Method for raising hot pressing bonding rate of PMMA micro fluidic chip formed by injection moulding

Provided is a method for raising the hot pressing bonding rate of a PMMA micro fluidic chip formed by injection moulding. The invention is directed to the field of micro manufacture technology, especially relates to a method for raising the hot pressing bonding quality of a micro fluidic chip. The method is characterized in that carrying out water processing before hot pressing bonding; unlike a traditional hot pressing bonding process flow of from ultrasonic cleaning to drying in a baking oven to hot pressing bonding, a new process flow of from ultrasonic cleaning to water processing to drying the surface with nitrogen to hot pressing bonding is adopted. According to the invention, problems of complex processing method, high cost and negative influence on system operational performance in processing methods such as ultraviolet ray and MMA monomer surface modification and the like are overcome. The processing method is characterized by high efficiency, low cost, unchanged microfluid system ...