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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 10. Отображено 10.
31-12-2008 дата публикации

Image sensing module having crystal three-dimensional stacking construction

Номер: CN0101335267A
Автор: SHUMING ZHANG, ZIYING GUO, JIAWEN JIANG, XIANGHONG ZHANG, ZHANG SHUMING, GUO ZIYING, JIANG JIAWEN, ZHANG XIANGHONG
Принадлежит:

The invention provides an image sensing module with a crystal-grain three-dimensional stacked structure, in which at least one through hole of an image sensing crystal grain and an interlayer hole of an insulating layer under the through hole are filled with conductive materials so as to lead the image sensing crystal grain to establish vertical electrical break-over with the an image processing crystal grain buried in the insulating layer and form a solder balling bump on the back of the image sensing module, thus ensuring that the image sensing module can be directly assembled on a circuit board. The image sensing module of the invention has wafer-level packaging structure and the features of crystal-grain three-dimensional stack, can shorten the distance of electrical connection and reduce the overall assembled area and height of the image sensing module.

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Номер записи: 1
07-07-2023 дата публикации

Implant with multi-dimensional cross-scale composite microstructure and preparation method thereof

Номер: CN116392228A
Автор: WANG CHENGYONG, YUAN HUILU, GUO ZIYING, ZHANG ZHILEI, WU MAOZHONG, LIU ZHIHUA, ZHU XINNA
Принадлежит:

The invention relates to the technical field of medical instruments, in particular to an implant with a multi-dimensional cross-scale composite microstructure and a preparation method of the implant. The implant comprises an implant body, a composite microstructure is constructed on the implant body, the composite microstructure is formed by combining microstructures of at least two sizes, the microstructures are any one of millimeter-level structures, micron-level structures or nanometer-level structures, the microstructures of the small sizes can be located on the faces of the microstructures of the large sizes, and the microstructures of the small sizes can be located on the faces of the microstructures of the large sizes. According to the implant, by controlling the microstructure of the implant, the implant effectively promotes tissue damage repair and regulates and controls the cell production environment, and the repair function of the implant is improved.

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Номер записи: 2
20-04-2011 дата публикации

3D conduction structure and manufacturing method thereof

Номер: CN0101651122B
Автор: XIANGHONG ZHANG, SHUMING ZHANG, ZIYING GUO, YUANZHANG LI, ZHANG XIANGHONG, ZHANG SHUMING, GUO ZIYING, LI YUANZHANG
Принадлежит:

The invention discloses a 3D conduction structure for packages. The 3D conduction structure comprises a substrate, a first redistribution conductor, a second redistribution conductor and an insulation material. The substrate has an active surface and a passive surface which is relative to the active surface, and the substrate is provided with a welded gasket and a through hole, and the welded gasket is arranged on the active surface. The first redistribution conductor comprises a projection part and a bearing part, the projection part projects outwards from the active surface of the substrateand is electrically connected to the welded gasket; the bearing part is arranged outside the active surface and connected to the projection part, and the projection part and the bearing part form an accommodation space which is communicated with the through hole. The second redistribution conductor is arranged in the through hole and the accommodation space and in contact with the bearing part, and ...

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Номер записи: 3
13-04-2021 дата публикации

Drug-loaded microneedle small splint

Номер: CN212940117U
Автор: WANG CHENGYONG, ZHANG ZHILEI, GUO ZIYING, LIU ZHIHUA, 王成勇, 张智雷, 郭紫莹, 刘志华
Принадлежит: UNIV GUANGDONG TECHNOLOGY, GUANGDONG UNIVERSITY OF TECHNOLOGY, 广东工业大学

The utility model provides a small medicine-carrying microneedle clamping plate which comprises a fixing part, an attaching part and a microneedle layer. The fixing part is connected with the attaching part, the attaching part is fixedly connected with the microneedle layer, and microneedles are symmetrically arranged on the microneedle layer; a drug layer is loaded on the microneedle; the using method comprises the steps that scanning modeling is conducted on the repositioned fractured limb of a patient, and the treatment size is obtained; selecting a microneedle type; taking out the corresponding fixed part and microneedle layer according to the size requirement; when an affected limb is treated, firstly, an attaching part is printed according to modeling, and a complete microneedle small splint is formed; and finally, pressing the small splint on a set treatment position, and binding and fixing the small splint to complete primary treatment. The medicine-carrying microneedle small splint ...

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Номер записи: 4
25-07-2012 дата публикации

Chip structure, three-dimensional stacked chip packaging structure and manufacturing method thereof

Номер: CN0101587875B
Автор: JUNDE LIN, ZIYING GUO, SHUMING ZHANG, LIN JUNDE, GUO ZIYING, ZHANG SHUMING
Принадлежит:

The invention provides a vertically electrically connected three-dimensional stacked chip packaging structure and a manufacturing method thereof. At least one vertical through hole is formed in the three-dimensional stacked chip packaging structure by a silicon chip through hole technology so as to build an electric connection in the vertical direction of the three-dimensional stacked chip packaging structure; and the electricity of the three-dimensional stacked chip packaging structure is led from a first surface to a second surface opposite to the first surface by utilizing blind holes on filling pieces and the design of rerouting among the through holes. In addition, the invention utilizes conducting flip chips to cover the filling pieces jointed with each other among the chips, therebypreventing the filling pieces from rupturing and further improving the reliability of the three-dimensional stacked chip packaging structure.

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Номер записи: 5
17-02-2010 дата публикации

3D conduction structure and manufacturing method thereof

Номер: CN0101651122A
Автор: XIANGHONG ZHANG, SHUMING ZHANG, ZIYING GUO, YUANZHANG LI, ZHANG XIANGHONG, ZHANG SHUMING, GUO ZIYING, LI YUANZHANG
Принадлежит:

The invention discloses a 3D conduction structure for packages. The 3D conduction structure comprises a substrate, a first redistribution conductor, a second redistribution conductor and an insulationmaterial. The substrate has an active surface and a passive surface which is relative to the active surface, and the substrate is provided with a welded gasket and a through hole, and the welded gasket is arranged on the active surface. The first redistribution conductor comprises a projection part and a bearing part, the projection part projects outwards from the active surface of the substrateand is electrically connected to the welded gasket; the bearing part is arranged outside the active surface and connected to the projection part, and the projection part and the bearing part form an accommodation space which is communicated with the through hole. The second redistribution conductor is arranged in the through hole and the accommodation space and in contact with the bearing part, and extends ...

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Номер записи: 6
04-04-2023 дата публикации

Traffic state discrimination method and device, and medium

Номер: CN115909741A
Автор: LI ZHEN, KANG CHUANGANG, GU JIN, CHANG ZHIHONG, CUI JIAN, GUO ZIYING
Принадлежит:

The invention discloses a traffic state discrimination method comprising the following steps: determining historical traffic flow data through a road network, determining a historical feature set according to the historical traffic flow data, and determining a space mapping model according to the historical feature set; acquiring real-time traffic flow data through the road network, and performing time-space segmentation on the real-time traffic flow data to obtain target data blocks; performing feature extraction on the target data block to obtain a target feature, and sequentially matching the target feature with a historical feature set to obtain a plurality of feature pairs; and inputting the plurality of feature pairs into a space mapping model to output a plurality of similarities corresponding to the target feature, sorting the plurality of similarities to determine the maximum similarity, and determining the traffic state according to the maximum similarity. According to the invention ...

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Номер записи: 7
27-01-2010 дата публикации

Image sensing module having crystal three-dimensional stacking construction

Номер: CN0100585850C
Автор: SHUMING ZHANG, ZIYING GUO, JIAWEN JIANG, XIANGHONG ZHANG, ZHANG SHUMING, GUO ZIYING, JIANG JIAWEN, ZHANG XIANGHONG
Принадлежит:

The invention provides an image sensing module with a crystal-grain three-dimensional stacked structure, in which at least one through hole of an image sensing crystal grain and an interlayer hole of an insulating layer under the through hole are filled with conductive materials so as to lead the image sensing crystal grain to establish vertical electrical break-over with the an image processing crystal grain buried in the insulating layer and form a solder balling bump on the back of the image sensing module, thus ensuring that the image sensing module can be directly assembled on a circuit board. The image sensing module of the invention has wafer-level packaging structure and the features of crystal-grain three-dimensional stack, can shorten the distance of electrical connection and reduce the overall assembled area and height of the image sensing module.

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Номер записи: 8
25-11-2009 дата публикации

Vertically electrically connected three-dimensional stacked chip packaging structure and manufacturing method thereof

Номер: CN0101587875A
Автор: JUNDE LIN, ZIYING GUO, SHUMING ZHANG, LIN JUNDE, GUO ZIYING, ZHANG SHUMING
Принадлежит:

The invention provides a vertically electrically connected three-dimensional stacked chip packaging structure and a manufacturing method thereof. At least one vertical through hole is formed in the three-dimensional stacked chip packaging structure by a silicon chip through hole technology so as to build an electric connection in the vertical direction of the three-dimensional stacked chip packaging structure; and the electricity of the three-dimensional stacked chip packaging structure is led from a first surface to a second surface opposite to the first surface by utilizing blind holes on filling pieces and the design of rerouting among the through holes. In addition, the invention utilizes conducting flip chips to cover the filling pieces jointed with each other among the chips, thereby preventing the filling pieces from rupturing and further improving the reliability of the three-dimensional stacked chip packaging structure.

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Номер записи: 9
04-06-2014 дата публикации

Anti-cheating method and system for unattended automatic card-issuing lane

Номер: CN103839299A
Автор: WANG JIN, ZHANG WEI, MA XIAOGANG, GUO ZIYING, LIU SHIGUO, PAN YONG, LIU ZHONGDI
Принадлежит:

The invention relates to an anti-cheating method and system for an unattended automatic card-issuing lane. By the adoption of the anti-cheating method and system for the unattended automatic card-issuing lane, cheating behaviors can be effective prevented. According to the anti-cheating method for the unattended automatic card-issuing lane, after a vehicle is driven into the lane, an existing coil is triggered firstly, and an industrial personal computer in an automatic card-issuing machine controls a license plate recognizer to snapshot and recognize the license plate of the vehicle; a driver presses a card getting key to request for a card, and the automatic card-issuing machine conducts card-issuing operation; after the driver gets the card, if the vehicle does not pass through a loading coil I located on an automatic barrier within the preset time ranging from 10 seconds to 60 seconds or if after the vehicle is driven to the position above the loading coil I and triggers the loading ...

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Номер записи: 10