Built-in substrate inspection method

The present invention provides a built-in substrate inspection method, which can effectively eliminate the influences, such as stray capacitance, etc., among the wirings in a detecting clamp, and the influences of the electrostatic capacitance among the wirings in the built-in substrate, and can detect the detection objects parts in the built-in substrate accurately. For example, on the condition that a capacitor (C1) is set as a cared detection object part, the probes (P1, P2, P5-P7) contacted with the detection points (D1, D2) which are set as the first selection detection points and the detection points (D5-D7) which are set as the first potential adjustment points, are electrically connected with a first output terminal of a power part. In addition, a probe (P4) contacted with a detection point which is set as a second selection points (D4) is electrically connected with a second output terminal of the power part (4), and the probes (P3, P8-P10) contacted with the detection points which ...

Metal base substrate, power module, and method for manufacturing metal base substrate

A metal base substrate of the present invention includes a copper plate made of copper, a metal layer that is formed on the copper plate and is made of a metal different from the copper, an insulating resin sheet that is formed by bonding a sheet made of an insulating resin onto the metal layer, and a circuit pattern formed on the insulating resin sheet.

VEHICLE ROOF STRUCTURE AND METHOD FOR MANUFACTURING VEHICLE ROOF STRUCTURE

The vehicle roof structure includes: a closely facing section that abuts or is adjacent to a side outer panel; a negative curved-surface section that is positioned more inwards in the vehicle width direction than the closely facing section of the roof panel, and has a recessed face that is indented downwards; and a mounting surface that is formed in the side outer panel at an inner side in the vehicle width direction to downwards of the vehicle towards, and at which the closely facing section abuts or is adjacent, in which an edge, on a side of the roof panel, of the brazing material that has solidified to join the roof panel and the side outer panel is positioned on the negative curved-surface section. 1. A vehicle roof structure having a roof panel and side outer panel joined by a brazing material , the vehicle roof structure comprising:a closely facing section that is positioned at both side parts in a vehicle width direction of the roof panel, and abuts or is adjacent to the side outer panel;a negative curved-surface section that is positioned more inwards in the vehicle width direction than the closely facing section of the roof panel, and has a recessed face that is indented downwards; anda mounting surface that is formed in the side outer panel at an inner side in the vehicle width direction to downwards of the vehicle, and at which the closely facing section abuts or is adjacent,wherein an edge, on a side of the roof panel, of the brazing material that has solidified to join the roof panel and the side outer panel is positioned on the negative curved-surface section.2. A method for manufacturing a vehicle roof structure having a roof panel and a side outer panel joined by a brazing material , the method comprising:a roof panel formation step of providing, to the roof panel, a closely facing section that is positioned on both side parts in a vehicle width direction of the roof panel and abuts or is adjacent to the side outer panel, and a negative curved- ...

Inspection jig

The present invention is to solve a problem of providing an inspection jig, which prevents that electronic components embedded in a substrate are damaged due to over voltage. To solve the problem, the present invention provides a substrate inspection device and an inspection jig, the substrate inspection device is used for electrically checking wiring formed on a component-embedded type substrate with built-in components, and the inspection jig is electrically connected with the component-embedded type substrate. The inspection jig is characterized by comprising: a plurality of rod-shaped contact members, one ends of which are abutted and electrically connected with a plurality of check points in the wiring of the substrate, a plurality of wiring portions respectively electrically connected with the plurality of contact members, and a voltage clamp unit used for setting a predetermined voltage across the inspection point contact members at one end of the wiring comprising electronic components ...

Semiconductor device

Semiconductor device

Semiconductor device and method of manufacture thereof

A semiconductor device includes an insulating substrate, a wiring pattern formed on the insulating substrate, a semiconductor chip secured to the wiring pattern, a junction terminal formed of the same material as the wiring pattern and electrically connected to the semiconductor chip, one end of the junction terminal being secured to the insulating substrate, the other end of the junction terminal extending upward away from the insulating substrate, and a control circuit for transmitting a control signal for the semiconductor chip, the control circuit being electrically connected to the junction terminal.

Process for producing an aluminum alloy sheet for motor vehicle

An aluminum alloy sheet for motor vehicles is produced by casting a melt, containing 3.0-3.5 mass % Mg, 0.05-0.3 mass % Fe, 0.05-0.15 mass % Si, and less than 0.1 mass % Mn, a balance substantially being inevitable impurities and Al, into a slab having a thickness of 5 to 15 mm in a twin-belt caster so that cooling rate at ¼ depth of thickness of the slab is 20 to 200° C./sec; winding the cast thin slab into a coiled thin slab subjected to cold rolling with a roll having a surface roughness of 0.2 to 0.7 μm Ra at a cold rolling reduction of 50 to 98%; subjecting the cold rolled sheet to final annealing either continuously in a CAL at a holding temperature of 400 to 520° C. within 5 minutes or in a batch annealing furnace at a holding temperature of 300 to 400° C. for 1 to 8 hours; and subjecting the resulting sheet to straightening with a leveler.

Terminal discrimination method and terminal discrimination device of built-in substrate

The invention provides a terminal discrimination method of a built-in substrate electronic part, and the method can determine the types of terminals of an electronic part arranged in a part built-in substrate. Aimd at the combination of all terminal pairs of the terminals (T1-T6) of the electronic part (8) arranged in a part built-in substrate (7), currents among the terminals are made to be switched along two feeding directions opposite to each other and are changed to be current feeding levels. Based on each of the two feeding directions and each of the current feeding levels, a level difference between each two terminals is detected during current feeding to serve as a detection potential difference value. Based on the detection result, one of the terminals of the electronic part (8), meeting the following condition, is determined to be a power type terminal, wherein the condition is that: a detection potential difference value on any of the two feeding directions between the terminal ...

Welding device

The present invention pertains to a welding device. The welding device (110) comprises a lower tip (132) and an upper tip (136), as welding tips, and pressuring members (138a, 138b). The pressuring members (138a, 138b) are supported by a support member (140) disposed in the upper tip (136). The pressuring members (138a, 138b) are displaced by the action of pressuring member displacement mechanisms (146a, 146b) and, together with the upper tip (136), come into contact with a metal plate (176a) arranged on the outermost part of a laminated body (170a).

Multi-layer panel

A multi-layer panel is provided, which may eliminate local portions having low strength and low rigidity and may suppress a stress concentration to increase rigidity and strength. The multi-layer panel includes a core panel; a pair of face plates sandwiching the core panel from both sides; and a beam member. The core panel has a standing portion extending in a direction intersecting with a surface of the multi-layer panel, and a flange formed in a manner of extending from a most outside end of the standing portion along a first one of the face plate. The beam member includes a portion with the rectangular cross section disposed so as to clamp the flange of the core panel with the first face plate.

Resistance welding method

A resistance welding method for welding a stack of three or more workpieces. The method includes the steps of holding a first welding tip in abutment against a first outermost workpiece, holding a second welding tip in abutment against a second outermost workpiece, and holding a pressing member in abutment against the first outermost workpiece. The method also includes the steps of gripping the stacked assembly with the first welding tip, the second welding tip, and the pressing member and passing an electric current between the first welding electrode and the second welding electrode.

Semiconductor device

Semiconductor device

Fan modules and server equipment

A fan module (1) and server equipment (8) are provided that can achieve a balance between increased airflow and noise reduction when an axial flow fan (3) is mounted in the server equipment (8). The fan module (1) for taking in and discharging air includes a stator (2) located on an upstream side with respect to airflow and an axial flow fan (3) located on the downstream side. When the fan module is viewed from the rotational-axial direction of the axial flow fan (3), if a leading edge of a rotor vane (32) constituting part of the axial flow fan (3) passes a trailing edge of a stator vane (22) constituting part of the stator (2), a skew is formed in which the leading edge of the rotor vane (32) constantly intersects the leading edge of the stator vane (22) at a single point.

LAMINATED PANEL

A laminated panel is provided with: a core panel having a vertical wall portion which extends in a direction which intersects with a panel surface, and a flat portion which is formed to extend along the panel surface from an end portion of the vertical wall portion; a pair of face plates which sandwich the core panel from both sides; and a structural material in which a rectangular cross-section portion which sandwiches the flat portion of the core panel between the rectangular cross-section portion and one of the face plates is disposed. The structural material is provided with peripheral edge structural materials which are disposed along a pair of opposing edge portions of a peripheral edge of the laminated panel, and connecting structural materials which extend in a direction which intersects with the peripheral edge structural materials. 1. A laminated panel comprising:a core panel having a vertical wall portion which extends in a direction which intersects with a panel surface, and a flat portion which is formed to extend along the panel surface from an end portion of the vertical wall portion;a pair of face plates which sandwich the core panel from both sides; anda structural material in which a rectangular cross-section portion which sandwiches the flat portion of the core panel between the rectangular cross-section portion and one of the face plates is disposed,the structural material including:a peripheral edge structural material which is disposed along peripheral edges of the pair of face plates; anda connecting structural material which extends in a direction which intersects with the peripheral edge structural material.2. The laminated panel according to claim 1 , further comprisingan end covering member having a holding portion which holds ends of the pair of face plates, whereinat least one of the connecting structural material and the peripheral edge structural material is held by the holding portion of the end covering member.3. The laminated panel ...

Semiconductor module and power converter

A semiconductor module includes a case, a semiconductor component provided in the case for switching a current, encapsulating resin provided in the case for covering the semiconductor component, a magnetic shield contacting the encapsulating resin and containing a magnetic material, and an embedded magnetic shield embedded in the case, the embedded magnetic shield containing a magnetic material.

MULTI-LAYER PANEL

A multi-layer panel is provided, which may eliminate local portions having low strength and low rigidity and may suppress a stress concentration to increase rigidity and strength. The multi-layer panel includes a core panel; a pair of face plates sandwiching the core panel from both sides; and a beam member. The core panel has a standing portion extending in a direction intersecting with a surface of the multi-layer panel, and a flange formed in a manner of extending from a most outside end of the standing portion along a first one of the face plate. The beam member includes a portion with the rectangular cross section disposed so as to clamp the flange of the core panel with the first face plate. 1. A multi-layer panel comprising:a core panel;a pair of face plates configured to sandwich the core panel from both sides;and a beam member, a standing portion configured to extend in a direction intersecting with a surface of the multi-layer panel; and', 'a flat portion formed in a manner of extending along the surface of the multi-layer panel from an end of the standing portion, and, 'the core panel includingthe beam member configured to be disposed along an end of the face plate and have a portion with a rectangular cross section disposed such as to sandwich the flat portion of the core panel with a first one of the face plates.2. The multi-layer panel according to claim 1 , whereinthe beam member includes a protruding portion configured to have a shape of protruding in a direction intersecting with a surface of a corresponding one of the pair of the face plates and to have an inner side of the protruding portion abutted by an end of the corresponding one of the pair of the face plates.3. The multi-layer panel according to claim 2 , whereina protruding height of the protruding portion is less than a thickness of the corresponding one of the pair of the face plates.4. The multi-layer panel according to claim 1 , whereinthe beam member includes an exposed portion ...

Welding method and welding device

The present invention relates to a resistance welding method and a resistance welding device. A resistance welding device (10) is provided with a lower tip (32) and an upper tip (38) which serve as welding tips, and pressing rods (46a, 46b) which serve as pressing members. Among the above-mentioned elements, the upper tip (38) and the pressing rods (46a, 46b) press a stacked body (48a), which is to be welded, from the metallic plate (54a) side which is the outermost member of the stacked body (48a), and the lower tip (32) presses the stacked body (48a) from the lowermost metallic plate (50a) side. In this state, an electric current is conducted from the upper tip (38) to the lower tip (32).

Semiconductor device and method of manufacture thereof

The present invention provides a semiconductor device suitable for being manufactured at a reduced cost, and a method of manufacture thereof. The semiconductor device includes an insulating substrate, a wiring pattern formed on the insulating substrate, a semiconductor chip secured to the wiring pattern, a junction terminal formed of the same material as the wiring pattern and electrically connected to the semiconductor chip, one end of the junction terminal being secured to the insulating substrate, the other end of the junction terminal extending upward away from the insulating substrate, and a control circuit for transmitting a control signal for the semiconductor chip, the control circuit being electrically connected to the junction terminal.

SEAWATER DESALINATION SYSTEM

A seawater desalination system uses a reverse osmosis separation device. According to characteristics of a reverse osmosis membrane, the pressure or flow change rate of seawater is controlled with respect to the membrane at the start and stop of a high-pressure pump. A drive power source control device including a parallel circuit of a reduced voltage starter and a switch is connected between an electric motor for driving the pump and an AC power source. Control of the starter causes an AC voltage supplied to the motor to increase continuously during a start-up adjustment duration to asymptotically approach an AC power source voltage from zero with an upwardly-convex monotonically-increasing function, and to decrease continuously to zero during a stop adjustment duration as far as zero. The switch is closed to supply the AC voltage of the power source directly to the motor when it equals voltage supplied via the starter. 1. A seawater desalination system for carrying out desalination of seawater to thereby produce freshwater from the seawater , the seawater desalination system comprising:a high pressure pump adapted to raise pressure of the seawater to be desalinated;a separation apparatus comprising an RO membrane adapted to separate the seawater provided from the high pressure pump, into freshwater having a low salt concentration and condensed seawater having a high salt concentration;an electric motor adapted to drive the high pressure pump;a start-up and shut-down adjusting device, coupled between the electric motor and an AC power source, adapted to continuously increase an AC voltage to be supplied to the electric motor during a start-up adjusting period of the electric motor, and continuously decrease the AC voltage to be supplied to the electric motor during a shut-down adjusting period of the electric motor; anda switching circuit coupled in parallel with the start-up and shut-down adjusting device, adapted to be closed when the AC voltage to be supplied ...

Semiconductor device

Spring biased slide switch

A switch includes: a case including a bottom portion and a side wall; a fixed terminal provided on the bottom portion of the case; a supporting member provided in the case; a movable contact strip supported by the supporting member so as to be pivotable in a vertical direction above the fixed terminal; a resilient member provided between the side wall of the case and the movable contact strip, and configured to urge one end portion of the movable contact strip obliquely upward; and a pressing member provided above the resilient member. The movable contact strip pivots and an opened-closed state between the movable contact strip and the fixed terminal is switched by pressing a center portion of the resilient member downward by the pressing member.

Switch

A switch has a first leaf spring having a first contact, the first contact being formed in a V shape and including two inclined surfaces, a second leaf spring having a second contact facing the first contact, the second contact being formed in a convex shape and including vertexes facing the inclined surfaces, respectively; and a pressing unit that presses the first leaf spring or the second leaf spring. When the pressing unit presses the first leaf spring or the second leaf spring, the inclined surface on a first side of the first contact and the vertex on a first side of the second contact come in contact with each other, and the vertex on the first side of the second contact slides on the inclined surface on the first side of the first contact.

RESISTANCE WELDING METHOD AND DEVICE THEREFOR

Disclosed are a resistance welding method for welding a stack of three or more works and a device therefor. A stack is formed in such that the thinnest work having the smallest thickness among the works is placed in the outermost position. The stack is held between a first welding electrode and a second welding electrode. A pressing member is brought into contact with a location of the thinnest work different from the location with which the first welding electrode is in contact, and the pressing member is caused to press the stack from the thinnest work side. In a state that the pressing force exerted on the stack by the first welding electrode and the pressing member is balanced with the pressing force exerted on the stack by the second welding electrode, current is applied between the first welding electrode and the second welding electrode. 1. A resistance welding method for resistance-welding a stacked assembly of at least three workpieces , including a thinnest workpiece of smallest thickness disposed on an outermost side of the stacked assembly , comprising the steps of:gripping the stacked assembly with a first welding electrode and a second welding electrode, holding a pressing member in abutment against an area of the thinnest workpiece, which differs from an area against which the first welding electrode is held in abutment, and causing the pressing member to press the stacked assembly from the side of the thinnest workpiece; andpassing an electric current between the first welding electrode and the second welding electrode, while pressing forces applied from the first welding electrode and the pressing member to the stacked assembly and a pressing force applied from the second welding electrode to the stacked assembly are held in equilibrium with each other.2. The resistance welding method according to claim 1 , wherein the pressing member comprises an auxiliary electrode claim 1 , which is opposite in polarity to the first welding electrode claim 1 , ...

PACKAGE APPARATUS OF POWER SEMICONDUCTOR DEVICE

A package apparatus is for packaging a power semiconductor device that includes a substrate formed, a mold part molded on the substrate, and electrode terminals extended from the mold part to a side opposite from the substrate by a predetermined length; includes: a holding unit that has insertion slots and is to holding the power semiconductor device, the insertion slots each being an opening into which the power semiconductor device is insertable in a direction perpendicular to extending direction of the electrode, edges of the opening being formed to make contact with the mold part and the substrate; and a container box that contains the holding unit. The insertion slots are provided to the holding unit so that an interval between the insertion slots in an extending direction of the electrode terminals of the power semiconductor device inserted is greater than the extending length of the electrode terminals. 1. A package apparatus of a power semiconductor device for packaging a power semiconductor device that includes a substrate formed in a square shape , a mold part molded on the substrate in a square thick plate-like shape , and a plurality of electrode terminals extended from the mold part to a side opposite from the substrate by a predetermined length , the package apparatus comprising:a holding unit that has a plurality of insertion slots and is configured to be capable of holding the power semiconductor device, the insertion slots each being an opening into which the power semiconductor device is insertable in a direction generally perpendicular to an extending direction of the electrode terminal, edges of the opening being formed so as to make contact with the mold part and the substrate; anda container box that contains the holding unit,the plurality of insertion slots being provided to the holding unit so that an interval between the plurality of insertion slots in an extending direction of the electrode terminals of the power semiconductor device ...

LIQUID DISCHARGE HEAD

A liquid discharge head includes a recording element substrate having a discharge-port surface having a discharge port discharging a liquid, side surfaces on sides of the discharge-port surface, and a back surface of the discharge-port surface having an opening of an ink supplying port supplying ink to the discharge port; a supporting member having a depression accommodating the recording element substrate, the depression including a supporting part disposed at a bottom surface of the depression and supporting the recording element substrate with an adhesive and an opening of an ink channel communicating with the ink supplying port; and an electric wiring substrate disposed on a surface of the supporting member having the depression and having an electric connecting part connecting with a side of the discharge-port surface of the recording element substrate. 1. A liquid discharge head comprising: a discharge-port surface having a discharge port discharging a liquid,', 'side surfaces on sides of the discharge-port surface, and', 'a back surface of the discharge-port surface having an opening of an ink supplying port supplying ink to the discharge port;, 'a recording element substrate having'} a supporting part disposed at a bottom surface of the depression and supporting the recording element substrate with an adhesive and', 'an opening of an ink channel communicating with the ink supplying port; and, 'a supporting member having a depression accommodating the recording element substrate, the depression including'}an electric wiring substrate disposed on a surface of the supporting member having the depression and having an electric connecting part connecting with a side of the discharge-port surface of the recording element substrate,wherein the side surfaces of the recording element substrate includes a first side surface on a side of the discharge-port surface having the electric connecting part and a second side surface on a side of the discharge-port surface not ...

SWITCH

A switch has a first leaf spring having a first contact, the first contact being formed in a V shape and including two inclined surfaces, a second leaf spring having a second contact facing the first contact, the second contact being formed in a convex shape and including vertexes facing the inclined surfaces, respectively; and a pressing unit that presses the first leaf spring or the second leaf spring. When the pressing unit presses the first leaf spring or the second leaf spring, the inclined surface on a first side of the first contact and the vertex on a first side of the second contact come in contact with each other, and the vertex on the first side of the second contact slides on the inclined surface on the first side of the first contact. 1. A switch comprising:a first leaf spring comprising a first contact, the first contact being formed in a V shape and including two inclined surfaces;a second leaf spring comprising a second contact facing the first contact, the second contact being formed in a convex shape and including vertexes facing the inclined surfaces, respectively; anda pressing unit that presses the first leaf spring or the second leaf spring,wherein, when the pressing unit presses the first leaf spring or the second leaf spring, the inclined surface on a first side of the first contact and the vertex on a first side of the second contact come in contact with each other, the vertex on the first side of the second contact slides on the inclined surface on the first side of the first contact, and finally the inclined surface on a second side of the first contact and the vertex on a second side of the second contact come in contact with each other.2. The switch according to claim 1 , wherein central axes of the first contact and the second contact that are in parallel with a pressing direction are shifted from each other in a direction that is perpendicular to the pressing direction.3. The switch according to claim 1 , wherein claim 1 , on first ...

FAN MODULES AND SERVER EQUIPMENT

A fan module and server equipment are provided that can achieve a balance between increased airflow and noise reduction when an axial flow fan is mounted in the server equipment. 1. A fan module for taking in and discharging air , comprising:a stator located on an upstream side with respect to airflow; andan axial flow fan located on a downstream side with respect to the airflow;wherein, when the fan module is viewed from a rotational-axial direction of the axial flow fan, the stator includes a stator vane trailing edge and the axial flow fan includes a rotor vane leading edge, the trailing edge and the leading edge each having two points of intersection with two concentric circles having different diameters, andwherein a straight line connecting the two points of intersection on the trailing edge and a straight line connecting the two points of intersection on the leading edge are configured such that if, on one of the two concentric circles, one point of intersection on the trailing edge is superimposed on the point of intersection on the leading edge, on the other of the two concentric circles, the other point of intersection on the trailing edge is not coincident with the other point of intersection on the leading edge.2. The fan module according to claim 1 ,wherein the rotor vane has a tilt direction opposite to that of the stator vane.3. The fan module according to claim 1 ,wherein the stator vane constituting part of the stator is configured to be warped like a U-shape.4. The fan module according to claim 3 ,wherein the stator vane applies a reverse pre-swirl to the rotor vane.5. The fan module according to claim 1 ,wherein a second stator is disposed on the downstream side of the axial flow fan.6. The fan module according to claim 5 ,wherein a trailing edge of a stator vane constituting part of the second stator disposed on the downstream side of the axial flow fan is located at a positive position with respect to a position of a leading edge of the stator ...

HYDROGEN PRODUCTION APPARATUS AND FUEL CELL SYSTEM

A hydrogen production apparatus includes a preferential oxidation unit that preferentially oxidizes carbon monoxide in a reformed gas containing hydrogen, a vaporization flow path that passes water to generate steam, and a gas flow path through which the reformed gas passes. The gas flow path is arranged between the preferential oxidation unit and the vaporization flow path. The reformed gas passes through the gas flow path and thereafter flows into the preferential oxidation unit. 1. A hydrogen production apparatus comprising:a preferential oxidation unit preferentially oxidizing carbon monoxide in a reformed gas containing hydrogen;a vaporization flow path passing water to generate steam; anda gas flow path through which the reformed gas passes, whereinthe gas flow path is arranged between the preferential oxidation unit and the vaporization flow path, andthe reformed gas passes through the gas flow path and thereafter flows into the preferential oxidation unit.2. The hydrogen production apparatus according to further comprising an exhaust gas flow path through which an exhaust gas from a burner for use to generate the reformed gas passes claim 1 , whereinthe exhaust gas flow path is arranged at a position adjacent to the vaporization flow path on a side opposite to the gas flow path.3. The hydrogen production apparatus according to further comprising:a shift unit removing carbon monoxide in the reformed gas through a shift reaction; andan air supply unit supplying air to the reformed gas directed from the shift unit to the preferential oxidation unit, whereinthe shift unit includes an outlet discharging the reformed gas after the shift reaction, andthe air supply unit supplies the air to the reformed gas flowing out of the outlet from a direction that opposes a flow of the reformed gas.4. A fuel cell system comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'the hydrogen production apparatus according to ; and'}a fuel cell stack generating power using ...

HYDROGEN PRODUCTION APPARATUS AND FUEL CELL SYSTEM

A hydrogen production apparatus includes a burner, a combustion tube provided so as to surround flame of the burner a reforming unit provided as to surround the tube, an exhaust gas flow path provided so as to pass through between the tube and the unit, fold back at the other side of the unit, and extend through outside of the unit on a predetermined side, a low temperature shift unit provided on one of inside and outside of an extending portion of the flow path that extends on the predetermined side so as to extend along the extending portion, and a preferential oxidation unit provided on the other of the inside and the outside of the extending portion so as to extend along the extending portion. 1. A hydrogen production apparatus for generating a reformed gas containing hydrogen using a raw fuel and steam , the hydrogen production apparatus comprising:a burner;a combustion tube provided so as to surround flame of the burner and exhausting an exhaust gas of the burner from one side thereof;a reforming unit provided in a tubular shape so as to surround the combustion tube and subjecting the raw fuel and the steam to a reforming reaction to generate the reformed gas;an exhaust gas flow path provided in a tubular shape so as to pass through between the combustion tube and the reforming unit, fold back at the other side of the reforming unit, and extend through outside of the reforming unit on a predetermined side, the exhaust gas flow path passing the exhaust gas exhausted from the one side of the combustion tube;a low temperature shift unit provided in a tubular shape on one of inside and outside of an extending portion of the exhaust gas flow path that extends on the predetermined side so as to extend along the extending portion, the low temperature shift unit subjecting the reformed gas generated in the reforming unit to a shift reaction to reduce a carbon monoxide concentration in the reformed gas; anda preferential oxidation unit provided in a tubular shape on ...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF

A semiconductor device includes an insulating substrate, a wiring pattern formed on the insulating substrate, a semiconductor chip secured to the wiring pattern, a junction terminal formed of the same material as the wiring pattern and electrically connected to the semiconductor chip, one end of the junction terminal being secured to the insulating substrate, the other end of the junction terminal extending upward away from the insulating substrate, and a control circuit for transmitting a control signal for the semiconductor chip, the control circuit being electrically connected to the junction terminal. 1. A semiconductor device comprising:an insulating substrate;a wiring pattern formed on said insulating substrate;a semiconductor chip secured to said wiring pattern;a junction terminal formed of the same material as said wiring pattern and electrically connected to said semiconductor chip, one end of said junction terminal being secured to said insulating substrate, the other end of said junction terminal extending upward away from said insulating substrate; anda control circuit for transmitting a control signal for said semiconductor chip, said control circuit being electrically connected to said junction terminal.2. The semiconductor device according to claim 1 , further comprising:a power terminal formed of the same material as said wiring pattern and electrically connected to said semiconductor chip, one end of said power terminal being secured to said insulating substrate, the other end of said power terminal extending upward away from said insulating substrate.3. A semiconductor device comprising:an insulating substrate;a wiring pattern formed on said insulating substrate and including a first wiring pattern, a second wiring pattern, and a third wiring pattern;a semiconductor chip secured to said first wiring pattern;a junction terminal electrically connected to said semiconductor chip, one end of said junction terminal being embedded in said second wiring ...

COOLING SYSTEM FOR ELECTRONIC DEVICE

The cooling system includes: a frame; a plurality of electronic devices disposed in the frame and operating or functioning independently from each other; fans disposed in the frame and supplying cooling air to the electronic devices; a temperature acquiring portion for acquiring the temperature of the cooling air; an air-flow resistance adjusting portion for adjusting the air-flow resistance to the cooling air; and a controller for controlling the fans and the each air-flow resistance adjusting portion. The controller determines each target cooling air volume required for cooling each electronic device to a predetermined temperature based on temperature information acquired by the temperature acquiring portion and heat generation information on each electronic device, controls each air-flow resistance adjusting portion to set the volume of cooling air to each target cooling air volume, and performs the drive control of the fans to set the volume of cooling air to the minimum necessary. 1. A cooling system for an electronic device comprising:a frame;a plurality of electronic devices disposed in the frame and operating or functioning independently from each other;a fan disposed in the frame and supplying cooling air to the plurality of electronic devices for cooling the plurality of electronic devices;a temperature acquiring portion disposed in the frame and acquiring temperature information of the cooling air supplied to each of the electronic devices;an air-flow resistance adjusting portion disposed in the frame and adjusting the resistance to a flow of the cooling air supplied to the each electronic device; anda controller for controlling the fan and the each air-flow resistance adjusting portion,wherein the controller determines each target cooling air volume required for cooling the each electronic device to a predetermined temperature based on temperature information acquired by the temperature acquiring portion and heat generation information on the each ...

WELDING METHOD AND WELDING DEVICE

A resistance welding device is provided with a lower tip and an upper tip that serve as welding tips, and pressing rods that serve as pressing members. The upper tip and the pressing rods press a stacked body, which is to be welded, from the metallic plate side, which is the outermost member of the stacked body. The lower tip presses the stacked body from the lowermost metallic plate side. In this state, and electric current is conducted from the upper tip to the lower tip. 1. A resistance welding method for carrying out resistance welding with respect to a stacked body formed by stacking a plurality of workpieces , comprising the steps of:sandwiching the stacked body between a first welding tip and a second welding tip, while bringing a pressing member into abutment against an outermost workpiece, which is positioned on an outermost portion of the stacked body and against which the first welding tip is in abutment, the stacked body being pressed from a side of the outermost workpiece by the pressing member; andconducting an electric current between the first welding tip and the second welding tip while maintaining a pressure by the pressing member.2. The resistance welding method according to claim 1 , wherein the pressing member comprises an auxiliary electrode having a polarity opposite to that of the first welding tip claim 1 , such that when electric current is conducted between the first welding tip and the second welding tip claim 1 , a branching current is made to flow either from the first welding tip to the auxiliary electrode claim 1 , or from the auxiliary electrode to the first welding tip.3. The resistance welding method according to claim 2 , wherein another auxiliary electrode claim 2 , which has a polarity opposite to that of the second welding tip claim 2 , is provided on a side of the second welding tip claim 2 , such that after either one of the branching current that flows from the first welding tip to the auxiliary electrode or the branching ...

WELDING DEVICE

A welding device includes a lower tip and an upper tip, as welding tips, and pressuring members. The pressuring members are supported by a support member disposed in the upper tip. The pressuring members are displaced by the action of pressuring member displacement mechanisms and, together with the upper tip, come into contact with a metal plate arranged on the outermost part of a laminated body. 1. A spot welding apparatus for spot welding a stacked body of a plurality of workpieces including the outermost workpiece , comprisinga first welding tip and a second welding tip, between which the stacked body is interposed,a pressing member for pressing the outermost workpiece of the stacked body body, the first welding tip and the pressing member being brought into contact with different portions of the outermost workpiece, anda holder for holding the first welding tip and the pressing member, which is displaced by a holder displacement mechanism,wherein the holder has a pressing member displacement mechanism for displacing the pressing member, andthe pressing member displacement mechanism is electrically isolated from the holder.2. The spot welding apparatus according to claim 1 , wherein the pressing member acts as an auxiliary electrode claim 1 , the auxiliary electrode has a polarity opposite to that of the first welding tip claim 1 , and a branching current is made to flow either from the first welding tip to the auxiliary electrode claim 1 , or from the auxiliary electrode to the first welding tip claim 1 , when electric current is conducted between the first welding tip and the second welding tip.3. The spot welding apparatus according to claim 2 , further comprising another auxiliary electrode disposed in a vicinity of the second welding tip claim 2 , wherein the other auxiliary electrode has a polarity opposite to that of the second welding tip claim 2 , and after the branching current from the first welding tip to the auxiliary electrode or from the auxiliary ...

SEAWATER DESALINATION SYSTEM AND ENERGY RECOVERY APPARATUS

A seawater desalination system for desalinating seawater by removing salinity from the seawater and an energy recovery apparatus which is preferably used in the seawater desalination system. The energy recovery apparatus includes a cylindrical chamber being installed such that a longitudinal direction of the chamber is placed in a vertical direction, a concentrated seawater port for supplying and discharging the concentrated seawater, a seawater port for supplying and discharging the seawater, a flow resistor provided at a concentrated seawater port side in the chamber, and a flow resistor provided at a seawater port side in the chamber. Each of the flow resistor provided at the concentrated seawater port side and the seawater port side comprises at least one perforated circular plate, and each perforated circular plate has a plurality of holes formed in an outer circumferential area outside a circle having a predetermined diameter on the perforated circular plate. 1. An energy recovery apparatus for converting pressure energy of concentrated seawater discharged from a reverse-osmosis membrane-separation apparatus to pressure energy of seawater in a seawater desalination system for producing fresh water from the seawater by supplying the seawater pressurized by a pump to the reverse-osmosis membrane-separation apparatus to separate the seawater into fresh water and concentrated seawater , the energy recovery apparatus comprising:a cylindrical chamber having a space for containing concentrated seawater and seawater therein, the chamber being installed such that a longitudinal direction of the chamber is placed in a vertical direction;a concentrated seawater port provided at a lower part of the chamber for supplying and discharging the concentrated seawater;a seawater port provided at an upper part of the chamber for supplying and discharging the seawater;a flow resistor provided at a concentrated seawater port side in the chamber; anda flow resistor provided at a ...

SEAWATER DESALINATION SYSTEM AND ENERGY RECOVERY APPARATUS

An energy recovery apparatus which is used in a seawater desalination system includes a cylindrical chamber (CH) being installed such that a longitudinal direction of the chamber is placed in a vertical direction, a concentrated seawater port (P) for supplying and discharging the concentrated seawater, a seawater port (P) for supplying and discharging the seawater, a flow resistor () provided at a concentrated seawater port (P) side in the chamber (CH), and a flow resistor () provided at a seawater port (P) side in the chamber (CH). The flow resistor () provided at the concentrated seawater port (P) side and the flow resistor () provided at the seawater port (P) side comprise at least one perforated circular plate, and the perforated circular plate has holes formed at an outer circumferential area outside a predetermined diameter of the circular plate. 1. An energy recovery apparatus for converting pressure energy of concentrated seawater discharged from a reverse-osmosis membrane-separation apparatus to pressure energy of seawater in a seawater desalination system for producing fresh water from the seawater by supplying the seawater pressurized by a pump to the reverse-osmosis membrane-separation apparatus to separate the seawater into fresh water and concentrated seawater , the energy recovery apparatus comprising:a cylindrical chamber having a space for containing concentrated seawater and seawater therein, the chamber being installed such that a longitudinal direction of the chamber is placed in a vertical direction;a concentrated seawater port provided at a lower part of the chamber for supplying and discharging the concentrated seawater;a seawater port provided at an upper part of the chamber for supplying and discharging the seawater;a flow resistor provided at a concentrated seawater port side in the chamber; anda flow resistor provided at a seawater port side in the chamber;wherein the flow resistor provided at the concentrated seawater port side and the ...

Light emitting device

A light emitting device includes a mounting board, a first light emitting element and a second light emitting element. The mounting board includes an insulator which includes a front face and a back face, a pair of front face wiring parts disposed on the front face of the insulator, a connection wiring part disposed on the front face of the insulator and spaced apart from the front face wiring parts, a pair of back face terminals disposed on the back face of the insulator, first interlayer wiring parts penetrating the insulator and electrically connecting the front face wiring parts and the back face terminals, and one or more second interlayer wiring parts embedded in the insulator to be in contact with the connection wiring part, and spaced apart from the back face terminals.

SWITCH AND METHOD OF ASSEMBLING SWITCH

A switch includes: a case including a bottom portion and a side wall; a fixed terminal provided on the bottom portion of the case; a supporting member provided in the case; a movable contact strip supported by the supporting member so as to be pivotable in a vertical direction above the fixed terminal; a resilient member provided between the side wall of the case and the movable contact strip, and configured to urge one end portion of the movable contact strip obliquely upward; and a pressing member provided above the resilient member. The movable contact strip pivots and an opened-closed state between the movable contact strip and the fixed terminal is switched by pressing a center portion of the resilient member downward by the pressing member. 1. A switch comprising:a case comprising a bottom portion and a side wall;a fixed terminal provided on the bottom portion of the case;a supporting member provided in the case;a movable contact strip supported by the supporting member so as to be pivotable in a vertical direction above the fixed terminal;a resilient member which is provided between the side wall of the case and the movable contact strip, and which urges one end portion of the movable contact strip obliquely upward; anda pressing member provided above the resilient member,wherein the movable contact strip pivots and an opened-closed state between the movable contact strip and the fixed terminal is switched by pressing a center portion of the resilient member downward by the pressing member.2. The switch according to claim 1 , further comprising:an operating member provided above the case and the pressing member so as to be operable,wherein the pressing member presses the center portion of the resilient member downward in conjunction with the operation of the operating member.3. The switch according to claim 2 , further comprising:a cover which closes an opening opened on top of the case,wherein the pressing member penetrates through the cover and is held by ...

SEMICONDUCTOR APPARATUS

A semiconductor apparatus includes: a case made of resin; an insert terminal including an external terminal portion embedded in the case and having a first terminal exposed from the case, and an internal terminal portion bent in a L shape with respect to a second terminal of the external terminal portion and having a first surface exposed from the case and an anchor part in close contact with the case; and a bonding wire bonded to the first surface of the internal terminal portion. 1. A semiconductor apparatus comprising:a case made of resin; a concave portion provided on a second surface of the internal terminal portion that faces in a direction opposite to a direction in which the first surface faces, and', 'a convex portion provided on the second surface of the internal terminal portion that faces in the direction opposite to the direction in which the first surface faces; and, 'an insert terminal including an external terminal portion embedded in the case and having a first terminal exposed from the case, and an internal terminal portion bent in an L shape with respect to a second terminal of the external terminal portion, the internal terminal portion having a first surface exposed from the case and an anchor portion, the anchor portion being in close contact with the case and including one ofa bonding wire bonded to the first surface of the internal terminal portion.2. The semiconductor apparatus according to claim 1 , wherein the anchor portion includes the concave portion provided on the second surface of the internal terminal portion.3. The semiconductor apparatus according to claim 2 , wherein the concave portion is a recess having a rectangular cross section.4. The semiconductor apparatus according to claim 2 , wherein the concave portion is a recess having a trapezoidal cross section.5. The semiconductor apparatus according to claim 3 , wherein a thickness T of the internal terminal portion is 0.5 mm≤T≤3.0 mm claim 3 ,a recess width W of the concave ...

LIGHT-EMITTING DEVICE

A light-emitting device includes a light-emitting element, first and second light-transmissive members disposed on the light-emitting element, a light-guiding member, and a light-reflective member. A perimeter of a lower surface of the first light-transmissive member is disposed inwardly of a perimeter of an upper surface of the light-emitting element in a plan view. The light-guiding member covers the upper surface of the light-emitting element and the lower surface and lateral surfaces of the first light-transmissive member. The light-guiding member does not cover an upper surface of the second light-transmissive member and at least a portion of a lateral surface of the second light-transmissive member continuous. The light-reflective member covers lateral surfaces of the light-guiding member and at least the portion of the lateral surface of the second light-transmissive member exposed from the light-guiding member. The light-reflective member does not cover the upper surface of the second light-transmissive member. 1. A light-emitting device comprising:a light-emitting element having an upper surface serving as a light-extracting surface of the light emitting element;a first light-transmissive member containing a phosphor and disposed on the upper surface of the light-emitting element, the first light-transmissive member having an upper surface and a lower surface, at least a portion of a perimeter of the lower surface of the first light-transmissive member being disposed inwardly of a perimeter of the upper surface of the light-emitting element in a plan view;a second light-transmissive member having an upper surface and a lower surface with the lower surface of the second light-transmissive member being bonded to the upper surface of the first light-transmissive member, a perimeter of the lower surface of the second light-transmissive member substantially coinciding with or disposed inwardly of a perimeter of the upper surface of the first light-transmissive ...

PROCESS FOR PRODUCING AN ALUMINUM ALLOY SHEET FOR MOTOR VEHICLE

An aluminum alloy sheet for motor vehicles is produced by casting a melt, containing 3.0-3.5 mass % Mg, 0.05-0.3 mass % Fe, 0.05-0.15 mass % Si, and less than 0.1 mass % Mn, a balance substantially being inevitable impurities and Al, into a slab having a thickness of 5 to 15 mm in a twin-belt caster so that cooling rate at ¼ depth of thickness of the slab is 20 to 200° C./sec; winding the cast thin slab into a coiled thin slab subjected to cold rolling with a roll having a surface roughness of 0.2 to 0.7 μm Ra at a cold rolling reduction of 50 to 98%; subjecting the cold rolled sheet to final annealing either continuously in a CAL at a holding temperature of 400 to 520° C. within 5 minutes or in a batch annealing furnace at a holding temperature of 300 to 400° C. for 1 to 8 hours; and subjecting the resulting sheet to straightening with a leveler. 13.-. (canceled)4. A process for producing an aluminum alloy sheet for motor vehicles excellent in press formability , resistance to surface roughening and shape fixability , the process comprising:casting a melt comprising 3.0-3.5 mass % Mg, 0.05-0.3 mass % Fe, 0.05-0.15 mass % Si, further a limited amount of less than 0.1 mass % Mn, and a balance substantially being inevitable impurities and Al, into a thin slab having a thickness of 5 to 15 mm in a twin-belt caster so that the cooling rate at ¼ depth of a thickness of the thin slab is 20 to 200° C./sec;winding the cast thin slab into a coiled thin slab;subjecting the coiled thin slab to cold rolling with a roll having a surface roughness of 0.2 to 0.7 μm Ra at a cold rolling reduction of 50 to 98% to produce a cold rolled thin sheet;subjecting the cold rolled thin sheet to final annealing continuously in a CAL at a holding temperature of 400 to 520° C. within 5 minutes; andsubjecting the resulting sheet to straightening with a leveler.5. (canceled)6. A process for producing an aluminum alloy sheet for motor vehicles excellent in press formability , resistance to surface ...

ENERGY RECOVERY SYSTEM

An energy recovery system in a seawater desalination plant uses a reverse-osmosis membrane method for removing salinity from seawater. The system is configured to supply high-pressure water produced by pressurizing raw water with a high-pressure pump to a reverse-osmosis membrane cartridge, and to supply concentrated water discharged from the cartridge to an isobaric energy recovery device to recover pressure energy of the concentrated water whereby part of the raw water supplied to the isobaric energy recovery device is pressurized, and then to allow the pressurized raw water to merge into the high-pressure water pressurized by the high-pressure pump. The system includes a booster pump for boosting a pressure of the concentrated water discharged from the cartridge, and an energy recovery turbine for recovering energy by using the pressure head difference between the pressurized raw water from the isobaric energy recovery device and the high-pressure water discharged from the pump. 1. An energy recovery system for supplying high-pressure water discharged from a high-pressure pump configured to pressurize raw water to a reverse-osmosis membrane cartridge configured to process the high-pressure water by a reverse-osmosis membrane to produce processed water , supplying concentrated water discharged from the reverse-osmosis membrane cartridge to an isobaric energy recovery device to recover pressure energy of the concentrated water whereby part of the raw water supplied to the isobaric energy recovery device is pressurized to become pressurized raw water , and making the pressurized raw water merge into the high-pressure water pressurized by the high-pressure pump , the energy recovery system comprising:a booster pump provided between the reverse-osmosis membrane cartridge and the isobaric energy recovery device and configured to boost a pressure of the concentrated water discharged from the reverse-osmosis membrane cartridge; andan energy recovery turbine configured to ...

SWITCHING ELECTRODE AND RESISTANCE WELDING DEVICE USING SAME, SPOT WELDING DEVICE AND SPOT WELDING METHOD

The invention provides a switching electrode which has a small variation in resistance value even when a large amount of current is repeatedly cut off and can carry a stable amount of current even when it is continuously used. In the invention, the switching electrode is used in a switch which includes a first switching electrode tip () and a second switching electrode tip (), brings the first switching electrode tip () and the second switching electrode tip () into surface contact with each other to carry a current, and separates the first switching electrode tip () and the second switching electrode tip () to cut off the current. At least one of contact surfaces of the first switching electrode tip () and the second switching electrode tip () is a flat surface having an uneven portion. 1. A switching electrode that is used in a switch which includes a pair of electrodes , brings the pair of electrodes into surface contact with each other to carry a current , and separates the pair of electrodes to cut off the current ,wherein at least one of contact surfaces of the pair of electrodes is a flat surface having an uneven portion.2. The switching electrode according to claim 1 ,wherein a surface roughness (Ra) of the flat surface is in the range of from 60 μm to 150 μm.3. The switching electrode according to claim 1 ,wherein a contact area ratio of the contact surfaces of the pair of electrodes is in the range of from 10% to 90%.4. A resistance welding device that performs resistance welding on a work formed by overlapping a plurality of plates claim 1 , comprising:a first welding electrode that comes into contact with one surface of the work;a second welding electrode that comes into contact with the work from a side opposite to the first welding electrode and has a polarity opposite to a polarity of the first welding electrode;an auxiliary electrode that comes into contact with the work from the same side as the first welding electrode and has a polarity opposite to ...

SEMICONDUCTOR DEVICE

A semiconductor device includes a metal substrate, semiconductor elements, wires, a control terminal, a main electrode terminal, a control substrate, a cover, a sealing resin, a case, and an insulator. The metal substrate includes a metal plate, an insulating layer formed on the top surface of the metal plate, and electrode patterns provided on the insulating layer. The semiconductor elements are secured to different ones of the electrode patterns by solder. The sealing resin seals the components within the case, such as the semiconductor elements. The insulator covers a portion of the surface of the insulating layer and at least a portion of the edge of each electrode pattern. 1. A semiconductor device comprising:a metal substrate including a metal plate, an insulating layer formed on a top surface of the metal plate, and a conductive material pattern provided on the insulating layer;a semiconductor element provided on the conductive material pattern;a sealing resin sealing the semiconductor element; andan insulator covering a portion of a surface of the insulating layer and at least a portion of an edge of the conductive material pattern.2. The semiconductor device according to claim 1 , wherein:a lower side of the edge of the conductive material pattern projects toward the insulator; andthe insulator covers at least the lower side of the edge of the conductive material pattern.3. The semiconductor device according to claim 1 , wherein the edge of the conductive material pattern has a recess claim 1 , and the insulator covers an interior surface of the recess.4. The semiconductor device according to claim 1 , wherein the insulator is made of a material having a coefficient of linear expansion equal to that of the insulating layer.5. The semiconductor device according to claim 1 , wherein a top surface of the conductive material pattern is level with a top surface of the insulator.6. The semiconductor device according to claim 1 , wherein the insulator extends onto ...

SEMICONDUCTOR MODULE AND POWER CONVERTER

A semiconductor module includes a case, a semiconductor component provided in the case for switching a current, encapsulating resin provided in the case for covering the semiconductor component, a magnetic shield contacting the encapsulating resin and containing a magnetic material, and an embedded magnetic shield embedded in the case, the embedded magnetic shield containing a magnetic material. 1. A semiconductor module comprising:a case;a semiconductor component provided in the case for switching a current;encapsulating resin provided in the case for covering the semiconductor component;a magnetic shield contacting the encapsulating resin and containing a magnetic material; andan embedded magnetic shield embedded in the case, the embedded magnetic shield containing a magnetic material.2. The semiconductor module according to claim 1 , wherein the magnetic shield is formed on whole of an upper surface of the encapsulating resin.3. The semiconductor module according to claim 1 , wherein the embedded magnetic shield surrounds side surfaces of the semiconductor component.4. The semiconductor module according to claim 1 , wherein the embedded magnetic shield is provided on a lower surface side of the semiconductor component.5. The semiconductor module according to claim 1 , further comprising:a control circuit board provided above the magnetic shield in the case; andan electronic component fixed to the control circuit board.6. A semiconductor module comprising:a case;a semiconductor component provided in the case for switching a current;encapsulating resin provided in the case for covering the semiconductor component;a magnetic shield contacting the encapsulating resin and containing a magnetic material;a control circuit board provided above the magnetic shield in the case; andan electronic component fixed to the control circuit board.7. The semiconductor module according to claims 6 , wherein the electronic component comprises a micro transformer for performing ...

SEMICONDUCTOR DEVICE

A semiconductor device includes a case enclosing a region filled with a sealing material. The case is made of resin. An electrode is fixed to the case. A section, which is a part of the electrode, is provided with a cutout that allows a part of the resin making the case to be exposed to the region. 1. A semiconductor device comprising a case enclosing a region filled with a sealing material ,whereinthe case is made of resin,an electrode is fixed to the case,the electrode has a section in contact with the region, the section being a part of the electrode,the sealing material is provided so that the sealing material at least covers the section, andthe section is provided with a cutout that allows a part of the resin making the case to be exposed to the region.2. The semiconductor device according to claim 1 , wherein the section is provided with a plurality of cutouts including the cutout.3. The semiconductor device according to claim 1 , whereina shape of the section is an elongated shape,the section has a forefront of the electrode, andthe cutout extends up to the forefront of the electrode.4. The semiconductor device according to claim 1 , whereinthe cutout extends up to a boundary between the section and the case , andthe cutout is configured so that a portion of the cutout closer to the boundary has a larger cross-sectional area.5. The semiconductor device according to whereinthe section extends toward a central portion of the case in a plan view,the semiconductor device includes a wire having a first end and a second end,the first end of the wire is connected to a front surface of the section,the second end is closer to the central portion of the case than the first end in a specific direction, which is a direction in which the section extends, andin the specific direction, the cutout exists between the first end and the second end.6. The semiconductor device according to claim 1 , whereinthe case is bonded to a heat sink in contact with a lower surface of the ...

LIGHT EMITTING DEVICE

A light emitting device includes a substrate, a light emitting element, and a plurality of bumps. The light emitting element is mounted on the substrate. The bumps connect the substrate and the light emitting element. The bumps are arranged in a plurality of columns extending parallel to one side of an outer edge of the light emitting element. A distance between adjacent ones of the bumps in one of the columns arranged closest to the outer edge of the light emitting element is smaller than a distance between adjacent ones of the bumps arranged on an inner side of the light emitting element in a plan view. 1. A light emitting device comprising;a substrate;a light emitting element mounted on the substrate; anda plurality of bumps connecting the substrate and the light emitting element, the bumps being arranged in a plurality of columns extending parallel to one side of an outer edge of the light emitting element, a distance between adjacent ones of the bumps in one of the columns arranged closest to the outer edge of the light emitting element being smaller than a distance between adjacent ones of the bumps arranged on, an inner side of the light emitting element in a plan view.2. The light emitting device according to claim 1 , whereinthe bumps in the one of the columns closest to the outer edge of the light emitting element are arranged at equal intervals.3. The light emitting device according to claim 1 , whereinthe light emitting element includes a first electrode and a second electrode arranged at a lower face of the light emitting element, andthe bumps include a plurality of first bumps connected to the first electrode and a plurality of second bumps connected to the second electrode, the first bumps and the second bumps being arranged in different ones of the columns.4. The light emitting device according to claim 3 , whereinthe first bumps include a plurality of first small bumps and a plurality of first large bumps each having a larger surface area than each ...

LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME

A light emitting device includes a substrate, a light emitting element, a plurality of bumps and a cover member. The bumps are disposed between the substrate and the light emitting element to mount the light emitting element on the substrate. The bumps include a plurality of first bumps bonded to a first electrode of the light emitting element, and a plurality of second bumps bonded to a second electrode of the light emitting element. The first bumps are spaced apart from exposed portions of a first semiconductor layer of the light emitting element. The first bumps include a plurality of large bumps and a plurality of small bumps each having a smaller surface area than each of the large bumps in a plan view. The cover member covers the light emitting element, the bumps, and the substrate. 1. A light emitting device comprising:a substrate having a wiring pattern on an upper face thereof; a semiconductor stack successively having a first semiconductor layer, an emission layer, and a second semiconductor layer, with the first semiconductor layer having a plurality of exposed portions exposed from the second semiconductor layer on an upper face side of the second semiconductor layer,', 'an insulation film covering the semiconductor stack and having a plurality of openings respectively above the exposed portions of the first semiconductor layer,', 'a first electrode connected to the exposed portions of the first semiconductor layer at the openings of the insulation film and partially disposed over the second semiconductor layer via the insulation film, and', 'a second electrode connected to the second semiconductor layer;, 'a light emitting element mounted on the wiring pattern of the substrate in a flip-chip manner, the light emitting element including'}a plurality of bumps disposed between the substrate and the light emitting element to mount the light emitting element on the substrate, the bumps including a plurality of first bumps bonded to the first electrode, and a ...

TRANSFER MEMBER, INK JET RECORDING METHOD, AND INK JET RECORDING APPARATUS

A transfer member according to the present invention includes a base layer and a surface layer, wherein a swelling rate of the surface layer by 1,2-hexanediol is 5% or less, and a storage elastic modulus of the surface layer is 30 MPa or more to 250 MPa or less. 1. A transfer member comprising:a base layer and a surface layer,wherein a swelling rate of the surface layer by 1,2-hexanediol is 5% or less, anda storage elastic modulus of the surface layer is 30 MPa or more to 250 MPa or less.2. The transfer member according to claim 1 , wherein the surface layer contains a condensate of a hydrolyzable organosilane compound.3. The transfer member according to claim 2 , wherein the condensate of the hydrolyzable organosilane compound has a hydrocarbon group represented by the following General Formula (3) claim 2 ,{'br': None, 'sub': n', '(2n-m)', 'p, '—(CH)—\u2003\u2003(3)'}wherein n represents an integer of 1 to 7, m represents an integer of 0 to 2, and p represents an integer of 1 to 120.4. The transfer member according to claim 1 , wherein the transfer member is used for heat transfer.5. The transfer member according to claim 1 , wherein the swelling rate of the surface layer by the 1 claim 1 ,2-hexanediol is 3% or less.6. An ink jet recording method comprising:applying a reaction liquid containing a component that increases a viscosity of an ink to an image formation surface of a transfer member;applying an ink to the image formation surface of the transfer member to form an ink image; andtransferring the ink image from the transfer member to a recording medium,wherein the transfer member includes a base layer and a surface layer,a swelling rate of the surface layer by 1,2-hexanediol is 5% or less, anda storage elastic modulus of the surface layer is 30 MPa or more to 250 MPa or less.7. The ink jet recording method according to claim 6 , further comprising heating the ink image at a temperature for transferring the ink image to the recording medium.8. An ink jet ...

TRANSFER MEMBER, IMAGE RECORDING APPARATUS, AND IMAGE RECORDING METHOD

A transfer member according to the present invention includes an elastic layer, and a compression layer, in which the elastic layer contains a thermally conductive filler having thermal conductivity of 5 [W/m·K] or more, and when a compressive elastic modulus of the elastic layer is defined as E1 [MPa], thermal conductivity of the elastic layer is defined as λ1 [W/m·K], a compressive elastic modulus of the compression layer is defined as E2 [MPa], and thermal conductivity of the compression layer is defined as λ2 [W/m·K], 1≤E1≤50, E2≤10, 0.25≤λ1, and λ2≤0.2 are satisfied. 1. A transfer member comprising:an elastic layer; anda compression layer,wherein the elastic layer contains a thermally conductive filler having thermal conductivity of 5 [W/m·K] or more, andwhen a compressive elastic modulus of the elastic layer is defined as E1 [MPa], thermal conductivity of the elastic layer is defined as λ1 [W/m·K], a compressive elastic modulus of the compression layer is defined as E2 [MPa], and thermal conductivity of the compression layer is defined as λ2 [W/m·K], 1≤E1≤50, E2≤10, 0.25≤λ1, and λ2≤0.2 are satisfied.2. The transfer member according to claim 1 ,wherein when a thickness of the elastic layer is defined as t1 [mm] and a thickness of the compression layer is defined as t2 [mm], 0.03≤t1≤0.2 and 0.1≤t2≤0.6 are satisfied.3. The transfer member according to claim 1 ,wherein the thermally conductive filler contains metallic silicon.4. The transfer member according to claim 1 ,wherein the thermally conductive filler contains alumina.5. The transfer member according to claim 1 ,wherein the elastic layer contains the thermally conductive filler in an amount of 1% by mass or more and 70% by mass or less based on a total mass of the elastic layer.6. The transfer member according to claim 1 , further comprising:an intermediate layer between the elastic layer and the compression layer,wherein in the intermediate layer, when a compressive elastic modulus is defined as E3 [MPa], ...

METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE

A method for manufacturing a light emitting device includes: providing a substrate defining a mounting region having a wiring pattern on an upper face thereof; forming a plurality of bumps arranged in a plurality of columns extending parallel to each other with a distance between adjacent ones of the bumps in one of the columns arranged closest to an outer edge of the mounting region is larger than a distance between adjacent ones of the bumps arranged on an inner side in a plan view, and the bumps include first bumps and second bumps with the first bumps including first large bumps and first small bumps, with all the bumps in the one of the columns arranged closest to the outer edge are the same size; mounting the light emitting element onto the bumps in a flip-chip manner; and forming a cover member. 1. A method for manufacturing a light emitting device comprising:providing a substrate defining a mounting region having a wiring pattern on an upper face thereof;forming a plurality of bumps for bonding a light emitting element to the wiring pattern in the mounting region of the substrate so that the bumps are arranged in a plurality of columns extending parallel to each other with a distance between adjacent ones of the bumps in one of the columns arranged closest to an outer edge of the mounting region is larger than a distance between adjacent ones of the bumps arranged on an inner side of the mounting region in a plan view, and so that the bumps include a plurality of first bumps and a plurality of second bumps with the first bumps including a plurality of first large bumps and a plurality of first small bumps each having a smaller surface area than each of the first large bumps in a plan view, with all the bumps in the one of the columns arranged closest to the outer edge of the mounting region are the same size;mounting the light emitting element onto the bumps in the mounting region of the substrate in a flip-chip manner so that the first bumps are bonded to a ...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF

A semiconductor device includes an insulating substrate, a wiring pattern formed on the insulating substrate, a semiconductor chip secured to the wiring pattern, a junction terminal formed of the same material as the wiring pattern and electrically connected to the semiconductor chip, one end of the junction terminal being secured to the insulating substrate, the other end of the junction terminal extending upward away from the insulating substrate, and a control circuit for transmitting a control signal for the semiconductor chip, the control circuit being electrically connected to the junction terminal. 1. A method of manufacturing a semiconductor device , comprising:a step of placing an insulating substrate in a mold having a wiring pattern-forming cavity for forming a wiring pattern on said insulating substrate and also having a junction terminal-forming cavity for forming a junction terminal extending upward from said insulating substrate;an aluminum pouring step of pouring aluminum into said wiring pattern-forming cavity and said junction terminal-forming cavity; anda step of cooling said aluminum.2. The method according to claim 1 , wherein:said mold has a power terminal-forming cavity for forming a power terminal extending upward from said insulating substrate; andsaid aluminum pouring step includes pouring aluminum into said power terminal-forming cavity. This application is a divisional of U.S. application Ser. No. 13/473,991, filed on May 17, 2012, and is based upon and claims the benefit of priority from prior Japanese Patent Application No. 2011-214412, filed on Sep. 29, 2011 in Japan, the entire contents of each of which are incorporated herein by reference.1. Field of the InventionThe present invention relates to a semiconductor device used, e.g., for high power switching, etc., and a method of manufacture thereof.2. Background ArtJapanese Laid-Open Patent Publication No. 2002-315357 discloses a semiconductor device in which metal plates serving as ...

SEAWATER DESALINATION SYSTEM AND ENERGY RECOVERY APPARATUS

The present invention relates to a seawater desalination system for desalinating seawater by removing salinity from the seawater and an energy recovery apparatus which is preferably used in the seawater desalination system. The energy recovery apparatus includes a cylindrical chamber (CH) being installed such that a longitudinal direction of the chamber is placed in a vertical direction, a concentrated seawater port (P) for supplying and discharging the concentrated seawater, a seawater port (P) for supplying and discharging the seawater, a flow resistor () provided at a concentrated seawater port (P) side in the chamber (CH), and a flow resistor () provided at a seawater port (P) side in the chamber (CH). Each of the flow resistor () provided at the concentrated seawater port (P) side and the seawater port (P) side comprises at least one perforated circular plate, and each perforated circular plate has a plurality of holes formed in an outer circumferential area outside a circle having a predetermined diameter on the perforated circular plate. 1. An energy recovery apparatus for converting pressure energy of concentrated seawater discharged from a reverse-osmosis membrane-separation apparatus to pressure energy of seawater in a seawater desalination system for producing fresh water from the seawater by supplying the seawater pressurized by a pump to the reverse-osmosis membrane-separation apparatus to separate the seawater into fresh water and concentrated seawater , the energy recovery apparatus comprising:a cylindrical chamber having a space for containing concentrated seawater and seawater therein, the chamber being installed such that a longitudinal direction of the chamber is placed in a vertical direction;a concentrated seawater port provided at a lower part of the chamber for supplying and discharging the concentrated seawater;a seawater port provided at an upper part of the chamber for supplying and discharging the seawater;a flow resistor provided at a ...

SEAWATER DESALINATION SYSTEM AND ENERGY RECOVERY APPARATUS

The present invention relates to a seawater desalination system for desalinating seawater by removing salinity from the seawater and an energy recovery apparatus which is preferably used in the seawater desalination system. The energy recovery apparatus includes a cylindrical chamber (CH) being installed such that a longitudinal direction of the chamber is placed in a vertical direction, a concentrated seawater port (P) for supplying and discharging the concentrated seawater, a seawater port (P) for supplying and discharging the seawater, a flow resistor () provided at a concentrated seawater port (P) side in the chamber (CH), and a flow resistor () provided at a seawater port (P) side in the chamber (CH). Each of the flow resistor () provided at the concentrated seawater port (P) side and the seawater port (P) side comprises at least one perforated circular plate, and each perforated circular plate has a plurality of holes formed in an outer circumferential area outside a circle having a predetermined diameter on the perforated circular plate. 1. An energy recovery apparatus for converting pressure energy of concentrated seawater discharged from a reverse-osmosis membrane-separation apparatus to pressure energy of seawater in a seawater desalination system for producing fresh water from the seawater by supplying the seawater pressurized by a pump to the reverse-osmosis membrane-separation apparatus to separate the seawater into fresh water and concentrated seawater , the energy recovery apparatus comprising:a cylindrical chamber having a space for containing concentrated seawater and seawater therein, the chamber being installed such that a longitudinal direction of the chamber is placed in a vertical direction;a concentrated seawater port provided at a lower part of the chamber for supplying and discharging the concentrated seawater;a seawater port provided at an upper part of the chamber for supplying and discharging the seawater;a flow resistor provided at a ...

INTERLAYER CONNECTION SUBSTRATE AND ITS MANUFACTURING METHOD

An electrode connected to a TH pad requiring electric conduction is formed on a bonded surface of a first multilayer substrate having piercing TH to form a solder bump on the electrode. An electrode connected to the TH pad is formed on a bonded surface of a second multilayer substrate to be bonded having a piercing TH at a position opposite the electrode formed on the first multilayer substrate to form a solder bump on the electrode. A three-layered sheet is formed by applying an adhesive as a resin material that is not completely cured to both surfaces of a core material as the cured resin, and has holes at positions corresponding to the TH and the solder bump, respectively. The first and the second multilayer substrates are then laminated having the bonded surfaces facing each other while having the three-layered sheet positioned and interposed therebetween, and batch thermocompression bonded. 1. A method of manufacturing an interlayer connection substrate comprising:providing an electrode connected to a pad for a TH, requiring electric conduction on a bonded surface of a first multilayer substrate to be bonded having a piercing TH to form a solder bump on the electrode;providing an electrode connected to a pad for a TH on a bonded surface of a second multilayer substrate to be bonded having a piercing TH at a position opposite the electrode formed on the first multilayer substrate to form a solder bump on the electrode;forming holes in a three-layered sheet derived from applying an adhesive as a resin material that is not completely cured to both surfaces of a core material as a cured resin at positions corresponding to the THs and the solder bumps on the electrodes, respectively; anddisposing the first and the second multilayer substrates having the respective bonded surfaces facing each other, which are laminated while having the three-layered sheet positioned and interposed therebetween, and batch thermocompression bonded through a process of heating and ...

LIGHT-EMITTING DEVICE

A light-emitting device includes a light-emitting element, first and second light-transmissive members disposed on the light-emitting element, a light-guiding member, and a light-reflective member. A perimeter of a lower surface of the first light-transmissive member is disposed inwardly of a perimeter of an upper surface of the light-emitting element in a plan view. The light-guiding member is in contact with a portion of lateral surfaces of the second light-transmissive member and covers the upper surface of the light-emitting element and the lower surface and lateral surfaces of the first light-transmissive member. The light-guiding member contains a resin material, and has convex lateral surfaces. The light-reflective member covers the lateral surfaces of the light-guiding member and at least the portion of the lateral surfaces of the second light-transmissive member exposed from the light-guiding member. The light-reflective member does not cover the upper surface of the second light-transmissive member. 1. A light-emitting device comprising:a light-emitting element having an upper surface serving as a light-extracting surface of the light emitting element;a first light-transmissive member containing a phosphor and disposed on the upper surface of the light-emitting element, the first light-transmissive member having an upper surface and a lower surface, at least a portion of a perimeter of the lower surface of the first light-transmissive member being disposed inwardly of a perimeter of the upper surface of the light-emitting element in a plan view;a second light-transmissive member having an upper surface and a lower surface with the lower surface of the second light-transmissive member being bonded to the upper surface of the first light-transmissive member, a perimeter of the lower surface of the second light-transmissive member substantially coinciding with or disposed inwardly of a perimeter of the upper surface of the first light-transmissive member in ...

INFORMATION PROVISION SYSTEM, VEHICULAR DEVICE, AND NON-TRANSITORY COMPUTER-READABLE STORAGE MEDIUM

An information provision system includes: a flying device for imaging a periphery of a vehicle from above, communicating with the vehicle, controlling flight by remote control and flight by autonomous control, and controlling to transmit an image to the vehicle; and a vehicular device for communicating with the flying device, and controlling to display the image on a vehicle-side display unit in real time. 1. An information provision system comprising:a flying device including an imaging unit that images a periphery of a vehicle from above, a flight-side communication unit that communicates with the vehicle, and a flight-side control unit that controls flight by remote control and flight by autonomous control, and controls transmitting an image captured by the imaging unit to the vehicle; anda vehicular device including a vehicle-side communication unit that communicates with the flying device, and a vehicle-side control unit that controls displaying an image captured by the flying device and received by the vehicle-side communication unit on a vehicle-side display unit in real time, wherein:the flying device further includes a flight position acquisition unit that acquires a flight position indicating a position of the flying device; andthe flying device flies by autonomous control while maintaining a predetermined positional relationship with the vehicle.2. The information provision system according to claim 1 , wherein:the vehicular device further includes a vehicle position acquisition unit that acquires a vehicle position indicating a position of the vehicular device;the vehicular device transmits an acquired vehicle position to the flying device; andthe flying device specifies the predetermined positional relationship with the vehicle based on a received vehicle position, and maintains the predetermined positional relationship with the vehicle.3. The information provision system according to claim 1 , wherein:the vehicular device further includes a route ...

METAL DIAPHRAGM VALVE

A metal diaphragm valve includes a body with a valve seat provided to a valve chamber communicating a primary flow path and a secondary flow path, a metal diaphragm having a center portion disposed above the valve chamber, the center portion vertically moving to make contact with the valve seat, and a stem provided above the metal diaphragm so as to be able to freely ascend and descend to cause the center portion of the metal diaphragm to move downward. A flow-path restriction part is provided to a part of the secondary flow path. The metal diaphragm valve is quite suitable as a valve for ALD process, the valve favorably reduces fluctuations of a Cv value due to deformation of a resin-made valve seat with time even after the valve is opened and closed at a level of ten million times while a fluid at high temperatures is flowing. 1. A metal diaphragm valve comprising:a body with a valve seat provided to a valve chamber communicating a primary flow path and a secondary flow path;a metal diaphragm having a center portion disposed above the valve chamber, the center portion vertically moving to make contact with the valve seat; anda stem provided above the metal diaphragm so as to be able to freely ascend and descend to cause the center portion of the metal diaphragm to move downward, anda flow-path restriction part being provided to a part of the secondary flow path.2. The metal diaphragm valve according to claim 1 , further comprisingCv value adjusting means which can make adjustment to a Cv value required for the valve.3. The metal diaphragm valve according to claim 2 , whereinthe Cv value adjustment in the Cv value adjusting means is performed by adjusting a degree of valve opening of the metal diaphragm.4. The metal diaphragm valve according to claim 3 , whereinthe Cv value adjusting means is stroke adjusting means which performs adjustment of a stroke of the metal diaphragm.5. The metal diaphragm valve according to claim 4 , whereinan actuator is mounted on the ...

IMAGE RECORDING APPARATUS

An image recording apparatus includes a liquid chamber that stores liquid, a first electrode pin and a second electrode pin to be inserted into the liquid chamber, applying unit for applying voltage across the first electrode pin and the second electrode pin, with the first electrode pin as an anode side and the second electrode pin as a cathode side, and detecting unit for detecting electric current flowing, and detection operation of detecting amount of liquid in the liquid chamber by the detecting unit detecting the electric current when the applying unit applies voltage. Prior to the detection operation, an oxidization aging operation is performed, in which the applying unit applies voltage across the first electrode pin and the second electrode pin. An amount of an oxide layer formed on at least a portion of the first electrode pin exposed inside the liquid chamber is greater than the second. 1. An image recording apparatus , comprising:a liquid chamber that stores liquid to be used in recording an image;a first electrode pin and a second electrode pin to be inserted into the liquid chamber;applying unit for applying voltage across the first electrode pin and the second electrode pin, with the first electrode pin serving as an anode side and the second electrode pin serving as a cathode side; anddetecting unit for detecting electric current flowing across the first electrode pin and the second electrode pin, whereinthe image recording apparatus is capable of performing a detection operation of detecting a remaining amount of liquid in the liquid chamber by the detecting unit detecting the electric current when the applying unit applies voltage across the first electrode pin and the second electrode pin,prior to executing the detection operation, an oxidization aging operation is performed, in which the applying unit applies voltage across the first electrode pin and the second electrode pin, andan amount of an oxide layer formed on at least a portion of the ...

Metal base substrate, power module, and method for manufacturing metal base substrate

A metal base substrate of the present invention includes a copper plate made of copper, a metal layer that is formed on the copper plate and is made of a metal different from the copper, an insulating resin sheet that is formed by bonding a sheet made of an insulating resin onto the metal layer, and a circuit pattern formed on the insulating resin sheet.

Magnetic impedance element having at least two thin film-magnetic cores

A magnetic impedance element including a substrate made of a non-magnetic material, a thin-film magnetic core formed on said substrate, and first and second electrodes disposed on both ends of said thin-film magnetic core in a longitudinal direction thereof, characterized in that said thin-film magnetic core is formed by laminating a plurality of magnetic films through non-magnetic thin-films.

光記録媒体

(57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。

液体噴射記録ヘッドおよびその製造方法

(57)【要約】 【課題】 第１基板と第２基板を組み合わせて形成する 液体噴射記録ヘッドにおいて、第１基板と第２基板とを 容易にかつ確実に封止することができ、封止工程の歩留 りの低下を解決できる記録ヘッドおよびその製造方法を 提供する。 【解決手段】 吐出エネルギー発生素子を形成した第１ 基板１７とインク流路や吐出口を形成した第２基板１１ とを接合し、その接合面を封止して作成する液体噴射記 録ヘッドにおいて、第１基板１７と第２基板１１との接 合面に、微粒子２１、例えば、第２基板の材料の組成に 含まれる１つの元素（例、カーボン）を主成分とする材 料、あるいは表面に水酸基をもつ高分子材料等、を介在 させた状態で、接合面やその周辺をシリコーン樹脂等の 封止剤２５で封止してある。よって、封止剤がインク流 路や吐出口に流れ込んで印字不良を引き起こすことを防 止することができる。

Resin ink jet filter and method of manufacturing the same

A filter used for the filtration of a liquid, in which pores based on a plurality of microbaloons are formed in a hardened layer of an activation energy setting resin, these pores communicating with one another so that a liquid can pass through the resin layer. This filter can be formed in an arbitrary place in a desired mode with a high precision. Especially, this filter is most suitably used as a filter in an ink jet head.

Squelch circuit

(57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。

Method and system for manufacturing liquid jet recording head

(57)【要約】 【課題】 レーザビームの照射による吐出口の加工にお いて、光学系を簡素化するとともにレーザビームの利用 効率を高め、スループットの向上を図ることができる液 体噴射記録ヘッドの製造方法および製造装置を提供す る。 【解決手段】 固定部材８によって複数の光ファイバー からなる光ファイバー束７のそれぞれの出射側の端面を 液体噴射記録ヘッドを構成する吐出口形成部材（ワー ク）１０の吐出口形成部位に対応させて配置して固定 し、レーザ発振器１から発振されたレーザビーム２を、 ビーム整形光学系６によって整形した後に、光ファイバ ー束８に入射させ、光ファイバー束８のそれぞれの光フ ァイバーの出射側の端面から出射したレーザビームを投 影光学系９を介して縮小投影して、ワークステーション １１に固定されたワーク１０に照射させ、ワーク１０に 対して全部のまたは複数の吐出口を一括して加工する。

Photomagnetic recording medium

(57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。

Al alloy brazing sheet for heat exchanger having excellent corrosion resistance at fillet forming part

(57)【要約】 【課題】 素子基板および天板に位置決め用の基準を設 けることにより、これらの基準を突き当てて素子基板と 天板の位置合わせをするようになし、高精度で信頼性の 高い液体噴射記録ヘッドを製造することができる製造方 法を提供する。 【解決手段】 ヒーター１１を配列する素子基板１０に 位置決め基準壁１３を予め形成しておき、素子基板１０ における位置決め基準壁１３から第１のヒーター１１ａ までの位置を測定し、この測定データΔｘに合わせて、 天板２０側に、位置決め基準壁１３と突き当てて位置を 決めるための位置決め基準溝３０を加工するとともに、 液流路溝３１と吐出口３２を加工し、その後に、加工さ れた天板２０を測定された素子基板１０上に移載し、素 子基板１０の位置決め基準壁１３と天板２０の位置決め 基準溝３０とを突き当てて天板２０と素子基板１０の位 置合わせを行ない、両者を接合して液体噴射記録ヘッド を組み立てる。

Optical recording medium and its production

Forced cut-off system for advance call of called party

Color reproducing device for electrooptical facsimile recorder

(57)【要約】 【課題】 レーザ照射状態を評価してレーザ情報をフィ ードバックすることにより液流路溝および吐出口を高精 度に加工でき、装置の稼働率を向上させかつ装置コスト を削減することができる液体噴射記録ヘッドの製造方法 を提供する。 【解決手段】 液体噴射記録ヘッドの樹脂製天板に液流 路溝および吐出口をレーザ加工する際に、レーザ光１２ の照射により加工した液流路溝２３を観察して画像処理 することにより、吐出口加工のアライメントを行なうと 同時に液流路溝の深さｄを測定し、この測定値を予め設 定されている規格値と比較し、この比較結果に基づい て、現在のレーザの出力状態を認識評価し、次の加工時 のレーザ照射エネルギーの補正量を決定して制御部やレ ーザ光源へ情報をフィードバックするようになし、レー ザ光源への印加電圧の調整等により、最適な照射エネル ギー密度を有するレーザ光１２を照射することで吐出口 等を高精度に加工する。

Semiconductor device

Eine Halbleitervorrichtung enthält ein Metallsubstrat (11), Halbleiterelemente (30, 32), Drähte (35, 36, 37, 38), einen Steueranschluss (40), einen Hauptelektrodenanschluss (42), ein Steuersubstrat (44), eine Abdeckung (45), ein Dichtungsharz (50), ein Gehäuse (20) und einen Isolator (18). Das Metallsubstrat (11) enthält eine Metallplatte (12), eine Isolierschicht (14), die auf der oberen Oberfläche der Metallplatte (12) ausgebildet ist, und Elektrodenmuster (16), die auf der Isolierschicht (14) vorgesehen sind. Die Halbleiterelemente (30, 32) sind durch Lötmittel an unterschiedlichen der Elektrodenmuster (16) befestigt. Das Dichtungsharz (50) dichtet die Komponenten innerhalb des Gehäuses (20) wie etwa die Halbleiterelemente (30, 32) ab. Der Isolator (18) bedeckt einen Abschnitt der Oberfläche der Isolierschicht (14) und wenigstens einen Abschnitt des Rands jedes Elektrodenmusters (16). A semiconductor device includes a metal substrate (11), semiconductor elements (30, 32), wires (35, 36, 37, 38), a control terminal (40), a main electrode terminal (42), a control substrate (44), a cover (45). , a sealing resin (50), a housing (20) and an insulator (18). The metal substrate (11) includes a metal plate (12), an insulating layer (14) formed on the upper surface of the metal plate (12), and electrode patterns (16) provided on the insulating layer (14). The semiconductor elements (30, 32) are fixed to different ones of the electrode patterns (16) by solder. The sealing resin (50) seals the components within the housing (20), such as the semiconductor elements (30, 32). The insulator (18) covers a portion of the surface of the insulating layer (14) and at least a portion of the edge of each electrode pattern (16).

Pressure adjustment chamber, ink-jet recording head having the same, and ink-jet recording device using the same

The present invention discloses an elastic transformable body for adjusting vapor pressure, a vapor pressure adjustment chamber using the same, an ink-jet recording head having a vapor pressure adjustment device and an ink-jet recording device having the recording head, and more particularly to a vapor pressure adjustment device for adjusting negative pressure generated in a liquid chamber in an ink-jet recording head when discharging ink. The pressure adjustment chamber has at least one elastic transformation body having a changeable volume according to vapor pressure to adjust the vapor pressure in a container communicated thereto and a support for supporting the elastic transformation body to the container. In the pressure adjustment chamber, the elastic transformation body includes an approximately circular opening and two surfaces approximately flat before transformation at an outer circumference, in which the two surfaces have a shape extended through a curved portion at a front end opposite to the opening.

Vehicle roof structure and method for manufacturing vehicle roof structure

The vehicle roof structure is characterized by including: a closely facing section, and abuts or is adjacent to a side outer panel; a negative curved-surface section that is positioned more inwards in the vehicle width direction than the closely facing section of the roof panel, and has a recessed face that is indented downwards; and a mounting surface that is formed in the side outer panel at an inner side in the vehicle width direction to downwards of the vehicle towards, and at which the closely facing section abuts or is adjacent, in which an edge, on a side of the roof panel, of the brazing material that has solidified to join the roof panel and the side outer panel is positioned on the negative curved-surface section.

Terminal call controller

Thin film transistor and manufacture thereof

(57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。

Solid electrolyte

Process for producing an ink jet recording head

An ink jet recording head is produced by forming in a first substrate a plurality of orifices for ejecting an ink droplet and a reference object for registration; forming in a second substrate ejection energy generating elements for supplying energy for ejecting the ink placed in liquid passages communicating with the orifices; and joining the first substrate and the second substrate together on the basis of the reference object for registration.

Ink jet head having plural elemental substrates, apparatus having the ink jet head, and method for manufacturing the ink jet head

An ink jet head for discharging ink comprises a plurality of elemental substrates having a plurality of discharge energy generating elements arranged in line for discharging ink, a grooved member having a plurality of walls joined with the plurality of elemental substrates arranged to constitute ink paths for each of the discharge energy generating elements, these ink paths being formed by joining the walls of the grooved member under pressure with the plurality of elemental substrates thus arranged, and among the plurality of walls, a plurality of ribs formed on the bottom of each wall arranged on each boundary between elemental substrates, and configured along this boundary line to abut upon each of different elemental substrates, respectively. In this way, any gaps and steps existing between the elemental substrates are sealed by the ribs formed for the walls of the grooved member when this member is joined with the elemental substrates under pressure, thus preventing any ink leakage from such gaps or steps, and also, suppressing the pressure wave cross talk between ink paths in order to perform recording in good condition.

Production of optical information recording disk

(57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。

Semiconductor photoelectric conversion device

(57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。

Ink Jet Recording Apparatus

an ink jet recording head includes a plurality of ink ejection outlets, a first member having a plurality of grooves in fluid communication with the ejection outlets, respectively, a second member having a plurality of energy generating elements for producing energy for ejecting ink in the grooves through the ejection outlets, and a clamping unit for clamping the first member with the second member to constitute ink passages with the grooves, wherein the clamping unit has a plurality of pressure regulating mechanism pressure regulating mechanisms, which are independently operable.

Turbo machine

(57)【要約】 【課題】 高比速度ターボ機械のディフューザ部内部で の剥離現象を抑制し、高比速度ターボ機械の高効率・高 コンパクト化を実現する。 【解決手段】 筒状のケーシング１０の内部に、軸線周 りに回転する羽根車１２と、ハブ１４及びディフューザ 羽根１６を有するディフューザ部１８とが設けられたタ ーボ機械において、ディフューザ部１８は、入口２２と 出口２４との間の子午面形状が窪み２６を有するように 形成され、入口２２から窪み２６までの間で環状流路面 積が増大している。

Aluminum alloy sheet for motor vehicle and process for producing the same

An aluminum alloy sheet for motor vehicles excellent in press formability, resistance to surface roughening and shape fixability is produced without subjecting the sheet to stabilization treatment by casting a melt, containing 3.0-3.5 mass% Mg, 0.05-0.3 mass% Fe, 0.05-0.15 mass% Si, and further a limited amount of less than 0.1 mass% Mn, a balance substantially being inevitable impurities and Al, into a thin slab having a thickness of to 15 mm in a twin-belt caster so that the cooling rate at 1/4 depth of the thickness of the thin slab is 20 to 200°C/sec; winding the cast thin slab into a coil; subjecting the coiled thin slab to cold rolling with a roll having a surface roughness of 0.2 to 0.7 µm Ra at a cold rolling reduction of 50 to 98%; subjecting the cold rolled thin sheet to final annealing either continuously in a CAL at a holding temperature of 400 to 520°C or in a batch annealing furnace at a holding temperature of 300 to 400°C; and then subjecting the resulting sheet to straightening with a leveler.

Overturning prevention machanism in manual shaft of manual tuner

(57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。

Ink jet recording head.

Repeater of communication system

【課題】通信装置の利用の際の電話番号入力ミスによる誤送信を防止するための中継装置を提供する。 【解決手段】ファクシミリ装置５０と電話回線１００の間に中継装置１を接続する。ファクシミリ装置５０からファクシミリ装置５１へ画像データの送信を行う際、ファクシミリ装置５０は相手先の電話番号を連続して２回入力する。中継装置１はファクシミリ装置５０から電話回線１００への電話番号の送信を検知し、電話番号を中点により二分し、前後で一致するかを判別する。一致する場合は画像データの送信を行い、不一致の場合は電話番号入力ミスと判断してビジートーンを送出し、ファクシミリ装置５０の送信動作をタイムアウトさせる。 【選択図】図２

Sealing member for ink cartridge

An adhesive sheet-type sealing member is suitably used for protecting ink-ejecting nozzles or a communication hole of an ink-jet recording head during transportation or storage. The sealing member exhibits a yield point at a load of not more than 1 kgf/cm for a specimen of 10 mm wide at a stress rate of 200 mm/min +/-10% according to JIS-K-7113 and/or exhibits a folding load of not more than 0.10 g/cm for a specimen of 10 mm wide with a free length of 10 mm from the end of a specimen holder measured on the center of an electronic balance placed at a position 5 mm apart from the end of the specimen holder.

Welding method and welding device

The present invention relates to a resistance welding method and a resistance welding device. A resistance welding device (10) is provide with a lower tip (32) and an upper tip (38) which serve as welding tips, and pressing rods (46a, 46b) which serve as pressing members. Among the above-mentioned elements, the upper tip (38) and the pressing rods (46a, a6b) press a stacked body (48a), which is to be welded, from the metallic plate (54a) side which is the outermost member of the stacked body (48a), and the lower tip (32) presses the stacked body (48a) from the lowermost metallic plate (50a) side. In this state, an electric current is conducted from the upper tip (38) to the lower tip (32).

Hydrogen production apparatus and fuel cell system

A hydrogen production apparatus 1 includes a burner 10, a combustion tube 11 provided so as to surround flame of the burner 10 and exhausting an exhaust gas of the burner 10 from one side thereof, a reforming unit 6 provided in a tubular shape so as to surround the combustion tube 11 and subjecting a raw fuel and steam to a reforming reaction to generate a reformed gas, an exhaust gas flow path L1 provided in a tubular shape so as to pass through between the combustion tube 11 and the reforming unit 6, fold back at the other side of the reforming unit 6, and extend through outside of the reforming unit 6 on a predetermined side, and passing the exhaust gas exhausted from the one side of the combustion tube 11, a low temperature shift unit 13 provided in a tubular shape on one of inside and outside of an extending portion L1b of the exhaust gas flow path L1 that extends on the predetermined side so as to extend along the extending portion L1b, and subjecting the reformed gas generated in the reforming unit 6 to a shift reaction to reduce a carbon monoxide concentration in the reformed gas, and a preferential oxidation unit 8 provided in a tubular shape on the other of the inside and the outside of the extending portion L1b so as to extend along the extending portion L1b, and preferentially oxidizing the reformed gas subjected to the shift reaction in the low temperature shift unit 13 to further reduce the carbon monoxide concentration.

Supporting frame for vapor deposition

(57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。

Manufacturing method for ink jet recording head and ink jet recording head

Hot strip laminator and hot strip laminating process directly combined with continuous casting

An ink jet recording apparatus

An ink jet recording head for effecting recording with ejection of ink includes a plurality of element substrates each having a plurality of ejection energy generating elements for ejecting the ink; a base plate for supporting the plurality of element substrates on one surface thereof in an array; a grooved member having a length corresponding to a length of the array and having passages corresponding to the ejection energy generating elements of the plurality of element substrates.

Liquid jet recording head and liquid jet recording apparatus having same

Reception device of digital broadcast, reception control method, and digital broadcast transmitter

【課題】無駄な処理や通信費を要することなく、エリア限定で放送している放送装置の独自サービスの存在をユーザに通知することができる技法を提供する。 【解決手段】広域およびローカルのデジタル放送のストリームを受信する受信部(120)を有するデジタル放送受信装置は、ローカルのデジタル放送を受信している旨を表示する表示部(DIS)と、ローカルのデジタル放送のデータ放送コンテンツに対応するパケット識別子を格納する記憶部(180)と、受信したストリームから記憶部(180)が格納しているパケット識別子を有するパケットを抽出する抽出部(190)と、抽出したパケットに基づいてローカルのデジタル放送のデータ放送用のモジュールを生成すると、ローカルのデジタル放送を受信している旨を表示するように表示部(DIS)を制御する制御部(170)とを具える。 【選択図】図６

Turbomachine

A turbomachine having an impeller rotating within a casing of the machine and groove passages are formed in a wall of the casing between an upstream portion and a downstream portion of the impeller and high pressure fluid is injected into the groove passages for increasing the stall margin without lowering the peak efficiency of the machine and prevents generation of a positive slope in a head-capacity curve.

Pump for gas liquid multi-phase flow

(57)【要約】 【課題】 本来、斜流ポンプの領域であるポンプ比速度 の領域を完全軸流型形式で実現し、気液混相流の昇圧と 輸送の性能を高める。 【解決手段】 気相と液相を含む気液混相流体を昇圧し 輸送するための気液混相流用ポンプにおいて、回転軸１ ２と一体のインペラ２４と固定側のガイドベーン２６と を有するディフューザ型の軸流型ポンプであって、比速 度が１０００［ｍ，ｍ 3 /min，min -1 ］以下であることを 特徴とする。

Pressure adjustment chamber, ink-jet recording head having the same, and ink-jet recording device using the same

Centrifugal or mixed flow turbomachinery

An impeller (6) in a turbomachin- ery has blades (3) designed such that re- duced static pressure difference .DELTA.Cp be- tween the hub (2) and the shroud (4) on the suction surface (3c) of the blade (3) shows a remarkably decreasing tendency in the vicinity of the impeller exit (6b) as it approaches the impeller exit (6b) be- tween the impeller inlet (6a) and the im- peller exit (6b).

Hydrogen production apparatus and fuel cell system

A hydrogen production apparatus includes a burner, a combustion tube provided so as to surround flame of the burner, a reforming unit provided so as to surround the tube, an exhaust gas flow path provided so as to pass through between the tube and the unit, fold back at the other side of the unit, and extend through outside of the unit on a predetermined side, a low temperature shift unit provided on one of inside and outside of an extending portion of the flow path that extends on the predetermined side so as to extend along the extending portion, and a preferential oxidation unit provided on the other of the inside and the outside of the extending portion so as to extend along the extending portion.

A laser treatment apparatus and system for producing ink-jet printheads

Power window switch

A power window switch has a case, a substrate disposed in the case, a window operation knob disposed on the case, a window lock button disposed on a front side of the window operation knob on the case, a window operation switch mechanism disposed in the case and activated in accordance with an operation of the window operation knob, a window lock switch mechanism disposed in the case and activated in accordance with an operation of the window lock button, and a connector having a terminal with a first terminal end protruding from the case and a second terminal end connected to the substrate. The window lock switch mechanism includes two conductive plate springs, and a pressing unit for pressing the plate springs.

Coating method and device

(57)【要約】 【課題】 フィルムの走行方向と逆方向に回転するアプ リケータロールでフィルムにコーティング液を塗布する 際、塗液の乾きにより発生したスカムによる塗布筋や塗 布斑の発生を防止することを目的とする。 【解決手段】 走行するプラスチックフィルム１に、フ ィルム１の走行方向と逆方向に回転するアプリケータロ ール３を用いて、塗布膜５を形成するに際し、表面粗さ が０．０５μｍ≦Ｒａ≦１．０μｍ、かつ、０．８μｍ ≦Ｒｍａｘ≦２０μｍである、表面に微細孔３ａまたは 微細溝構造を有するアプリケータロール３を用いること により、微細孔３または微細溝に残存する塗液のためロ ール３表面の塗液の固化を防ぐ。

Ink jet recording head, ink jet recording apparatus using such ink jet recording head, and method for manufacturing ink jet recording head

An ink jet recording head comprises an ink tank, a nozzle for discharging ink, a liquid chamber for retaining a specific amount of ink supplied from the ink tank through a filter, while supplying ink to the nozzle, and a covering member to be bonded to the liquid chamber, and on the circumference of the liquid chamber, a groove is formed to enable bonding agent to be coated therefor, and on the circumference of the covering member, an extrusion is formed to be fitted into the groove. For this ink jet recording head, gas releasing means is provided for releasing gas remaining in the bonding agent to the outside of the groove when the covering member is bonded to the liquid chamber by fitting the extrusion into the groove after the bonding agent is coated in the groove. With the structure thus arranged, it is possible to prevent leakage form occurring between liquid chambers, because voids are not formed by gas remaining in the bonding agent, which may connect liquid chambers adjacent to each other, and each of the liquid chambers is airtightly closed in the ink jet recording head for a better performance thereof.

Transmitting device and receiving device

【課題】複数のサービスを関連させて放送するような場合に、関連するサービスを受信するための選局から映像出力までが素早く行えないと、視聴者はストレスを感じてしまうことになり、場合によっては、視聴を断念してしまうことも考えられる。 【解決手段】データ取得部２２が取得した複数のサービスの各データと、関連情報取得部２３が取得した複数のサービスの関連性を示す情報とを多重化して送信する送信部２６とを備える送信装置１２。チューナ１３が、受信した放送波から各サービスのデータと複数のサービスの関連性を示す情報とを取得し、音声デコード部１５及び映像デコード部１６が、選択したサービスのデータをデコードすると共に、複数のサービスの関連性を示す情報に基づいて、選択したサービスに関連する他のサービスのデータもデコードするように制御する制御部２０とを備える受信装置１１。 【選択図】図２

System for detecting condition of floding

(57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。

Combustion apparatus

To provide a combustion apparatus that has a vaporizer capable of vaporizing liquid fuel completely without complicating the structure of the combustion apparatus. The combustion apparatus has an evaporating part for heating and vaporizing the liquid fuel into combustion gas, and a premixed gas spout part for spouting out premixed gas in which the combustion gas is mixed with primary air, with an inflow port of the premixed gas spout part being provided at a position higher than the evaporating part. By configuring the combustion apparatus like this, a space for accumulating unvaporized liquid fuel is formed between the evaporating part and the inflow port, and sufficient time to completely vaporize the liquid fuel can be afforded. Therefore, unevaporated fuel in a liquid state can be prevented from flowing into the premixed gas spout part.

Patent JPH0220475B2

Ink jet recording head, cartridge and apparatus.

An ink jet recording apparatus includes a liquid passage (112) for ejection of ink; a liquid chamber (108) for supplying ink to the passage; a device for mounting the recording head on the ink jet recording apparatus at an angle not more than 45 degrees relative to the horizontal plane; wherein the chamber (108) has an internal surface (105) which is slanted in a direction from an ink inlet (103) thereof toward the liquid passage (112) at the angle of 5 - 40 degrees relative to an extension of the liquid passage (112).

Saddle riding type motorcar having four wheels

A new and unique saddle-riding type motorcar having four wheels comprising two front wheels and two rear wheels, wherein each of the front and rear wheels has a balloon tire mounted thereon and only the front wheels are rotatably supported on axles in such a manner as to turn in both directions relative to the longitudinal axis of the motorcar and the latter is steered by steering the front wheels by means of a bar handle constituting a steering mechanism. The motorcar includes a frame structure comprising a pair of upper frames, a pair of lower frames and a plurality of spacer frames, said pair of upper frames comprising a pair of fore-end portions extending downward from a bent portion at a forward inclination angle and a pair of inclined portions extending rearward by a certain distance from said bent portion at a gentle downward slope, said pair of lower frames being fixedly connected to the pair of upper frames by way of a fore axle at their fore end and by way of vertically extending frames at their rear end and said spacer frames extending in the transverse direction relative to the upper and lower frames so as to connect one of the upper frames to the other and one of the lower frames to the other. A steering head is located at the bent portion of the upper frames. Supporting sections are disposed at both the end-parts of the fore axle and at the rearmost end-parts of the lower frames to support the wheels. A suspension mechanism may be disposed at least on one of the front wheels and the rear wheels and each of the rear wheels may include an independent driving axle adapted to be swingably supported by means of an independent swing arm and an independent suspension mechanism.

Press-contact connector built in substrate

A press-contact terminal (3) is held on the terminal holder (5) of a main housing (6). The lead (12) of the press-contact terminal (3) is soldered to the first surface (10a) of a circuit board (10) after passed through the bottom plate (13) of the main housing (6) and the circuit board (10), and the board (10) is held in a second holding space (11) between the main housing (6) and a second cover housing (8). After the press-contact terminal (3) is press-contacted to a desired position of a coated wire (2) with such a sub-assembled condition kept, a first cover housing (7) is assembled to the main housing (6). A press-contact weight is received by the receiving portion (44) of he second cover housing (8) via the bottom plate (13) of the main housing (6) and the circuit board (10). A positive press-contact can be attained without the bottom plate (13) nor the circuit board (10) inadvertently bending, thus making practically possible an in-housing press-contacting.

Process for producing an ink jet recording head

A process for producing an ink jet recording head for ejecting an ink and more particularly a process for producing orifices in the ink jet recording head is disclosed. This process comprises the steps of: providing an orifice plate constituting said ink jet recording head; and irradiating laser beams sequentially which are symmetrical each other in intensity distribution thereof onto same portion of said orifice plate which corresponds to an aimed ink passage so as to form the orifice.

Process for manufacturing an inkjet printhead.

Ink jet recording head, cartridge and apparatus

Aluminum alloy sheet for motor vehicle and process for producing the same

An aluminum alloy sheet for motor vehicles excellent in press formability, resistance to surface roughening and shape fixability is produced without subjecting the sheet to stabilization treatment by casting a melt, containing 3.0-3.5 mass% Mg, 0.05-0.3 mass% Fe, 0.05-0.15 mass% Si, and further a limited amount of less than 0.1 mass% Mn, a balance substantially being inevitable impurities and Al, into a thin slab having a thickness of 5 to 15 mm in a twin-belt caster so that the cooling rate at 1/4 depth of the thickness of the thin slab is 20 to 200°C/sec; winding the cast thin slab into a coil; subjecting the coiled thin slab to cold rolling with a roll having a surface roughness of 0.2 to 0.7 µm Ra at a cold rolling reduction of 50 to 98%; subjecting the cold rolled thin sheet to final annealing either continuously in a CAL at a holding temperature of 400 to 520°C or in a batch annealing furnace at a holding temperature of 300 to 400°C; and then subjecting the resulting sheet to straightening with a leveler.

Liquid jet recording head and manufacture thereof

(57)【要約】 【課題】 吐出口プレートにおける吐出口の吐出面側の 開口面積を大きくするとともに吐出口周辺の表面性状を 変化させて、液滴の吐出方向の安定化を特別な工程を設 けることなく実現し、製造のスループットを向上させ て、印字特性を良好なものとすることができる液体噴射 記録ヘッドの製造方法を提供する。 【解決手段】 コヒーレントなレーザ光Ｌの照射により 吐出口２３となる穴を一括アブレーション加工する際 に、吐出口プレート２１の吐出面側にレーザ光Ｍを照射 して、吐出口プレート２１の吐出面側の部位２４を削り 取って吐出口形成部位の厚さを薄くし、同時に吐出口プ レート２１の吐出面の表面性状を変化させ、さらに吐出 口形成時に発生する副生成物の付着を防止する。

Aluminum alloy sheet for motor vehicle and process for producing the same

A melt which contains 3.0-3.5 mass% magnesium, 0.05-0.3 mass% iron, and 0.05-0.15 mass% silicon and has a manganese content reduced to below 0.1 mass%, with the remainder substantially being incidental impurities and aluminum, is cast into a thin slab having a thickness of 5-15 mm with a twin-belt casting machine under such conditions as to result in a cooling rate, as measured in a position corresponding to 1/4 the thickness, of 20-200 °C/sec. The cast is wound into a coil and then subjected to cold rolling with a roll having a surface roughness (Ra) of 0.2-0.7 µm at a cold rolling reduction of 50-98%. The slab rolled is subjected to final annealing either continuously in a CAL at a holding temperature of 400-520°C or with a batch annealing oven at a holding temperature of 300-400°C. The resultant sheet is subjected to stress relieving with a leveler. Thus, an aluminum alloy sheet for motor vehicles which is excellent in press formability, unsusceptibility to surface roughening, and shape fixability is provided without the need of a stabilization treatment.