Cryptographic sequencing system and method

A method is disclosed for intermixing a first stream of data and a second stream of data. An associated first secret key is expanded to form a first associated expanded secret key. An associated second secret key is expanded to form a second associated expanded secret key. The first stream of data and the second stream of data are intermixed to form a combined stream of data, which is ciphered. The combined stream of data is de-multiplexed after ciphering thereof and provided at an output port.

Method for Inspection of Materials for Defects

The present invention is a non-destructive method of inspecting a bond, particularly a braze bond, in a hermetic package. The invention involves a unique hermetic package design adapted for ultrasonic inspection and a method of inspecting the package. This package and non-destructive inspection process are particularly useful in implantable neural stimulators such as visual prostheses. 1. A method of inspecting a bond in a hermetic package comprising: a bottom having an inside surface and an outside surface,', 'a top having an edge surface in contact with said inside surface,', 'a bond attaching said edge surface to said inside surface, wherein said bond is parallel to and less than 500 μm from said outside surface;, 'providing a hermetic package comprisingscanning said hermetic package with ultrasonic energy;receiving reflected ultrasonic energy from said step of scanning; anddetermining the quality of said bond from said reflected ultrasonic energy.2. The method of inspecting a bond according to claim 1 , wherein said step of scanning is scanning with acoustic micro imaging.3. The method of inspecting a bond according to claim 1 , wherein said step of scanning is scanning with scanning acoustic microscopy.4. The method of inspecting a bond according to claim 1 , wherein said bond is selected from the group consisting of a braze bond and a solder bond.5. The method of inspecting a bond according to claim 1 , wherein said top and said bottom are optically opaque.6. The method of inspecting a bond according to claim 1 , wherein said top and said bottom are selected from the group consisting of a metal and a ceramic.7. The method of inspecting a bond according to claim 1 , wherein said reflected ultrasonic energy identifies gaps in said bond.8. The method of inspecting a bond according to claim 1 , wherein said reflected ultrasonic energy identifies delaminations of said bond.9. A hermetic package comprising:a top having an edge surface;a bottom having an outside ...

Flexible Circuit Electrode Array

A flexible circuit electrode array with more than one layer of metal traces comprising: a polymer base layer; more than one layer of metal traces, separated by polymer layers, deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; and a polymer top layer deposited on said polymer base layer and said metal traces. Polymer materials are useful as electrode array bodies for neural stimulation. They are particularly useful for retinal stimulation to create artificial vision, cochlear stimulation to create artificial hearing, or cortical stimulation many purposes. The pressure applied against the retina, or other neural tissue, by an electrode array is critical. Too little pressure causes increased electrical resistance, along with electric field dispersion. Too much pressure may block blood flow. 1. A method of making a flexible circuit electrode array comprising:depositing a polymer base layer;depositing a first metal layer on said polymer base layer;patterning said first metal to form first metal traces;depositing a polymer interlayer on said polymer base layer and said metal traces;patterning said polymer interlayer to provide vias;depositing a second metal layer on said polymer interlayer;patterning said second metal layer to form second metal traces;depositing a polymer top layer on said polymer interlayer and said second metal traces forming a flexible circuit; andembedding the flexible circuit in an curved body having a generally curved in the plane of a retina, the curved body curved to conform to a spherical curvature of the retina.2. The method according to claim 1 , further comprising repeating the steps of depositing metal layers patterning and depositing polymer interlayers to create additional trace layers.3. The method according to claim 1 , wherein vias are created by MEMS process.4. The method according to claim 1 , wherein the steps of patterning polymer are etching by reactive plasma.5. The method according to ...

Visual Prosthesis Including a Flexible Circuit Electrode Array

A visual prosthesis which includes a hermetic package and flexible circuit electrode array is disclosed. The hermetic package includes electrode drivers and contacts. The flexible circuit electrode array includes a polymer base layer, metal traces, including electrodes suitable to stimulate visual neural tissue and bond pads bonded to contacts on the hermetic package, all deposited on the polymer base layer, a polymer top layer deposited on the polymer base layer and deposited on the metal traces, a partial or an entire coating of the polymer base layer and of the polymer top layer by a soft polymer that is softer than the polymer base layer; and the polymer base layer and the polymer top layer contain a plurality of aligned holes to facilitate bonding of the soft polymer. 1. A visual prosthesis comprising:a hermetic package including electrode drivers; a polymer base layer having a first edge,', 'metal traces, including electrodes suitable to stimulate visual neural tissue and bond pads bonded to contacts on the hermetic package, deposited on said polymer base layer,', 'a polymer top layer, having a second edge, deposited on said polymer base layer and deposited on said metal traces,', 'a partial or an entire coating of said polymer base layer and of said polymer top layer by a soft polymer that is softer than said polymer base layer; and', 'said polymer base layer and said polymer top layer of said flexible circuit electrode array contain a plurality of aligned holes to facilitate said soft polymer bonding, said holes not aligned to said electrodes., 'a flexible circuit electrode array including2. The visual prosthesis according to claim 1 , wherein said first edge of said polymer base layer and said second edge of said polymer top layer are covered by said soft polymer.3. The visual prosthesis according to claim 1 , wherein said polymer base layer and said polymer top layer are completely coated with said soft polymer.4. The visual prosthesis according to claim 1 ...

Cortical Interface for Motor Signal Recording and Sensory Signal Stimulation

The present invention consists of an implantable device with at least one package that houses electronics that sends and receives data or signals, and optionally power, from an external system through at least one coil attached to the at least one package and processes the data, including recordings of neural activity, and delivers electrical pulses to neural tissue through at least one array of multiple electrodes that is/are attached to the at least one package. The device is adapted to electrocorticographic (ECoG) and local field potential (LFP) signals. The output signals provide control for a motor prosthesis and the inputs signals provide sensory feedback for the motor prosthesis. The invention, or components thereof, is/are intended to be installed in the head, or on or in the cranium or on the dura, or on or in the brain. 1. An implantable device comprising:a hermetic package enclosing an electronic circuit suitable to implanted within a head;a flexible circuit including a plurality of electrodes electrically coupled to the electronic circuit suitable to record neural activity; anda wireless transceiver electrically coupled to the electronic circuit for sending data derived from the neural activity and receiving sensory data.2. The implantable device according to claim 1 , where the electronic circuit is adapted to record Electrocorticographic Signals.3. The implantable device according to claim 1 , wherein the electronic circuit is adapted to record local field potential signals.4. The implantable device according to claim 1 , wherein the data controls a motor prosthesis.5. The implantable device according to claim 1 , wherein the plurality of electrodes are part of a flexible circuit electrode array bonded to the hermetic package.7. The flexible circuit electrode array according to claim 6 , wherein at least some of the fingers are curved.8. The flexible circuit electrode array according to claim 6 , wherein at least some of the fingers are pointed.9. The ...

Implantable Microelectronic Device and Method of Manufacture

An implantable hermetically sealed microelectronic device and method of manufacture are disclosed. The microelectronic device of the present invention is hermetically encased in a insulator, such as alumina formed by ion bean assisted deposition (“IBAD”), with a stack of biocompatible conductive layers extending from a contact pad on the device to an aperture in the hermetic layer. In a preferred embodiment, one or more patterned titanium layers are formed over the device contact pad, and one or more platinum layers are formed over the titanium layers, such that the top surface of the upper platinum layer defines an external, biocompatible electrical contact for the device. Preferably, the bottom conductive layer is larger than the contact pad on the device, and a layer in the stack defines a shoulder. 1. A method of making an implantable electronic device comprising:providing an electronic component having contact pads on a surface;applying a polymer layer to the surface of the electronic component;patterning the polymer layer including forming voids over the contact pads;applying a conductive layer to the surface including the polymer layer and the voids over the contact pads; andremoving the polymer layer by peeling, leaving a patterned conductive layer covering at least the contact pads.2. The method according to claim 1 , wherein the step of patterning is patterning by photolithography.3. The method according to claim 1 , wherein the electronic component is an integrated circuit having on its surface a passivation layer including openings for the contact pads.4. The method according to claim 1 , wherein the contact pads are aluminum.5. The method according to claim 1 , wherein the step of applying a polymer layer is applying polyimide.6. The method according to claim 5 , wherein the polyimide is applied between 5 μm and 15 μm thick.8. The method according to claim 7 , wherein the step of patterning the polymer layer through reactive ion etch also roughens a ...

Face Detection, Tracking, and Recognition for a Visual Prosthesis

The present invention is a system for detecting, tracking and recognizing human faces in a visual prosthesis. In a visual prosthesis, the input camera is always higher resolution than the electrode array providing percepts to the subject. It is advantageous to detect, track and recognize human faces. Then information can be provided to the subject by highlighting the face in the visual scene, providing auditor or vibratory notice that a human face is in the visual scene, looking up the face in a database to state the name of the person in the visual scene, otherwise communication id like providing a custom vibratory pattern corresponding to known individuals (like custom ring tones associated with caller ID) or automatically zooming in on a face to aid the subject in identifying the face. 1. A method of aiding a visual prosthesis subject comprising:detecting a face in the subject's visual scene; andproviding cues to the subject regarding a detected face.2. The method of claim 1 , wherein the cue is a sound.3. The method of claim 1 , wherein the cue is a vibration.4. The method of claim 1 , wherein the cue is stating a name associated with the detected face.5. The method according to claim 4 , further comprising looking up the face in a look up table to retrieve the name associated with the detected face.6. The method of claim 1 , wherein the cue is highlighting the detected face.7. The method of claim 1 , wherein the cue is zooming in on the detected face.8. The method of claim 1 , wherein the cue includes an indication of if the face is looking toward the subject or turned away.9. The method of claim 1 , wherein the cue is tactile feedback.10. The method of claim 1 , further comprising detecting facial characteristic.11. The method of claim 10 , wherein the characteristic is gender.12. The method of claim 10 , wherein the characteristic is size.13. The method of claim 10 , wherein the characteristic is distance.14. The method of claim 10 , wherein the ...

Retinal Prosthesis

The invention is a retinal prosthesis with an improved configuration mounting necessary components within and surrounding the eye. The present invention better allows for the implantation of electronics within the delicate eye structure. The invention provides for less height of the part external to the eye by mounting a receiver coil around an electronics package. 1. A retinal prosthesis comprising:an electrode array suitable to be mounted in close proximity to a retina;an electronics package suitable to be outside the eye and mounted to the eye;a cable suitable to pierce the sclera electrically coupling said electrode array to said electronics package; anda coil electrically coupled to said electronics package and surrounding the electronics package.2. The retinal prosthesis according to claim 1 , wherein the coil and electronics package are suitable to be mounted to a side of the eye.3. The retinal prosthesis according to claim 1 , wherein the electronics package is a hermetic package.4. The retinal prosthesis according to claim 1 , further comprising a demultiplexer suitable to be mounted internal to the sclera and electrically coupled to the electrode array.5. The retinal prosthesis according to claim 4 , wherein the demultiplexer is integral to the electrode array.6. The retinal prosthesis according to claim 4 , wherein said demultiplexer is suitable to be within the eye claim 4 , but distant from the electrode array.7. The retinal prosthesis according to claim 5 , wherein said electrode array and said demultiplexer are formed on a common substrate.8. The retinal prosthesis according to claim 4 , wherein said multiplexer is deposited on a thin film substrate.9. The retinal prosthesis according to claim 8 , wherein said electrode array and said multiplexer are deposited on a common thin film substrate.10. The retinal prosthesis according to claim 9 , wherein said electrode array claim 9 , said multiplexer claim 9 , and said cable are deposited on a common thin ...

Method for Inspection of Materials for Defects

The present invention is a non-destructive method of inspecting a bond, particularly a braze bond, in a hermetic package. The invention involves a unique hermetic package design adapted for ultrasonic inspection and a method of inspecting the package. This package and non-destructive inspection process are particularly useful in implantable neural stimulators such as visual prostheses. 1. A method according to inspecting a bond in a hermetic package comprising: a bottom having an inside surface, an outside surface and a side surface,', 'a top having a first lip in contact with the side surface,', 'a bond attaching the top to the inside surface, wherein the bond is parallel to and sufficiently proximate to the outside surface to allow acoustic inspection;, 'providing a hermetic package comprisingscanning the hermetic package with acoustic energy;receiving reflected acoustic energy from the step of scanning; anddetermining the quality of the bond from the reflected acoustic energy.2. The method of inspecting a bond according to claim 1 , wherein the acoustic energy is ultrasonic energy.3. The method of inspecting a bond according to claim 1 , wherein the step of scanning is scanning with acoustic micro imaging.4. The method of inspecting a bond according to claim 1 , wherein the step of scanning is scanning with scanning acoustic microscopy.5. The method of inspecting a bond according to claim 1 , wherein the bond is selected from the group consisting of a braze bond and a solder bond.6. The method of inspecting a bond according to claim 1 , wherein the top and the bottom are optically opaque.7. The method of inspecting a bond according to claim 1 , wherein the top and the bottom are selected from the group consisting of a metal and a ceramic.8. The method of inspecting a bond according to claim 1 , wherein the reflected acoustic energy identifies gaps in the bond.9. The method of inspecting a bond according to claim 1 , wherein the reflected acoustic energy ...

Package for a Neural Stimulation Device

An implantable device, including a first electrically non-conductive substrate; a plurality of electrically conductive vias through the first electrically non-conductive substrate; a flip-chip multiplexer circuit attached to the electrically non-conductive substrate using conductive bumps and electrically connected to at least a subset of the plurality of electrically conductive vias; a flip-chip driver circuit attached to the flip-chip multiplexer circuit using conductive bumps; a second electrically non-conductive substrate attached to the flip-chip driver circuit using conductive bumps; discrete passives attached to the second electrically non-conductive substrate; and a cover bonded to the first electrically non-conductive substrate, the cover, the first electrically non-conductive substrate and the electrically conductive vias forming a hermetic package.

SOFT-PROJECTILE LAUNCHING DEVICE

A device for projecting a soft-projectile made from a super absorbent polymer, the device comprising a holder designed for containing the soft-projectile made from a super absorbent polymer; and a firing mechanism operatively arranged to accelerate the holder from a firing position. 1. A projectile launching system , comprising:ammunition comprising a plurality of soft-projectiles formed from hydrated super absorbent polymer; anda projectile launcher for launching the ammunition in free flight.2. The system of claim 1 , further comprising a sealed container for storage of the ammunition.3. The system of claim 1 , wherein the projectile launcher is a toy.4. The system of claim 1 , wherein the projectile launcher is in the shape of a gun.5. The system of claim 1 , wherein the projectile launcher includes a feed chamber for loading the soft-projectiles within projectile launcher.6. The system of claim 5 , wherein the feed chamber is provided within a magazine.7. The system of claim 5 , wherein the projectile launcher is adapted to load the soft-projectiles from the feed chamber to a firing position of the projectile launcher.8. The system of claim 1 , wherein the soft-projectiles are substantially spherical.9. The system of claim 1 , wherein the super absorbent polymer has a cross linking density sufficient to prevent the soft-projectiles from breaking apart when launched from the projectile launcher.10. The system of claim 1 , wherein the projectile launcher is designed to use air pressure to launch the soft-projectiles.11. The system of claim 1 , wherein the projectile launcher comprises a firing mechanism that stores energy independent of a user.12. The system of claim 1 , wherein the projectile launcher comprises a firing mechanism that is incapable of storing energy independent of a user.13. The system of claim 1 , wherein the projectile launcher comprises a firing mechanism that directly applies a force to the ammunition.14. The system of claim 1 , wherein the ...

Retinal Prosthesis and Method of Manufacturing a Retinal Prosthesis

The present invention is an improved package and configuration for an implantable retinal prosthesis. The retinal prosthesis of the present invention includes an electrode array suitable to be mounted in close proximity to a retina, an electronics package and inductive receiving coil mounted next to each other on a strap surrounding the sclera so that the height above the sclera of the prosthesis is minimized. 1. An implantable device comprising:a polymer body;a hermetic electronics package mounted to the polymer body includinga. a base, including an electrically non-conductive substrate and a plurality of electrically conductive vias through the electrically non-conductive substrate,b. a flip-chip circuit attached directly to the base using conductive bumps and electrically connected to at least one of the plurality of electrically conductive vias, andc. a cover bonded to the base; anda secondary inductive coil mounted to the polymer body such that it is coplanar with the hermetic electronics package, electrically coupled to the electronics package and powering the flip-chip circuit in the electronics package.2. The implantable device according to claim 1 , further comprising suture tabs connected to the polymer body.3. The implantable device according to claim 1 , further comprising a second circuit within the hermetic electronics package wire bonded to the base and electrically connected to at least one of the conductive vias.4. The implantable device according to claim 3 , wherein the second circuit is a wire bonded hybrid stack circuit claim 3 , including thin film metallization claim 3 , wire bonded directly to the base.5. The implantable device according to claim 1 , wherein the secondary inductive coil is a wound wire coil.6. The implantable device according to claim 1 , wherein the secondary inductive coil is oval shaped.7. The implantable device according to claim 1 , further comprising an electrode array electrically coupled to a plurality of the ...

Package for an Implantable Device

The present invention is an improved hermetic package for implantation in the human body. The implantable device of the present invention includes an eclectically non-conductive bass including electrically conductive vias through the substrate. A circuit is flip-chip bonded to a subset of the vias. A second circuit is wire bonded to another subset of the vias. Finally, a cover is bonded to the substrate such that the cover, substrate and vias form a hermetic package. 1. A hermetic package for an implantable device , comprising:a base, including an electrically non-conductive substrate and a plurality of electrically conductive vias through the electrically non-conductive substrate;a flip-chip circuit attached directly to the base using conductive bumps wherein the flip-chip circuit is smaller than the base defining a bonding region between the flip-chip circuit and the edge of the base;a circuit element bonded to the base in the bonding region;a cover bonded to the base, the cover, and the base forming a hermetic package.2. The hermetic package according to claim 1 , further comprising patterned thin film metallization on the electrically non-conductive substrate and forming part of the base.3. The hermetic package of claim 1 , wherein the electrically non-conductive substrate contains ceramic.4. The hermetic package according to claim 3 , wherein the cover contains metal.5. The hermetic package according to claim 3 , wherein the electrically conductive vias are a metallic and ceramic paste co-fired with the electrically non-conductive substrate to form a hermetic seal.6. The hermetic package according to claim 3 , wherein the cover is brazed to the base.7. The hermetic package according to claim 2 , wherein the patterned thin film metallization is multiple layer thin film metallization and the flip-chip circuit and the wire bonded circuit are bonded to the patterned thin film metallization.8. The hermetic package according to claim 7 , wherein the multiple layer ...

Adherent Metal Oxide Coating Forming a High Surface Area Electrode

An implantable electrode and method for manufacturing the electrode wherein the electrode has a strong, adherent surface inert coating on a conductive coating on the electrode surface, which demonstrates an increase in surface area of at least five times when compared to smooth platinum of the same geometry. An iridium oxide coating may be formed on a platinum coating by a physical deposition process, such as sputtering. The process of electroplating the iridium oxide surface coating is accomplished by voltage control processes. A gradient coating of iridium oxide ranging in composition from essentially pure platinum to essentially pure iridium oxide is produced by sputtering. 1. An implantable electrode comprising:a substrate having a basic geometric shape;a conductive coating over the substrate having a surface area greater than five times the basic geometric shape;a surface coating of inert material over the conductive coating.2. The implantable electrode according to claim 1 , wherein the surface coating is comprised of iridium oxide.3. The implantable electrode according to claim 1 , wherein the surface coating is comprised of titanium nitride.4. The implantable electrode according to claim 1 , wherein the conductive coating is comprised of platinum grey.5. The implantable electrode according to claim 1 , wherein the electrode has a charge storage capacity that is greater than 35 mC/cm.6. The implantable electrode according to claim 1 , wherein the surface coating is a sputtered coating.7. The implantable electrode according to claim 1 , wherein the conductive coating is an electroplated coating.8. The implantable electrode according to claim 1 , wherein the conductive coating and surface coating are graded coatings.9. The implantable electrode according to claim 1 , wherein the surface coating is rough increasing the surface area of the surface coating over the surface area of the conductive coating.10. The implantable electrode according to claim 1 , wherein ...

Flexible Circuit Electrode Array Embedded in a Cured Body

Polymer materials are useful as electrode array bodies for neural stimulation. They are particularly useful for retinal stimulation to create artificial vision, cochlear stimulation to create artificial hearing, and cortical stimulation, and many related purposes. The pressure applied against the retina, or other neural tissue, by an electrode array is critical. Too little pressure causes increased electrical resistance, along with electric field dispersion. Too much pressure may block blood flow. Common flexible circuit fabrication techniques generally require that a flexible circuit electrode array be made flat. Since neural tissue is almost never flat, a flat array will necessarily apply uneven pressure. Further, the edges of a flexible circuit polymer array may be sharp and cut the delicate neural tissue. It is advantageous that the array edges not contact tissue. 2. The flexible circuit electrode array according to claim 1 , wherein the body is curved to substantially conform to the curvature of a retina of a recipient's eye.3. The flexible circuit electrode array according to claim 1 , wherein the body is curved with a contracting radius at its edges.4. The flexible circuit electrode array according to claim 1 , comprising 1 to 1000 electrodes.5. The flexible circuit electrode array according to claim 1 , comprising 16 to 250 electrodes.6. The flexible circuit electrode array according to claim 1 , comprising 60 to 250 electrodes.7. The flexible circuit electrode array according to wherein the flexible circuit is from 0.3 mm to 0.7 mm wide.8. The flexible circuit electrode array according to wherein the flexible circuit is from 3.5 mm to 4.5 mm long.9. The flexible circuit electrode array according to wherein the spacing between the electrodes is 5 μm-500 μm.10. The flexible circuit electrode array according to wherein the spacing between the electrodes is 250 μm-500 μm.11. The flexible circuit electrode array according to wherein the spacing between the ...

Flexible Circuit Electrode Array and Method of Manufacturing the Same

A method for manufacturing a flexible circuit electrode array adapted to electrically communicate with organic tissue including the following steps: 1. A method for manufacturing a flexible circuit electrode array adapted to electrically communicate with organic tissue , comprising:a) providing a flexible polymer base layer;b) curing the flexible polymer base layer;c) depositing a metal trace layer on a surface of the flexible polymer base layer;d) patterning the metal trace layer and forming metal traces on the flexible polymer base layer;e) roughening the surface of the flexible polymer base layer creating a roughened surface;f) chemically reverting the cure of the roughened surface of the flexible polymer base layer to create an uncured surface;g) depositing a flexible polymer top layer on the uncured surface and the metal traces;h) curing the flexible polymer top layer and the uncured surface thereby forming one single flexible polymer combined layer with the flexible polymer base layer and the flexible polymer top layer; andi) creating openings through the single flexible polymer layer to the metal trace layer.2. The method according to claim 1 , wherein the step of roughening is by reactive ion etch (RIE).3. The method according to claim 2 , wherein RIE includes oxygen in the etchant.4. The method according to claim 1 , wherein the flexible polymer base layer and the flexible polymer top layer are polyimide.5. The method according to claim 4 , wherein chemically reversing the curing of the roughened surface is deimidization.6. The method according to claim 4 , wherein the polymer base layer and the polymer top layer are applied by spin-coating as polyamic acid solution and the polyimide layer is obtained by curing the polyamic acid solution.7. The method according to claim 1 , wherein the flexible polymer base layer and the flexible polymer top layer are deposited by vapor deposition.8. The method according to claim 1 , wherein depositing of the metal trace ...

Method of Manufacturing a Flexible Circuit Electrode Array

Polymer materials make useful materials as electrode array bodies for neural stimulation. They are particularly useful for retinal stimulation to create artificial vision. Regardless of which polymer is used, the basic construction method is the same. A layer of polymer is laid down. A layer of metal is applied to the polymer and patterned to create electrodes and leads for those electrodes. A second layer of polymer is applied over the metal layer and patterned to leave openings for the electrodes, or openings are created later by means such as laser ablation. Hence the array and its supply cable are formed of a single body. 1. A method of making a flexible circuit electrode array for neural stimulation comprising:depositing a polymer base layer;depositing a metal layer comprising platinum on the polymer base layer;depositing photoresist on the metal layer;exposing the photoresist;patterning the metal by wet etch with Aqua Regia to form metal traces; anddepositing a polymer top layer on the polymer base layer and the metal traces.2. The method according to claim 1 , wherein the metal layer further comprises titanium.3. The method according to claim 2 , wherein the step of depositing metal includes first depositing titanium claim 2 , then depositing platinum and then depositing a second layer of titanium.4. The method according to claim 1 , wherein the step of patterning forms metal traces claim 1 , electrodes and bond pads.5. The method according to claim 4 , further comprising creating openings in the polymer base layer or the polymer top layer to exposes the electrodes and the bond pads.6. The method according to claim 5 , wherein creating openings is by laser ablation.7. The method according to claim 1 , further comprising activating the polymer base before depositing the polymer top layer.8. The method according to claim 7 , wherein activation comprises deimidization.9. The method according to claim 7 , wherein activation comprises RIE etch.10. The method ...

ELECTRONIC COMMUNICATING

Among other things, we describe enabling two or more users to share a workspace that is dynamically populated by artifacts of electronic communications among the users that are expressed in a form of at least one of social network posts and email messages, and in which the users can interact using the artifacts in any of the forms. 1. A computer-implemented method comprisingenabling two or more users to share a workspace that is dynamically populated by artifacts of electronic communications among the users that are expressed in a form of at least one of social network posts and email messages, and in which the users can interact using the artifacts in any of the forms.2. The method of in which the artifacts comprise at least portions of email messages that are native to an email application.3. The method of in which the artifacts comprise at least portions of social network posts that are native to a social network platform.4. The method of in which the workspace is part of a social network application or client.5. The method of in which the workspace is part of an email client or application.6. The method of in which an email message is presented in a manner that enables it to be used in a social networking mode.7. A computer-implemented method comprisingassociating two or more artifacts that contain content, each of the artifacts having been authored by an author in a source application that provides at least one of: (a) social network features, (b) email features, or (c) file management features,the association of the two or more artifacts being based on at least one of (a) a relationship of the authors or (b) a relationship of the content.exposing at least some of the artifacts to a user who is associated with at least one of: (a) an author of at least one of the artifacts or (b) the content of at least one of the artifacts,the artifacts being exposed through an application that provides at least one of: (a) email features, (b) social network features, or (c) ...

Implantable Package to Facilitate Inspection

The present invention is a non-destructive method of inspecting a bond, particularly a braze bond, in a hermetic package. The invention involves a unique hermetic package design adapted for ultrasonic inspection and a method of inspecting the package. This package and non-destructive inspection process are particularly useful in implantable neural stimulators such as visual prostheses. 1. A hermetic package comprising:a top having an edge surface;a bottom having an outside surface and an inside surface;a bond attaching said edge surface to said inside surface,wherein said top, bottom and bond form a rigid, biocompatible, hermetic package suitable for implantation within a human body; andwherein said bond is parallel to and sufficiently proximate to the outside surface to allow acoustic inspection.2. The hermetic package according to claim 1 , wherein said bond is less than 500 μm from the outside surface.3. The hermetic package according to claim 1 , wherein said bond is selected from the group consisting of a braze bond and a solder bond.4. The hermetic package according to claim 1 , wherein said top and said bottom are selected from the group consisting of a metal and a ceramic.5. The hermetic package according to claim 1 , wherein said hermetic package is biocompatible.6. The hermetic package according to claim 5 , wherein said hermetic package is suitable for implantation within a human body as a neural stimulator.7. The hermetic package according to claim 6 , wherein said hermetic package is suitable for implantation within a human body as a visual prosthesis. This application is a divisional application of U.S. patent application Ser. No. 13/752,636, filed Jan. 29, 2013, for Method for Inspection of Materials for Defects, which is a divisional application of U.S. patent application Ser. No. 13/360,480, filed Jan. 27, 2012, for Implantable Package to Facilitate Inspection, now U.S. Pat. No. 8,391,987, which is a divisional application of U.S. Ser. No. 12/209, ...

Package for an Implantable Neural Stimulation Device

An implantable device, including a first electrically non-conductive substrate; a plurality of electrically conductive vias through the first electrically non-conductive substrate; a flip-chip multiplexer circuit attached to the electrically non-conductive substrate using conductive bumps and electrically connected to at least a subset of the plurality of electrically conductive vias; a flip-chip driver circuit attached to the flip-chip multiplexer circuit using conductive bumps; a second electrically non-conductive substrate attached to the flip-chip driver circuit using conductive bumps; discrete passives attached to the second electrically non-conductive substrate; and a cover bonded to the first electrically non-conductive substrate, the cover, the first electrically non-conductive substrate and the electrically conductive vias forming a hermetic package. 1. An implantable device , comprising:A first electrically non-conductive substrate;a plurality of electrically conductive vias through the first electrically non-conductive substrate;conductive traces deposited on the first electrically non-conductive substrate, the first electrically non-conductive substrate, electrically conductive vias and conductive traces forming a base;a flip-chip circuit attached to the base using conductive bumps;a stack chip circuit bonded to the flip chip circuit and wire bonded to the base;a second electrically non-conductive substrate bonded to the stack chip circuit and wire bonded to the base;discrete passives attached to the second electrically non-conductive substrate; anda cover bonded to the base, the cover and the base forming a hermetic package.2. The implantable device according to claim 1 , wherein the electrically conductive vias are a metallic and ceramic paste co-fired with the first electrically non-conductive substrate to form a hermetic seal.3. The implantable device according to claim 1 , wherein the cover is brazed to the base.4. The implantable device according ...

SUPER ABSORBENT POLYMER PROJECTILE LAUNCHING DEVICE

A device for projecting a soft-projectile made from a super absorbent polymer, the device comprising a holder designed for containing the soft-projectile made from a super absorbent polymer; and a firing mechanism operatively arranged to accelerate the holder from a firing position. 1. A system for projecting a soft-projectile comprising:a device for projecting a soft-projectile;a magazine for holding soft-projectiles for use with the device; andwherein both the device and the magazine include a complementary locking mechanism designed to prevent access to an interior of the magazine and an interior of the device, except when the magazine and the device are mated together.2. The system of claim 1 , further comprising a refill container wherein the refill container includes a complementary locking mechanism designed to mate with the magazine and allow access from an interior of the refill container to an interior of the magazine only when the refill container is mated to the magazine.3. The system of claim 1 , wherein the complimentary locking mechanism of the magazine includes an opening that aligns with an opening in the complimentary locking mechanism of the device when the magazine and the device are mated together.4. The system of claim 3 , wherein the opening in the complimentary locking mechanisms of both the magazine and the device has a trap door slideably disposed behind the opening.5. The system of claim 4 , wherein the trap doors are biased by springs to force the trap doors over their respective openings when the magazine and projection device are not mated.6. The system of claim 5 , wherein the trap doors are designed to both retract against the biasing force of the corresponding springs so that the trap doors no longer block their respective openings when the magazine is mated with the device.7. The system of claim 6 , wherein the complementary locking mechanisms of the magazine includes a key designed to fit through a slot of the complimentary locking ...

MOBILE WORKSTATION WITH ADJUSTABLE HEIGHT

A mobile workstation with adjustable height of the present disclosure may comprise a top assembly, an adjustment assembly, and a bottom assembly. Adjustment assembly may comprise telescopically engaged segments. One or more pulleys or pulley assemblies may be disposed within one or more of the segments to allow for withdrawing and retracting segments from one another at the same rate. Actuation of the raising or lowering of the overall height of the mobile workstation may be realized through either a manual actuation or an electronic element such as a linear actuator. 120-. (canceled)21. A mobile workstation comprising:(a) a top assembly;(b) a base assembly; and (i) a set of shaft segments including a bottom shaft segment that is secured to the base assembly, a middle shaft segment that is slideably engaged with the bottom shaft segment, and a top shaft segment that is secured to the top assembly and that is slideably engaged with the middle shaft segment,', "(ii) a cable diverter configured to engage and change a cable's direction, and", '(iii) a cable, wherein the cable extends from a first end to a spaced apart second end, wherein the cable is engaged with the cable diverter, and wherein each of the first end and the second end are secured to different shaft segments of the set of shaft segments., '(c) an adjustment assembly configured to selectively change the distance between the top assembly and the base assembly, the adjustment assembly comprising22. The mobile workstation of claim 21 , wherein the cable diverter comprises a pulley.23. The mobile workstation of claim 21 , wherein the first end of the cable is secured to the top shaft segment.24. The mobile workstation of claim 23 , wherein the second end of the cable is secured to the middle shaft segment.26. The mobile workstation of claim 24 , wherein the adjustment assembly is configured to claim 24 , when changing the distance between the top assembly and the base assembly claim 24 , cause the top shaft ...

EXPANSION JOINT SEAL AND EXPANSION JOINT

An expansion joint seal for sealing a gap between two structural members that includes a coverplate, a snap-fit connector extending downwardly from the coverplate, a central spine connected to the coverplate with a snap-fit connector and extending downwardly from the connector, and foam seal members engaged with the central spine of the expansion joint seal. An expansion joint including spaced-apart structural members defining a gap between the spaced-apart members and the expansion joint seal. 1. An expansion joint seal comprising:a coverplate;a snap-fit connector depending downwardly from said coverplate;a central spine connected to said coverplate by said snap-fit connector and extending downwardly from said connecting member; andat least one piece of expandable and compressible foam seal engaged with said central spine.2. The expansion joint seal of claim 1 , wherein said coverplate comprises a metal claim 1 , a metal alloy claim 1 , a rigid plastic claim 1 , an elastomer claim 1 , or a composite material.3. The expansion joint seal of claim 2 , wherein said coverplate comprises a rigid plastic material.4. The expansion joint seal of claim 3 , wherein said snap-fit connector comprises a rigid plastic material.5. The expansion joint seal of claim 4 , wherein said snap-fit connector is bonded to said coverplate.6. The expansion joint seal of claim 4 , wherein coverplate and said snap-fit connecter comprise a single extruded integral piece.7. The expansion joint seal of claim 2 , wherein said coverplate comprises a metal.8. The expansion joint seal of claim 7 , wherein said snap-fit connecter is connected to said coverplate by a dovetail joint.9. The expansion joint seal of claim 2 , wherein said coverplate comprises an elastomeric material.10. The expansion joint seal of claim 9 , wherein said coverplate comprises an elongated resilient elastomeric cover having a load bearing surface opposite a support surface including marginal support areas along opposite ...

PRE-LOADING CACHE LINES

A system for caching is configured for a pending lock state of a cache line, pre-loading the cache line into cache memory, and locking the cache line to prevent eviction of the cache line from the cache memory. The cache line is associated with instructions or data, and the pre-loading of the cache line may include loading the cache line into the cache memory before an algorithm relying on the instructions or data needs them. The pre-loading of a cache line associated with instructions may be done without execution of the instructions. The pending lock state of the cache line may be achieved by configuring the cache system to know that, when a cache line associated with an address is loaded into the cache memory, it should lock the cache line. The locking of the cache line may be done by promoting the pending lock state to a locked state.

Flexible Circuit Electrode Array

Polymer materials are useful as electrode array bodies for neural stimulation. They are particularly useful for retinal stimulation to create artificial vision, cochlear stimulation to create artificial hearing, or cortical stimulation many purposes. The pressure applied against the retina, or other neural tissue, by an electrode array is critical. Too little pressure causes increased electrical resistance, along with electric field dispersion. Too much pressure may block blood flow. Common flexible circuit fabrication techniques generally require that a flexible circuit electrode array be made flat. Since neural tissue is almost never flat, a flat array will necessarily apply uneven pressure. Further, the edges of a flexible circuit polymer array may be sharp and cut the delicate neural tissue. By applying the right amount of heat to a completed array, a curve can be induced. With a thermoplastic polymer it may be further advantageous to repeatedly heat the flexible circuit in multiple molds, each with a decreasing radius. Further, it is advantageous to add material along the edges. It is further advantageous to provide a fold or twist in the flexible circuit array. Additional material may be added inside and outside the fold to promote a good seal with tissue. 1. A method of making a flexible circuit electrode array comprising:depositing a polymer base layer;depositing metal on the polymer base layer forming a bond pad portion, a cable portion and an electrode array portion;patterning the metal to form a bond pad portion, a cable portion and an electrode array portion;depositing a polymer top layer on the polymer base layer and the metal; andembedding the electrode array portion in a body comprising an electrically insulating material softer than the polymer base layer forming the electrode array portion to have an approximately spherical shape.2. The method according to claim 1 , wherein the step of depositing the polymer base layer is depositing polyimide.3. The ...

Memory Data Transfer Method and System

A method and apparatus are disclosed for providing a DMA process. Accordingly, a DMA process is initiated for moving data from contiguous first locations to contiguous second locations and to a third location or third locations. Within the DMA process the data from each of the contiguous first locations is retrieved and stored in a corresponding one of the contiguous second locations and in the third location or corresponding one of the third locations. The DMA process is performed absent retrieving the same data a second other time prior to storing of same within the corresponding one of the contiguous second locations and in the third location or corresponding one of the third locations.

Flexible Circuit Electrode Array Embedded in a Cured Body

Polymer materials are useful as electrode array bodies for neural stimulation. They are particularly useful for retinal stimulation to create artificial vision, cochlear stimulation to create artificial hearing, and cortical stimulation, and many related purposes. The pressure applied against the retina, or other neural tissue, by an electrode array is critical. Too little pressure causes increased electrical resistance, along with electric field dispersion. Too much pressure may block blood flow. Common flexible circuit fabrication techniques generally require that a flexible circuit electrode array be made flat. Since neural tissue is almost never flat, a flat array will necessarily apply uneven pressure. Further, the edges of a flexible circuit polymer array may be sharp and cut the delicate neural tissue. It is advantageous that the array edges not contact tissue. 1. A visual prosthesis comprising:an implantable electronics unit within a hermetic package; a polymer base layer,', 'metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue,', 'said polymer base layer and said metal traces are embedded in a body, said body being curved., 'a flexible circuit electrode array connected to the electronics unit including'}, 'a secondary coil suitable to receive visual data from an external source connected to the implantable electronics unit; and'}2. The visual prosthesis according to claim 1 , wherein the body is curved to substantially conform to the curvature of a retina of a recipient's eye.3. The visual prosthesis according to claim 1 , wherein the body is curved with a contracting radius at its edges.4. The visual prosthesis according to claim 1 , wherein the flexible circuit electrode array comprises 1 to 1000 electrodes.5. The visual prosthesis according to claim 1 , wherein the flexible circuit electrode array comprises 16 to 250 electrodes.6. The visual prosthesis according to claim 1 , wherein the flexible ...

FIRE BARRIER, A METHOD FOR INSTALLING THE SAME, AN EXPANSION JOINT SYSTEM AND A FIRE BARRIER ASSEMBLY

The presently claimed invention relates to a fire barrier, a method for installing the same, an expansion joint system and a fire barrier assembly. 1200. A fire barrier () comprising:{'b': 10', '11', '12', '13', '14', '10, 'a first fire blanket () having a top side (), a bottom side (), a first lateral side () and a second lateral side (), said first fire blanket (),'}{'b': 20', '21', '22', '23', '24', '20, 'a second fire blanket () having a top side (), a bottom side (), a first lateral side () and a second lateral side (), said second fire blanket (),'}{'b': 40', '41', '42', '40', '300, 'a first intumescent sheet () having a first surface () and a second surface (), said first intumescent sheet () affixed to a first structure (), and'}{'b': 50', '51', '52', '50', '400, 'a second intumescent sheet () having a first surface () and a second surface (), said second intumescent sheet () affixed to a second structure (),'}{'b': 13', '10', '23', '20', '41', '40', '14', '10', '24', '20', '51', '50, 'wherein the first lateral side () of the first fire blanket () and the first lateral side () of the second fire blanket () are affixed to a portion of the first surface () of the first intumescent sheet () and the second lateral side () of the first fire blanket () and the second lateral side () of the second fire blanket () are affixed to a portion of the first surface () of the second intumescent sheet ().'}2200. The fire barrier () according to claim 1 , which is capable of meeting the requirement for a 3-hour fire-rating according to UL 2079.32001020. The fire barrier () according to claim 1 , wherein at least one of the first () and second () fire blankets is surrounded by a metal foil.42002021222324. The fire barrier () according to claim 1 , further comprising a second fire blanket () having a top side () claim 1 , a bottom side () claim 1 , a first lateral side () and a second lateral side ().520030. The fire barrier () according to claim 4 , wherein the second fire ...

Mobile cart with adjustable height

A mobile workstation with adjustable height of the present disclosure may comprise a top assembly, an adjustment assembly, and a bottom assembly. Adjustment assembly may comprise telescopically engaged segments. One or more pulleys or pulley assemblies may be disposed within one or more of the segments to allow for withdrawing and retracting segments from one another at the same rate. Actuation of the raising or lowering of the overall height of the mobile workstation may be realized through either a manual actuation or an electronic element such as a linear actuator.

Implantable Package to Facilitate Inspection

The present invention is a non-destructive method of inspecting a bond, particularly a braze bond, in a hermetic package. The invention involves a unique hermetic package design adapted for ultrasonic inspection and a method of inspecting the package. This package and non-destructive inspection process are particularly useful in implantable neural stimulators such as visual prostheses. 1. A hermetic package comprising:a top;a bottom;a bond attaching the top to the bottom;wherein the top, bottom and bond form a rigid, biocompatible, hermetic package suitable for implantation within a human body; andwherein the bond is parallel to and sufficiently proximate to an outside surface to allow acoustic inspection of the bond.2. The hermetic package according to claim 1 , wherein the bond is less than 500 μm from the outside surface.3. The hermetic package according to claim 1 , wherein the bond is selected from the group consisting of a braze bond and a solder bond.4. The hermetic package according to claim 1 , wherein the top and the bottom are selected from the group consisting of a metal and a ceramic.6. The hermetic package according to claim 1 , wherein the hermetic package is suitable for implantation within a human body as a neural stimulator.75. The hermetic package according to claim claim 1 , wherein the hermetic package is suitable for implantation within a human body as a visual prosthesis.8. The hermetic package according to claim 1 , wherein the bottom is flat claim 1 , the top is curved and the bond is to an edge of the top.9. The hermetic package according to claim 1 , wherein the bottom is a ceramic substrate including electrical feedthroughs.10. The hermetic package according to claim 9 , further comprising electronic circuits mounted to the substrate and connected to the feedthroughs.11. The hermetic package according to claim 10 , wherein the electronic circuits include a flip chip.12. The hermetic package according to claim 10 , wherein the electronic ...

SYSTEM AND METHOD FOR CRYPTOGRAPHIC PROCESSING IN A TIME WINDOW

A method is disclosed for providing first data and a first secret key to a cipher processor for ciphering. The first data is ciphered in accordance with a first cipher process and the first secret key to provide output data. Before ciphering of the first data, extra data is inserted within the cipher processor for ciphering in accordance with at least a portion of said first cipher process. The extra data is inserted within a sequence of cipher processor operations for obfuscating the output data. 1. A method comprising:providing first data and a first secret key to a cipher processor for ciphering;said cipher processor ciphering the first data in accordance with a first cipher process and the first secret key to provide output data; andbefore ciphering of the first data, inserting extra data within the cipher processor for ciphering in accordance with at least a portion of said first cipher process, said extra data inserted within a sequence of cipher processor operations for obfuscating said output data.2. A method according to wherein the at least a portion of said first cipher process comprises inserting a plurality of guard rounds at one or more locations within the sequence of cipher processor operations to obfuscate an operation of the cipher processor from side-channel attack.3. A method according to wherein the at least a portion of said first cipher process comprises inserting a plurality of guard rounds immediately before an initial round and immediately after a final round claim 1 , the initial and final rounds processed in a similar fashion to other rounds.4. A method according to wherein the at least a portion of said first cipher process comprises inserting a plurality of guard rounds similar to an initial round and a plurality of guard rounds similar to a final round to make it difficult to determine by way of side-channel attack when the initial and final rounds occurred.5. A method according to wherein the at least a portion of said first cipher ...

System and method for multichannel cryptographic processing

A processor is disclosed for ciphering of first data. The processor includes a key store and a first data store. In use the processor for ciphering the first data in accordance with a first cipher process and a first secret key to provide output data, during ciphering of the first data inserting within the cipher processor other data for ciphering in accordance with at least a portion of the first cipher process, the other data inserted within a sequence of cipher processor operations and scheduled for obfuscating the output data.

CRYPTOGRAPHIC SEQUENCING SYSTEM AND METHOD

A method is disclosed for intermixing a first stream of data and a second stream of data. An associated first secret key is expanded to form a first associated expanded secret key. An associated second secret key is expanded to form a second associated expanded secret key. The first stream of data and the second stream of data are intermixed to form a combined stream of data, which is ciphered. The combined stream of data is de-multiplexed after ciphering thereof and provided at an output port. 1. A method for leak resistant ciphering comprising:providing a first stream of data and an associated first secret key;expanding the associated first secret key to form a first associated expanded secret key;providing a second stream of data and an associated second secret key;expanding the associated second secret key to form a second associated expanded secret key;intermixing the first stream of data and the second stream of data to form a combined stream of data;ciphering the combined stream of data in accordance with the first and second associated expanded secret keys to form a ciphered combined stream;de-multiplexing the ciphered combined stream of data to form de-multiplexed streams of data; andproviding the de-multiplexed streams of data at an output port.2. The method as defined in wherein the combined stream of data comprises a sequence of frames from each of the first stream of data and the second stream of data claim 1 , the sequence different than a sequence consistently alternating a predetermined number of frames from each stream claim 1 , said predetermined number being an integer>0.3. The method as defined in wherein said first stream of data is plain text.4. The method as defined in wherein said second stream of data is plain text.5. The method as defined in wherein said first stream of data is ciphered text.6. The method as defined in wherein said second stream of data is ciphered text.7. The method as defined in wherein said ciphering is encrypting.8. The ...

Automatic Control System and Method for a True Random Number Generator

A system for reseeding a pseudo random number generator to generate pseudo random numbers includes a true random number generator generating a true random number, a storage device storing the generated true random number, a pseudo random number generator generating pseudo random numbers using the stored true random number as a seed, and a controller coupled to the true random number generator and the pseudo random number generator to (1) generate a new true random number concurrently with the operation of the pseudo random number generator, and storing the new true random number, and (2) reseed the pseudo random number generator with the new true random number. 1. A system for reseeding a pseudo random number generator to generate pseudo random numbers , the system comprising:a seed generator;a pseudo random number generator (PRNG) having at least one input register, the PRNG providing a sequence of values in accordance with a deterministic process and based on random seed values generated by the seed generator;a serial communication interface between the seed generator and the at least one input register of the PRNG;a control/status circuit coupled through the serial communication interface to initiate loading of the at least one input register from the seed generator.2. The system of claim 1 , wherein the serial communication interface comprises:a reseed command signal line;a reseeding status signal line;a rand_bit data output signal line; anda rand_vld status signal line.3. The system of claim 2 , the serial communication interface further comprising a reseeded status signal line.4. The system of claim 2 , the serial communication interface further comprising a reseed_reminder signal line.5. The system of claim 1 , wherein the control/status circuit initiates the loading without pausing or stopping the PRNG.6. The system of claim 1 , in which the control/status circuit initiates the loading in response to a pseudo randomly selected condition.7. The system of ...

IMMUNOASSAY METHODS

The present invention generally relates to the field of antibody detection, and in particular relates to assays for the detection of antibodies in a sample comprising patient bodily fluid. The invention provides a method of detecting an antibody in a test sample comprising a bodily fluid from a mammalian subject, wherein the test sample is contacted with a plurality of different amounts of an antigen specific for the antibody, the amount of specific binding between the antibody and the antigen is detected and the presence or absence of antibody is determined based upon the amount of specific binding between the antibody and the antigen and a secondary curve parameter arising from a curve of the amount of specific binding versus the amount of antigen for each amount of antigen used. 1. A method of detecting an antibody in a test sample comprising a bodily fluid from a mammalian subject , the method comprising the steps of:(a) contacting said test sample with a plurality of different amounts of an antigen specific for said antibody;(b) detecting the amount of specific binding between said antibody and said antigen;(c) plotting or calculating a curve of the amount of said specific binding versus the amount of antigen for each amount of antigen used in step (a);(d) calculating a secondary curve parameter from the curve plotted or calculated in step (c); and(e) determining the presence or absence of said antibody based upon a combination of:(i) the amount of specific binding between said antibody and said antigen determined in step (b); and(ii) said secondary curve parameter determined in step (d).3. The method of claim 2 , wherein the two or more antigens of the panel are distinct antigens.4. The method of claim 3 , wherein the panel comprises two or more antigen variants of one or more of the distinct antigens.5. The method of claim 2 , wherein the two or more antigens of the panel are antigen variants.6. The method of claim 1 , wherein the secondary curve parameter is ...

Cortical Visual Prosthesis

The present invention is a visual prosthesis adapted for implantation in the brain, and more particularly with an electrode array adapted for implantation in the Calcarine Sulcus of the visual cortex. The electrode array of the invention has electrodes on each side and spaced appropriately for the Calcarine Sulcus and driven by an electronic circuit within a hermetic package small enough to be implanted with a skull. 1. A visual prosthesis comprising:a flexible circuit and including a bond pad portion, and cable portion and an electrode array portion including stimulating electrodes on both side of the flexible circuit adapted to stimulate neurons in the Calcarine Sulcus region of the brain;a driver circuit driving stimulation signals on the flexible circuit, the driver circuit within a hermetic housing suitable to be implanted with a head; anda coil providing power and data to the driver circuit.2. The visual prosthesis according to claim 1 , wherein flexible circuit includes more than one branch suitable to stimulate different regions of the Calcarine Sulcus.3. The visual prosthesis according to claim 2 , wherein the flexible circuit includes four or more branches.4. The visual prosthesis according to claim 1 , wherein electrodes on opposite sides of the flexible circuit are aligned with each other.5. The visual prosthesis according to claim 1 , wherein electrodes on opposite sides of the flexible circuit are offset from each other.6. The visual prosthesis according to claim 1 , wherein the electrodes are organized on the flexible circuit in a rectangular pattern.7. The visual prosthesis according to claim 1 , wherein the electrodes are organized on the flexible circuit in a hexagonal pattern.8. The visual prosthesis according to claim 1 , wherein the electrodes are organized in the flexible circuit having varying pitch.9. The visual prosthesis according to claim 8 , wherein the varying pitch is closer toward the fovea of the Calcarine Sulcus.10. The visual ...

MEMORY DATA TRANSFER METHOD AND SYSTEM

A method and apparatus are disclosed for providing a DMA process. Accordingly, a DMA process is initiated for moving data from contiguous first locations to contiguous second locations and to a third location or third locations. Within the DMA process the data from each of the contiguous first locations is retrieved and stored in a corresponding one of the contiguous second locations and in the third location or corresponding one of the third locations. The DMA process is performed absent retrieving the same data a second other time prior to storing of same within the corresponding one of the contiguous second locations and in the third location or corresponding one of the third locations. 1. A method comprising:providing a processor having DMA (Direct Memory Access) capability integrated therein, the DMA capability comprising a DMA process for moving a first data from a plurality of first locations to a plurality of second locations in response to an initial command and for moving the first data to at least a third location in response to a command, and within said DMA process of the processor:retrieving a subset of the first data from each of the plurality of first locations to a memory within the processor, the memory within the processor for temporary storage of the retrieved data;storing the retrieved subset from the memory within the processor to a corresponding one of the plurality of second locations; andstoring the retrieved data from the memory to a location of the at least a third location,wherein the plurality of second locations forms a memory buffer having the first data duplicated therein and the at least a third location forms one of a memory buffer having the first data duplicated therein and a memory supporting inline processing of data provided therein.2. The method according to comprising providing a first indicator for addressing each of the plurality of first locations and incrementing the first indicator between data retrieval operations claim ...

Flexible Circuit Electrode Array and a Method for Backside Processing of a Flexible Circuit Electrode Device

The invention involves a flexible circuit electrode array device comprising: a polymer layer; wherein the polymer layer includes one or more metal traces, an electrode array; one or more bond pads; and the electrode array is located on the opposite side of the polymer layer. 1. A method for backside processing of a polymer electrode array , comprising:preparing a front side of the polymer electrode array while a backside of the polymer electrode array is affixed to a substrate;releasing the polymer electrode array from the substrate;fixing the front side of the polymer electrode array on a new substrate;processing openings in the backside of the polymer electrode array; andreleasing the polymer electrode array from the new substrate.2. The method according to claim 1 , wherein the step of processing openings in the backside of the polymer electrode array comprises:coating thick photoresist on the backside of the polymer electrode array;patterning the photoresist; andetching openings in the backside of the polymer electrode array.3. The method according to claim 1 , wherein the step of patterning the photoresist is achieved by photolithography.4. The method according to claim 1 , wherein the step of processing opening in the backside of the polymer electrode array is achieved by RIE.5. The method according to claim 1 , wherein singulation of polymer electrode arrays is achieved by RIE.6. The method according to claim 1 , wherein processing openings in the backside of the polymer electrode array is by drilling.7. The method according to claim 6 , wherein the step of drilling is laser drilling.8. The method according to claim 1 , further comprising cleaning polymer residues from the polymer electrode array by plasma. This application is a divisional application of U.S. patent application Ser. No. 13/397,604, filed Feb. 15, 2012, for Method for Backside Processing of a Flexible Circuit Electrode Array, which is a divisional application of U.S. patent application Ser. No ...

Flexible Circuit Electrode Array with Wire or Film Support

The disclosure relates to a flexible circuit electrode array comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces; and at least one support embedded in said array. The disclosure further relates to a flexible circuit electrode array comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces; and a folded flexible circuit cable connecting the electrode array with an interconnection pad. The disclosure further relates to a method of making a flexible circuit electrode array comprising: depositing a polymer base layer; depositing metal on said polymer base layer; patterning said metal to form metal traces; depositing a polymer top layer on said polymer base layer and said metal traces; heating said flexible circuit electrode array in a mold to form a three dimensional shape in said flexible circuit electrode array, embedding a support at least in the base layer, top layer or between the base and top layer, and/or folding a flexible circuit cable at least once connecting the electrode array with an interconnection pad on the array. 1. A flexible circuit electrode array comprising:a polymer base layer;a metal trace layer deposited on the polymer base layer, the metal trace layer including a two dimensional array of electrodes configured to stimulate neural tissue defining an electrode field within an electrode array portion, a two dimensional array of bond pads configured to attach to an electronic circuit package defining a bond pad portion and traces defining a cable portion between the electrode array portion and the bond pad portion connecting the electrodes to the bond pads;a polymer top layer deposited on the polymer base layer and ...

Package for an Implantable Neural Stimulation Device

An implantable device, including a first electrically non-conductive substrate; a plurality of electrically conductive vias through the first electrically non-conductive substrate; a flip-chip multiplexer circuit attached to the electrically non-conductive substrate using conductive bumps and electrically connected to at least a subset of the plurality of electrically conductive vias; a flip-chip driver circuit attached to the flip-chip multiplexer circuit using conductive bumps; a second electrically non-conductive substrate attached to the flip-chip driver circuit using conductive bumps; discrete passives attached to the second electrically non-conductive substrate; and a cover bonded to the first electrically non-conductive substrate, the cover, the first electrically non-conductive substrate and the electrically conductive vias forming a hermetic package.

Reducing latency in performing a task among distributed systems

Among other things, at a client computer system in communication with a computer network, a request object is generated that includes logic to control the handling of requests. At least one of the requests depends on (for example, simply by being part of a sequence) a result of at least one of the other of the requests. The request object is sent to a server computer system that is in communication with the computer network. A response object is received that includes results of at least some of the requests.

MULTIPORT CONTENT ENCRYPTION ENGINE

A method for ciphering protected content communicated between a first device and a plurality of devices over a plurality of channels comprises performing authentication between the first device and each of the plurality of devices to create two or more shared key and initialization vector pairs allowing the ciphering of the protected content; generating a key stream for each of the channels based on a selected one of the two or more of shared key and initialization vector pairs; maintaining a buffer for each channel, each of the buffer containing the key stream generated for the corresponding channel; and ciphering data incoming on a selected channel using the selected key stream from the buffer corresponding to the selected channel. 1. A method for ciphering protected content communicated between a first device and a plurality of devices over a plurality of channels , said method comprising:performing authentication between the first device and each of said plurality of devices to create two or more shared key and initialization vector pairs allowing the ciphering of the protected content;generating a key stream for each of said channels based on a selected one of said two or more of shared key and initialization vector pairs;maintaining a buffer for each channel, each of said buffer containing the key stream generated for the corresponding channel; andciphering data incoming on a selected channel using the selected key stream from the buffer corresponding to the selected channel.2. The method of in which said generating a key stream is based on an Advanced Encryption Standard process.3. The method of in which said plurality of channels comprise a plurality of plain text inputs and wherein each of said plain text inputs is reformatted into a plurality of reformatted plain text inputs claim 1 , and said plurality of reformatted plain text inputs are ciphered selectively to generate a plurality of ciphered outputs of a plurality of formats.4. The method of in which ...

AUTOMATIC CONTROL SYSTEM AND METHOD FOR A TRUE RANDOM NUMBER GENERATOR

A system for reseeding a pseudo random number generator to generate pseudo random numbers includes a true random number generator generating a true random number, a storage device storing the generated true random number, a pseudo random number generator generating pseudo random numbers using the stored true random number as a seed, and a controller coupled to the true random number generator and the pseudo random number generator to (1) generate a new true random number concurrently with the operation of the pseudo random number generator, and storing the new true random number, and (2) reseed the pseudo random number generator with the new true random number. 1. A system for reseeding a pseudo random number generator to generate pseudo random numbers , said system comprisinga true random number generator generating a true random number,a storage device storing the generated true random number,a pseudo random number generator generating pseudo random numbers using the stored true random number as a seed, generate a new true random number concurrently with the operation of the pseudo random number generator, and storing the new true random number, and', 'reseed the pseudo random number generator with the new true random number., 'a controller coupled to said true random number generator and said pseudo random number generator to'}2. The system of in which the controller reseeds the pseudo random number generator upon occurrence of a known condition.3. The system of in which the known condition is programmable prior to operation of the controller.4. The system of in which the known condition is programmable during operation of the circuit.5. The system of in which the known condition comprises at least one of a length of time from seeding the pseudo random number generator with a current seed value claim 1 , and a number of values provided by the pseudo random number generator and derived based on the current seed value.6. The system of in which the controller ...

System And Method For Dynamic Tuning Feedback Control For Random Number Generator

A random number generator includes a first circuit producing a random sequence of values, the first circuit having an adjustable input that changes the entropy of the random sequence of numbers; a second circuit receiving the random sequence of values from the first circuit and producing an output indicative of the degree of entropy of the random sequence of values, and a third circuit that adjusts the adjustable input of the first circuit in response to the output of the second circuit. 1. A random number generator comprisinga first circuit producing a random sequence of values, said circuit having an adjustable input that changes the entropy of the random sequence of numbers,a second circuit receiving the random sequence of values from the first circuit and producing an output indicative of the degree of entropy of the random sequence of values, anda third circuit that adjusts the adjustable input of the first circuit in response to the output of the second circuit.2. The random number generator of in which said first circuit includesa pair of oscillators producing first and second oscillating output signals, at least the second oscillator being tunable so that the frequency of said second oscillating output signal can be adjusted, anda sampling circuit receiving said first and second oscillating output signals and sampling said first oscillating output signal at intervals determined by said second oscillating output signal,3. The random number generator of in which said first and second oscillators are free-running from the first application of power claim 2 , so that said first and second oscillating output signals have random phases with respect to each other.4. The random number generator of in which said sampling circuit is a D-type flip flop having a D input receiving said first oscillating output signal claim 2 , and a clock input receiving said second oscillating output signal.5. The random number generator of in which said second circuit is a von Neumann ...

System and Method for Cryptographic Processing in a Time Window

A method is disclosed for providing first data and a first secret key to a cipher processor for ciphering. The first data is ciphered in accordance with a first cipher process and the first secret key to provide output data. Before ciphering of the first data, extra data is inserted within the cipher processor for ciphering in accordance with at least a portion of said first cipher process. The extra data is inserted within a sequence of cipher processor operations for obfuscating the output data.

Method of Manufacturing a Flexible Circuit Electrode Array

Polymer materials make useful materials as electrode array bodies for neural stimulation. They are particularly useful for retinal stimulation to create artificial vision. Regardless of which polymer is used, the basic construction method is the same. A layer of polymer is laid down. A layer of metal is applied to the polymer and patterned by wet etch to create electrodes and leads for those electrodes. The base polymer layer is activated. A second layer of polymer is applied over the metal layer and patterned to leave openings for the electrodes, or openings are created later by means such as laser ablation. Hence the array and its supply cable are formed of a single body. 1. A method of making a flexible circuit electrode array for neural stimulation comprising:depositing a polymer base layer;depositing a metal layer comprising platinum on the polymer base layer;depositing photoresist on the metal layer;exposing the photoresist;patterning the metal by wet etch to form metal traces;activating the polymer base layer; anddepositing a polymer top layer on the polymer base layer and the metal traces.2. The method according to claim 1 , wherein the metal layer further comprises titanium.3. The method according to claim 2 , wherein the step of depositing metal includes first depositing titanium claim 2 , then depositing platinum and then depositing a second layer of titanium.4. The method according to claim 1 , wherein the step of patterning forms metal traces claim 1 , electrodes and bond pads.5. The method according to claim 4 , further comprising creating openings in the polymer base layer or the polymer top layer to exposes the electrodes and the bond pads.6. The method according to claim 5 , wherein creating openings is by laser ablation.7. The method according to claim 1 , further comprising activating the polymer base before depositing the polymer top layer.8. The method according to claim 7 , wherein activation comprises deimidization.9. The method according to ...

Package for an Implantable Neural Stimulation Device

An implantable device having a biocompatible hermetic package made from a biocompatible electrically non-conductive substrate and a cover bonded to the substrate. In integrated circuit and passive circuits all bonded directly to the substrate. 1. An implantable device , comprising:a biocompatible electrically non-conductive substrate;an integrated circuit attached directly to the substrate;passive circuits attached directly to the substrate; anda biocompatible cover bonded to the substrate, the cover and the substrate forming a hermetic package.2. The implantable device according to claim 1 , further comprising conductive traces deposited on the electrically non-conductive substrate.3. The implantable device according to claim 1 , further comprising a flexible circuit connected to the substrate and including electrodes suitable stimulate neural tissue.4. The implantable device according to claim 1 , further comprising a polymer body supporting the hermetic package and suitable to be attached to a sclera.5. The implantable device according to claim 4 , further comprising suture tabs on the polymer body suitable for attaching the polymer body to a sclera.6. The implantable device according to claim 1 , wherein the cover has convex in profile.7. The implantable device according to claim 1 , wherein the cover has concave in profile.8. The implantable device according to claim 1 , wherein the integrated circuit is a flip-chip circuit.9. The implantable device according to claim 2 , wherein the cover is brazed to the substrate.10. The implantable device according to claim 9 , further comprising a braze stop on the substrate and along a periphery of the substrate surrounding the conductive traces and separating a braze joint from the conductive traces.11. The implantable device according to claim 2 , wherein the conductive traces are metal traces.12. The implantable device according to claim 11 , wherein the metal traces are chosen to withstand braze temperatures.13. The ...

SECURED MEMORY SYSTEM AND METHOD THEREFOR

There is disclosed a cache memory controller for storing cache data within a cache, the cache data comprising an unsecured version data to corresponding secured first data. 1. A circuit comprising:a cache memory having memory therein secured against tampering;a first memory; and,a cache controller having a first circuit for storing in a form secure from tampering and within the first memory second data corresponding to first data stored within the cache memory in plain text for use by a processor associated with the cache controller.2. A circuit according to wherein the cache memory is integrated within a same integrated circuit as the processor and wherein the first memory comprises external memory.3. A circuit according to wherein the first circuit comprises a processor for computing a secure tag claim 1 , the secure tag for being stored in association with the second data and for use in validating the second data against tampering.4. A circuit according to wherein the first circuit comprises an indexing circuit for indexing the secure tag to associate the secure tag with a corresponding second data claim 3 , the indexed secure tag for being stored within the cache memory.5. A circuit according to wherein the first circuit comprises an indexing circuit for indexing the secure tag to associate the secure tag with a corresponding second data claim 3 , the indexed secure tag being stored within the first memory.6. A circuit according to wherein the first circuit comprises a processor for computing a MAC tag claim 2 , the MAC tag being stored in association with the second data and for use in validating the second data against tampering.7. A circuit according to wherein the first circuit comprises an indexing circuit for indexing the MAC tag to associate the MAC tag with a corresponding second data claim 6 , the indexed MAC tag being stored within the cache memory.8. A circuit according to wherein the first circuit comprises an indexing circuit for indexing the MAC ...

FLEXIBLE CIRCUIT ELECTRODE ARRAY AND METHOD OF MANUFACTURING THE SAME

A method for manufacturing a flexible circuit electrode array, comprising: 1. A flexible circuit comprising:a polymer base layer forming an electrode portion, a cable portion, and a bond pad portion, the bond pad portion adapted to connect to an electronic control unit;a patterned metal layer on the polymer base layer, including at least one electrode, at least one bond pad and at least one trace connecting the electrode to the bond pad; anda polymer top layer deposited on the polymer base layer and the patterned metal including at least one opening to expose the electrode;wherein a top surface of the polymer base layer is cured with the polymer top layer so that the polymer base layer and polymer top layer form a polymer single layer.2. The flexible circuit according to claim 1 , wherein the polymer base layer and polymer top layer are polyimide and curing is imidizing the polyimide.3. The flexible circuit according to claim 1 , further comprising a soft polymer layer claim 1 , softer than the polymer single layer claim 1 , over at least a portion of the polymer single layer.4. The flexible circuit according to claim 1 , further comprising at least one bumper bonded to a peripheral edge of the flexible circuit.5. The flexible circuit according to claim 1 , wherein an interface between the polymer base layer and the polymer top layer is not smooth.6. The flexible circuit according to claim 1 , wherein the patterned metal layer comprises multiple layers of different metals.7. The flexible circuit according to claim 6 , wherein the patterned metal layer includes layers of base titanium claim 6 , platinum and top titanium. This application is a divisional application of U.S. patent application Ser. No. 13/668,137, filed Nov. 2, 2012, for Flexible Circuit Electrode Array and Method of Manufacturing the Same, which is a divisional application of U.S. patent application Ser. No. 11/926,498, filed Nov. 2, 2012 for Flexible Circuit Electrode Array and Method of ...

Package for a Retinal Prosthesis

The present invention is an improved hermetic package for a retinal prosthesis implanted in the human body. The retinal prosthesis includes a flexible circuit electrode array suitable to stimulate the retina while connected to a hermetic package on the outside of the eye, the hermetic package including a cover and a base where the cover is bonded to the base such that the cover and base form the hermetic package. 1. A retinal prosthesis comprising: a planar base, including an electrically non-conductive substrate and', 'biocompatible patterned metallization on the non-conductive substrate,', 'a circuit attached directly to a first side of the base wherein the circuit is smaller than the base, and', 'a rounded cover, the base and the rounded cover forming the biocompatible package;, 'a biocompatible package comprising'}a molded polymer body suitable to attach the biocompatible package to a sclera; anda flexible circuit electrically connected to the circuit, the flexible circuit extending from the biocompatible package and suitable to pass through a pars plana and having an array of electrodes suitable to stimulate retinal tissue.2. The retinal prosthesis according to claim 1 , wherein the molded body is curved to approximate the shape of the sclera.3. The retinal prosthesis according to claim 1 , further comprising suture tabs in the molded body.4. The retinal prosthesis according to claim 1 , further comprising a coil receiving electrical power to power the integrated circuit.5. The retinal prosthesis according to claim 1 , wherein the electrically non-conductive substrate contains ceramic.6. The retinal prosthesis according to claim 1 , wherein the patterned metallization is multiple layer metallization and the integrated circuit is bonded to the patterned metallization.7. The retinal prosthesis according to claim 6 , wherein the multiple layer metallization is chosen to withstand braze temperatures.8. The retinal prosthesis according to claim 7 , wherein the ...

CORTICAL INTERFACE FOR MOTOR SIGNAL RECORDING AND SENSORY SIGNAL STIMULATION

The present invention consists of an implantable device with at least one package that houses electronics that sends and receives data or signals, and optionally power, from an external system through at least one coil attached to the at least one package and processes the data, including recordings of neural activity, and delivers electrical pulses to neural tissue through at least one array of multiple electrodes that is/are attached to the at least one package. The invention, or components thereof, is/are intended to be installed in the head, or on or in the cranium or on the dura, or on or in the brain. Variations of the embodiments depend on the physical locations of the coil(s), package(s) and array(s) with respect to the head, cranium, dura, and brain. Novel features of the present invention include the small size of the implantable package which houses the controller, the high number of electrodes that are provided for stimulation and/or sensing and stimulation, and the methods for manufacturing such a device. These features have unique applications in neural stimulation to treat or prevent disorders or disease. 1. A neural interface system comprising:an external portion including a processor, telemetry circuit, and external coil, the external coil sending power to, and sending and receiving data to and from, an implanted portion; an internal coil receiving power from, and sending and receiving data to a from the external coil,', 'a hermetic package,', 'an electronic circuit within the hermetic package receiving power from the internal coil and sending and receiving data to and from the internal coil,', 'a differential neural amplifier within the hermetic package,', 'an analog to digital converter connecting the differential neural amplifier to the electronic circuit,', 'a driver within the hermetic package connected to the electronic circuit, and', 'a flexible circuit including at least one stimulating electrode connected to the driver and at least one ...

Flexible circuit electrode array

A flexible circuit electrode array comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces; and a central opening in the area of the metal traces. A flexible circuit electrode array comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces; and a soft polymer filling an attachment point. A flexible circuit electrode array comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces; and a hump to avoid a touching of the flexible electrode array and the optic nerve.

Self-contained frictionally damped resilient suspension system

A mobile vehicle shock insulated suspension system is provided with unique variable rate elastomer springs and co-related variable rate friction damping system.

Expansion joint seal and expansion joint

An expansion joint seal for sealing a gap between two structural members that includes a coverplate, a snap-fit connector extending downwardly from the coverplate, a central spine connected to the coverplate with a snap-fit connector and extending downwardly from the connector, and foam seal sections positioned on each side of the central spine of the expansion joint seal. An expansion joint including spaced-apart structural members defining a gap between the spaced-apart members and the expansion joint seal.

Implantable microelectronic device and method of manufacture

Package for an implantable neural stimulation device

An implantable device, including a first electrically non-conductive substrate with a plurality of electrically conductive vias. The device also includes a flip-chip multiplexer circuit attached to the electrically non-conductive substrate using conductive bumps, the circuit being electrically connected to at a subset of the plurality of electrically conductive vias. Another a flip-chip driver circuit is attached to the flip-chip multiplexer circuit using conductive bumps while a second electrically non-conductive substrate attached to the flip-chip driver circuit using conductive bumps. Discrete passives are attached to the second electrically non-conductive substrate and a cover is bonded to the first electrically non-conductive substrate. The cover, the first electrically non-conductive substrate and the electrically conductive vias form a hermetic package.

Railcar truck

Implantable microelectronic device and method of manufacture

An implantable hermetically sealed microelectronic device and method of manufacture are disclosed. The microelectronic device of the present invention is hermetically encased in a insulator, such as alumina formed by ion bean assisted deposition (“IBAD”), with a stack of biocompatible conductive layers extending from a contact pad on the device to an aperture in the hermetic layer. In a preferred embodiment, one or more patterned titanium layers are formed over the device contact pad, and one or more platinum layers are formed over the titanium layers, such that the top surface of the upper platinum layer defines an external, biocompatible electrical contact for the device. Preferably, the bottom conductive layer is larger than the contact pad on the device, and a layer in the stack defines a shoulder.

Flexible circuit electrode array with at least one tack opening

FLEXIBLE CIRCUIT ELECTRODE ARRAY WITH AT LEAST ONE TACK OPENING Abstract Disclosed is a flexible circuit electrode array (10) adapted for neural stimulation, comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate visual neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces; at least one tack opening; 10 wherein said polymer base layer, said metal traces and said polymer top layer are thermoformed in an approximately semispherical shape; and said tack opening is made thinner from a soft polymer, softer than said polymer base layer. Also disclosed is a method of making a flexible circuit electrode array (10) comprising depositing a polymer base layer; depositing metal on said polymer base layer; patterning said metal to form 15 metal traces; depositing a polymer top layer on said polymer base layer and said metal traces; preparing at least one tack opening; and heating said flexible circuit electrode array in a mold to form an approximately semispherical shape in said flexible circuit electrode array; wherein said tack opening is from a soft polymer, softer than said polymer base layer.

Automatic control system and method for a true random number generator

A system for reseeding a pseudo random number generator to generate pseudo random numbers includes a true random number generator generating a true random number, a storage device storing the generated true random number, a pseudo random number generator generating pseudo random numbers using the stored true random number as a seed, and a controller coupled to the true random number generator and the pseudo random number generator to (1) generate a new true random number concurrently with the operation of the pseudo random number generator, and storing the new true random number, and (2) reseed the pseudo random number generator with the new true random number.

Expansion joint seal and expansion joint

An expansion joint seal for sealing a gap between two structural members that includes a coverplate, a snap-fit connector extending downwardly from the coverplate, a central spine connected to the coverplate with a snap-fit connector and extending downwardly from the connector, and foam seal sections positioned on each side of the central spine of the expansion joint seal. An expansion joint including spaced-apart structural members defining a gap between the spaced-apart members and the expansion joint seal.

Package for an implantable neural stimulation device

The present invention is an improved hermetic package for implantation in the human body. The implantable device comprises an electrically non-conductive substrate; a plurality of electrically conductive vias through said electrically non-conductive substrate; a flip-chip circuit attached to said electrically non-conductive substrate using conductive bumps and electrically connected to a first subset of said plurality of electrically conductive vias, wherein said flip-chip circuit contains one or more stacks or a folded stack; a wire bonded circuit attached to said electrically non-conductive substrate and electrically connected to a second subset of said electrically conductive vias; and a cover bonded to said electrically non-conductive substrate, said cover, said electrically non-conductive substrate and said electrically conductive vias forming a hermetic package.

Membrane edge-attaching structure

Flexible circuit electrode array with wire or film support

The disclosure relates to a flexible circuit electrode array comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces; and at least one support embedded in said array. The disclosure further relates to a flexible circuit electrode array comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces; and a folded flexible circuit cable connecting the electrode array with an interconnection pad. The disclosure further relates to a method of making a flexible circuit electrode array comprising: depositing a polymer base layer; depositing metal on said polymer base layer; patterning said metal to form metal traces; depositing a polymer top layer on said polymer base layer and said metal traces; heating said flexible circuit electrode array in a mold to form a three dimensional shape in said flexible circuit electrode array, embedding a support at least in the base layer, top layer or between the base and top layer, and/or folding a flexible circuit cable at least once connecting the electrode array with an interconnection pad the array.

Cochlear stimulation device comprising a flexible electrode array

A cochlear stimulation device comprising an electrode array designed to provide enhanced charge injection capacity necessary for neural stimulation. The electrode array comprises electrodes with high surface area or a fractal geometry and correspondingly high electrode capacitance and low electrical impedance. The resultant electrodes have a robust surface and sufficient mechanical strength to withstand physical stress vital for long term stability. The device further comprises wire traces having a multilayer structure which provides a reduced width for the conducting part of the electrode array. The cochlear prosthesis is attached by a grommet to the cochleostomy that is made from a single piece of biocompatible polymer. The device, designed to achieve optimum neural stimulation by appropriate electrode design, is a significant improvement over commercially available hand-built devices.

Improved biocompatible bonding method

The invention is a device and method for connecting a hermetic package to a flexible circuit such as for an electrode array in an implantable device. Attaching metal pads on a flexible circuit to metal pads on a hermetic device by conductive adhesive is known. A smooth metal, such as platinum, does not bond well to conductive epoxy. The invention provides a roughened surface, such as by etching or by applying high surface area platinum gray, to improve adhesion to platinum or other metal pads.

Flexible circuit electrode array with at least one tack opening

The present invention provides a flexible circuit electrode array adapted for neural stimulation, comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces at least one tack opening; wherein said polymer base layer, said metal traces and said polymer top layer are thermoformed in a three dimensional shape. The present invention provides further a method of making a flexible circuit electrode array comprising depositing a polymer base layer; depositing metal on said polymer base layer; patterning said metal to form metal traces; depositing a polymer top layer on said polymer base layer and said metal traces; preparing at least one tack opening; and heating said flexible circuit electrode array in a mold to form a three dimensional shape in said flexible circuit electrode array.

Pump

Quaternary ammonium salts, polymeric film containing them and colorimetric device

There is described an oxygen substituted quaternary alkyl ammonium cation of formula (I), and salts thereof, in which R1, R2 and R3, which may be the same or different, are each alkyl C1 to 20; and m and n, which may be the same or different, are preferably an integer from 1 to 19. There is also described a film formulation comprising a cation of formula (I), a colorimetric sensor device comprising said film and an endotracheal intubation apparatus comprising a sensor.

Power management system and method for electronic circuits

A hardware implementation of the Transfer Control Protocol/Internet Protocol (TCP/IP) software stack comprising multiple modular hardware gate level blocks used to implement the discrete functions required for link termination. These modules are designed using low power techniques to minimize the power required to achieve the data processing required by TCP/IP. These hardware blocks are modular so that they can be run at varying clock rates, or have various supply voltages provided thereto, depending on the throughput requirement of each block. Furthermore, at design time of each programmable hardware circuit (PHC) functional circuit blocks (FCBs) used to implement functionality within the PHC are optimized in accordance with predetermined parameters in order to obtain predetermined programmed PHC functionality, such as reduced power consumption or high bandwidth data throughput.

Railway car truck

Raisable fluidizing strip container discharge mechanisms

Air propeller hub

A fire barrier, a method for installing the same, an expansion joint system and a fire barrier assembly

The presently claimed invention relates to a fire barrier, a method for installing the same, an expansion joint system and a fire barrier assembly.

Rubber bearing bush

Package for an implantable neural stimulation device

The present invention is an improved hermetic package for implantation in the human body. The implantable device includes an electrically non-conductive substrate with electrically conductive vias. A flip-chip circuit is attached to the substrate using conductive bumps and electrically connected to a first subset of the vias. The flip-chip circuit can contain one or more stacks or a folded stack. A wire-bonded circuit is also attached to the substrate and electrically connected to a second subset of the vias. A cover is bonded to the substrate. The cover, substrate, and vias form an improved hermetic package for implantation.

Improved biocompatible bonding method

The invention is a device and method for connecting a hermetic package to a flexible circuit such as for an electrode array in an implantable device. Attaching metal pads on a flexible circuit to metal pads on a hermetic device by conductive adhesive is known. A smooth metal, such as platinum, does not bond well to conductive epoxy. The invention provides a roughened surface, such as by etching or by applying high surface area platinum gray, to improve adhesion to platinum or other metal pads.

Soft projectile launching device

A device for projecting a soft-projectile made from a super absorbent polymer, the device comprising a holder designed for containing the soft-projectile made from a super absorbent polymer; and a firing mechanism operatively arranged to accelerate the holder from a firing position.

Dischargeable bin

SYSTEM FOR RECORDING AND REPRODUCTION OF NOISE-INDUCED VIBRATION-NOISE INFORMATION.

Container-emptying clamp stand with gas-fluidizing cap

Electrode with increased stability and method of manufacturing the same

An implantable electrode with increased stability having a clustered structure wherein the surface of the electrode is covered with a material comprising openings which are filled with sticks or posts. An implantable electrode with increased stability wherein the surface is of the electrode comprises mesh grids which are filled with sticks which are filed with a conducting or insulating material. A method of manufacturing an electrode with increased stability, comprising: depositing a metal layer on an base layer; applying photoresist layer on the metal layer; patterning the photoresist layer providing openings; electroplating the openings with metal; removing the photoresist layer leaving spaces; and filling the spaces with polymer. A method of manufacturing an electrode with increased stability, comprising: depositing a metal layer on an base layer; applying a polymer layer on the metal layer; applying photoresist layer on the polymer layer; patterning the photoresist layer providing openings; electroplating the openings with metal; and removing the photoresist layer.

Flexible architecture for processing of large numbers and method therefor

A method of implementing large number multiplication and exponentiation is provided upon a general purpose microprocessor. These large number multiplication and exponentiation processes being common to cryptography standards such as RSA and AES that typically employ numbers with 512-bits, 1024-bits, and 2048-bits. According to the invention the method establishes the size of the large number processes according to value stored within a control register, this control register and other registers storing data are configured according to this value and accessed as N-bit registers (i.e. as 1024-bit registers for 1024-bit encryption. Additionally, the multiplication and exponentiation processes are handled according to the size of an arithmetic primitive, which is established according to the hardware configuration upon which the process is operating. As such the invention allows for an encryption process to adjust both to the configuration of the host microprocessor and supporting hardware/firmware and dynamically according to degree of security determined from the value stored within the control register.

Memory data transfer method and system

A method and apparatus are disclosed for providing a DMA process. Accordingly, a DMA process is initiated for moving data from contiguous first locations to contiguous second locations and to a third location or third locations. Within the DMA process the data from each of the contiguous first locations is retrieved and stored in a corresponding one of the contiguous second locations and in the third location or corresponding one of the third locations. The DMA process is performed absent retrieving the same data a second other time prior to storing of same within the corresponding one of the contiguous second locations and in the third location or corresponding one of the third locations.

Return electrode for a flexible circuit electrode array

In a visual prosthesis electrodes stimulate retinal tissue to induce the perception of light to a user implanted with the prosthesis. The prosthesis must have a return, or common, electrode to make a complete circuit with the retinal tissue. To avoid stimulating tissue with the return electrode, it is advantageous if the electrode is large. The invention involver a flexible circuit electrode array comprising a polymer base layer, metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue a polymer top layer deposited on said polymer base layer and said metal traces, and a return electrode separate from said stimulating electrodes. The flexible circuit electrode array comprises a secondary coil for receiving visual data; an electronics package electrically coupled to said receiving coil, and a plurality of stimulating electrode electrically coupled to said electronics package.

Quaternary ammonium salts, polymeric film containing them and colorimetric device

There is described a polymeric quaternary alkyl ammonium cation of general formula (I), or a salt thereof; in which R1, R2, R3 and R4, which may be the same or different are each alkyl C1 to 20; m is an integer from 1 to 100; and n is an integer from 1 to 7. There is also described a film formulation comprising a cation of formula (I), a colorimetric sensor device comprising said film and an endotracheal intubation apparatus comprising a sensor.

Flexible circuit electrode array embedded in a cured body

Polymer materials are useful as electrode array bodies for neural stimulation. They are particularly useful for retinal stimulation to create artificial vision, cochlear stimulation to create artificial hearing, and cortical stimulation, and many related purposes. The pressure applied against the retina, or other neural tissue, by an electrode array is critical. Too little pressure causes increased electrical resistance, along with electric field dispersion. Too much pressure may block blood flow. Common flexible circuit fabrication techniques generally require that a flexible circuit electrode array be made flat. Since neural tissue is almost never flat, a flat array will necessarily apply uneven pressure. Further, the edges of a flexible circuit polymer array may be sharp and cut the delicate neural tissue. It is advantageous that the array edges not contact tissue.

Polymer layer comprising silicone and at least one metal trace and a process of manufacturing the same

The invention relates to a method of embedding a metal trace in a silicone containing polymer layer, by the steps of applying an agent that does not adhere to a substrate; applying a polymer layer on the non adhering agent; irradiating a surface of the polymer with a light beam emitted by an excimer laser creating cuts, grooves, blind holes or vias; immersing the irradiated polymer in an autocatalytic bath containing metal ions and metallizing the polymer; thermally treating the metallized polymer layer to induce diffusion of the metalized metal into the first polymer layer; applying a polymer layer on the thermally treated metallized polymer; and thermally treating the metallized polymer.

Flexible circuit electrode array with wire or film support

The disclosure relates to a flexible circuit electrode array comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces; and at least one support embedded in said array. The disclosure further relates to a flexible circuit electrode array comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces; and a folded flexible circuit cable connecting the electrode array with an interconnection pad. The disclosure further relates to a method of making a flexible circuit electrode array comprising: depositing a polymer base layer; depositing metal on said polymer base layer; patterning said metal to form metal traces; depositing a polymer top layer on said polymer base layer and said metal traces; heating said flexible circuit electrode array in a mold to form a three dimensional shape in said flexible circuit electrode array, embedding a support at least in the base layer, top layer or between the base and top layer, and/or folding a flexible circuit cable at least once connecting the electrode array with an interconnection pad the array.

Memory data transfer method and system

A method and apparatus are disclosed for providing a DMA process. Accordingly, a DMA process is initiated for moving data from contiguous first locations to contiguous second locations and to a third location or third locations. Within the DMA process the data from each of the contiguous first locations is retrieved and stored in a corresponding one of the contiguous second locations and in the third location or corresponding one of the third locations. The DMA process is performed absent retrieving the same data a second other time prior to storing of same within the corresponding one of the contiguous second locations and in the third location or corresponding one of the third locations.

Elastic coupling between an air screw hub and a co-axial driving shaft

Flexible circuit electrode array

A flexible circuit electrode array comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces; and a central opening in the area of the metal traces. A flexible circuit electrode array comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces; and a soft polymer filling an attachment point. A flexible circuit electrode array comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces; and a hump to avoid a touching of the flexible electrode array and the optic nerve.

Polymer layer comprising silicone and at least one metal trace and a process of manufacturing the same

The present invention relates to a process for embedding at least one layer of at least one metal trace in a silicone containing polymer, comprising: a) applying a non adhering on a substrate; b) applying a polymer layer on the non adhering agent; c) irradiation at least one surface area of said polymer with a light beam emitted by an excimer laser; d) immersing said irradiated polymer in at least one autocatalytic bath containing metal ions of at least one metal and metallizing the polymer; e) thermally treating said metallized polymer; f) applying a polymer layer on said thermally treated metallized polymer; and g) thermally treating said metallized polymer.

Package for an implantable neural stimulation device

Apparatus for calculating and encryption

An apparatus for calculating and encryption of data has a multistage processing array and a plurality of registers. Each register has a status bit which indicates a “go” or “done” condition when the register is loaded. This enables the process array, after completion of a processing cycle, to connect to a “ready” register.

Flexible circuit electrode array

A flexible circuit electrode array with more than one layer of metal traces comprising: a polymer base layer; more than one layer of metal traces, separated by polymer layers, deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; and a polymer top layer deposited on said polymer base layer and said metal traces. Polymer materials are useful as electrode array bodies for neural stimulation. They are particularly useful for retinal stimulation to create artificial vision, cochlear stimulation to create artificial hearing, or cortical stimulation many purposes. The pressure applied against the retina, or other neural tissue, by an electrode array is critical. Too little pressure causes increased electrical resistance, along with electric field dispersion. Too much pressure may block blood flow.

Flexible circuit electrode array

Carbon dioxide sensor