06-09-2018 дата публикации
Номер: US20180255664A1
Принадлежит:
Embodiments of the present disclosure provide a middle frame member including: a middle frame substrate body; a first metal layer, attached to a first area of the middle frame substrate body, where a coefficient of heat conductivity of the first metal layer is greater than a coefficient of heat conductivity of the middle frame substrate body, the first area includes all or a part of an outer surface of the middle frame substrate body, and the first metal layer is used to conduct, to the entire first metal and the middle frame substrate body, heat generated by at least one of the components that is in contact with or adjacent to the first metal layer; and a passivated insulation layer, attached to a surface of the first metal layer. 1. A middle frame member , comprising:a middle frame substrate body, wherein the middle frame member is a support part inside an electronic product for supporting components in the electronic product;a first metal layer, attached to a first area of the middle frame substrate body, wherein a coefficient of heat conductivity of the first metal layer is greater than a coefficient of heat conductivity of the middle frame substrate body, the first area comprises all or a part of an outer surface of the middle frame substrate body, and the first metal layer is used to conduct, to the middle frame substrate body, heat generated by at least one of the components that is in contact with or adjacent to the first metal layer; anda passivated insulation layer, attached to a surface of the first metal layer.2. The middle frame member of claim 1 , whereinthe components in the electronic product comprise one or more of a printed circuit board PCB, a chip, a battery, or a screen.3. The middle frame member of claim 1 , whereinthe first metal layer comprises one or more of:a copper layer, a silver layer, or a gold layer.4. The middle frame member of claim 1 , whereinthe first area comprises all or a part of the outer surface of the middle frame substrate ...
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