provided with a layered structure on both sides, at least one circuit level being implemented in each case both in the MEMS-side layered structure and also in the rear-side layered structure of ASIC substrate; and', 'in the ASIC substrate, at least one ASIC through contact is implemented which, originating from the rear side of the component, electrically contacts at least one of a circuit level of the rear-side layered structure and a circuit level of the MEMS-side layered structure., 'wherein2. The component as recited in claim 1 , wherein:a cap- ...

HYBRIDLY INTEGRATED COMPONENT AND METHOD FOR THE PRODUCTION THEREOF

A hybridly integrated component includes an ASIC element having a processed front side, a first MEMS element having a micromechanical structure extending over the entire thickness of the first MEMS substrate, and a first cap wafer mounted over the micromechanical structure of the first MEMS element. At least one structural element of the micromechanical structure of the first MEMS element is deflectable, and the first MEMS element is mounted on the processed front side of the ASIC element such that a gap exists between the micromechanical structure and the ASIC element. A second MEMS element is mounted on the rear side of the ASIC element. The micromechanical structure of the second MEMS element extends over the entire thickness of the second MEMS substrate and includes at least one deflectable structural element. 1. A hybridly integrated component , comprising:an ASIC element having a processed front side;a first MEMS element having a first substrate and a first micromechanical structure extending over the entire thickness of the first substrate, wherein at least one structural element of the first micromechanical structure is deflectable, and wherein the first MEMS element is mounted on the processed front side of the ASIC element such that a gap exists between the first micromechanical structure and the ASIC element;a first cap wafer mounted over the first micromechanical structure of the first MEMS element;a second MEMS element mounted on a rear side of the ASIC element, the second MEMS element having a second substrate and a second micromechanical structure extending over the entire thickness of the second substrate, wherein the second MEMS element includes at least one deflectable structural element, and wherein a gap exists between the second micromechanical structure and the ASIC element; anda second cap wafer mounted over the second micromechanical structure of the second MEMS element.2. The component as recited in claim 1 , wherein in the ASIC element ...

HYBRID INTEGRATED COMPONENT AND METHOD FOR THE MANUFACTURE THEREOF

A hybrid integrated component includes: at least one ASIC element having integrated circuit elements and a back-end stack; an MEMS element having a micromechanical structure, which extends over the entire thickness of the MEMS substrate; and a cap wafer. The hybrid integrated component is provided with an additional micromechanical function. The MEMS element is mounted on the ASIC element, so that a gap exists between the micromechanical structure and the back-end stack of the ASIC element. The cap wafer is mounted above the micromechanical structure of the MEMS element. A pressure-sensitive diaphragm structure having at least one deflectable electrode of a capacitor system is implemented in the back-end stack of the ASIC element, which diaphragm structure spans a pressure connection in the rear side of the ASIC element. 1. A hybrid integrated component , comprising:an ASIC element having integrated circuit elements and a back-end stack;an MEMS element having a substrate and a micromechanical structure which extends over the entire thickness of the substrate of the MEMS element; anda cap wafer;wherein the MEMS element is mounted on the ASIC element in such a way that a gap exists between the micromechanical structure and the back-end stack of the ASIC element, and the cap wafer is mounted above the micromechanical structure of the MEMS element, and wherein a pressure-sensitive diaphragm structure having at least one deflectable electrode of a capacitor system is implemented in the back-end stack of the ASIC element, and the diaphragm structure spans a pressure connection in the rear side of the ASIC element.2. The component as recited in claim 1 , wherein the diaphragm structure having the deflectable electrode is implemented in at least one metallization level of the back-end stack.3. The component as recited in claim 2 , wherein the diaphragm structure has a layered structure claim 2 , which includes multiple metallization levels and insulating layers.4. The ...

COMPONENT HAVING THROUGH-HOLE PLATING, AND METHOD FOR ITS PRODUCTION

A method for producing a component having a semiconductor substrate with through-hole plating is provided, the through-plating being surrounded by a recess, and the semiconductor substrate having a first layer on one side, which covers the recess on the first side. The semiconductor substrate has a second layer on a second side, which covers the recess on the second side, and the through-hole plating is surrounded by a ring structure which is produced from the semiconductor substrate. The recess surrounding the ring structure is produced in the same process step or at the same time as the recess for the through-hole plating. 1. A component , comprising:a semiconductor substrate including a through-hole plating, wherein the through-hole plating is surrounded by a recess, and wherein the semiconductor substrate has a first layer on a first side, the first layer covering the recess on the first side, and wherein the semiconductor substrate has a second layer on a second side, the second layer covering the recess on the second side; anda circuit track provided on the first layer of the semiconductor substrate, the circuit track being connected to the through-hole plating;wherein the through-hole plating is surrounded by a ring structure produced from the semiconductor substrate.2. The component as recited in claim 1 , wherein the first layer at least partially has a layer in the form of a lattice structure at least one of (i) above the recess and (ii) in the region of the through-hole plating.3. The component as recited in claim 1 , wherein the first layer at least partially has a layer in the form of a lattice structure above the ring structure.4. The component as recited in claim 2 , wherein the through-hole plating is configured in the form of a sleeve.5. The component as recited in claim 4 , wherein the through-hole plating is filled with an insulation material.6. The component as recited in claim 4 , wherein the through-hole plating has a cylindrical cavity.7. The ...

HYBRID INTEGRATED PRESSURE SENSOR COMPONENT

A pressure sensor component includes a MEMS component having at least one pattern element that is able to be deflected perpendicular to the component plane, which is equipped with at least one electrode of a measuring capacitor device, and an ASIC component having integrated circuit elements and at least one back end stack, at least one counter-electrode of the measuring capacitor device being developed in a metallization plane of the back end stack. The MEMS component is mounted on the back end pile of the ASIC component. The MEMS component includes at least one pressure-sensitive diaphragm pattern and is mounted on the ASIC component in such a way that the pressure-sensitive diaphragm pattern spans a cavity between the MEMS component and the back end stack of the ASIC component. 1. A hybrid integrated pressure sensor component , comprising:a MEMS component having at least one pattern element that is deflectable perpendicular to a component plane and equipped with at least one electrode of a measuring capacitor device; and the MEMS component is mounted on the back end stack of the ASIC component,', 'the MEMS component includes at least one pressure-sensitive diaphragm pattern,', 'the MEMS component is mounted on the ASIC component in such a way that the pressure-sensitive diaphragm pattern spans a cavity between the MEMS component and the back end stack of the ASIC component,', 'the pressure-sensitive diaphragm pattern includes a diaphragm element and at least one electrode carrier,', 'the diaphragm element closes the cavity on an MEMS side, and', 'the at least one electrode carrier is situated within the cavity and is connected mechanically to the diaphragm element in such a way that a pressure-conditioned deformation of the diaphragm element effects a deflection of the at least one electrode carrier essentially perpendicular to a diaphragm plane, but no deformation of the at least one electrode carrier itself, 'an ASIC component having integrated circuit elements ...

MAGNETICALLY DRIVABLE MICROMIRROR

A magnetically drivable micromirror having an outer frame, a coil former, and torsion springs, situated in a first plane, the torsion springs having an axis of rotation, and the coil former being connected to the outer frame by the torsion springs so as to be capable of rotational motion about the axis of rotation, having a mirror element that is situated in a second plane parallel to the first plane, the mirror element being connected to the coil former by an intermediate layer. A 2D scanner having a first magnetically drivable micromirror and a second drivable mirror, and to a method for producing a micromirror are also described. 18-. (canceled)9. A magnetically drivable micromirror , comprising:an outer frame;torsion springs situated in a first plane and having an axis of rotation;a coil former connected to the outer frame by the torsion springs so as to be capable of rotational motion about the axis of rotation; anda mirror element situated in a second plane parallel to the first plane, the mirror element connected to the coil former by an intermediate layer.10. The magnetically drivable micromirror as recited in claim 9 , wherein the outer frame has a reinforcement that is situated in the second plane and is connected to the outer frame by the intermediate layer.11. The magnetically drivable micromirror as recited in claim 9 , further comprising:at least one stop situated in the second plane and connected to the outer frame by the intermediate layer, the stop limiting a deflection of at least one of: i) the coil former, and ii) the torsion springs.12. The magnetically drivable micromirror as recited in claim 9 , wherein the coil former has a first coil and a second coil that are situated in the first plane claim 9 , the axis of rotation being situated between the first coil and the second coil.13. The magnetically drivable micromirror as recited in claim 12 , wherein the mirror element is capable of being tilted about the axis of rotation through supply of ...

MICROMECHANICAL COMPONENT

A micromechanical component includes a first space in which a first sensor is situated and a second space in which a second sensor is situated, different pressures prevailing in the first and second spaces, one of the two spaces extending via a third space to a first lattice structure which is situated in an edge region of the component and is essentially hermetically sealed. 1. A micromechanical component , comprising:a first space in which a first sensor is situated and a second space in which a second sensor is situated, pressures prevailing in each of the first and second spaces being different,wherein one of the two spaces extends via a third space to a lattice structure situated in an edge region of the component that is essentially hermetically sealed.2. The micromechanical component according to claim 1 , further comprising:a sealing layer on an upper surface of the component adapted to at least partially seal the lattice structure and the component.3. The micromechanical component according to claim 2 , wherein the sealing layer is deposited with the aid of different deposition processes.4. The micromechanical component according to claim 1 , further comprising:a connecting region between the one of the two spaces and the third space, the connecting region including a constriction.5. The micromechanical component according to claim 4 , wherein the constriction is formed with the aid of bonding materials of a sensor wafer and a cap wafer of the component.6. The micromechanical component according to claim 4 , wherein the connecting region is an essentially lateral lattice structure and/or a channel structure.7. The micromechanical component according to claim 2 , further comprising:a passivation layer situated on at least a portion of an upper surface of the sealing layer.8. The micromechanical component according to claim 1 , further comprising:an electrically conducting connection formed to at least one of the sensors, the electrically conducting ...

HYBRID INTEGRATED COMPONENT

A component has at least one MEMS element and at least one cap made of a semiconductor material. The cap, in addition to its mechanical function as a terminus of a cavity and protection of the micromechanical structure, is provided with an electrical functionality. The micromechanical structure of the MEMS element of the component is situated in a cavity between a carrier and the cap, and includes at least one structural element which is deflectable out of the component plane within the cavity. The cap includes at least one section extending over the entire thickness of the cap, which is electrically insulated from the adjoining semiconductor material in such a way that it may be electrically contacted independently from the remaining sections of the cap. 1. A component , comprising:at least one MEMS element; andat least one cap made of a semiconductor material;wherein the micromechanical structure of the at least one MEMS element is situated in a cavity between a carrier and the at least one cap, and wherein the micromechanical structure includes at least one deflectable structural element which is deflectable out of a component plane within the cavity, and wherein the at least one cap includes at least one section which (i) extends over the entire thickness of the cap, and (ii) is electrically insulated from the adjoining semiconductor material in such a way that the at least one section is electrically contacted independently of remaining sections of the at least one cap.2. The component as recited in claim 1 , wherein the electrical insulation between individual sections of the cap and the adjoining semiconductor material is implemented in the form of trench structures in the semiconductor material claim 1 , and wherein the trench structures extend over the entire thickness of the cap and are at least partially filled with an electrically insulating material.3. The component as recited in claim 1 , wherein the surface of the cap facing toward the cavity is ...

Methods for treating or preventing asthma by administering an il-4r antagonist

Methods for treating or preventing asthma (e.g., allergic asthma, asthma associated with allergic bronchopulmonary aspergillosis (ABPA), moderate-to-severe asthma, persistent asthma or the like) and associated conditions (e.g., ABPA, ABPA comorbid with asthma, ABPA comorbid with cystic fibrosis (CF), ABPA comorbid with asthma and CF) in a subject are provided. Methods comprising administering to a subject in need thereof a therapeutic composition comprising an interleukin-4 receptor (IL-4R) antagonist, such as an anti-IL-4R antibody or antigen-binding fragment thereof, are provided.

METHOD FOR COATING METAL SURFACES USING AN AQUEOUS COMPOUND HAVING POLYMERS, THE AQUEOUS COMPOUND, AND USE OF THE COATED SUBSTRATES

The invention concerns a process for coating a metallic surface with an aqueous composition, wherein in addition to water the composition contains 140.-. (canceled)41. Coated substrate with at least one metallic surface , wherein a coating is on the metallic surface , wherein the coating is prepared by a process comprising the steps of coating a metallic surface with an aqueous composition to form a coated metal part , wherein the aqueous composition comprises:an organic film former comprising at least one synthetic resin, wherein 70 to 100 wt % of the content of synthetic resin in the organic film former comprises from at least 30 to 150 g/L of comprising at least one water-soluble or water-dispersible synthetic resin in a content in the range of from 30 to 150 g/L selected from the group consisting of a polymer, copolymer, block polymer and graft polymer; wherein the water soluble or water-dispersible synthetic resin is based on a member a synthetic resin selected from the group consisting of polycarbonate, polyurethane, ionomer, poly(meth)acrylate, polyester, polyether or polystyrene, wherein the content of polycarbonate and polyurethane is being at least 10 wt. % each and the content of polycarbonate and polyurethane together in the organic film former being at least 50 wt. % 50 wt. %;at least one 4 to 16 carbon long-chain alcohol as film-forming aid for the organic film former selected from the group consisting of a butanediol, an ethylene glycol ether and a polypropylene glycol ether;at least one inorganic crosslinker based on a member selected from the group consisting of titanium, hafnium and zirconium;from 2 to 30 g/L of a wax, wherein the wax comprises a cationically stabilized oxidized polyethylene wax with a melting point of about 130° C., and an anionically stabilized paraffin wax with a melting point in the range from 56 to 80° C.;A) at least one silane, silanol or siloxane or B) at least one inorganic compound in particle form with an average particle ...

Micromechanical component for a capacitive sensor device, and manufacturing method for a micromechanical component for a capacitive sensor device

A micromechanical component for a capacitive sensor device includes first and second electrodes. The first electrode is at least partially formed from a first semiconductor layer and/or metal layer, and at least one inner side of the second electrode facing the first electrode is formed from a second semiconductor layer and/or metal layer. A cavity is between the first and second electrodes. Continuous recesses are structured into the inner side of the second electrode and sealed off with a closure layer. At least one reinforcing layer of the second electrode and at least one contact element which is electrically connected to the first electrode, to the layer of the second electrode which forms the inner side, to at least one printed conductor, and/or to a conductive substrate area, are formed from at least one epi-polysilicon layer. Also described is a micromechanical component manufacturing method for a capacitive sensor device. 1. A micromechanical component for a capacitive sensor device , comprising:a first electrode; anda second electrode, the first electrode being at least partially formed from a first semiconductor layer and/or metal layer, and at least one inner side of a layer of the second electrode facing the first electrode being formed from a second semiconductor layer and/or metal layer;wherein the second electrode is suspended at a distance from the first electrode so that a cavity is present between the first electrode and the second electrode, and continuous recesses are structured into the layer of the second electrode which forms the inner side, and being sealed off with the aid of a closure layer,wherein at least one reinforcing layer of the second electrode and at least one contact element which is electrically connected to the first electrode, to the layer of the second electrode which forms the inner side, to a first printed conductor composed of the first semiconductor layer and/or metal layer, to a second printed conductor composed of the ...

PRODUCTION METHOD FOR A MICROMECHANICAL COMPONENT

A production method for a micromechanical component for a sensor or microphone device. The method includes: patterning a plurality of first trenches through a substrate surface of a monocrystalline substrate made of at least one semiconductor material using anisotropic etching, covering the lateral walls of the plurality of first trenches with a passivation layer, while bottom areas of the plurality of first trenches are kept free or are freed of the passivation layer, etching at least one first cavity, into which the plurality of first trenches opens, into the monocrystalline substrate using an isotropic etching method, in which an etching medium of the isotropic etching method is conducted through the plurality of first trenches, and by covering the plurality of first trenches by epitaxially growing a monocrystalline sealing layer on the substrate surface of the monocrystalline substrate made of the at least one identical semiconductor material as the monocrystalline substrate. 1. A production method for a micromechanical component for a sensor or microphone device , comprising the following steps:patterning a plurality of first trenches through a substrate surface of a monocrystalline substrate, made of at least one semiconductor material, using an anisotropic etching method;covering lateral walls of the plurality of first trenches with a passivation layer, while bottom areas of the plurality of first trenches are kept free or are freed of the passivation layer;etching at least one first cavity, into which the plurality of first trenches opens, into the monocrystalline substrate using an isotropic etching method, in which an etching medium of the isotropic etching method is conducted through the plurality of first trenches; andcovering the plurality of first trenches by epitaxially growing a monocrystalline sealing layer on the substrate surface of the monocrystalline substrate made of at least one identical semiconductor material as the monocrystalline substrate ...

SENSOR DEVICE AND METHOD FOR PRODUCING A SENSOR DEVICE

A sensor device. The sensor device includes: a substrate; an electrical insulation layer on the substrate; an edge structure disposed on the electrical insulation layer and that delimits an internal region above the substrate; a membrane anchored on the edge structure and at least partly spanning the internal region, the membrane encompassing in the internal region a region movable by a pressure; a first intermediate carrier that extends in the movable region below the membrane and is electrically and mechanically connected to the membrane by contact points, and encompasses at least one spacing element that extends from the intermediate carrier toward the substrate; and a first counter electrode on the electrical insulation layer, the first counter electrode extending under the intermediate carrier, and a first distance between the intermediate carrier and the first counter electrode being modifiable by the pressure on the movable region. 116-. (canceled)17. A sensor device , comprising:a substrate;at least one electrical insulation layer on the substrate;an edge structure that is disposed on the at least one electrical insulation layer and delimits an internal region above the substrate;a membrane that is anchored on the edge structure and at least partly spans the internal region, the membrane encompassing, in the internal region, a region movable by a pressure;a first intermediate carrier that extends in the movable region below the membrane and is electrically and mechanically connected to the membrane by contact points, the membrane being able to be stiffened by the first intermediate carrier, and the first intermediate carrier representing a movable electrode, and encompasses at least one spacing element that extends from the intermediate carrier toward the substrate; anda first counter electrode on the at least one electrical insulation layer, the first counter electrode extending under the intermediate carrier, and a first distance between the intermediate ...

COMPONENT HAVING A VIA AND METHOD FOR MANUFACTURING IT

An advantageous method and system for realizing electrically very reliable and mechanically extremely stable vias for components whose functionality is realized in a layer construction on a conductive substrate. The via (Vertical Interconnect Access), which is led to the back side of the component and which is used for the electrical contacting of functional elements realized in the layer construction, includes a connection area in the substrate that extends over the entire thickness of the substrate and is electrically insulated from the adjoining substrate by a trench-like insulating frame likewise extending over the entire substrate thickness. According to the present system, the trench-like insulating frame is filled up with an electrically insulating polymer. 114-. (canceled)15. A component , whose functionality is realized in a layer construction on a conductive substrate , comprising:a component arrangement having at least one via (Vertical Interconnect Access), led to a back side of the component arrangement, for electrically contacting functional elements realized in the layer construction,wherein the at least one via includes a connection area in the substrate that extends over the entire thickness of the substrate, and is electrically insulated from the adjoining substrate by a trench-like insulating frame likewise extending over the entire substrate thickness, andwherein the trench-like insulating frame is filled up with an electrically insulating polymer.16. A component , comprising:functional elements, which are realized in a layer construction on a substrate;a conductive cap substrate on the layer construction; andat least one via (Vertical Interconnect Access), led through the cap substrate, for electrically contacting the functional elements, the via including a connection area that extends over the entire thickness of the cap substrate up to a connecting conductor track in the layer construction on the substrate, and being electrically insulated ...

dispersion for the metallization of contactings

A dispersion is provided having a dispersion medium and a plurality of colloid particles finely distributed in the dispersion medium, the colloid particles being electrically conductive, the dispersion being a functional ink for the wetting of an inner wall of a contacting opening of a substrate using a print process. 1. A dispersion , comprising:a dispersion medium; andcolloid particles dispersed in the dispersion medium;wherein the colloid particles are electrically conductive, andwherein the dispersion is a functional ink for wetting an inner wall of a contacting opening of a substrate using a printing process.2. The dispersion of claim 1 , wherein a particle size distribution of the colloid particles in the dispersion medium is a bimodal or multimodal particle size distribution.3. The dispersion of claim 2 , wherein the particle size distribution has a first maximum at a first particle size of the colloid particles claim 2 , the first particle size being between 1 nm and 100 nm.4. The dispersion of claim 2 , wherein the particle size distribution has a second maximum at a second particle size of the colloid particles claim 2 , the second particle size being between 200 nm and 400 nm.5. The dispersion of claim 1 , wherein the colloid particles have a silver material claim 1 , gold material claim 1 , or copper material.6. The dispersion of claim 1 , wherein the dispersion has a viscosity between 1 millipascal-second (mPas) and 100 mPas.7. A component claim 1 , comprising:a substrate having an electrically conductive contact having an electrically conductive layer; a dispersion medium; and', 'colloid particles dispersed in the dispersion medium;', 'wherein the colloid particles are electrically conductive, and', 'wherein the dispersion is a functional ink for wetting an inner wall of a contacting opening of a substrate using a printing process., 'wherein the electrically conductive layer includes a sintered dispersion, including8. The component of claim 7 , wherein ...

BONDING PAD LAYER SYSTEM, GAS SENSOR AND METHOD FOR MANUFACTURING A GAS SENSOR

A bonding pad layer system is deposited on a semiconductor chip as a base, for example, a micromechanical semiconductor chip, in which at least one self-supporting dielectric membrane made up of dielectric layers, a platinum conductor track and a heater made of platinum is integrated. In the process, the deposition of a tantalum layer takes place first, upon that the deposition of a first platinum layer, upon that the deposition of a tantalum nitride layer, upon that the deposition of a second platinum layer and upon that the deposition of a gold layer, at least one bonding pad for connecting with a bonding wire being formed in the gold layer. The bonding pad is situated in the area of the contact hole on the semiconductor chip, in which a platinum conductor track leading to the heater is connected using a ring contact and/or is connected outside this area. 113-. (canceled)14. A bonding pad layer system , comprising:a semiconductor chip as a base, upon which a tantalum layer, a first platinum layer, a tantalum nitride layer, a second platinum layer, and a gold layer, are sequentially deposited, at least one bonding pad being formed in the gold layer for connecting to a bonding wire.15. The bonding pad layer system as recited in claim 14 ,wherein the semiconductor chip is a micromechanical semiconductor chip, in which at least one self-supporting dielectric membrane including dielectric layers, a platinum conductor track and a heater made of platinum is integrated.16. The bonding pad layer system as recited in claim 15 ,wherein at least one of the at least one bonding pad is situated in an area of a contact hole on the semiconductor chip, in which a platinum conductor track leading to the heater is electrically connected with using a ring contact.17. The bonding pad layer system as recited in claim 14 ,wherein at least one of the at least one bonding pad is situated in an area outside the contact hole on the semiconductor chip.18. A bonding pad layer system as ...

METHOD FOR THE MICRO-STRUCTURED APPLICATION OF A FLUID OR PASTE ONTO A SURFACE

A method for the micro-structured application of a fluid or paste onto a surface, including providing a substrate having a surface, coating the surface with a non-stick layer, at least partially removing the non-stick layer and producing a coating area, and applying at least one fluid droplet or paste droplet onto the surface in the coating area. 1. A method for the micro-structured application of a fluid or paste onto a surface , comprising:(A) providing a substrate having a surface;(B) coating the surface with a non-stick layer;(C) at least partially removing the non-stick layer and producing a coating area;(D) applying at least one fluid droplet or paste droplet onto the surface in the coating area.2. The method as recited in claim 1 , wherein the removal of the non-stick layer is carried out in step (C) with the aid of laser radiation.3. The method as recited in claim 1 , wherein following step (D) claim 1 , a solvent is expelled from the paste droplet or the ink droplet in a step (E).4. The method as recited in claim 3 , wherein the non-stick layer is removed after step (E) in a step (F). The present application claims the benefit under 35 U.S.C. §119 of German Patent Application No. DE 102015224992.1 file on Dec. 11, 2015, which is expressly incorporated herein by reference in its entirety.The present invention relates to a method for the micro-structured application of a fluid or paste onto a surface.Various methods that make it possible to deposit material on a surface in a defined manner are commercially available. Among them, for example, are methods such as time-pressure dispensing, the ink-jet method or the aerosol-jet method. In these methods, material in the form of pastes or inks is deposited onto a surface. The methods essentially differ by whether the paste/ink is pressed out of a hollow needle and the droplet is then deposited on a surface by contact with this surface (time-pressure dispensing) or whether a paste-ink droplet is “shot” through a ...

MICROMECHANICAL PRESSURE SENSOR DEVICE AND CORRESPONDING MANUFACTURING METHOD

A micromechanical pressure sensor device and a corresponding manufacturing method. The micromechanical pressure sensor device is equipped with a sensor substrate; a diaphragm system that is anchored in the sensor substrate and that includes a first diaphragm and a second diaphragm situated spaced apart therefrom, which are circumferentially connected to one another in an edge area and enclose a reference pressure in an interior space formed in between; and a plate-shaped electrode that is suspended in the interior space and that is situated spaced apart from the first diaphragm and from the second diaphragm and forms a first capacitor with the first diaphragm and forms a second capacitor with the second diaphragm. The first diaphragm and the second diaphragm are designed in such a way that they are deformable toward one another when acted on by an external pressure. 115-. (canceled)16. A micromechanical pressure sensor device. comprising:a sensor substrate;a diaphragm system that is anchored in the sensor substrate and that includes a first diaphragm and a second diaphragm situated spaced apart therefrom, which are circumferentially connected to one another in an edge area, and enclose a reference pressure in an interior space formed in between the first and second diaphragm; anda plate-shaped central electrode that is suspended in the interior space and that is situated spaced apart from the first diaphragm and from the second diaphragm and that forms a first capacitor with the first diaphragm and forms a second capacitor with the second diaphragm;wherein the first diaphragm and the second diaphragm are configured in such a way that they are deformable toward one another when acted on by an external pressure.17. The micromechanical pressure sensor device as recited in claim 16 , wherein the diaphragm system is situated in a cantilever manner claim 16 , and is anchored in the sensor substrate across at least one extension area that extends laterally away from the ...

MICROMECHANICAL COMPONENT FOR A SENSOR DEVICE OR MICROPHONE DEVICE

A micromechanical component for a sensor device or microphone device. The component includes a diaphragm support structure with a diaphragm, a cavity formed in the diaphragm support structure and adjoined by a diaphragm inner side, and a separating trench structured through the surface of the diaphragm support structure and extends to the cavity and completely frames the diaphragm, and that is sealed off media-tight and/or air-tight using at least one separating trench closure material. An etching channel is formed in the diaphragm support structure, separately from the separating trench, and extends from its first etching channel end section to its second etching channel end section. The first etching channel end section opens into the cavity, and the second etching channel end section is sealed off media-tight and/or air-tight using at least one etching channel closure structure formed on an outer partial surface of the surface of the diaphragm support structure. 110-. (canceled)11. A micromechanical component for a sensor device or microphone device , comprising:a diaphragm support structure with a diaphragm formed at a surface of the diaphragm support structure and includes a diaphragm inner side directed away from the surface of the diaphragm support structure;a cavity formed in the diaphragm support structure and adjoined by the diaphragm inner side;a separating trench that is structured through the surface of the diaphragm support structure and that extends to the cavity and completely frames the diaphragm, and that is at least partially framed by an outer partial surface of the surface of the diaphragm support structure, and that is sealed off media-tight and/or air-tight using at least one separating trench closure material; andat least one etching channel that is formed in the diaphragm support structure separately from the separating trench, and that each extends from a first etching channel end section of the etching channel to a second etching channel ...

MICROMECHANICAL COMPONENT FOR A CAPACITIVE PRESSURE SENSOR DEVICE

A micromechanical component for a capacitive pressure sensor device includes a substrate; a frame structure that frames a partial surface; a membrane that is tensioned by the frame structure such that a self-supporting region of the membrane extends over the framed partial surface and an internal volume with a reference pressure therein is sealed in an airtight fashion, the self-supporting region of the membrane being deformable by a physical pressure on an external side of the self-supporting region that not equal to the reference pressure; a measurement electrode situated on the framed partial surface; and a reference measurement electrode that is situated on the framed partial surface and is electrically insulated from the measurement electrode. 1. A micromechanical component for a capacitive pressure sensor device , the micromechanical component comprising:a substrate;a frame structure that frames a partial surface of the substrate and/or at least one intermediate layer on the substrate;a membrane that is tensioned by the frame structure in such a way that a self-supporting region of the membrane extends over the framed partial surface;a measurement electrode that is situated on the framed partial surface; anda reference measurement electrode that is situated on the framed partial surface and is electrically insulated from the measurement electrode; an internal volume enclosed by the frame structure and the membrane is air-tightly sealed with a reference pressure therein; and', 'the self-supporting region of the membrane is deformable by a physical pressure that is applied on an external side of the self-supporting region, oriented away from the internal volume, when the physical pressure is unequal to the reference pressure., 'wherein2. The micromechanical component of claim 1 , further comprising:a counter-electrode arranged in and/or on the self-supporting region; anda reference counter-electrode arranged in the self-supporting region and/or on the frame ...

ROLLER GROUPS FOR GRINDING DEVICES, GRINDING DEVICES, AND METHODS

Roller packages (IO) for grinding devices (), comprising a first roller (II), which is maintained by at least one first bearing body (), and a second roller (), which is maintained by at least one second bearing body (). The first bearing body () and the second bearing body () are prestressed against each other and comprise stop elements () with stop surfaces (), the contact of which counteracts a contact of the rollers (II, ). The rotational position of the first stop element () determines the minimum width of the grinding gap. Also disclosed are grinding devices (), methods for operating a roller group (IO) and methods for determining the radial force acting between the rollers (II, ) of a roller group (IO). 117-. (canceled)181070. A roll assembly () for a milling apparatus () comprising:{'b': 11', '13', '12', '14, 'a first roll (), which is held by at least one first bearing body (), and a second roll (), which is held by at least one second bearing body (),'}{'b': 13', '14', '11', '12, 'wherein the first bearing body () and the second bearing body () are adjustable relative to one another in such a way that a milling gap formed, between the first roll () and the second roll (), is adjustable,'}{'b': 13', '14', '16', '11', '12, 'claim-text': [{'b': 13', '17', '18', '14', '19', '20, 'the first bearing body () has at least one first abutment body () with a first abutment surface (), and the second bearing body () has at least one second abutment body () with a second abutment surface (),'}, {'b': 18', '20', '13', '14', '18', '20', '11', '12, 'the abutment surfaces (, ) are formed and are or can be arranged on the bearing bodies (, ) in such a way that a contact of the abutment surfaces (, ) counteracts a contact of the rolls (, ),'}, {'b': 17', '1', '18', '18', '17', '1', '17, 'the first abutment body () is rotatable about a first axis of rotation (A), and the first abutment surface () is formed by a circumferential surface () of the first abutment body () that is ...

DEVICE FOR TREATING AND/OR PROCESSING BULK MATERIAL

A stationary device, which is mounted on at least one hydraulic and/or pneumatic suspension element, for treating and/or processing bulk material in the bulk material processing industry. At least one suspension element is hydraulically and/or pneumatically regulated and/or controlled dependent on the position and/or speed and/or acceleration and/or weight, whereby at least one perpendicular positioning of the device can be adjusted. 1. A stationary device , mounted on at least one of an hydraulic and a pneumatic suspension element , for at least one of treating and processing bulk material in the bulk material processing industry ,wherein the at least one suspension element is at least one of regulated and controlled at least one of hydraulically and pneumatically in a manner selected from the group of position-dependent speed-dependent, acceleration-dependent and weight-dependent manner, with a result that at least one vertical positioning of the device is settable.2. The device as claimed in claim 1 , wherein the device is part of a machine for at least one of treating and processing bulk material in the bulk material processing industry claim 1 , and relative positioning of one machine part with respect to at least one further machine component is at least one of regulated and controlled at least one of hydraulically and pneumatically by the at least one suspension element.3. The device as claimed in claim 1 , wherein claim 1 , during operation claim 1 , the device is moved with a vibration which is generated at least one of hydraulically and pneumatically.4. The device as claimed in claim 1 , wherein the device comprises means for sensing at least one of a position claim 1 , speed and acceleration of at least one of the suspension element and of the device.5. The device as claimed in claim 4 , wherein the mea for sensing comprise a resilient element and a force transducer.6. The device as claimed in claim 1 , wherein weight sensing takes place via a pressure ...

COMPONENT INCLUDING MEANS FOR REDUCING ASSEMBLY-RELATED MECHANICAL STRESSES AND METHODS FOR MANUFACTURING SAME

Measures are provided for stress decoupling between a semiconductor component and its mounting support, these measures being implementable very easily, inexpensively and in a space-saving manner, regardless of the substrate thickness of the component, and not being limited to soldered connections but instead also being usable in conjunction with other mounting and joining techniques. These measures relate to components, which include at least one electrical and/or micromechanical functionality and at least one wiring level, which is formed in a layer structure on a main surface of the component substrate, at least one mounting surface being implemented in the wiring level to establish a mechanical and/or electrical connection of the component to a support. The at least one mounting surface is spring mounted and is separated from the layer structure in at least some areas for this purpose. 1. A component , comprising: an electrical and/or micromechanical functionality, and', 'a wiring level, which is formed in a layer structure on a main surface of the component substrate, at least one mounting surface for establishing a mechanical and/or electrical connection of the component to a support being implemented in the wiring level, wherein the at least one mounting surface is spring mounted and separated from the layer structure in at least some areas., 'an arrangement for reducing assembly-related mechanical stresses, at least including2. The component of claim 1 , wherein the at least one electrical and/or micromechanical functionality is implemented in a layer structure on a semiconductor substrate claim 1 , wherein the wiring level having the at least one mounting surface is formed in a layer structure on the rear side of the semiconductor substrate claim 1 , and wherein at least one through-contact is provided claim 1 , which establishes an electrical connection between the functionality in the front-side layer structure and the wiring level in the rear-side layer ...

COMPONENT IN THE FORM OF A WAFER LEVEL PACKAGE AND METHOD FOR MANUFACTURING SAME

A vertically integrated hybrid component is implemented in the form of a wafer level package including: at least two element substrates assembled one above the other; a molded upper sealing layer made of an electrically insulating casting; and an external electrical contacting of the component being implemented on the top side via at least one contact stamp which is embedded in the sealing layer so that (i) its lower end is connected to a wiring level of an element substrate and (ii) its upper end is exposed in the surface of the sealing layer. 1. A component in the form of a wafer level package , comprising:at least two element substrates assembled one above the other;a molded upper sealing layer of an electrically insulating casting compound; andat least one contact stamp via which an external electrical contacting of the component on the top side of the component is implement, the at least one contact stamp being embedded in the molded upper sealing layer such that (i) a lower end of the at least one contact stamp is connected to a wiring level of one of the element substrates and (ii) an upper end of the at least one contact stamp is exposed on the surface of the sealing layer.2. The component as recited in claim 1 , wherein the at least one contact stamp contains at least one of Al claim 1 , Cu claim 1 , Au and Ag.3. The component as recited in claim 1 , wherein the at least one contact stamp is connected to a wiring level on the molded sealing layer claim 1 , and wherein at least one terminal pad is formed in the wiring level on the molded sealing layer for external electrical contacting of the component.4. The component as recited in claim 3 , wherein at least one electrical connection in the form of a wire bond connection is implemented between active element front side of the two element substrates claim 3 , and wherein the wire bond connection is completely embedded in the electrically insulating sealing layer.5. The component as recited in claim 3 , ...

ASIC ELEMENT INCLUDING A VIA

In an ASIC element, vias are integrated into the CMOS processing of an ASIC substrate. The ASIC element includes an active front side in which the circuit functions are implemented. The at least one via is intended to establish an electrical connection between the active front side and the rear side of the element. The front side of the via is defined by at least one front-side trench which is completely filled, and the rear side is defined by at least one rear-side trench which is not completely filled. The rear-side trench opens into the filled front-side trench. 1. An ASIC element , comprising:an active front side in which circuit functions are implemented; andat least one via which establishes an electrical connection between the active front side and a rear side of the ASIC element;wherein the front side of the via is defined by at least one front-side trench which is completely filled, and wherein the rear side of the via is defined by at least one rear-side trench which is not completely filled, the rear-side trench opening into the filled front-side trench.2. The ASIC element as recited in claim 1 , wherein the front-side trench and the rear-side trench are implemented as annular isolation trenches which electrically isolate a selected substrate area extending across the complete thickness of the ASIC substrate claim 1 , the selected substrate area functioning as the at least one via.3. The ASIC element as recited in claim 1 , wherein:the front-side trench is electrically isolated from the adjacent semiconductor material by at least one dielectric layer;the front-side trench is filled with an electrically conductive material;the rear-side trench is electrically isolated from the adjacent semiconductor material by at least one dielectric layer; andat least one printed conductor track is routed from a wiring level on the rear side of the ASIC element on the wall of the rear-side trench to the electrically conductive material filling the front-side trench.4. ...

METHOD FOR PRODUCING A METAL STRUCTURE IN A SEMICONDUCTOR SUBSTRATE

A method for producing a metal structure in a semiconductor substrate includes: producing an opening in the rear side of the semiconductor substrate in the area of the metal structure to be produced, which extends to the front side layer structure; filling the opening at least partially with a metal so that a metal structure is created which extends from the rear side of the semiconductor substrate to the front side layer structure; masking the rear side of the semiconductor substrate for a trench process for exposing the metal structure in such a way that the trench mask includes a lattice structure in an area adjacent to the metal structure; producing an isolation trench adjacent to the metal structure, the metal structure acting as a lateral etch stop and the lattice structure being laterally undercut in the trench mask; and applying a sealing layer to the mask. 1. A method for producing at least one metal structure in a semiconductor substrate having a front side provided with a front side layer structure , comprising:producing at least one opening, which extends at least to the front side layer structure, in a rear side of the semiconductor substrate in an area corresponding to a location of the metal structure;filling the at least one opening at least partially with at least one metal to create a metal structure which extends from the rear side of the semiconductor substrate at least to the front side layer structure;masking the rear side of the semiconductor substrate for a trench process for exposing the metal structure, wherein the trench mask includes a lattice structure in an area adjacent to the metal structure;producing an isolation trench adjacent to the metal structure, wherein the metal structure acts as a lateral etch stop and the lattice structure in the trench mask is laterally undercut; andapplying at least one sealing layer to the trench mask so that the isolation trench below the lattice structure is closed off as a cavity.2. The method as ...

MICROMECHANICAL COMPONENT AND METHOD FOR MANUFACTURING A MICROMECHANICAL COMPONENT

A micromechanical component, whose diaphragm is supported and has support structures on its inner diaphragm side. Each of the support structures includes a first and second edge element structure, and at least one intermediate element structure positioned between the first and second edge element structures. For each of the support structures, a plane of symmetry is definable, with respect to which at least the first edge element structure of the respective support structure and the second edge element structure of the respective support structure are specularly symmetric. In each of support structures, a first maximum dimension of its first edge element structure perpendicular to its plane of symmetry and a second maximum dimension of its second edge element structure perpendicular to its plane of symmetry are greater than the maximum dimension of its intermediate element structure perpendicular to its plane of symmetry. 110-. (canceled)11. A micromechanical component , comprising:a substrate having an upper substrate surface;a diaphragm, which spans a cavity lying between the diaphragm and the upper substrate surface, so as to be spaced apart from a bottom side of the cavity pointed away from the diaphragm; anda plurality of support structures, which each extend from an inner diaphragm side of the diaphragm to the bottom side of the cavity and/or from the inner diaphragm side to a measuring electrode suspended on the diaphragm;wherein each support structure of the support structures includes, in each instance, a first edge element structure, a second edge element structure, and at least one intermediate element structure positioned between the first edge element structure of the support structure and the second edge element structure of the support structure; for each respective support structure of the support structures, in each instance, a respective plane of symmetry is definable, with respect to which at least the first edge element structure of the ...

METHOD FOR COATING METALLIC SURFACES WITH A COMPOSITION THAT IS RICH IN POLYMERS

A method for coating a metallic surface with an aqueous composition for pretreating before applying another coating or for treating said metallic surface. In addition to water, the composition contains: a) at least one hydrolyzable or at least partially hydrolyzed silane; b) at least one metal chelate; c) at least one organic film former, and; d) at least one long-chain alcohol that serves as a film forming aid. The unsoiled, scoured, cleaned and/or pretreated metallic surface is brought into contact with the aqueous composition so that a film forms on the metallic surface, which is subsequently dried, compacted in part or completely by film formation and, if necessary, additionally hardened. The dried and, if necessary, additionally hardened film has a layer thickness ranging from 0.01 to 10 μm. The invention also relates to corresponding aqueous compositions. 140-. (canceled)41. A process comprising: 'wherein the dried film has a layer thickness in the range from 0.01 to 10 μm, for pretreatment before a further coating or for treatment,', 'contacting a metallic surface that is at least one of clean, pickled, cleaned or pretreated with an aqueous composition having a solids content to form a film on the metallic surface to form a coated substrate, which is then dried to partly or completely compact the formed dried film,'}wherein the aqueous composition has a pH of from 4 to 9.5 and is largely or completely free of chromium(VI) compounds,wherein the aqueous composition comprises:water;a hydrolysable or at least partly hydrolyzed silane;a metal chelate which has only a low reactivity in the aqueous composition;a crosslinking agent based on a member selected from the group consisting of a titanium cation, a hafnium cation, a zirconium cation, a carbonate anion or and an ammonium carbonate anion; 'a long-chain alcohol as a film-forming auxiliary.', 'an organic film-forming agent comprising at least one of a water-soluble organic polymer, a water-dispersible organic ...

Process for heterophase reactions in a liquide or supercritical dispersion medium

The invention provides a process for heterophase reactions in a liquid or supercritical dispersion medium, in which the starting materials are introduced into the reaction zone of a reactor provided with one or more enrichment zones and the reaction product or unreacted starting material or both starting material and reaction product are discharged via one enrichment zone in each case, wherein a) the reaction product together with the dispersion medium is discharged from the reactor via an enrichment zone, the reaction product is separated off and the dispersion medium is, if desired in countercurrent to the reaction product/dispersion medium mixture and via an enrichment zone, returned to the reaction zone, or b) unreacted starting material together with the dispersion medium is discharged, the starting material is separated from the dispersion medium and returned directly to the reaction zone and the dispersion medium is, if desired, in countercurrent to the reaction product/dispersion medium mixture and via an enrichment zone, returned to the reaction zone, or the steps a) and b) are combined with one another.

Method of heterogeneous reaction in liquid or supercritical dispersant employs sequential concentration zones with countercurrent dispersant recycle

The reaction product with dispersant, is led out of the reactor through a concentration zone. The reaction product (i.e. fully-converted) is separated. Dispersant is returned to the reaction zone, and if appropriate countercurrent to the product/dispersant mixture, passing through a concentration zone. Alternatively non-converted educt is led out with the dispersant, the dispersant is separated, and directly returned to the reaction zone, if appropriate through a concentration zone as before. An Independent claim is included for the corresponding reactor with one or more concentration zones, comprising sequential filtration tray(s). Preferred features: A further variant of the process is described. The reactor is vertical, with central reaction zone connected to concentration zones at opposite ends. Centrifugal pumps are integrated into the concentration zones.

Process for coating fine particles with conductive polymers

A process is disclosed for coating fine particles, in which the feed mixture contains: at least one monomer and/or at least one oligomer selected from monomers and/or oligomers of aromatic compounds and/or unsaturated hydrocarbon compounds suitable for forming an electroconductive oligomer, polymer, copolymer, block copolymer or graft copolymer; at least one type of anions which (1) are and/or can be incorporated as doping ions into the structure of the conductive polymer; (2) can be discharged from said structure in the event of a potential fall of the conductive polymer (reduction); and (3) can have an anti-corrosive effect in the presence of a metallic surface; at least one type of particles; if necessary, at least one oxidising agent and water and/or at least another solvent. A coating is formed from the feed mixture on the particle surface, the feed mixture being converted by oxidation into a conductive polymer in the presence of at least one type of mobile anti-corrosive anions. Alternatively, the fine particles are coated with a product mixture that contains a conductive polymer.

Method, useful to protect metallic surface with corrosion inhibitor composition coating comprises applying coating on metallic surface, where the components comprising: deposit substance; and further components and/or matrix substance

Method for the protection of metallic surface (A) with a coating (A1) of corrosion inhibitor composition, comprises applying (A1) on (A), where a component optionally at least partially in a matrix comprising: at least a deposit substance (a) comprising incorporating anions by an oxidation reaction and releasing at least a part of anions for a potential variation; and optionally at least a further components and/or matrix substance. Method for the protection of metallic surface (A) with a coating (A1) of corrosion inhibitor composition, that after providing, optionally drying and hardening, comprises applying (A1) on (A), that as a component optionally at least partially in a matrix comprising: (a) at least deposit substance and at least a conductive polymer, comprising (1) anions incorporated by an oxidation reaction as doped ion and (2) releasing at least a part of anions for a potential variation (reduction), where at least a type of anions is suitable to inhibit an anodic and/or cathodic part reaction of the corrosion and optionally also to act as coupling agent, where the anions respectively exhibits ionic radius, that it is non- or not substantially- impaired the migration through the deposit substances and optionally through at least a further component e.g. in a matrix of the coating, where at least a type of anion are mobile in water, at least an another polar solvent and/or also in at least non polar solvent containing mixture, where the release of anions from at least a deposit substance does not and/or only dependent over a deprotonation reaction, but predominantly and/or completely takes place over a reduction reaction, and where at least a educt for the preparation of the deposit substance is selected, that the oxidation potential is less or same to the decomposition potential of the water and/or at least an another polar solvents in the mixture; and (b) optionally at least a further component and/or at least a matrix substance, that at least a deposit ...

Process for coating metallic surfaces with an anti-corrosive coating

Die Erfindung betrifft ein Verfahren zum Beschichten von metallischen Ober-flächen mit einer korrosionsschützenden Zusammensetzung, die leitfähiges Polymer enthält, wobei die Zusammensetzung eine Dispersion ist, die das mindestens eine leitfähige Polymer vorwiegend oder gänzlich in partikulärer Form sowie ein Bindersystem enthält, und wobei das leitfähige Polymer min-destens eines ist auf der Basis von Polyphenylen, Polyfuran, Polyimidazol, Polyphenanthren, Polypyrrol, Polythiophen oder/und Polythiophenylen, das mit korrosionsschützenden beweglichen Anionen beladen ist. Alternativ können die metallischen Oberflächen zuerst mit einer Dispersion auf Basis von leitfähigen Polymeren in partikulärer Form und anschließend mit einer ein Bindersystem enthaltenden Zusammensetzung beschichtet werden.

Process for coating particles with conductive polymers, mixture for coating, coated particles, the use of particles coated in this way and composition of a coating

Verfahren zum Beschichten von anorganischen oder organischen Partikeln, bei dem die Partikel in einem Gemisch vorliegen oder/und hierin anfangs gebildet werden, wobei das Gemisch eine Dispersion, eine fließfähige oder knetbare Masse, ein Sol oder/und ein Gel ist, dadurch gekennzeichnet, dass das als Edukt-Gemisch bezeichnete Gemisch enthält: – Mindestens ein Monomer oder/und mindestens ein Oligomer – im Folgenden als „Edukt(e) der leitfähigen Polymere” oder nur als „Edukt(e)” bezeichnet – ausgewählt aus Monomeren oder/und Oligomeren von Aromaten oder/und ungesättigten Kohlenwasserstoff-Verbindungen, die geeignet sind, hieraus elektrisch leitfähiges Oligomer/Polymer/Copolymer/Blockcopolymer/Pfropfcopolymer zu bilden, wobei mindestens ein Edukt zur Herstellung von mindestens einem leitfähigen Polymer danach ausgewählt wird/ist, dass sein Oxidationspotenzial kleiner oder gleich ist dem Zersetzungspotenzial des Wassers oder/und mindestens eines anderen polaren Lösemittels in dem hierzu verwendeten Gemisch und wobei die Freisetzung von beweglichen korrosionsschützenden Anionen aus dem entstandenen leitfähigen, Anionen-beladenen Polymer nicht oder/und nur untergeordnet über eine Deprotonierungsreaktion, sondern vorwiegend oder gänzlich über eine Reduktionsreaktion erfolgt, – mindestens eine Art von Anionen, wobei diese mindestens eine Art von Anionen in das leitfähige Polymer 1. als Dotierion in die Struktur des leitfähigen Polymers eingebaut werden kann oder/und eingebaut ist, 2. aus dieser Struktur im Falle eines Potenzialabfalls des leitfähigen Polymers (Reduktion) auch wieder freigesetzt werden kann und 3. im Falle der Anwesenheit einer metallischen Oberfläche korrosionsschützend wirken kann – im Folgenden „bewegliche korrosionsschützende Anionen” genannt, – mindestens ein Oxidationsmittel, wobei dieses mindestens eine Oxidationsmittel gänzlich oder teilweise entfallen kann, wenn mindestens ein Anion gleichzeitig als Oxidationsmittel wirkt oder/und wenn ...

Process for coating metallic surfaces with an anti-corrosive coating

Patent DE3735558C2

Combustion device for wood and coal

Privacy and security systems and methods of use

Some embodiments include a privacy/security apparatus for a portable communication device that includes a housing assembly configured to at least partially attenuate at least one of sound energy, acoustic energy, and electromagnetic energy including light, optical, and IR energy and RF radiation from passing through the housing assembly. The housing assembly includes a Faraday cage with two or more portions, and at least one protective shell coupled to or forming at least one aperture. The at least one aperture is configured and arranged to at least partially enclose the portable communication device so that at least a portion of the portable communication device is positioned within at least one portion of the Faraday cage, and the at least one seal coupled or integrated with the protective shell. The housing assembly can be an articulating assembly, a sliding assembly, and can include an active acoustic jamming or passive acoustic attenuation element.

Dental treatment system

A medical tool (4i) and/or a magazine (1) and a device (7, 9) for recognizing and modifying codings on the magazine form a system with which the state of tools that can be accommodated inside the magazine can be monitored. To this end, codings are placed on the medical tool (4i) and/or on the magazine (1) that contain information concerning individual tools. These codings can be modified by the device (7, 9) while taking the state of the tools into consideration.

Medical device

Method for pretreating and coating metal surfaces, prior to forming, with a paint-like coating and use of substrates so coated

MICROMECHANICAL COMPONENT AND PROCEDURE FOR THE MANUFACTURE OF A MICROMECHANICAL COMPONENT.

MICROMECHANICAL COMPONENT AND PROCEDURE FOR THE MANUFACTURE OF A MICROMECHANICAL COMPONENT.

Process for the production of penicillamine

Methods for treating allergy and enhancing allergen-specific immunotherapy by administering an il-4r antagonist

Methods for enhancing the efficacy, safety, and/or tolerability of a grass allergen-specific subcutaneous immunotherapy (SCIT) regimen in a subject having a grass allergy are provided. Methods comprising administering to a subject in need thereof a therapeutic composition comprising an interleukin-4 receptor (IL-4R) antagonist, such as an anti-IL-4R antibody or antigen-binding fragment thereof, are provided.

Method of treating acute rhinosinusitis

Disclosed are methods of treating rhinosinusitis of the upper airway passages in patients afflicted with said disease, which comprises administering at least once-a-day to the surfaces of said passages of said patients an amount of aerosolized particles of mometasone furoate as a monotherapy effective for treating said disease.

Floating device providing noise reduction properties

The present invention relates to a floating noise reduction system for moving and/or falling fluids, the process for manufacturing of such system and the use of such system.

PROCEDURE FOR PENICILLAMINE OR ITS HOMOLOGIST

A biscuit product and a method of manufacture thereof

A biscuit, consisting of agglomerated granules of an extrusion cooked base, which are coated with a binder. The biscuit has a density of from 0.3 to 0.8 g/cm3 and a water content of from 1.5 to 4.5% by weight. The base consists of from 40 to 80 parts by weight of cereal flour, from 0 to 20 parts by weight of sucrose and from 0.5 to 3 parts by weight of oil or fat. The base has a specific weight of from 0.1 to 0.3 g/cm3. The binder consists of from 8 to 30 parts by weight of sucrose and/or mixtures of glucose and its polymers.

Rapid charging system and method for electrical connection of a vehicle to a charging station

Process for coating metallic surfaces with a composition that is rich in polymer

The invention relates to a method for coating a metallic surface with an aqueous composition for pretreating before applying another coating or for treating said metallic surface. In addition to water, the composition contains: a) at least one hydrolyzable or at least partially hydrolyzed silane; b) at least one metal chelate; c) at least one organic film former, and; d) at least one long-chain alcohol that serves as a film forming aid. The unsoiled, scoured, cleaned and/or pretreated metallic surface is brought into contact with the aqueous composition and a film is formed on the metallic surface, is subsequently dried, compacted in part or completely by film formation and, if necessary, additionally hardened. The dried and, if necessary, additionally hardened film has a layer thickness ranging from 0.01 to 10 ~m. The invention also relates to corresponding aqueous compositions.

Method for coating a semiconductor material using high remanent induction, coated superconductor material and the use thereof

The invention relates to a method for coating shaped bodies made of a superconducting material based on (Y/SE)BaCuO. The invention is characterized in that a coating consisting of a coating material is applied to at least one part of a surface of the shaped body, whereby the coating material at least partially melts at a lower temperature than that of the material of the shaped body and/or is flowable at a lower temperature than that of said material. The shaped body with the applied coating material is heated to a temperature at which the material of the shaped body does not yet melt and/or is not yet flowable, however at which the coating material is at least partially melted thereon and/or is in a flowable state. In addition, at least one part of the area of the shaped body located near the surface is modified at said temperature and/or during a successive cooling, and the shaped body treated in such a manner is enriched with oxygen during cooling and/or during a successive heat treatment, whereby the modification contributes to the increase in remanent induction and/or to the critical current density of the shaped body enriched with oxygen. The invention also relates to a shaped body made of a superconducting material which is based on (Y/SE)BaCuO and which can be obtained by using the above-mentioned method. Said superconducting material contains at least one rare-earth element selected from the group of Y, La, Ce, Pr, Nd, Eu, Gd, Th, Dy, Ho, Er, Tm, Yb and Lu and comprises a maximal value of remenant induction of at least 1100 mT at 77 K and 0 T.

Fire protection system for expanded polymers.

La presente invención se refiere a sistemas de recubrimiento de múltiples capas (A) (B) versátiles para propósitos anti-llama especialmente para la protección de polímeros orgánicos expandidos (C) que conducen a las propiedades ignífugas mejoradas junto con la generación baja de humo, al proceso para la fabricación de tales sistemas, uso de tales sistemas en sustratos y al uso de tales sistemas y compuestos resultantes.

WORK EQUIPMENT FOR DRILLING, CUTTING AND SCREWING TOOLS FOR MEDICAL PURPOSES

Heating appliance

The process includes an afterburning of the flue gas which is fed into an afterburning chamber with admixture of a secondary air. The primary flue discharge (14) takes place from a deep point of the combustion chamber. Flue gases are added to the primary flue gas from a higher secondary flue discharge (15) during its flow into the afterburning chamber (13) via a first flue gas return duct (11). Pref. the admixture of the flue gases (4) of the first return duct and of the secondary air (5) into the primary flue gas is carried out by exhausting such that the primary flue gas passes through a nozzle system, prior to reaching the afterburning chamber.

Process for producing a polymeric film on a metal surface, and concentrate and treatment liquid therefor

Die Erfindung betrifft ein Verfahren zur Herstellung eines Kunststofffilmes oder eines kunststoffhaltigen Filmes auf einer Metalloberfläche, bei dem eine Behandlungsflüssigkeit, die zu Beginn der Benetzung mit der Behandlungsflüssigkeit 0,1 bis 50 Gew.-% eines ein oder mehrere Harze enthaltenden nichtflüchtigen filmbildenden Gemisches und 99,9 bis 50 Gew.-% eines wassermischbaren oder/und wasserlöslichen Lösemittels oder/und Wasser enthält, auf der Metalloberfläche einen Film ausbildet, wobei der flüchtige Anteil zumindest teilweise entweicht, das dadurch gekennzeichnet ist, daß die Behandlungsflüssigkeit zu Beginn der Benetzung mit der Behandlungsflüssigkeit eine Temperatur im Bereich von 10 bis 100 DEG C aufweist, daß die Metalloberfläche zu Beginn der Benetzung mit der Behandlungsflüssigkeit eine um mindestens 20 DEG C höhere Temperatur als die Behandlungsflüssigkeit und eine Temperatur im Bereich von 30 bis 700 DEG C aufweist und daß der Film der Behandlung der Metalloberfläche dient. DOLLAR A Die Erfindung betrifft auch eine Behandlungsflüssigkeit zur Herstellung eines Kunststofffilmes oder kunststoffhaltigen Filmes auf einer Metalloberfläche während der Benetzung der Metalloberfläche mit der Behandlungsflüssigkeit, wobei die Behandlungsflüssigkeit 0,1 bis 50 Gew.-% eines ein oder mehrere Harze enthaltenden nichtflüchtigen filmbildenden Gemisches und 99,9 bis 50 Gew.-% eines wassermischbaren oder wasserlöslichen Lösemittels oder/und Wasser enthält, die dadurch gekennzeichnet ist, daß ... The invention relates to a process for producing a plastic film or a plastic-containing film on a metal surface, in which a treatment liquid which contains 0.1 to 50% by weight of a non-volatile film-forming mixture containing one or more resins at the start of wetting with the treatment liquid and 99 , 9 to 50 wt .-% of a water-miscible and / or water-soluble solvent and / or water, forms a film on the metal surface, the volatile portion escaping at least partially, which is ...

Producing pyridines aromatically or heteroaromatically substituted in the 2 position

ABSTRACT OF THE DISCLOSURE The present invention provides 3 process for producing pyridines which are aromatically or heteroaromatically substituted in the 2 position, in which aliphatic-aromatic or aliphatic-hetero-aromatic ketones are reacted at temperatures from approximately 250 to 550°C with aliphatic oxo compounds, which have an unsaturated carbon bond adjacent to the oxo group, in the gas phase in the presence of ammonia and in the presence of a catalyst having dehydrating and dehydrogenating properties.

Process and apparatus for the manufacture of fibrids of thermoplastics materials

ABSTRACT OF THE DISCLOSURE A process for the manufacture of fibrids of a thermoplastic organic polymer material which comprises extruding strands of molten thermoplastic organic polymer material through orifices of die means/and introducing a propulsive jet of liquid flowing from a nozzle located in the center of said die means at a velocity of from 10 to 100 meters per second and flowing in the same direction as said strands with in a liquid-filled zone surrounding said orifices, passing said strands, the propulsive jet and entrained liquid immediately and directly into and through a tubular impulse exchange zone having a mean diameter of from 2 to 20 times the diameter of said nozzle of said propulsive jet and a length of from 2 to 30 times its hydraulic diameter to provide shear stresses acting on said strands within said impulse exchange zone, and causing said strands of thermoplastic organic polymer material to solidify by the cooling of said melt by said liquid and to be broken up into fibrids by said shear stresses within said impulse exchange zone. The invention also relates to an apparatus for carrying out the above process. This apparatus consists of a container filled with liquid, a nozzle for melt of said thermoplastic organic polymer material and which surrounds a nozzle or nozzles for the propulsive jet projecting parallel into said container and a tube having a diameter from 2 to 20 times the diameter of the nozzles for the propulsive jet and having a length from 2 to 30 times its hydraulic diameter, said tube being disposed at a short distance from the die orifi-ces coaxially with an imaginary extension of the axis of the die so that said tube can accommodate the propulsive jet and the extruded thermoplastic organic polymer material leaving said die orifices. The orifices for the molten plastics material comprise a circle of round nozzles disposed around a propulsive nozzle or in the form of arcuate slots disposed concentrically with said propulsive ...

Pure alpha bisabolol

Method for producing coated metal surfaces and the use of said metal surfaces

Method for pretreating and/or coating metallic surfaces with a paint-like coating prior to forming and use of substrates coated in this way

The invention relates to a method for coating a metallic strip. The strip or optionally, the strip sections produced from said strip in the subsequent process, is/are first coated with at least one anticorrosion layer - accordi ng to an alternative form of embodiment, this can be left out - and then with a t least one layer of a paint-like coating containing polymers. After being coated with at least one anticorrosion layer or after being coated with at least one layer of a paint-like coating, the strip is divided into strip sections. The coated strip sections are then formed, joined and/or coated wi th at least one (other) paint-like coating and/or paint coating. The paint-like coating is formed by coating the surface with an aqueous dispersion containi ng the following in addition to water: a) at least one organic film former containing at least one water-soluble or water-dispersed polymer with an aci d value of 5 to 200; b) at least one inorganic compound in particle form with an average particle diameter measured on a scanning electron microscope of 0.00 5 to 0.3 .mu.m; and c) at least one lubricant and/or at least one corrosion inhibitor. The metallic surface that is optionally coated with at least one anticorrosion layer is brought into contact with the aqueous composition and a film containing particles is formed on the metallic surface, this film then being dried and optionally also hardened, the dried and optionally, also hardened film having a layer thickness of 0.01 to 10 .mu.m. The invention al so relates to a corresponding aqueous composition.

Process for applying an insulating layer

ABSTRACT OF THE DISCLOSURE A process is disclosed for applying to sheet steel an elec-trically insulating layer whose main purpose is to permit a satisfactory welding of the sheets when they have been blanked and stacked. The sheet steel is contacted with a treating liquor which contains a resin adapted to be diluted in an alkaline aqueous medium, and a fluoride of a polyvalent metal, particularly aluminum fluoride, in an amount of 0.1 to 80 parts by weight per 100 parts by weight of resin. The treating liquor is subsequently dried and the sheet is subjected to a stress-relieving annealing, if required. In accordance with a preferred embodiment, the treating liquor additionally contains borates and/or dispersed particles made of silicate and/or polymers, and is applied by means of rollers before being dried at 120 to 350°C.

Plant separating mixed polyglycol and ethylene leaking from compressor lubrication duty

The separation plant, connected to the leakage collection line (30), purifies the polyglycol, returning it to the lubrication system. Preferred features: Leakage (30) enters the ethylene stripper. The high internal energy of the influx is released at the inlet. An impact baffle (32) made of sintered bronze opposes the influx. Ethylene stripped passes (33) into the storage vessel (34). Enriched polyglycol in the storage vessel base leaves via the bottom connection (35) for the stilling tank (36) where residual ethylene in the polyglycol is released under atmospheric pressure. The ethylene leaves via the head line (37), recycled by a fan (38) to the compression process. The filter (41) is a sieve or centrifugal filter. Lubrication system pumps (15, 15a) take polyglycol from the reservoir to compressor (4-11) lubricant channels.

Method for pretreating and subsequently coating metallic surfaces with a paint-type coating prior to forming and use of substrates coated in this way

Semiconductor storage device

【課題】プロセスのばらつきに対して回路定数を内部で自動的に変更する機能を有する半導体記憶装置を提供すること。【解決手段】半導体記憶装置は、出力パッドと、前記出力パッドに接続され、第１設定信号が供給される第１回路と、前記第１回路に接続され、第２設定信号が供給される第２回路と、前記第１回路の特性ばらつきに応じて前記第１回路を制御する第１設定信号を出力する第３回路と、前記第３回路から受信した前記第１設定信号に基づいて前記第２回路を制御する第２設定信号を生成して出力する第４回路と、を備える。【選択図】図５

Method for pretreating and subsequently coating metallic surfaces with a paint-type coating prior to forming and use of substrates coated in this way

The invention relates to a method for coating a metallic strip. The strip or optionally, the strip sections produced from said strip in the subsequent process, is/are coated first with at least one anticorrosion layer and then with at least one layer of a paint-like coating containing polymers and/or with at least one paint coating. After being coated with at least one anticorrosion layer or after being coated with at least one layer of a paint-like coating and/or with at least one paint coating, the strip is divided into strip sections. The coated strip sections are then formed, joined and/or coated with at least one (other) paint-like coating and/or paint coating. At least one of the anticorrosion layers is formed by coating the surface with an aqueous dispersion containing the following in addition to water: a) at least one organic film former containing at least one water-soluble or water-dispersed polymer; b) a quantity of cations and/or hexa- or tetrafluoro complexes of cations chosen from a group consisting of titanium, zirconium, hafnium, silicon, aluminium and boron; and c) at least one inorganic compound in particle form with an average particle diameter measured on a scanning electron microscope of 0.005 to 0.2 νm. The clean metallic surface is brought into contact with the aqueous composition and a film containing particles is formed on the metallic surface, this film then being dried and optionally also hardened, the dried and optionally, also hardened film having a layer thickness of 0.01 to 10 νm.

Continuous production of polycarbonates

High molecular weight linear polycarbonates are prepared by continuous condensation of organic dihydroxy compounds and phosgene in two reaction zones, a mixture of an aqueous-alkaline solution of the organic dihydroxy compound and an aqueous catalyst solution being introduced at the rate of from 1 to 50 meters per second and the phosgene at the rate of from 30 to 300 meters per second into the first reaction zone and condensed, an organic solvent being incorporated into the resultant reaction mixture containing oligomer and polycarbonate and the condensation of the aqueous-organic reaction mixture carried to completion in the second reaction zone by the two-phase interfacial method.

Method for pretreating and/or coating metallic surfaces with a paint-like coating prior to forming and use of substrates coated in this way

A method for coating metallic surfaces with a paint or paint-like coating prior to forming.

FOERFARANDE FOER RINGSPALTNING AV 2-ISOPROPYL-5,5-DIMETHYLTHIAZOLIDINEFOERENINGAR FOER ERHAOLLANDE AV PENICILLAMINER ELLER DERAS DERIVAT

Measuring circuit for detecting measurement signals

- 7 - O.Z. 0050/40470 Abstract of the Disclosure: A control loop comprising a control section, a set value/actual value comparator and a controller is expanded for ultraprecision measurements in such a way that, to detect measurement signals, the control variable connection between the controller output and the control section input is guided via a measured value transducer and, to evaluate and display the measured value, the correcting variable output of the controller is additionally connected to an evaluating circuit.

Methods for treating or preventing asthma by administering an il-4r antagonist

Methods for treating or preventing asthma (e.g., allergic asthma, asthma associated with allergic bronchopulmonary aspergillosis (ABPA), moderate-to-severe asthma, persistent asthma or the like) and associated conditions (e.g., ABPA, ABPA comorbid with asthma, ABPA comorbid with cystic fibrosis (CF), ABPA comorbid with asthma and CF) in a subject are provided. Methods comprising administering to a subject in need thereof a therapeutic composition comprising an interleukin-4 receptor (IL-4R) antagonist, such as an anti-IL-4R antibody or antigen-binding fragment thereof, are provided.

Method for coating metallic surfaces with an aqueous composition, the aqueous composition and use of the coated substrates

BASIC SUBSTITUTED XANTINE DERIVATIVES.

Flame retardant elastic foam material

Material elastomérico que contiene entre un 50 y un 100 por ciento en peso de policloropreno con respecto al contenido total de polímero y más de un 25 por ciento en peso de cloroparafina con respecto al contenido total de polímero, donde el material está vulcanizado y expandido y contiene materiales de carga y aditivos. Elastomeric material containing between 50 and 100 percent by weight of polychloroprene with respect to the total polymer content and more than 25 percent by weight of chloroparaffin with respect to the total polymer content, where the material is vulcanized and expanded and Contains fillers and additives.

FRAME FOR THE PREPARATION OF THERAPEUTIC THERAPEUTIC 6-AZA-3H-1,4-BENZODIAZEPIN-2-ONER OCH DERAS SALTER

Substituted quaterrylene tetracarboxylic acid diimides

The invention concerns quaterrylene tetracarboxylic acid diimides of formula (I), in which the variables have the following meanings: R represents hydrogen; C1-C30-alkyl whose carbon chain can be interrupted by one or more of the groupings -O-, -S-, -NR1-, -CO- and/or -SO¿2?- and which can be singly or multiply substituted by cyano, C1-C6-alkoxy or a 5-7 member heterocyclic group, bound by a nitrogen atom, which can contain additional heteroatoms and can be aromatic; R?1¿ then represents hydrogen or C¿1?-C6 alkyl; C5-C8 cycloalkyl whose carbon skeleton can be interrupted by one or more of the groupings -O-, -S- and/or -NR?1¿-, aryl or hetaryl which can be singly or multiply substituted by C¿1?-C18 alkyl, C1-C6 alkoxy, cyano, -CONHR?2¿, -NHCOR2 and/or aryl or a hetarylazo which itself can be substituted by C¿1?-C10 alkyl, C1-C6 alkoxy or cyano; R?2¿ represents hydrogen; C¿1?-C18 alkyl or hetaryl which can be substituted by C1-C6 alkyl, C1-C6 alkoxy, halogen or cyano; X represents hydrogen; C1-C18 alkyl; aryloxy, arylthio, hetaryloxy or hetarylthio which can be substituted by C1-C4 alkyl or C1-C4 alkoxy; n is a number between 2 and 12. The invention also concerns the production of the said compounds and their use as pigments or fluorescent dyes, and substituted 9-haloperylene-3,4-dicarboxylic acid imides III as their intermediate products.

Method for coating metallic surfaces with a polymer-containing coating agent, the coating agent and use thereof.

La invención se relaciona con un método para recubrir superficies metálicas con composiciones acuosas como una solución o dispersión, en el cual la composición contiene a) al menos un fosfato, b) al menos 0.1 g/l de al menos un compuesto de titanio y/o circonio, c) al menos un agente complejante, d) cationes de aluminio, cromo (III) y/o zinc y/o al menos un compuesto que tiene un contenido de aluminio, cromo (III) y/o zinc y e) 1 a 500 g/l de al menos un polímero/copolímero orgánico, catiónico o no jónico, tolerante al ácido, basándose en el contenido de sólidos y los ingredientes activos de estos aditivos.

PROCESS FOR THE PREPARATION OF BENZOYLCYANIDE

High temperature superconducting magnetic bearing

The present invention is directed to a magnetic bearing wherein a rotating shaft (3) is held magnetically in a floating condition within a stator (1) wherein the stator (1) comprises a superconductor (5) and the shaft (3) is attached to a segmented exciting system (10) of permanent magnets (12a,12b,13a,13b) wherein one or more of the segments (12a,13a,13b) are movable with respect to the remaining segment(s) (12b).

Pressure module, in particular for lithium-ion battery cells

The invention relates to a pressure module (1) for a battery cell, wherein: the pressure module is an elastomer component for compensating for swelling, and has a simultaneous cooling or heating function, for rechargeable batteries; and the pressure module (1) comprises an outer covering (2) made of a polymer material which surrounds a cavity (9) that has a channel structure; and connections for the inlet (5) and outlet (6) for the thermal transfer medium are provided in the outer covering (2); wherein the outer covering (2) has two main faces opposite one another which are interconnected via the edges thereof, wherein structural elements (10a, 10b; 19a, 19b) are provided on the inner faces (7, 8) and are arranged so as to correspond to one another and to interact with one another so as to define and stabilise the channel structure for conducting the thermal transfer medium.

Infrared measuring device, especially for the spectrometry of aqueous systems, preferably multiplecomponent systems

The invention relates to an infrared measuring device, especially for the spectrometry of aqueous systems. Said device comprises at least one measuring unit, especially a measuring cell, also comprising at least one ATR-body and at least one infrared light source. The measuring unit contains at least one ATR-body which comprises at least two planar, substantially parallel limiting surfaces and which is transparent with respect to measuring radiation and which has an index of refraction which is greater than that of the medium which is arranged next to at least one limiting surface and which is to be examined, especially larger or equal to 1.5. The IR-measuring radiation on at least one of the planar, parallel limiting surfaces of the ATR-body can be totally reflected in an attenuated manner by at least six times.

Methods for treating prurigo nodularis by administering an il-4r antagonist

Methods for treating or preventing prurigo nodularis (PN) in a subject are provided. Methods comprising administering to a subject in need thereof a therapeutic composition comprising an interleukin-4 receptor (IL-4R) antagonist, such as an anti-IL-4R antibody or antigen-binding fragment thereof, are provided.

Solid fuel heater

Fodder for cows

The calcium salts of mono-hydroxymethyl lysine and bis(hydroxymethyl) lysine are prepared by reacting lysine and formaldehyde in water containing calcium ions at a pH of at least 8 and at most 12.5. The compounds are useful as fodder for ruminants.

Sulphur-containing trialkoxy-benzoyl-amino carboxylic acids

ANALOGY PROCEDURE FOR THE PREPARATION OF THERAPEUTIC ACTIVE BASIC SUBSTITUTED THEOPHYLININE DERIVATIVES

5-aryl-pyrido-(b-6,7)-1,4-diazepines having a wider annuelated hetero cycle

ABSTRACT OF THE DISCLOSURE The present invention provides a compound having the general formula

Fire protection system for expanded polymers

Paint matting agents