17-06-2015 дата публикации
Номер: CN104717841A
Принадлежит:
The invention belongs to the field of circuit board manufacturing, and provides a circuit board preparation method and a circuit board. The circuit board preparation method comprises the steps of base providing, silk-screen printing and the like. According to the circuit board preparation method, copper paste is printed to a substrate through silk-screen printing, solidifying, development, etching and other steps in an existing preparation technology are omitted, equipment, raw materials and labor are saved, the production cost is greatly lowered, meanwhile, dust will not fall down from the printed circuit board or the printed circuit board will not be disengaged by selecting the specific copper paste, the resistance is low, and the circuit board is suitable for being used in modern electronic industry. Dust will not fall down from the circuit board, and the circuit board is not disengaged, and is low in resistance and suitable for being used in the modern electronic industry.
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