04-08-2023 дата публикации
Номер: CN116536149A
Принадлежит:
The invention provides a thermal cycle device. The thermal cycle device comprises a radiator, a temperature controller, a heat conducting plate and a heat conducting film, the temperature controller is positioned on the radiator; the heat conducting plate is located on the surface of the temperature controller, the heat conducting plate and the radiator are connected in a sealed mode to form a sealed cavity, and the temperature controller is located in the sealed cavity; the heat-conducting film is located on the surface of the heat-conducting plate, and a vacuum groove is formed in the heat-conducting film; the radiator is provided with a first through hole, the heat conducting plate is provided with a second through hole, and the sealing cavity is communicated with the first through hole, the second through hole and the vacuum groove respectively and further communicated with a vacuum device, so that negative pressure is formed in the sealing cavity and the vacuum groove. The invention ...
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