17-08-2011 дата публикации
Номер: CN0102153979A
Автор:
YONGPING LEI,
HAITING LAN,
ZHIDONG YAN,
XIAOJUN YANG,
LANLI YI,
YAOWU SHI,
FU GUO,
LEI YONGPING,
LAN HAITING,
YAN ZHIDONG,
YANG XIAOJUN,
YI LANLI,
SHI YAOWU,
GUO FU
Принадлежит:
The invention discloses an intermediate-temperate rapidly-cured surface mount adhesive for lead-free welding, belonging to the field of electronic industry. The adhesive comprises the following components in percentage by mass: 50.0-60.0% of low-viscosity epoxy resin, 14.0-22.0% of complex latent curing agent, 6.0-15.0% of active diluent, 0.0-6.0% of plasticizer, 5.0-10.5% of thixotropic agent, 7.5-13.5% of inorganic filling material and 0.5-1.0% of pigment. The adhesive can be used for the lead-free welding and can be rapidly cured at the intermediate temperate of 110 DEG C within 140-155 seconds; and after being cured, the adhesive has high stretching and shearing strength, is repairable, has favorable forming property, is less possible to spread and cave in, and can be applied to the technical field of lead-free electronic packaging.
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