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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 8. Отображено 8.
14-04-2023 дата публикации

Wafer level chip packaging method and packaging structure

Номер: CN115966476A
Автор: LIU ZAIFU, GUO RUILIANG, JIAO JIE
Принадлежит:

The embodiment of the invention provides a wafer-level chip packaging method and packaging structure. The packaging method comprises the following steps: respectively providing a carrier plate, a chip and a cooling fin; wherein the first surface of the chip is provided with a conductive bump; forming a circuit layer on the first surface of the carrier plate; fixing the first surface of the chip on the first surface of the carrier plate, so that the conductive bumps are electrically connected with the circuit layer; forming a plastic package layer on the first surface of the carrier plate and the second surface of the chip; fixing a radiating fin on the second surface of the chip to form a packaging body; and cutting the packaging body to form a plurality of independent chip packaging structures. The wafer-level packaging technology is adopted to fix the cooling fin on the chip at a time, the mounting efficiency is high, warping generated in the mounting process is reduced, and the chip ...

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Номер записи: 1
09-06-2023 дата публикации

2.5 D packaging structure

Номер: CN116247010A
Автор: LIU ZAIFU, GUO RUILIANG, JIAO JIE
Принадлежит:

The invention provides a 2.5 D packaging structure and a manufacturing method. The 2.5 D packaging structure comprises a substrate, a first rewiring layer, a first chip, a second rewiring layer, an intermediate layer, a second chip and a third chip, a concave cavity is formed in the upper surface of the substrate, and a first rewiring layer is arranged on the upper surface of the substrate; the first rewiring layer is electrically connected with the interposer, and the first chip is electrically connected with the interposer through the second rewiring layer; the second chip is arranged on one side, far away from the substrate, of the first rewiring layer; the side, close to the first rewiring layer, of the second chip is electrically connected with the first rewiring layer, and the side, away from the second chip, of the third chip is connected with the first rewiring layer through a wire. The 2.5 D packaging structure has the advantages that the assembling technology of the 2.5 D packaging ...

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Номер записи: 2
08-08-2023 дата публикации

Packaging method and packaging structure of stacked chips

Номер: CN116564886A
Автор: LIU ZAIFU, GUO RUILIANG, JIAO JIE
Принадлежит:

The embodiment of the invention provides a packaging method and a packaging structure for stacked chips. The method comprises the following steps: fixing a first chip on a substrate; fixing the side, on which the plastic packaging layer is formed, of the preset packaging body to the first chip; fixing an adapter plate on a packaging substrate of a preset packaging body, wherein the adapter plate is electrically connected with the packaging substrate; sequentially stacking and fixing a plurality of second chips on the adapter plate, wherein the plurality of second chips are electrically connected with the adapter plate; electrically connecting the adapter plate with the substrate through a bonding wire; a plastic package body is formed on one side, facing the adapter plate, of the substrate; and forming a signal output layer on one side, deviating from the first chip, of the substrate. The adapter plate is electrically connected with the substrate of the preset packaging body, so that rapid ...

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Номер записи: 3
09-05-2023 дата публикации

Semiconductor structure and manufacturing method thereof

Номер: CN116093065A
Автор: LIU ZAIFU, GUO RUILIANG, JIAO JIE
Принадлежит:

The invention discloses a semiconductor structure and a manufacturing method thereof, and the semiconductor structure comprises a substrate, a re-wiring layer laid on the substrate, a conductive column embedded in the re-wiring layer, and an electric connecting wire or wire used for electrically connecting the re-wiring layer with the substrate. According to the scheme, high-density wire arrangement can be achieved, the number of working procedures is reduced, the packaging thickness is reduced, and the electric signal transmission performance is improved.

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Номер записи: 4
29-08-2023 дата публикации

Fan-out chip packaging method and packaging device

Номер: CN116666230A
Автор: LIU ZAIFU, GUO RUILIANG, JIAO JIE
Принадлежит:

The embodiment of the invention provides a fan-out chip packaging method and device, and the method comprises the steps: providing a carrier plate, a first chip and a second chip, and enabling the first chip to be provided with a conductive connection structure penetrating through the thickness of the first chip; fixing the first surface of the first chip on the carrier plate; forming a passivation layer on the surface, facing the first chip, of the carrier plate, wherein the passivation layer wraps the first chip; forming a conductive column penetrating through the thickness of the passivation layer on the passivation layer; a second chip is connected to the second surface of the first chip and the side, away from the carrier plate, of the passivation layer; and removing the carrier plate and forming a signal output layer on the first surface of the first chip and the surface, deviating from the second chip, of the passivation layer. According to the packaging method, the packaging process ...

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Номер записи: 5
01-08-2023 дата публикации

Packaging body evaluation method, analysis device and computer readable storage medium

Номер: CN116519797A
Автор: HAN JUN, NING FUYING, GUO RUILIANG
Принадлежит:

The invention discloses a packaging body evaluation method, an analysis device and a computer readable storage medium, a packaging body comprises a chip, a heat dissipation material and a heat dissipation cover which are stacked, a first interface is correspondingly arranged between the heat dissipation material and the heat dissipation cover, and a second interface is correspondingly arranged between the heat dissipation material and the chip. The method comprises the following steps: respectively scanning a first interface, a second interface and a packaging body by utilizing ultrasonic waves to obtain a first scanning graph corresponding to the first interface, a second scanning graph corresponding to the second interface and a third scanning graph corresponding to the packaging body; wherein the first interface, the second interface and the packaging body correspond to respectively matched ultrasonic scanning modes; based on the first scanning image, the second scanning image and the ...

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Номер записи: 6
06-06-2023 дата публикации

Volume steel content calculation method and device, computer equipment and storage medium

Номер: CN116227270A
Автор: YANG FENGSONG, GAO PENG, CHEUNG WAITUNG, GUO RUILIANG, LI FUJUN, HU XIAOJING, ZHAO DONGMING, YAN YUN, WANG FEI, ZHAO SHENGLIN, SUN YINGMING
Принадлежит:

The invention provides a volume steel content calculation method and device, computer equipment and a storage medium, and the method comprises the steps: obtaining a finite element calculation model of a target building, the finite element calculation model comprising a wallboard unit and a beam column unit; the reinforcement result of the target building is extracted, and the unit volume reinforcement ratios corresponding to the wallboard units and the beam-column units are calculated respectively; based on the preset wallboard unit volume, the preset beam-column unit volume and the preset unit volume reinforcement ratio, the tie bar reinforcement amount and the longitudinal bar reinforcement amount corresponding to the wallboard unit and the beam-column unit are calculated respectively, and the reinforcement total weight is calculated; based on the total weight of the reinforcing bars, the volume of the wallboard unit and the volume of the beam-column unit, the volume steel content corresponding ...

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Номер записи: 7
28-07-2023 дата публикации

Processor frame assembling equipment

Номер: CN116493933A
Автор: XU GANG, LU YUHUA, ZHU JUN, GUO RUILIANG
Принадлежит:

The invention discloses a processor frame assembling device which comprises a lathe bed platform, a processor carrying disc conveying device, a product carrying disc conveying device, a first mechanical arm, a second mechanical arm and an assembling module. The assembling module comprises a mounting plate, a frame mounting bin, a first carrying table, a first carrying table driving piece, a second carrying table, a third carrying table, a sliding support, a sliding support driving piece, a frame grabbing head and a frame press-fitting device. The first mechanical arm can convey a processor on a carrying disc of the processor carrying disc conveying device to the third carrying table. And the second manipulator can convey the pressed products to a carrying disc of the product carrying disc conveying device. The processor frame assembly equipment provided by the invention can better support the assembly of processors and frames of server products with different models and different generations ...

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Номер записи: 8