Apparatus and Method For Protecting a Micro-Electro-Mechanical System

A protective cover for a micro-electro-mechanical system that has a low mass/area, preferably <3 gsm, most preferably <1 gsm. 1. A method of protecting a micro-electro-mechanical system having an ultrasonic transducer comprising the step of disposing adjacent to said ultrasonic transducer an expanded PTFE membrane having a mass/area ratio of about 3 g/mor less.2. A method as defined in wherein said mass/area ratio is about 1 g/mor less.3. A method as defined in wherein said expanded PTFE membrane captures particles greater than about 0.25 microns in diameter.4. A method as defined in wherein said expanded PTFE membrane provides transmission loss of less than about 3 dB at a frequency of about 50 to about 92.5 KHz.5. A method as defined in wherein said expanded PTFE membrane provides sonic transmission claim 1 , particle capture claim 1 , and pressure venting claim 1 ,6. A micro-electro-mechanical system comprising an ultrasonic transducer and an expanded PTFE protective cover having a mass/area ratio of about 3 g/mor less disposed adjacent to said ultrasonic transducer.7. A system as defined in wherein said mass/area ratio is about 1 g/mor less.8. A system as defined in wherein said expanded PTFE membrane captures particles greater than about 0.25 microns in diameter claim 1 ,9. A system as defined in wherein said expanded PTFE membrane provides transmission loss of less than about 3 dB at a frequency of about 50 to about 92.5 KHz.10. A system as defined in wherein said expanded PTFE membrane provides sonic transmission claim 1 , particle capture claim 1 , and pressure venting.12. A method as disclosed in where said membrane is ePTFE. The integration of mechanical elements, sensors, actuators or the like and electronics on a common silicon substrate through micro-fabrication technology is known as micro-electro-mechanical system (“MEMS”). MEMS sensors may be used in microphones, consumer pressure sensor applications, tire pressure monitoring systems, gas flow ...

VENTING ARRAY AND MANUFACTURING METHOD

The invention relates to a vent array comprising a plurality of venting regions comprising a porous PTFE matrix material and a nonporous material comprising a substrate material having a plurality of perforations, wherein the substrate material fills the pores of a porous PTFE matrix material to form nonporous regions, the nonporous regions interconnecting the plurality of venting regions. 1. A vent array comprising:a. a plurality of venting regions comprising a porous PTFE matrix, andb. a nonporous matrix material comprising a substrate material having a plurality of perforations, wherein the substrate material fills the pores of a porous PTFE matrix to form nonporous regions, the nonporous regions interconnecting the plurality of venting regions.2. The vent array of in which the porous PTFE matrix is oleophobic.3. The vent array of in which the substrate material is a dielectric material.4. The vent array of in which the substrate material is an epoxy.5. The vent array of in which the substrate material is polyimide.6. The vent array of having a thickness of less than 200 micron.7. The vent array of further comprising an attachment layer.8. A method of manufacturing a venting device for a container claim 1 , the container defining an internal space and an ambient space claim 1 , and having an aperture between the internal space and the ambient space claim 1 , the venting device adapted for placement over the aperture claim 1 , said method comprising:a. providing a porous PTFE matrix,b. providing a substrate material having a plurality of perforations,c. combining the porous PTFE matrix and the substrate material such that the substrate material fills the adjacent porous PTFE matrix thereby creating a composite having regions of porous PTFE and regions of filled PTFE matrix, andd. separating the composite into a plurality of venting devices, each venting device including at least one region of porous PTFE matrix.9. A method of manufacturing a vented MEMS package ...

Vent Attachment System For Micro-Electromechanical Systems

A method of installing a vent to protect an open port of a micro-electrical mechanical system (MEMS) device, the vent being of the type comprising an environmental barrier membrane attached to a carrier and the vent further being attached to a liner, the method comprising the steps of: (a) feeding the vent to a die attach machine with die ejectors and at least one of a vacuum head and a gripper head; (b) detaching the vent from said liner using the die ejectors; (c) picking up the vent with at least one of the vacuum head and the gripper head of the die attach machine; (d) disposing the vent over the open port of the MEMS device; and (e) securing the vent over the open port of the MEMS device. 1. A method of installing a vent assembly to protect an open port of a micro-electrical mechanical system (MEMS) device , said vent assembly being of the type comprising an environmental barrier membrane attached to a carrier and said vent further being attached to a liner , said method comprising the steps of:(a) feeding said vent assembly to a die attach machine with die ejectors and at least one of a vacuum head and a gripper head;(b) detaching said vent assembly from said liner using said die ejectors;(c) picking up said vent assembly with at least one of said vacuum head and said gripper head of said die attach machine;(d) disposing said vent assembly over said open port of said MEMS device; and(e) securing said vent assembly over said open port of said MEMS device.2. A method as defined in wherein said carrier comprises a material selected from the group consisting of PEEK and polyimide.3. A method as defined in wherein said carrier is attached to said membrane by a pressure sensitive adhesive.4. A method as defined in wherein said carrier is attached to said membrane by a weld.5. A method as defined in wherein said weld is selected from a group comprising a heat weld claim 4 , a sonic weld claim 4 , and a laser weld.6. A method as defined in wherein said liner comprises ...

Venting Array and Manufacturing Method

The invention relates to a vent array comprising a plurality of venting regions comprising a porous PTFE matrix material and a nonporous material comprising a substrate material having a plurality of perforations, wherein the substrate material fills the pores of a porous PTFE matrix material to form nonporous regions, the nonporous regions interconnecting the plurality of venting regions. 17.-. (canceled)8. A method of manufacturing a venting device for a container , the container defining an internal space and an ambient space , and having an aperture between the internal space and the ambient space , the venting device adapted for placement over the aperture , said method comprising:a. providing a porous PTFE matrix,b. providing a substrate material having a plurality of perforations,c. combining the porous PTFE matrix and the substrate material such that the substrate material fills the adjacent porous PTFE matrix thereby creating a composite having regions of porous PTFE and regions of filled PTFE matrix, andd. separating the composite into a plurality of venting devices, each venting device including at least one region of porous PTFE matrix.9. A method of manufacturing a vented MEMS package comprising:a. providing a MEMS package having a container, the container defining an internal space and an ambient space, and having an aperture between the internal space and the ambient space,b. providing a porous PTFE matrix,c. providing a substrate material having a plurality of perforations,d. combining the porous PTFE matrix and the substrate material such that the substrate material fills the adjacent porous PTFE matrix thereby creating a composite having regions of porous PTFE and regions of filled PTFE matrix,e. separating the composite into a plurality of venting devices, each venting device including at least one region of porous PTFE matrix, andf. attaching a venting device over the aperture of the MEMS package.10. A method of manufacturing a vent array , said ...

Vent Attachment System For Micro-Electromechanical Systems

A method of installing a vent to protect an open port of a micro-electrical mechanical system (MEMS) device, the vent being of the type comprising an environmental barrier membrane attached to a carrier and the vent further being attached to a liner, the method comprising the steps of: (a) feeding the vent to a die attach machine with die ejectors and at least one of a vacuum head and a gripper head; (b) detaching the vent from said liner using the die ejectors; (c) picking up the vent with at least one of the vacuum head and the gripper head of the die attach machine; (d) disposing the vent over the open port of the MEMS device; and (e) securing the vent over the open port of the MEMS device. 1. A method of installing a vent assembly to protect an open port of a micro-electrical mechanical system (MEMS) device , said vent assembly being of the type comprising an environmental barrier membrane attached to a carrier and said vent further being attached to a liner , said method comprising the steps of:(a) feeding said vent assembly to a die attach machine with die ejectors and at least one of a vacuum head and a gripper head;(b) detaching said vent assembly from said liner using said die ejectors;(c) picking up said vent assembly with at least one of said vacuum head and said gripper head of said die attach machine;(d) disposing said vent assembly over said open port of said MEMS device; and(e) securing said vent assembly over said open port of said MEMS device.2. A method as defined in wherein said carrier comprises a material selected from the group consisting of PEEK and polyimide.3. A method as defined in wherein said carrier is attached to said membrane by a pressure sensitive adhesive.4. A method as defined in wherein said carrier is attached to said membrane by a weld.5. A method as defined in wherein said weld is selected from a group comprising a heat weld claim 4 , a sonic weld claim 4 , and a laser weld.6. A method as defined in wherein said liner comprises ...

ACOUSTIC PROTECTIVE COVER INCLUDING A CURABLE SUPPORT LAYER

A protective cover assembly is disclosed that includes a membrane and a layered assembly bonded to the membrane. The membrane is positioned in an acoustic pathway and has a first side and a second side, the first side facing toward an acoustic cavity and the second side of the membrane facing toward an opening of the acoustic pathway. The layered assembly includes at least one curable support layer bonded to a side of the membrane formed of a polymer adhesive and defining at least a portion of a wall for the acoustic pathway. 1. An assembly comprising:a membrane in an acoustic pathway, a first side, wherein the first side faces toward an acoustic cavity; and', 'a second side, wherein the second side of the membrane faces toward an opening of the acoustic pathway; and, 'wherein the membrane comprisesat least one layered assembly, wherein the at least one layered assembly is bonded to one of the first side of the membrane or the second side of the membrane along a periphery of the first side of the membrane or the second side of the membrane [ 'wherein the first external adhesive is bonded to the curable support layer; and', 'a first external adhesive,'}, 'wherein the second external adhesive is bonded to the membrane;', 'a second external adhesive,'}, 'wherein the at least one layered assembly defines at least a portion of a wall for the acoustic pathway, and', 'wherein the curable support layer has a shear stiffness of at least 8,000 gf at a strain of 0.5 mm., 'a curable support layer; and'}, 'wherein the at least one layered assembly comprises2. The assembly of claim 1 , wherein the curable support layer is a thermoset adhesive comprising a phenolic resin claim 1 , epoxy resin claim 1 , urea resin claim 1 , polyurethane resin claim 1 , melamine resin claim 1 , or polyester resin.3. The assembly of claim 1 , wherein the curable support layer is stiffer than the first external adhesive layer.4. The assembly claim 1 , wherein the curable support layer has a stiffness ...

PROTECTIVE ENVIRONMENTAL BARRIER FOR A DIE

An environmental-barrier layer can protect a die or an array of die. A substrate that includes various functional components can be coupled to a porous environmental-barrier layer to form an array of die prior to dividing the array into individual die. The porous environmental-barrier layer can be a layer that includes polymer or fluoropolymer. The porous environmental-barrier layer can also be a filter layer for allowing certain waves to pass through and blocking particles and other debris. The porous environmental-barrier layer can protect each die in the array and the functional components from damage by protecting the die and the functional components from mechanical, electrical, or environmental damage (e.g., contamination by fluid or dust) without impeding a function of the functional components. 1. An apparatus comprising:a substrate with substrate features including functional components; anda porous barrier layer coupled to the substrate to form an array of die, the porous barrier layer covering the substrate and protecting the functional components,wherein the array of die is dividable subsequent to coupling the porous barrier layer to the substrate to form a plurality of die, each die of the plurality of die including a portion of the substrate with a functional component in a substrate feature and a portion of the porous barrier layer covering the functional component.2. The apparatus of claim 1 , wherein the porous barrier layer is a filter layer comprising expanded polytetrafluoroethylene (“ePTFE”) for protecting the functional components by preventing passage of fluids or dust.3. The apparatus of claim 1 , wherein the porous barrier layer is positionable proximate to the substrate features such that the porous barrier layer covers the substrate features and is in contact with the substrate features claim 1 ,wherein the porous barrier layer is a selectively permeable layer for preventing passage of fluids or dust and allowing passage of a pressure wave ...

Venting array and manufacturing method

The invention relates to a vent array comprising a plurality of venting regions comprising a porous PTFE matrix material and a nonporous material comprising a substrate material having a plurality of perforations, wherein the substrate material fills the pores of a porous PTFE matrix material to form nonporous regions, the nonporous regions interconnecting the plurality of venting regions.

Venting array and manufacturing method

The invention relates to a vent array comprising a plurality of venting regions comprising a porous PTFE matrix material and a nonporous material comprising a substrate material having a plurality of perforations, wherein the substrate material fills the pores of a porous PTFE matrix material to form nonporous regions, the nonporous regions interconnecting the plurality of venting regions.

Venting array and manufacturing method

The invention relates to a vent array comprising a plurality of venting regions comprising a porous PTFE matrix material and a nonporous material comprising a substrate material having a plurality of perforations, wherein the substrate material fills the pores of a porous PTFE matrix material to form nonporous regions, the nonporous regions interconnecting the plurality of venting regions.

Environmental barrier for a chip

Eine Umgebungsbarrierenschicht kann einen Chip oder eine Chipanordnung schützen. Ein Substrat, das verschiedene Funktionskomponenten beinhaltet, kann mit einer porösen Umgebungsbarrierenschicht gekoppelt werden, um eine Chipanordnung zu bilden, bevor die Anordnung in einzelne Chips zerteilt wird. Bei der porösen Umgebungsbarrierenschicht kann es sich um eine Schicht handeln, die Polymer oder Fluorpolymer aufweist. Bei der porösen Umgebungsbarrierenschicht kann es sich auch um eine Filterschicht handeln, die bestimmte Wellen hindurch lässt und Partikel sowie andere Verunreinigungen blockiert. Die poröse Umgebungsbarrierenschicht kann den jeweiligen Chip in der Anordnung sowie die Funktionskomponenten vor Beschädigung schützen, indem sie den Chip sowie die Funktionskomponenten vor mechanischen und elektrischen Schäden oder Umweltschäden schützt (z.B. Verunreinigung durch Fluid oder Staub), ohne eine Funktion der Funktionskomponenten zu beeinträchtigen. An environmental barrier layer may protect a chip or a chip assembly. A substrate including various functional components may be coupled to an ambient barrier porous layer to form a chip assembly before the assembly is divided into individual chips. The porous environmental barrier layer may be a layer comprising polymer or fluoropolymer. The porous ambient barrier layer may also be a filter layer that allows certain waves to pass through and blocks particles and other contaminants. The porous ambient barrier layer can protect the respective chip in the assembly as well as the functional components from damage by protecting the chip as well as the functional components from mechanical and electrical damage or environmental damage (eg contamination by fluid or dust) without affecting a function of the functional components.

Acoustic protective cover including a curable support layer

A protective cover assembly is disclosed that includes a membrane and a layered assembly bonded to the membrane. The membrane is positioned in an acoustic pathway and has a first side and a second side, the first side facing toward an acoustic cavity and the second side of the membrane facing toward an opening of the acoustic pathway. The layered assembly includes at least one curable support layer bonded to a side of the membrane formed of a polymer adhesive and defining at least a portion of a wall for the acoustic pathway.

Venting array and manufacturing method

Eine härtbare trägerschicht einschliessende akustikschutzabdeckung

Akustikschutzabdeckungsbaugruppe (100) für eine akustische Vorrichtung, umfassend:eine Membran (322, 522) in einem Schallweg (308) mit einer ersten und einer zweiten Seite, wobei die erste Seite einem akustischen Hohlraum (306) und die zweite Seite der Membran (322, 522) einer Öffnung (12, 316) des Schallweges (308) zugewandt ist; undmindestens eine geschichtete Anordnung (320), die eine härtbare Trägerschicht (324) umfasst, die mit einer der ersten Seite oder der zweiten Seite der Membran (322, 522) entlang deren Peripherie verbunden angeordnet ist, und die ferner zwei äußere Klebstoffschichten (326, 328, 526, 528) umfasst, wobei die erste äußere Klebstoffschich (326)t an die härtbare Trägerschicht (324) gebunden ist und die zweite äußere Klebstoffschicht (328) an die Membran (322, 522) gebunden ist, wobei die härtbare Trägerschicht (324) einen Polymerklebstoff umfasst und wobei die mindestens eine geschichtete Anordnung (320) mindestens einen Teil einer Wandung für den Schallweg (308) definiert, undwobei die härtbare Trägerschicht (324) eine Schersteifigkeit von mindestens 8.000 gf bei einer Dehnung von 0,5 mm aufweist.

Apparatus and method for protecting a micro-electro-mechanical system