02-06-2023 дата публикации
Номер: CN116197812A
Принадлежит:
The invention relates to the technical field of wafer grinding, and provides wafer grinding equipment which comprises a lower pedestal, a servo motor, a grinding table and an upper pedestal. A wafer grinding machine body is mounted on the upper pedestal, a supporting table is fixedly mounted on the surface of the lower pedestal, and a mounting groove is formed in the supporting table; the servo motor is fixedly mounted in the mounting groove, and the output end of the servo motor is fixedly connected with a connecting supporting rod. The grinding table is fixedly installed on the top of the supporting table, a rotating table is rotatably installed in the grinding table, and a plurality of positioning blocks are arranged on the rotating table in a sliding mode. A user can adjust the rotation degree of the rotating table by controlling the servo motor to adjust the tightening degree of the positioning block, so that the device can be suitable for clamping wafers of various sizes, the lifting ...
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