POWER MODULE INCLUDING HEAT SINK

A power module according to an embodiment of the present invention includes a chip assembly including at least one power semiconductor chip, a coupling part spaced apart from the chip assembly by a predetermined distance, a chip assembly receiving part including the chip assembly and the coupling part, a first heat sink formed on the upper side of the chip assembly receiving part, and a cover coupled to the upper side of the first heat sink and forming a first flow path between the first heat sink and the cover. The first heat sink includes a first plate in contact with the upper side of the chip assembly, and a plurality of pins formed on a position of the first plate in contact with the chip assembly, wherein the plurality of pins have different heights. Accordingly, the present invention can prevent the outline part of the chip assembly from being damaged or broken. COPYRIGHT KIPO 2018 ...