23-05-2013 дата публикации
Номер: US20130126171A1
A downhole assembly may include a housing having an outer surface and an inner surface, the outer surface adapted for contact with a downhole fluid, the inner surface defining an interior volume. One or more heat producing components may be disposed within the interior volume and in thermal contact with a structural component (e.g., chassis). One or more thermal dissipation members may be disposed within the housing, the one or more thermal dissipation members in thermal contact with the chassis and in thermal contact with the inner surface of the housing. 1. A downhole assembly comprising:a housing having an inner surface and an outer surface;a structural component extending through the housing;one or more heat producing components; andone or more thermal dissipation members extending from the structural component and in thermal contact with the one or more heat producing components and the inner surface of the housing, such that at least a portion of thermal energy generated from the one or more heat producing components is dissipated through the housing by transferring said thermal energy from the one or more heat producing components to the inner surface of the housing via the one or more thermal dissipation members.2. The downhole assembly of claim 1 , wherein the structural component is in thermal contact with the one or more heat producing components and the one or more thermal dissipation members; and wherein at least a portion of said thermal energy is transferred from the one or more heating producing components to the one or more thermal dissipation members via the structural component.3. The downhole assembly of or claim 1 , wherein said thermal energy is dissipated into a downhole fluid that is in contact with the outer surface of the housing.43. The downhole assembly of any of - claims 1 , wherein at least a portion of the one or more thermal dissipation members is in physical contact with the inner surface of the housing.53. The downhole assembly of ...
Подробнее
