Signal Acquisition System Having a Compensation Digital Filter

A signal acquisition system has a signal acquisition probe having probe tip circuitry coupled to a resistive center conductor signal cable. The resistive center conductor signal cable is coupled to a compensation system in a signal processing instrument via an input node and input circuitry in the signal processing instrument. The signal acquisition probe and the signal processing instrument have mismatched time constants at the input node with the compensation system having an input amplifier with feedback loop circuitry and a compensation digital filter providing pole-zero pairs for maintaining flatness over the signal acquisition system frequency bandwidth.

Automatic Probe Ground Connection Checking Techniques

A test system can include a probe suitable to be coupled between a test measurement device and a device under test (DUT). The probe can include a signal input to receive an active signal from the DUT and a signal output to provide the active signal to the test measurement device. The probe can also include an input ground to connect to the DUT ground and an output ground to connect to the test measurement device ground. A probe ground connection checking device can automatically determine whether the probe ground connections to the DUT ground and test measurement device ground are solid. 1. A probe ground connection checking device , comprising:a magnetic core configured to receive a probe cable therethrough; anda test coil configured to be coupled with said magnetic core and further configured to receive an alternating current such that an impedance thereof may be measured and used in determining whether a ground loop exists, said ground loop including a probe cable ground path and appropriate ground connections at both ends of said probe cable.2. The probe ground connection checking device of claim 1 , wherein said magnetic core is permanently coupled to said probe cable.3. The probe ground connection checking device of claim 2 , wherein said test coil is permanently coupled to said magnetic core.5. The probe ground connection checking device of claim 1 , wherein said magnetic core is removably attachable to said probe cable.5. The probe ground connection checking device of claim 1 , further comprising an alert mechanism configured to provide a user with an alert responsive to a determination that said ground loop does not exist.6. A probe ground connection checking device claim 1 , comprising:a probe having an input ground configured to electrically connect to a ground of a device under test (DUT), an output ground configured to electrically connect to a ground of a test measurement device, and a probe ground path electrically coupled between said input ground ...

Signal acquisition system having reduced probe loading of a device under test

A signal acquisition system has a signal acquisition probe having probe tip circuitry coupled to a resistive center conductor signal cable. The resistive center conductor signal cable of the signal acquisition probe is coupled to a compensation system in a signal processing instrument via an input node and input circuitry in the signal processing instrument. The signal acquisition probe and the signal processing instrument have mismatched time constants at the input node with the compensation system having an input amplifier with feedback loop circuitry and a shunt pole-zero pair coupled to the input circuitry providing pole-zero pairs for maintaining flatness over the signal acquisition system frequency bandwidth.

Attachable/detachable probing tip system for a measurement probing system

A attachable/detachable probing tip system ( 10 ) has a housing ( 12 ) that includes a probing tip mounting member ( 14 ) and opposing substantially orthogonal attachment ( 16, 18 ) arms extending from the probing tip mounting member. The attachment arms define an inner surface of the probing tip mounting member in which is disposed at least a first a non-compressive set, resilient member ( 56 ). First and second probing tips ( 42, 44 ) are disposed over the non-compressive, resilient member ( 56 ) and secured to the housing by latching means ( 60, 66, 92, 96, 100, 130 ). The attachable/detachable probing tip system allows mounting of the probing tips ( 42, 44 ) to probing contacts on a device under test without a probe body or probing tip member ( 38 ) being attached. The attachment arms ( 16, 18 ) allows a probe body or probing tip member ( 38 ) to be attached and detached to the probing tip system ( 10 ). The probing tip member ( 38 ) includes contact pins that engage contact areas ( ...

HIGH IMPEDANCE COMPLIANT PROBE TIP

A test probe tip can include a compliance member or force deflecting assembly and a tip component. The compliance member or force deflecting assembly can include a plunger component and a barrel component to receive the plunger component, wherein the plunger component is configured to slide axially inside the barrel component. The test probe tip can also include a spring mechanism within the barrel component to act on the plunger component, and a resistive/impedance element coupled with the plunger component at one end and with the tip component at the opposite end, the resistive/impedance element including at least one rod having a semi-cylindrical form and a resistive material situated thereon. 1. A test probe tip , comprising:a force deflecting assembly; at least a first rod having a substantially semi-cylindrical form that includes a substantially flat side; and', 'a resistive material situated on the substantially flat side of the first rod, the resistive material configured to provide a conductive path along the substantially flat side of the first rod; and, 'a resistive/impedance element configured to be coupled with the force deflecting assembly, wherein the resistive/impedance element comprisesa tip component configured to be coupled with the resistive/impedance element.2. The test probe tip of claim 1 , wherein the first rod is a zirconia extrusion.3. The test probe tip of claim 1 , wherein the resistive/impedance element further comprises:a second rod having a substantially semi-cylindrical form that includes a substantially flat side; andan adhesive material coupled between the first rod and the second rod.4. The test probe tip of claim 3 , wherein each of the first and second rods is a zirconia extrusion.5. The test probe tip of claim 3 , wherein the adhesive material is a non-conductive epoxy.6. The test probe tip of claim 1 , wherein the force deflecting assembly includes:a plunger component configured to be coupled with the resistive/impedance ...

Low Capacitance Signal Acquisition System

A low capacitance signal acquisition system has a signal acquisition probe having a low capacitance input circuit coupled to a compensation amplifier in a signal processing instrument via a signal cable. The low capacitance input circuit, the signal cable and the signal processing instrument input have mismatched time constants with the compensation amplifier having feedback loop circuitry providing adjustable gain and pole-zero pairs for maintaining flatness over the low capacitance signal acquisition system frequency bandwidth.

Signal acquisition system having reduced probe loading of a device under test

A signal acquisition system has a signal acquisition probe having probe tip circuitry coupled to a resistive center conductor signal cable. The resistive center conductor signal cable of the signal acquisition probe is coupled to a compensation system in a signal processing instrument via an input node and input circuitry in the signal processing instrument. The signal acquisition probe and the signal processing instrument have mismatched time constants at the input node with the compensation system providing pole-zero pairs for maintaining flatness over the signal acquisition system frequency bandwidth.

High impedance compliant probe tip

A test probe tip can include a compliance member or force deflecting assembly and a tip component. The compliance member or force deflecting assembly can include a plunger component and a barrel component to receive the plunger component, wherein the plunger component is configured to slide axially inside the barrel component. The test probe tip can also include a spring mechanism within the barrel component to act on the plunger component, and a resistive/impedance element, e.g., a round rod resistor, coupled with the plunger component at one end and with the tip component at the opposite end.

Method of manufacturing probe with printed tip

The manufacturing method of a probe with printed tip consists of a substrate having a plurality of probe tips connected to its end edge, a plurality of test paths, each connected to one of the probe tips and extending along the substrate, and at least one of the test paths including an electrical component adjacent to the test path's probe tip. The electrical component may be a resistor. The probe tips may have a width equal to the thickness of the substrate. The probe tips may consist of a plurality of probe tip layers. The invention also includes a method of probing signals transmitted over target transmission lines on a target board. The disclosure also includes a method of manufacturing the claimed invention.

Signal acquisition system having reduced probe loading of a device under test

A signal acquisition system has a signal acquisition probe having probe tip circuitry coupled to a resistive center conductor signal cable. The resistive center conductor signal cable of the signal acquisition probe is coupled to a compensation system in a signal processing instrument via an input node and input circuitry in the signal processing instrument. The signal acquisition probe and the signal processing instrument have mismatched time constants at the input node with the compensation system having an input amplifier with feedback loop circuitry and a shunt pole-zero pair coupled to the input circuitry providing pole-zero pairs for maintaining flatness over the signal acquisition system frequency bandwidth.

Signal Acquisition System Having Reduced Probe Loading of a Device Under Test

A signal acquisition system has a signal acquisition probe having probe tip circuitry coupled to a resistive center conductor signal cable. The resistive center conductor signal cable of the signal acquisition probe is coupled to a compensation system in a signal processing instrument via an input node and input circuitry in the signal processing instrument. The signal acquisition probe and the signal processing instrument have mismatched time constants at the input node with the compensation system providing pole-zero pairs for maintaining flatness over the signal acquisition system frequency bandwidth.

Wide bandwidth attenuator input circuit for a measurement probe

A wide bandwidth attenuator input circuit for a measurement probe has a Z 0 attenuator circuit coupled in series with a compensated RC attenuator circuit. The series attenuator elements of the Z 0 and the compensated RC attenuator circuits are coupled via a controlled impedance transmission line to the shunt attenuator elements of the Z 0 and the compensated RC attenuator circuits. The shunt element of the Z 0 attenuator element terminates the transmission line in its characteristic impedance. The junction of the series and shunt attenuator elements are coupled to the input of a buffer amplifier. At low and intermediate frequencies, the compensated RC attenuator circuit attenuates an input signal while at high frequencies, the compensated RC attenuator circuit acts as a short and the Z 0 attenuator circuits attenuates the input signal.

Automatic probe ground connection checking techniques

A test system can include a probe suitable to be coupled between a test measurement device and a device under test (DUT). The probe can include a signal input to receive an active signal from the DUT and a signal output to provide the active signal to the test measurement device. The probe can also include an input ground to connect to the DUT ground and an output ground to connect to the test measurement device ground. A probe ground connection checking device can automatically determine whether the probe ground connections to the DUT ground and test measurement device ground are solid.

Test and measurement probe with adjustable test point contact

A probe for making electrical contact with a device-under-test test point includes a body, a rigid member capable of travelling linearly with respect to the body, a flexible arm having a test point contact at one end and fastened to the rigid member at the other end, and a flexible linkage fixed to the body and to the flexible arm. The flexible linkage is structured to cause the flexible arm to bend in response to travel of the rigid member in one direction, and to cause the flexible arm to unbend in response to travel of the rigid member in the other direction. A second flexible arm may be included, the two arms opening and closing to change the distance between test point contacts. A light source may be disposed on a portion of the flexible linkage that simultaneously articulates to automatically track the orientation of the test point contact.

Automatic probe ground connection checking techniques

A test system can include a probe suitable to be coupled between a test measurement device and a device under test (DUT). The probe can include a signal input to receive an active signal from the DUT and a signal output to provide the active signal to the test measurement device. The probe can also include an input ground to connect to the DUT ground and an output ground to connect to the test measurement device ground. A probe ground connection checking device can automatically determine whether the probe ground connections to the DUT ground and test measurement device ground are solid.

High impedance compliant probe tip

A test probe tip can include a compliance member or force deflecting assembly and a tip component. The compliance member or force deflecting assembly can include a plunger component and a barrel component to receive the plunger component, wherein the plunger component is configured to slide axially inside the barrel component. The test probe tip can also include a spring mechanism within the barrel component to act on the plunger component, and a resistive/impedance element coupled with the plunger component at one end and with the tip component at the opposite end, the resistive/impedance element including at least one rod having a semi-cylindrical form and a resistive material situated thereon.

AUTOMATIC PROBE GROUND CONNECTION CHECKING TECHNIQUES

A test system can include a probe suitable to be coupled between a test measurement device and a device under test (DUT). The probe can include a signal input to receive an active signal from the DUT and a signal output to provide the active signal to the test measurement device. The probe can also include an input ground to connect to the DUT ground and an output ground to connect to the test measurement device ground. A probe ground connection checking device can automatically determine whether the probe ground connections to the DUT ground and test measurement device ground are solid.

Automatic probe ground connection checking techniques

A test system can include a probe suitable to be coupled between a test measurement device and a device under test (DUT). The probe can include a signal input to receive an active signal from the DUT and a signal output to provide the active signal to the test measurement device. The probe can also include an input ground to connect to the DUT ground and an output ground to connect to the test measurement device ground. A probe ground connection checking device can automatically determine whether the probe ground connections to the DUT ground and test measurement device ground are solid.

Probe with printed tip

The probe with printed tip consists of a substrate having a plurality of probe tips connected to its end edge, a plurality of test paths, each connected to one of the probe tips and extending along the substrate, and at least one of the test paths including an electrical component adjacent to the test path's probe tip. The electrical component may be a resistor. The probe tips may have a width equal to the thickness of the substrate. The probe tips may consist of a plurality of probe tip layers. The invention also includes a method of probing signals transmitted over target transmission lines on a target board. The disclosure also includes a method of manufacturing the claimed invention.

TRI-MODE PROBE WITH AUTOMATIC SKEW ADJUSTMENT

A probe, including a first input configured to receive a first input signal, a second input configured to receive a second input signal, a first cable connected to the first input, a second cable connected to the second input, an electronically adjustable delay connected to the first cable, the electronically adjustable delay configured to delay the first input signal to remove a skew between the first input signal and the second input signal, and an amplifier configured to receive the first input signal from the electronically adjustable delay and a second input signal. 1. A probe , comprising:a first input configured to receive a first input signal;a second input configured to receive a second input signal;an electronically adjustable delay connected to the first input, the electronically adjustable delay configured to delay the first input signal to remove a skew between the first input signal and the second input signal; andan amplifier configured to receive the first input signal from the electronically adjustable delay and the second input signal.2. The probe of claim 1 , wherein the electronically adjustable delay is a first electronically adjustable delay claim 1 , and the probe further comprises a second electronically adjustable delay connected to the second input claim 1 , the second electronically adjustable delay configured to delay the second input to remove the skew between the first input signal and the second input signal in combination with the first electronically adjustable delay.3. The probe of claim 1 , further comprising a processor connected to the electronically adjustable delay claim 1 , the processor configured to determine a delay adjustment amount.4. The probe of claim 1 , wherein the probe is a differential probe.5. The probe of claim 1 , wherein the probe is a TriMode probe claim 1 , and the probe further includes a third input configured to receive a ground signal.6. The probe of claim 1 , wherein the electronically adjustable delay ...

Signal acquisition system having a compensation digital filter

A signal acquisition system has a signal acquisition probe having probe tip circuitry coupled to a resistive center conductor signal cable. The resistive center conductor signal cable is coupled to a compensation system in a signal processing instrument via an input node and input circuitry in the signal processing instrument. The signal acquisition probe and the signal processing instrument have mismatched time constants at the input node with the compensation system having an input amplifier with feedback loop circuitry and a compensation digital filter providing pole-zero pairs for maintaining flatness over the signal acquisition system frequency bandwidth.

Differential termination and attenuator network for a measurement probe

A differential termination and attenuator network receives a differential input signal having a DC common mode voltage. The network circuit includes input termination resistors coupled in parallel with corresponding resistive attenuator circuits. A monitoring circuit coupled to input nodes of the network generates an output signal representative of the combination of a DC common mode voltage on the input nodes and an applied termination voltage. A control circuit receives the output signal from the monitoring circuit and the applied termination voltage and generates a scaled termination voltage and a scaled compensation voltage and drive currents. The scaled termination and compensation voltages and drive currents provide DC currents through the input termination resistances and the attenuators for nulling DC currents at the network input nodes and provides a DC common mode voltage output from the attenuators for optimizing the dynamic range of a differential measurement amplifier.

Method and apparatus for probing

A probe comprises a small consumable probe substrate permanently mounted to a circuit-under-test. The probe substrate includes a high-fidelity signal pathway, which is inserted into a conductor of the circuit-under-test, and a high-bandwidth sensing circuit which senses the signal-under-test as it propagates along the signal pathway. The probe substrate further includes a probe socket for receiving a detachable interconnect to a measurement instrument. Power is alternatively supplied to the probe by the circuit-under-test or the interconnect. When the interconnect is attached, control signals from the measurement instrument are supplied to the sensing circuit and the output of the sensing circuit is supplied to the measurement instrument. In one embodiment, the sensing circuit uses high-breakdown transistors in order to avoid the use of passive attenuation. In a further embodiment, the sensing circuit includes broadband directional sensing circuitry.

Automatic Probe Ground Connection Checking Techniques

A test system can include a probe suitable to be coupled between a test measurement device and a device under test (DUT). The probe can include a signal input to receive an active signal from the DUT and a signal output to provide the active signal to the test measurement device. The probe can also include an input ground to connect to the DUT ground and an output ground to connect to the test measurement device ground. A probe ground connection checking device can automatically determine whether the probe ground connections to the DUT ground and test measurement device ground are solid.

Signal acquisition system having reduced probe loading of a device under test

A signal acquisition system has a signal acquisition probe having probe tip circuitry coupled to a resistive center conductor signal cable. The resistive center conductor signal cable of the signal acquisition probe is coupled to a compensation system in a signal processing instrument via an input node and input circuitry in the signal processing instrument. The signal acquisition probe and the signal processing instrument have mismatched time constants at the input node with the compensation system providing pole-zero pairs for maintaining flatness over the signal acquisition system frequency bandwidth.

Automatic probe ground connection checking techniques

A test system can include a probe suitable to be coupled between a test measurement device and a device under test (DUT). The probe can include a signal input to receive an active signal from the DUT and a signal output to provide the active signal to the test measurement device. The probe can also include an input ground to connect to the DUT ground and an output ground to connect to the test measurement device ground. A probe ground connection checking device can automatically determine whether the probe ground connections to the DUT ground and test measurement device ground are solid.

Signal Acquisition System Having Probe Cable Termination in a Signal Processing Instrument

A signal acquisition system has a signal acquisition probe having probe tip circuitry coupled to a resistive center conductor signal cable with the signal cable coupled to a signal processing instrument via an input node. The input node is coupled to an input current amplifier via input circuitry. The input circuitry provides at least one of resistive and capacitive termination of the resistive center conductor signal cable. The termination of the resistive center conductor signal cable in the signal processing instrument provides a signal acquisition system where the capacitive loading of a device under test at higher frequencies is reduced by reducing the input capacitance of the probe tip circuitry resulting in an increase in the signal acquisition system bandwidth.

Probing Adapter for a Signal Acquisition Probe

A probing adapter has a support member receiving a probing tip assembly having probing arms. The probing tip assembly is mounted to the support member via a rotational joint having elastomeric member disposed in the probing arms with each of the probing arms having a pivot point disposed away from the rotational joint. Each of the probing arms supports a removable probing tip substrate having a probing tip at one end electrically coupled via an electrical signal conductor to an electrical connector at the other end. Substrate retention clips secure the removable probing tip substrates to the probing arms. A probing tip positioning member is mounted to the probing arms for varying the distance between the probing tips on the removable probing tip substrates.

TEST AND MEASUREMENT PROBE WITH ADJUSTABLE TEST POINT CONTACT

A probe for making electrical contact with a device-under-test test point includes a body, a rigid member capable of travelling linearly with respect to the body, a flexible arm having a test point contact at one end and fastened to the rigid member at the other end, and a flexible linkage fixed to the body and to the flexible arm. The flexible linkage is structured to cause the flexible arm to bend in response to travel of the rigid member in one direction, and to cause the flexible arm to unbend in response to travel of the rigid member in the other direction. A second flexible arm may be included, the two arms opening and closing to change the distance between test point contacts. A light source may be disposed on a portion of the flexible linkage that simultaneously articulates to automatically track the orientation of the test point contact.

Differential termination attenuator network for a measurement probe having an internal termination voltage generator

A differential termination and attenuator network having an internal common mode termination voltage generator includes first and second termination resistors coupled in parallel with corresponding resistive attenuator circuits. A monitoring circuit coupled to input nodes of the network generates an output signal representative of the combination of a DC common mode voltage on the input nodes and an internal termination voltage. A control circuit generates scaled termination and compensation voltages and associated drive currents using the internal termination voltage and the monitoring circuit output signal. The scaled termination voltage and the scaled compensation voltage operate on the differential termination and attenuation network to optimize the dynamic range of a differential amplifier connected to the first and second attenuator outputs and null the DC currents at the input of the network. The internal termination voltage generator receives termination voltage parameters from ...

Signal acquisition system having probe cable termination in a signal processing instrument

A signal acquisition system has a signal acquisition probe having probe tip circuitry coupled to a resistive center conductor signal cable with the signal cable coupled to a signal processing instrument via an input node. The input node is coupled to an input current amplifier via input circuitry. The input circuitry provides at least one of resistive and capacitive termination of the resistive center conductor signal cable. The termination of the resistive center conductor signal cable in the signal processing instrument provides a signal acquisition system where the capacitive loading of a device under test at higher frequencies is reduced by reducing the input capacitance of the probe tip circuitry resulting in an increase in the signal acquisition system bandwidth.

Tri-mode probe with automatic skew adjustment

A probe, including a first input configured to receive a first input signal, a second input configured to receive a second input signal, a first cable connected to the first input, a second cable connected to the second input, an electronically adjustable delay connected to the first cable, the electronically adjustable delay configured to delay the first input signal to remove a skew between the first input signal and the second input signal, and an amplifier configured to receive the first input signal from the electronically adjustable delay and a second input signal.

Differential termination and attenuator network for a measurement probe having an automated common mode termination voltage generator

A differential termination and attenuator network having an automated common mode termination voltage generator includes first and second termination resistors coupled in parallel with corresponding resistive attenuator circuits. A monitoring circuit coupled to input nodes of the network generates an output signal representative of the combination of a DC common mode voltage on the input nodes and an adjustable termination voltage. A control circuit generates scaled termination and compensation voltages and associated drive currents using the adjustable termination voltage and the monitoring circuit output signal. The scaled termination voltage and the scaled compensation voltage operate on the differential termination and attenuation network to optimize the dynamic range of a differential amplifier connected to the first and second attenuator outputs. An automated termination voltage generator automatically adjusts the adjustable termination voltage to match the DC common mode input voltage ...

Wide bandwidth attenuator input circuit for a measurement probe

A wide bandwidth attenuator input circuit for a measurement probe has a Z0 attenuator circuit coupled in series with a compensated RC attenuator circuit. The series attenuator elements of the Z0 and the compensated RC attenuator circuits are coupled via a controlled impedance transmission line to the shunt attenuator elements of the Z0 and the compensated RC attenuator circuits. The shunt element of the Z0 attenuator element terminates the transmission line in its characteristic impedance. The junction of the series and shunt attenuator elements are coupled to the input of a buffer amplifier. At low and intermediate frequencies, the compensated RC attenuator circuit attenuates an input signal while at high frequencies, the compensated RC attenuator circuit acts as a short and the Z0 attenuator circuits attenuates the input signal.

PROBE TIP AND PROBE ASSEMBLY

A test probe tip can include a resistive element coupled with a tip component. The resistive element can include a resistive layer disposed on an exterior surface of a structural member of the resistive impedance element. In embodiments, the resistive element can be configured to form a structural component of the test probe tip without an insulating covering applied thereto. Additional embodiments may be described and/or claimed herein. 1. A test probe tip , comprising:a resistive element having a resistive layer applied to an exterior surface of a structural member of the resistive impedance element; anda tip component configured to be coupled with the resistive element, wherein the resistive element is configured to be electrically and mechanically coupled with the tip component such that the resistive element forms a structural component of the test probe tip without an insulating covering applied thereto.2. The test probe tip of claim 1 , wherein the structural member of the resistive element further includes zirconium claim 1 , quartz claim 1 , or a combination thereof.3. The test probe tip of claim 1 , wherein the resistive layer comprises oxides of ruthenium claim 1 , iridium claim 1 , and/or rhenium.4. The test probe tip of claim 1 , wherein the structural member is substantially cylindrical in shape.5. The test probe tip of claim 1 , further comprising a force deflecting assembly coupled with the resistive element.6. The test probe tip of claim 5 , wherein the force deflecting assembly is configured to couple the test probe tip to a test probe body.7. The test probe tip of claim 5 , wherein the force deflecting assembly includes:a plunger component configured to be coupled with the resistive element;a barrel component configured to receive the plunger component, wherein the plunger component is configured to slide axially inside the barrel component; anda spring mechanism positioned within the barrel component and configured to act on the plunger component ...

Signal Acquisition System Having a Compensation Digital Filter

A signal acquisition system has a signal acquisition probe having probe tip circuitry coupled to a resistive center conductor signal cable. The resistive center conductor signal cable is coupled to a compensation system in a signal processing instrument via an input node and input circuitry in the signal processing instrument. The signal acquisition probe and the signal processing instrument have mismatched time constants at the input node with the compensation system having an input amplifier with feedback loop circuitry and a compensation digital filter providing pole-zero pairs for maintaining flatness over the signal acquisition system frequency bandwidth.

Wide bandwidth attenuator input circuit for a measurement probe

A wide bandwidth attenuator input circuit for a measurement probe has a Z₀ attenuator circuit coupled in series with a compensated RC attenuator circuit. The series attenuator elements of the Z₀ and the compensated RC attenuator circuits are coupled via a controlled impedance transmission line to the shunt attenuator elements of the Z₀ and the compensated RC attenuator circuits. The shunt element of the Z₀ attenuator element terminates the transmission line in its characteristic impedance. The junction of the series and shunt attenuator elements are coupled to the input of a buffer amplifier. At low and intermediate frequencies, the compensated RC attenuator circuit attenuates an input signal while at high frequencies, the compensated RC attenuator circuit acts as a short and the Z₀ attenuator circuits attenuates the input signal.

HIGH IMPEDANCE COMPLIANT PROBE TIP

A test probe tip can include a compliance member or force deflecting assembly and a tip component. The compliance member or force deflecting assembly can include a plunger component and a barrel component to receive the plunger component, wherein the plunger component is configured to slide axially inside the barrel component. The test probe tip can also include a spring mechanism within the barrel component to act on the plunger component, and a resistive/impedance element, e.g., a round rod resistor, coupled with the plunger component at one end and with the tip component at the opposite end.

Signal Acquisition System Having Reduced Probe Loading of a Device Under Test

A signal acquisition system has a signal acquisition probe having probe tip circuitry coupled to a resistive center conductor signal cable. The resistive center conductor signal cable of the signal acquisition probe is coupled to a compensation system in a signal processing instrument via an input node and input circuitry in the signal processing instrument. The signal acquisition probe and the signal processing instrument have mismatched time constants at the input node with the compensation system having an input amplifier with feedback loop circuitry and a shunt pole-zero pair coupled to the input circuitry providing pole-zero pairs for maintaining flatness over the signal acquisition system frequency bandwidth.

Probing adapter for a signal acquisition probe having pivoting, compliant, variable spacing probing tips

A probing adapter has a support member receiving a probing tip assembly having probing arms. The probing tip assembly is mounted to the support member via a rotational joint having elastomeric member disposed in the probing arms with each of the probing arms having a pivot point disposed away from the rotational joint. Each of the probing arms supports a removable probing tip substrate having a probing tip at one end electrically coupled via an electrical signal conductor to an electrical connector at the other end. Substrate retention clips secure the removable probing tip substrates to the probing arms. A probing tip positioning member is mounted to the probing arms for varying the distance between the probing tips on the removable probing tip substrates.

Signal Acquisition System Having Reduced Probe Loading of a Device Under Test

A signal acquisition system has a signal acquisition probe having probe tip circuitry coupled to a resistive center conductor signal cable. The resistive center conductor signal cable of the signal acquisition probe is coupled to a compensation system in a signal processing instrument via an input node and input circuitry in the signal processing instrument. The signal acquisition probe and the signal processing instrument have mismatched time constants at the input node with the compensation system having an input amplifier with feedback loop circuitry and a shunt pole-zero pair coupled to the input circuitry providing pole-zero pairs for maintaining flatness over the signal acquisition system frequency bandwidth. 1. A calibration process for a signal acquisition system having a signal acquisition probe and a signal processing instrument comprising the steps of:a) acquiring digital values of a broad frequency content signal as a calibration waveform using the signal acquisition probe and the signal processing instrument;b) determining at least a first a measured error value between a fast edge signal reference calibration waveform stored in the signal processing instrument and the calibration waveform at a common location on the waveforms set by at least one of a time location and a frequency location;c) determining the measured error factor as a function of at least the measured error value and the common location on the waveforms;d) applying measured error factor to a register value of an appropriate register in a plurality of registers in feedback loop circuitry of an input amplifier;e) repeating steps b), c), and d) for additional common locations on the waveforms;f) acquiring digital values of a broad frequency content signal as a calibration waveform using the signal acquisition probe and the signal processing instrument after determining the measured error value and measured error factor at the last common location on the waveform;g) comparing calibration ...

AUTOMATIC PROBE GROUND CONNECTION CHECKING TECHNIQUES

A test system can include a probe suitable to be coupled between a test measurement device and a device under test (DUT). The probe can include a signal input to receive an active signal from the DUT and a signal output to provide the active signal to the test measurement device. The probe can also include an input ground to connect to the DUT ground and an output ground to connect to the test measurement device ground. A probe ground connection checking device can automatically determine whether the probe ground connections to the DUT ground and test measurement device ground are solid. 1. A test system , comprising: a signal input configured to electrically receive an active signal from the DUT;', 'a signal output configured to electrically provide the active signal to the test measurement device;', 'an input ground configured to electrically connect to a ground of the DUT; and', 'an output ground configured to electrically connect to a ground of the test measurement device; and, 'a probe suitable to be coupled between a test measurement device and a device under test (DUT), said probe comprisinga probe ground connection checking device configured to automatically determine whether a suitable ground connection exists between said probe input ground and said DUT ground.2. The test system of claim 1 , wherein said test measurement device comprises an oscilloscope.3. The test system of claim 1 , wherein said probe ground connection checking device is configured to determine whether a sufficiently low impedance exists from said probe input ground through said DUT ground claim 1 , an auxiliary ground connection from said DUT ground to said test measurement device ground claim 1 , and back to said probe output ground.4. The test system of claim 1 , further comprising an alert mechanism configured to provide a user with an alert responsive to a determination that there is no suitable ground connection between said probe input ground and said DUT ground.5. The test system ...

SIGNAL ACQUISITION SYSTEM HAVING REDUCED PROBE LOADING OF A DEVICE UNDER TEST

A signal acquisition system has a signal acquisition probe having probe tip circuitry coupled to a resistive center conductor signal cable. The resistive center conductor signal cable of the signal acquisition probe is coupled to a compensation system in a signal processing instrument via an input node and input circuitry in the signal processing instrument. The signal acquisition probe and the signal processing instrument have mismatched time constants at the input node with the compensation system providing pole-zero pairs for maintaining flatness over the signal acquisition system frequency bandwidth.

Signal acquisition system having reduced probe loading of a device under test

A signal acquisition system has a signal acquisition probe having probe tip circuitry coupled to a resistive center conductor signal cable. The resistive center conductor signal cable of the signal acquisition probe is coupled to a compensation system in a signal processing instrument via an input node and input circuitry in the signal processing instrument. The signal acquisition probe and the signal processing instrument have mismatched time constants at the input node with the compensation system having an input amplifier with feedback loop circuitry and a shunt pole-zero pair coupled to the input circuitry providing pole-zero pairs for maintaining flatness over the signal acquisition system frequency bandwidth.

Wide bandwidth attenuator input circuit for a measurement probe

Removable probing tip for a Messondiersystem

信号取込みシステム及びその校正処理方法

【課題】プローブ時に、被測定デバイスの負荷を減少させる。 【解決手段】信号取込みシステムには、抵抗性中心導体信号ケーブル２０２に結合されたプローブ・チップ回路２０６を有する信号取込みプローブ１０５がある。信号取込みプローブ１０５の抵抗性中心導体信号ケーブル２０２は、信号処理装置１１５中の入力ノード及び入力回路を介して、信号処理装置中の補償システム２２５に結合される。信号取込みプローブ１０５及び信号処理装置１１５は、入力ノード２０４においては時定数がミスマッチしているが、補償システム２２５がフィードバック・ループ回路２４０のある入力増幅回路２３２及び補償デジタル・フィルタ２５６を有し、信号取込みシステム１１５の周波数帯域幅に渡ってフラットを維持するための極−零点対を提供する。 【選択図】図６

プローブ及びスキュー補正方法

【課題】差動信号の２つ側の間のスキューを除去するためにプローブ内の遅延を調整する。 【解決手段】プローブ１００は、第１入力信号を受ける第１入力端１０２、第２入力信号を受ける第２入力端１０４、第１入力端１０２に接続された第１ケーブル１１２、第２入力端１０４に接続された第２ケーブル１１４、第１ケーブルに接続された電気的に調整可能な遅延器１１６を有する。調整可能な遅延器は、第１入力信号を遅延して第１及び第２入力信号間のスキューを除去する。増幅器１２０は、第２入力信号及び調整可能な遅延器１１６からの第１入力信号を受ける。種々の方法に基づいてスキュー量を求める。 【選択図】図１

Probe with printed tip

The probe with printed tip consists of a substrate having a plurality of probe tips connected to its end edge, a plurality of test paths, each connected to one of the probe tips and extending along the substrate, and at least one of the test paths including an electrical component adjacent to the test path's probe tip. The electrical component may be a resistor. The probe tips may have a width equal to the thickness of the substrate. The probe tips may consist of a plurality of probe tip layers. The invention also includes a method of probing signals transmitted over target transmission lines on a target board. The disclosure also includes a method of manufacturing the claimed invention.

Signal acquisition system having a compensation digital filter

A signal acquisition system (50) has a signal acquisition probe (52) having probe tip circuitry coupled to a resistive center conductor signal cable (54). The resistive center conductor signal cable is coupled to a compensation system (68) in a signal processing instrument via an input node and input circuitry in the signal processing instrument. The signal acquisition probe and the signal processing instrument have mismatched time constants at the input node with the compensation system having an input amplifier with feedback loop circuitry and a compensation digital filter providing pole-zero pairs for maintaining flatness over the signal acquisition system frequency bandwidth.

Attachable/detachable probing tip system for a measurement probing system