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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 21. Отображено 21.
16-07-2002 дата публикации

Patch antenna using non-conductive frame

Номер: US0006421011B1
Автор: Maarten Van Egmond, Keith V. Guinn, Stelios Papatheodorou, Edward Bryan Roberts, Ming-Ju Tsai, Michael A. Zimmerman, VAN EGMOND MAARTEN, GUINN KEITH V, PAPATHEODOROU STELIOS, ROBERTS EDWARD BRYAN, TSAI MING-JU, ZIMMERMAN MICHAEL A, GUINN KEITH V., ZIMMERMAN MICHAEL A.
Принадлежит: Lucent Technologies Inc., LUCENT TECHNOLOGIES INC, LUCENT TECHNOLOGIES INC.

A non-conductive frame supports the resonators in a patch antenna assembly. The frame supports the resonators without making holes in the resonators and thereby avoids the problem of creating unwanted electric field polarizations. Additionally, the frame grasps the resonators in areas of low current density and thereby avoids creating additional disturbances in the radiation pattern. The frames may also include posts that are used to attach the frames to the feedboard without using additional components such as screws.

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Номер записи: 1
04-06-2009 дата публикации

Metal foil interconnection of electrical devices

Номер: US2009140427A1
Автор: GUINN KEITH V, GUINN KEITH V.
Принадлежит:

An electrical assembly (300, 400) includes a power IC such as a MOSFET (112, 412) attached to a substrate module (114, 214). The MOSFET includes a top surface comprising first and second conductive device surfaces (A, B), associated with first and second device ports, and a bottom surface comprising a third conductive device surface C associated with a third device port. A first foil element is bonded to the first conductive device surface(s) A and to each of the first conductive substrate surfaces (A1, A2) and provides a continuous conductive pathway from each conductive surface (A) to each other conductive surface (A) and to each conductive surface (A1, A2). A second foil element is bonded to the second conductive device surface(s) B and to the second conductive substrate surface B1 and provides a continuous conductive pathway from each device conductive surface (B) to the substrate conductive surface (B1). A third foil element may be installed to electrically interconnect the discrete ...

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Номер записи: 2
30-12-2014 дата публикации

Microtruss based thermal plane structures and microelectronics and printed wiring board embodiments

Номер: US0008921702B1
Автор: William B. Carter, Peter D. Brewer, Adam F. Gross, Jeffrey L. Rogers, Keith V. Guinn, Alan J. Jacobsen, CARTER WILLIAM B, BREWER PETER D, GROSS ADAM F, ROGERS JEFFREY L, GUINN KEITH V, JACOBSEN ALAN J, CARTER WILLIAM B., BREWER PETER D., GROSS ADAM F., ROGERS JEFFREY L., GUINN KEITH V., JACOBSEN ALAN J.
Принадлежит: HRL Laboratories, LLC, CARTER WILLIAM B, BREWER PETER D, GROSS ADAM F, ROGERS JEFFREY L, GUINN KEITH V, JACOBSEN ALAN J, HRL LAB LLC, CARTER WILLIAM B., BREWER PETER D., GROSS ADAM F., ROGERS JEFFREY L., GUINN KEITH V., JACOBSEN ALAN J., HRL LABORATORIES, LLC

In one possible implementation, a thermal plane structure includes a non-wicking structural microtruss between opposing surfaces of a multilayer structure and a thermal transport medium within the thermal plane structure for fluid and vapor transport between a thermal source and a thermal sink. A microtruss wick is located between the opposing surfaces and extends between the thermal source and the thermal sink.

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Номер записи: 3
29-10-2013 дата публикации

Method for interconnecting electrical device to a module

Номер: US0008567049B2
Автор: Keith V. Guinn, GUINN KEITH V, GUINN KEITH V.
Принадлежит: Raytheon Company, GUINN KEITH V, RAYTHEON CO, GUINN KEITH V., RAYTHEON COMPANY

An electrical assembly (300, 400) includes a power IC such as a MOSFET (112, 412) attached to a substrate module (114, 214). The MOSFET includes a top surface comprising first and second conductive device surfaces (A, B), associated with first and second device ports, and a bottom surface comprising a third conductive device surface C associated with a third device port. A first foil element is bonded to the first conductive device surface(s) A and to each of the first conductive substrate surfaces (A1, A2) and provides a continuous conductive pathway from each conductive surface (A) to each other conductive surface (A) and to each conductive surface (A1, A2). A second foil element is bonded to the second conductive device surface(s) B and to the second conductive substrate surface B1 and provides a continuous conductive pathway from each device conductive surface (B) to the substrate conductive surface (B1). A third foil element may be installed to electrically interconnect the discrete ...

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Номер записи: 4
15-05-2001 дата публикации

PATCH ANTENNA USING NONCONDUCTIVE THERMALLY FORMED FRAME

Номер: KR20010040137A
Автор: FRANEY JOHN PHILIP, GUINN KEITH V., MANZIONE LOUIS T., TSAI MING-JU
Принадлежит:

PURPOSE: A patch antenna using nonconductive thermally formed frame is provided to support the resonators without making holes in the resonators and thereby avoid the problem of creating unwanted electric field polarizations and grasp the resonators in areas of low current density and thereby avoids creating additional disturbances in the radiation pattern. CONSTITUTION: An assembly(100) is enclosed by conductive rear housing section(112) and non-conductive front housing section(114). Resonator elements(116,118) are held in non-conductive frame(124). Feedboard is positioned in front housing section(114) by positioning tabs(132). Feedboard(130) is multilayered and contains a ground plane, a plane containing conductor(134), and insulating layers on the top and bottom surfaces and between conductor(134) and the ground plane. Slots(136,138) in the ground plane permit a radio frequency(RF) signal on conductor(134) to couple to resonators(116,118) so that RF energy may be transmitted through ...

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Номер записи: 5
15-05-2001 дата публикации

PATCH ANTENNA USING NONCONDUCTIVE FRAME

Номер: KR20010040153A
Автор: GUINN KEITH V., MICHEL A. ZIMMERMANN, PAPATHEODOROU STELIOS, ROBERTS EDWARD BRYAN, TSAI MING-JU, VAN EGMOND MAARTEN
Принадлежит:

PURPOSE: A patch antenna using nonconductive frame is provided to support the resonators without making holes in the resonators and thereby avoids the problem of creating unwanted electric field polarizations and grasp the resonators in areas of low current density and thereby avoids creating additional disturbances in the radiation pattern. CONSTITUTION: Non-conductive frames(124,126) include posts(128). Post holes(129) in feedboard(130) receive posts(128). The frames may be held in place by melting the portion of post(128) that extends through feedboard(130) to form a mushroom cap that holds the frames in place. Resonators(116,118) are snapped into frames(124,126), respectively. The frames hold resonators(116,118) approximately 1/10 of a wavelength at the frequency of operation away from feedboard(130). Front housing section(114) includes tabs(132) that assist in the alignment or placement of feedboard(130) into front housing section(114). © KIPO 2002 ...

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Номер записи: 6
08-01-2013 дата публикации

Multi-layered integrated circuit and apparatus with thermal management and method

Номер: US0008349650B1
Автор: Peter D. Brewer, Keith V. Guinn, Jonathan J. Lynch, BREWER PETER D, GUINN KEITH V, LYNCH JONATHAN J, BREWER PETER D., GUINN KEITH V., LYNCH JONATHAN J.
Принадлежит: HRL Laboratories, LLC, HRL LAB LLC, BREWER PETER D, GUINN KEITH V, LYNCH JONATHAN J, HRL LABORATORIES, LLC, BREWER PETER D., GUINN KEITH V., LYNCH JONATHAN J.

A multi-layered semiconductor apparatus capable of producing at least 500 W of continuous power includes at least two device substrates arranged in a stack. Each of the at least two device substrates has a first side and a second side opposite to the first side, and each of the at least two device substrates is configured to produce an average power density higher than 100 W/cm2. A plurality of active devices are provided on the first side of each of the at least two device substrates. The plurality of active devices are radiatively coupled among the at least two device substrates. At least one of the at least two device substrates is structured to provide a plurality of cavities on its second side to receive corresponding ones of the plurality of active devices on the first side of an adjacent one of the at least two device substrates.

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Номер записи: 7
20-12-2011 дата публикации

Module for scalable millimeter wave imaging arrays

Номер: US0008080774B1
Автор: Keith V. Guinn, James H. Schaffner, Jonathan Lynch, GUINN KEITH V, SCHAFFNER JAMES H, LYNCH JONATHAN, GUINN KEITH V., SCHAFFNER JAMES H.
Принадлежит: HRL Laboratories, LLC, GUINN KEITH V, SCHAFFNER JAMES H, LYNCH JONATHAN, HRL LAB LLC, GUINN KEITH V., SCHAFFNER JAMES H., HRL LABORATORIES, LLC

A millimeter wave module for providing one pixel having a pixel resolution in a millimeter wave focal plane array includes a horn antenna having a first cross section area less than or equal to the pixel resolution, a detector for detecting the millimeter wave signals received by the horn antenna, the detector mounted in a recess in the horn antenna and having a second cross section area less than or equal to the first cross section area, and a video output adapter connected to the horn antenna and electrically connected to the detector for providing a connection from the detector, the video output adapter having a third cross section area less than or equal to the first cross section area.

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Номер записи: 8
11-06-2002 дата публикации

Patch antenna

Номер: US0006404389B1
Автор: John Philip Franey, Keith V. Guinn, Louis Thomas Manzione, Ming-Ju Tsai, FRANEY JOHN PHILIP, GUINN KEITH V, MANZIONE LOUIS THOMAS, TSAI MING-JU, GUINN KEITH V.
Принадлежит: Lucent Technologies Inc., LUCENT TECHNOLOGIES INC, LUCENT TECHNOLOGIES INC.

An inexpensive, easy to assemble patch antenna is disclosed where unwanted polarizations in the transmitted RF energy are minimized. A feedboard, spacer and resonator are held in a compressed relationship by two halves of the antenna housing. The spacer is a thermo-formed sheet with semi-spherical spacers. The spacers have a height that provides the desired spacing between the feedboard and the resonator.

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Номер записи: 9
30-08-2011 дата публикации

Metal foil interconnection of electrical devices

Номер: US0008009439B2
Автор: Keith V. Guinn, GUINN KEITH V, GUINN KEITH V.
Принадлежит: Raytheon Company, RAYTHEON CO, RAYTHEON COMPANY

An electrical assembly (300, 400) includes a power IC such as a MOSFET (112, 412) attached to a substrate module (114, 214). The MOSFET includes a top surface comprising first and second conductive device surfaces (A, B), associated with first and second device ports, and a bottom surface comprising a third conductive device surface C associated with a third device port. A first foil element is bonded to the first conductive device surface(s) A and to each of the first conductive substrate surfaces (A1, A2) and provides a continuous conductive pathway from each conductive surface (A) to each other conductive surface (A) and to each conductive surface (A1, A2). A second foil element is bonded to the second conductive device surface(s) B and to the second conductive substrate surface B1 and provides a continuous conductive pathway from each device conductive surface (B) to the substrate conductive surface (B1). A third foil element may be installed to electrically interconnect the discrete ...

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Номер записи: 10
18-06-2002 дата публикации

Patch antenna using non-conductive thermo form frame

Номер: US0006407704B1
Автор: John Philip Franey, Keith V. Guinn, Louis Thomas Manzione, Ming-Ju Tsai, FRANEY JOHN PHILIP, GUINN KEITH V, MANZIONE LOUIS THOMAS, TSAI MING-JU, GUINN KEITH V.
Принадлежит: Lucent Technologies Inc., LUCENT TECHNOLOGIES INC, LUCENT TECHNOLOGIES INC.

A patch antenna's resonators are supported by a non-conductive frame. The frame supports the resonators without making holes in the resonators and thereby avoids the problem of creating unwanted electric field polarizations. Additionally, the frame grasps the resonators in areas of low current density and thereby avoids creating additional disturbances in the radiation pattern. In one embodiment of the invention, the frame includes a perimeter lip that snaps over the edges of the feedboard and thereby attaches the frame to the feedboard.

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Номер записи: 11
07-06-2011 дата публикации

Multi-layered integrated circuit and apparatus with thermal management and method

Номер: US0007956381B1
Автор: Peter D. Brewer, Keith V. Guinn, Jonathan J. Lynch, BREWER PETER D, GUINN KEITH V, LYNCH JONATHAN J, BREWER PETER D., GUINN KEITH V., LYNCH JONATHAN J.
Принадлежит: HRL Laboratories, LLC, HRL LAB LLC, HRL LABORATORIES, LLC

A multi-layered semiconductor apparatus capable of producing at least 500 W of continuous power includes at least two device substrates arranged in a stack. Each of the at least two device substrates has a first side and a second side opposite to the first side, and each of the at least two device substrates is configured to produce an average power density higher than 100 W/cm2. A plurality of active devices are provided on the first side of each of the at least two device substrates. The plurality of active devices are radiatively coupled among the at least two device substrates. At least one of the at least two device substrates is structured to provide a plurality of cavities on its second side to receive corresponding ones of the plurality of active devices on the first side of an adjacent one of the at least two device substrates.

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Номер записи: 12
17-11-2011 дата публикации

Metal foil interconnection of electrical devices

Номер: US20110278350A1
Автор: Keith V. Guinn, GUINN KEITH V, GUINN KEITH V.
Принадлежит:

An electrical assembly (300, 400) includes a power IC such as a MOSFET (112, 412) attached to a substrate module (114, 214). The MOSFET includes a top surface comprising first and second conductive device surfaces (A, B), associated with first and second device ports, and a bottom surface comprising a third conductive device surface C associated with a third device port. A first foil element is bonded to the first conductive device surface(s) A and to each of the first conductive substrate surfaces (A1, A2) and provides a continuous conductive pathway from each conductive surface (A) to each other conductive surface (A) and to each conductive surface (A1, A2). A second foil element is bonded to the second conductive device surface(s) B and to the second conductive substrate surface B1 and provides a continuous conductive pathway from each device conductive surface (B) to the substrate conductive surface (B1). A third foil element may be installed to electrically interconnect the discrete ...

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Номер записи: 13
15-05-2001 дата публикации

Patch antenna construction

Номер: US0006232923B1
Автор: Keith V. Guinn, George John Shevchuk, Yiu-Huen Wong, GUINN KEITH V, SHEVCHUK GEORGE JOHN, WONG YIU-HUEN, GUINN KEITH V.
Принадлежит: Lucent Technologies Inc., LUCENT TECHNOLOGIES INC, LUCENT TECHNOLOGIES INC.

The conductive layers corresponding to a patch antenna are formed on a single substrate, as by printing a conductive ink. The substrate is in the form of an elongated, non-conductive, flexible sheet with the consecutive antenna layers printed thereon side-by-side. The layers of the antenna can then be brought into superposed alignment by appropriate folding of the sheet. The non-conductive rectangles can be maintained in spaced alignment to the cut-outs by placing a porous non-conductive block of spacing material therebetween. In a preferred embodiment the assembled structure has the various layers bonded together.

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Номер записи: 14
13-01-2004 дата публикации

Connector for differential-mode transmission line providing virtual ground

Номер: US0006677832B1
Автор: Keith V. Guinn, Louis Thomas Manzione, Ming-Ju Tsai, Hui Wu, GUINN KEITH V, MANZIONE LOUIS THOMAS, TSAI MING-JU, WU HUI, GUINN KEITH V.
Принадлежит: Lucent Technologies Inc., LUCENT TECHNOLOGIES INC, LUCENT TECHNOLOGIES INC.

An electrical connecting element is disclosed comprised of a dielectric substrate having two conductor paths disposed on opposite sides and being substantially aligned with one another. The electrical connecting element employs differential-mode signaling such that the first conductor path carries a signal of opposite polarity to the second conductor path. A virtual ground exists between the differential + and - lines that permits an otherwise "groundless" differential transmission line. The substantial alignment of the first and second conductor paths improves the space constraints, relative to conventional electrical connecting elements. The characteristic impedance of the disclosed differential transmission line depends on the width of the trace lines the thickness of the dielectric substrate.

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Номер записи: 15
17-08-2017 дата публикации

COOLING APPARATUS FOR DIODE-LASER BARS

Номер: US20170237231A1
Автор: GUINN Keith V.
Принадлежит:

A cooler for diode-laser bars comprises a machined base including a water-input plenum and a water-output plenum, and a top plate on which the diode-laser bars can be mounted. A stack of three etched plates is provided between the base and first plate. The stack of etched plates is configured to provide a five longitudinally spaced-apart rows of eight laterally spaced-apart cooling-channels connected to the water-input and water-output plenums. Water flows in the cooling-channels and in thermal contact with the first plate. 1. Cooling apparatus for diode-laser bars , comprising:a base member including a water-input plenum and a water-output plenum;a first plate on which the diode-laser bars can be mounted; anda plurality N of other plates stacked between the base-member and the first plate, the N other plates configured and arranged to provide a plurality M of longitudinally spaced-apart rows, each row including laterally spaced-apart cooling-channels in fluid communication with the water-input and water-output plenums, and in thermal contact with the top plate.2. The apparatus of claim 1 , wherein N is three and the three other plates are designated second claim 1 , third claim 1 , and fourth plates claim 1 , with the second plate including the plurality M of longitudinally spaced-apart rows of laterally spaced-apart cooling-channels and in contact with the first plate claim 1 , and with the third and fourth plates providing fluid communication between the water-input and water-output plenums and the rows of cooling-channels.3. The apparatus of claim 2 , wherein the fourth plate is in contact with the base member and includes M longitudinally spaced-apart inlet-apertures adjacent one edge thereof and M of longitudinally spaced-apart outlet-apertures adjacent an opposite edge thereof claim 2 , the inlet-apertures and outlet-apertures aligned respectively with the inlet-plenum and the output-plenum and in fluid communication therewith.4. The apparatus of claim 3 , ...

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Номер записи: 16
07-05-2003 дата публикации

Patch antenna using non-conductive thermo-formed frame

Номер: EP1094543A3
Автор: John Philip Franey, Keith V. Guinn, Louis Thomas Manzione, Ming-Ju Tsai
Принадлежит: Lucent Technologies Inc

A patch antenna's resonators (116, 118) are supported by a non-conductive frame (124). The frame supports the resonators without making holes in the resonators and thereby avoids the problem of creating unwanted electric field polarizations. Additionally, the frame grasps the resonators in areas of low current density and thereby avoids creating additional disturbances in the radiation pattern. In one embodiment of the invention, the frame includes a perimeter lip (164) that snaps over the edges of the feedboard (130) and thereby attaches the frame to the feedboard.

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Номер записи: 17
17-08-2017 дата публикации

Cooling apparatus for diode-laser bars

Номер: WO2017139077A1
Автор: Keith V. Guinn
Принадлежит: Coherent, Inc.

A cooler for diode-laser bars comprises a machined base including a water- input plenum and a water-output plenum, and a top plate on which the diode-laser bars can be mounted. A stack of three etched plates is provided between the base and first plate. The stack of etched plates is configured to provide a five longitudinally spaced- apart rows of eight laterally spaced-apart cooling-channels connected to the water-input and water-output plenums. Water flows in the cooling-channels and in thermal contact with the first plate.

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Номер записи: 18
04-06-2009 дата публикации

Metal foil interconnection of electrical devices

Номер: US20090140427A1
Автор: Keith V. Guinn
Принадлежит: Raytheon Co

An electrical assembly ( 300, 400 ) includes a power IC such as a MOSFET ( 112, 412 ) attached to a substrate module ( 114, 214 ). The MOSFET includes a top surface comprising first and second conductive device surfaces (A, B), associated with first and second device ports, and a bottom surface comprising a third conductive device surface C associated with a third device port. A first foil element is bonded to the first conductive device surface(s) A and to each of the first conductive substrate surfaces (A 1 , A 2 ) and provides a continuous conductive pathway from each conductive surface (A) to each other conductive surface (A) and to each conductive surface (A 1, A 2 ). A second foil element is bonded to the second conductive device surface(s) B and to the second conductive substrate surface B 1 and provides a continuous conductive pathway from each device conductive surface (B) to the substrate conductive surface (B 1 ). A third foil element may be installed to electrically interconnect the discrete second device surfaces (B). The foil elements reduce interconnection parasitics and reduce charge and thermal energy density at device conductive surfaces as compared to wire bonded electrical interconnections. The foil elements may be comprised of formed metal elements that are flexible but sufficiently rigid to hold a formed shape or flexible foils supported on a flexible dielectric substrate.

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Номер записи: 19
13-03-2018 дата публикации

Cooling apparatus for diode-laser bars

Номер: US09917413B2
Автор: Keith V. Guinn
Принадлежит: Coherent Inc

A cooler for diode-laser bars comprises a machined base including a water-input plenum and a water-output plenum, and a top plate on which the diode-laser bars can be mounted. A stack of three etched plates is provided between the base and first plate. The stack of etched plates is configured to provide a five longitudinally spaced-apart rows of eight laterally spaced-apart cooling-channels connected to the water-input and water-output plenums. Water flows in the cooling-channels and in thermal contact with the first plate.

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Номер записи: 20
17-01-2017 дата публикации

Microtruss based thermal heat spreading structures

Номер: US09546826B1
Автор: Adam F. Gross, Alan J. Jacobsen, David Kisailus, Keith V. Guinn, William B. Carter
Принадлежит: HRL LABORATORIES LLC

A heat transport structure is provided having a structural microtruss wick with a thermal transport medium associated with the microtruss wick for thermal energy transport by fluid and vapor transport between a heat source and a heat sink.

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Номер записи: 21