Nylon MXD6 based biaxially stretched polyamide film of low permeability to gases and production method thereof

Fuel-barrier polyamide resin and multilayer shaped article

MOLDED ARTICLE

Polyamide resin composition

Polyamide Resin Composition

Fuel-barrier polyamide resin and multilayer shaped article

Biaxially stretched film and production method thereof

POLYAMIDE RESIN COMPOSITION

POLYAMIDE RESIN COMPOSITION

MOLDED ARTICLE

STORAGE METHOD

A storage method of storing a package with its contents under irradiation of light. At least part of the package is made of polyamide (A) which is obtained by polycondensation of a diamine component comprising 70 mol % or more of m-xylylenediamine and a dicarboxylic acid component comprising 70 mol % or more of α,ω-linear aliphatic dicarboxylic acid having 4 to 20 carbon atoms. The oxygen transmission of the package including polyamide (A) is reduced by irradiation of light, to prevent the spoilage of the contents. 1. A storage method comprising:placing a product to be stored in a package, andstoring the package containing the product under irradiation of light, thereby reducing an oxygen transmission of the package,at least part of the package comprising polyamide (A) which is obtained by polycondensation of a diamine component comprising 70 mol % or more of m-xylylenediamine and a dicarboxylic acid component comprising 70 mol % or more of α,ω-linear aliphatic dicarboxylic acid having 4 to 20 carbon atoms.2. The storage method according to claim 1 , wherein:the package comprises 0.1 to 100% by weight of polyamide (A),an average thickness of the package is 10 to 3000 μm, andthe oxygen transmission of the package after irradiation of light having a wavelength of 10 to 1000 nm at an illuminance of 100 to 10000 lux for 24 h is 1 to 75% of the oxygen transmission before irradiation. The present invention relates to a method of storing food, drink, chemicals, electronic parts, and other products.To protect the contents for distribution, cold storage, treatment, such as heat treatment for sterilization, the packaging material used for packaging food and drink is required to have various functions, for example, high transparency for ensuring outside view of the contents, etc. in addition to mechanical properties, such as strength, resistance to cracking, and heat resistance. Recently, oxygen barrier properties for preventing oxygen from penetrating into the package to ...

POLYAMIDE RESIN COMPOSITION AND MOLDED PRODUCT

Disclosed is an m-xylene group-containing polyamide resin composition having excellent gas barrier properties and heat aging resistance, which contains (A) a polyamide composed of a diamine unit containing 30% by mole or more of an m-xylylenediamine unit and a dicarboxylic acid unit and (B) an aromatic secondary amine based compound and has an oxygen permeability coefficient of not more than 1 cc·mm/m·day·atm at 23° C. and 75% RH. 1. A polyamide resin composition , comprising(A) a polyamide comprising a diamine unit, comprising 30% by mole or more of an m-xylylenediamine unit, and a dicarboxylic acid unit, and(B) an aromatic, secondary-amine-based compound,{'sup': '2', 'wherein the polyamide resin composition has an oxygen permeability coefficient of not more than 1 cc·mm/m·day·atm at 23° C. and 75% RH.'}2. The polyamide resin composition of claim 1 , further comprising(C) an organic, sulfur-based compound.3. The polyamide resin composition of claim 2 , wherein a content ratio of the aromatic claim 2 , secondary-amine-based compound (B) and the organic claim 2 , sulfur-based compound (C) ((B)/(C) mass ratio) in the polyamide resin composition is from 0.05 to 15.4. The polyamide resin composition of claim 1 , wherein the diamine unit comprises 50% by mole or more of the m-xylylenediamine unit.5. The polyamide resin composition of claim 1 , wherein the diamine unit comprises 70% by mole or more of the m-xylylenediamine unit.6. The polyamide resin composition of claim 1 , wherein the diamine unit comprises the m-xylylenediamine unit and a p-xylylenediamine unit.7. The polyamide resin composition of claim 1 , whereinthe diamine unit comprises the m-xylylenediamine unit and a p-xylylenediamine unit, anda proportion of the m-xylylenediamine unit in the diamine unit is 30% by mole or more.8. The polyamide resin composition of claim 1 , wherein the dicarboxylic acid unit comprises 50% by mole or more of an α claim 1 ,ω-linear aliphatic dicarboxylic acid unit having from 4 ...

POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE

Disclosed is a polyamide resin composition having excellent gas barrier properties and heat aging resistance, which contains (A) a polyamide composed of a diamine unit containing a 1,3-bis(aminomethyl)cyclohexane unit and a dicarboxylic unit and at least either of (B) an aromatic secondary amine based compound and (D) a phenol based antioxidant and has an oxygen permeability coefficient of not more than 1.5 cc·mm/m·day·atm at 23° C. and 75% RH. 1. A polyamide resin composition , comprising:(A) a polyamide comprising (a1) a diamine unit comprising a 1,3-bis(aminomethyl)cyclohexane unit and (a2) a dicarboxylic acid unit andat least one selected from the group consisting of(B) an aromatic secondary amine compound and(D) a phenolic antioxidant,{'sup': '2', 'wherein the composition has an oxygen permeability coefficient of not more than 1.5 cc·mm/m·day·atm at 23° C. and 75% RH.'}2. The composition of claim 1 , further comprising:(C) an organic sulfur compound.3. The composition of claim 2 , wherein a content ratio of the aromatic secondary amine compound (B) to the organic sulfur compound (C) claim 2 , (B)/(C) mass ratio claim 2 , in the composition is from 0.5 to 10.0.4. The composition of claim 2 , wherein a content ratio of the phenolic antioxidant (D) to the organic sulfur based compound (C) (D)/(C) mass ratio claim 2 , in the composition is from 0.5 to 10.0.5. The composition of claim 1 , wherein the diamine unit (a1) comprises 30% by mole or more of a 1 claim 1 ,3-bis(aminomethyl)cyclohexane unit.6. The composition of claim 1 , wherein the diamine unit (a1) comprises contains 50% by mole or more of a 1 claim 1 ,3-bis(aminomethyl)cyclohexane unit.7. The composition of claim 1 , wherein the dicarboxylic acid unit (a2) comprises 50% by mole or more of an α claim 1 ,ω-linear aliphatic dicarboxylic acid unit comprising from 4 to 20 carbon atoms.8. The composition of claim 7 , wherein the dicarboxylic acid unit (a2) comprises an adipic acid unit.9. The composition of ...

POLYAMIDE RESIN COMPOSITION

A polyamide resin composition contains a resin component containing at least a polyamide, a fatty acid metallic salt having from 10 to 50 carbon atoms, and an additive. The polyamide is obtained through melt polycondensation of a diamine component containing 70% by mol or more of m-xylylenediamine and a dicarboxylic acid component containing 70% by mol or more of an α,ω-linear aliphatic dicarboxylic acid. The additive is at least one compound selected from the group consisting of a diamide compound obtained from a fatty acid having from 8 to 30 carbon atoms and a diamine having from 2 to 10 carbon atoms, a diester compound obtained from a fatty acid having from 8 to 30 carbon atoms and a diol having from 2 to 10 carbon atoms, and a surfactant. 1. A polyamide resin composition comprising:a resin component containing a polyamide (X) obtained through melt polycondensation of a diamine component containing 70% by mol or more of m-xylylenediamine and a dicarboxylic acid component containing 70% by mol or more of an α,ω-linear aliphatic dicarboxylic acid,a fatty acid metallic salt having from 10 to 50 carbon atoms, andan additive (A),wherein the additive (A) is at least one compound selected from the group consisting of a diamide compound obtained from a fatty acid having from 8 to 30 carbon atoms and a diamine having from 2 to 10 carbon atoms, a diester compound obtained from a fatty acid having from 8 to 30 carbon atoms and a diol having from 2 to 10 carbon atoms, and a surfactant.2. The polyamide resin composition as claimed in claim 1 , wherein the polyamide (X) is a polyamide obtained through polycondensation of a diamine component containing 70% by mol or more of m-xylylenediamine and a dicarboxylic acid component containing 70% by mol or more of an α claim 1 ,ω-linear aliphatic dicarboxylic acid having from 4 to 20 carbon atoms and from 1 to 20% by mol of isophthalic acid.3. The polyamide resin composition as claimed in claim 1 , wherein the composition comprises ...

Polyamide resin-type composite material and method of producing same

A xylylenediamine-based polyamide resin/fiber composite material and molding are provided that do not exhibit a decline in properties under high temperatures and high humidities, and that exhibit a high elastic modulus and present little warping, and exhibit better recycle characteristics, a better moldability, and a better productivity than for thermosetting resins. The polyamide resin-type composite material comprises a fibrous material (B) impregnated with a polyamide resin (A) wherein at least 50 mole % of diamine structural units derived from xylylenediamine, and having a number-average molecular weight (Mn) of 6,000 to 30,000, and containing a component of a molecular weight of not more than 1,000 at 0.5 to 5 mass %.

POLYAMIDE RESIN COMPOSITION

The present invention relates to a polyamide resin composition comprising polyamide (X) comprising a diamine unit containing 70 mol % or more of a metaxylylenediamine unit and a dicarboxylic acid unit and an alkali compound (A), wherein the following equations (1) to (4) are satisfied: 1. A polyamide resin composition; comprising:a polyamide (X) comprising a diamine unit comprising 70 mol % or more of a metaxylylenediamine unit and a dicarboxylic acid unit; andan alkali compound (A), [{'br': None, 'sub': '2', '10≦([COOH]—[NH])≦80\u2003\u2003(1)'}, {'br': None, '0 32≦P<6.46\u2003\u2003(2)'}, {'br': None, '0.50 Подробнее

POLYAMIDE RESIN COMPOSITION

The present invention relates to a polyamide resin composition comprising polyamide (X) comprising a diamine unit containing 70 mol % or more of a metaxylylenediamine unit and a dicarboxylic acid unit and an alkali compound (A), wherein the following equations (1) to (3) are satisfied: 1. A polyamide resin composition comprising a polyamide (X) comprising a diamine unit comprising 70 mol % or more of a metaxylylenediamine unit and a dicarboxylic acid unit and an alkali compound (A) , wherein the following equations (1) to (3) are satisfied:{'br': None, 'i': 'P<', '0.03≦0.32\u2003\u2003(1);'}{'br': None, 'i': 'M≦', '2.2≦26.1\u2003\u2003(2); and'}{'br': None, 'i': 'M/P≦', '5<200\u2003\u2003(3),'}wherein:P represents a mole concentration (μmol/g) of a phosphorus atom contained per g of the polyamide resin composition; andM represents a sum (μmol/g) of values obtained by multiplying a mole concentration of an alkali metal atom and a mole concentration of an alkaline earth metal atom each contained per g of the polyamide resin composition by valencies thereof respectively.2. The polyamide resin composition according to claim 1 , wherein the alkali compound (A) is a carboxylate having 10 or less carbon atoms of an alkali metal.3. The polyamide resin composition according to claim 1 , wherein the polyamide (X) is polyamide comprising a diamine unit comprising 70 mol % or more of a metaxylylenediamine unit and a dicarboxylic acid unit comprising 70 mol % or more of an adipic acid unit.4. The polyamide resin composition according to claim 1 , wherein the polyamide (X) is polyamide comprising a diamine unit comprising 70 mol % or more of a metaxylylenediamine unit and a dicarboxylic acid unit comprising 70 to 99 mol % of an adipic acid unit and 1 to 30 mol % of an isophthalic acid unit.5. The polyamide resin composition according to claim 1 , wherein the polyamide (X) is polyamide comprising a diamine unit comprising 70 mol % or more of a metaxylylenediamine unit and a ...

POLYAMIDE RESIN

Provided is a polyamide resin having excellent color tone and elastic modulus, excellent gas barrier properties and low water absorption. The polyamide resin comprises a diamine structural unit and a dicarboxylic acid structural unit, wherein 70 mol % or more of the diamine structural unit is derived from xylylenediamine (A-1) and/or bis(aminomethyl)cyclohexane (A-2) and 50 mol % or more of the dicarboxylic acid structural unit is derived from sebacic acid (B), characterized in that it has a sulfur atom concentration of 1 to 200 ppm by mass. 1. A polyamide resin material comprising:a diamine structural unit; anda dicarboxylic acid structural unit,wherein 70 mol % or more of the diamine structural unit is derived from xylylenediamine (A-1) and/or bis(aminomethyl)cyclohexane (A-2), 50 mol % or more of the dicarboxylic acid structural unit is derived from sebacic acid (B), a sulfur atom concentration is 1 to 200 ppm by mass, and a sodium atom concentration is 1 to 500 ppm by mass.2. The polyamide resin material according to claim 1 , which has a phosphorus atom concentration of 1 to 500 ppm by mass.3. (canceled)4. The polyamide resin material according to claim 1 , wherein the xylylenediamine (A-1) is m-xylylenediamine claim 1 , p-xylylenediamine or a mixture thereof.5. The polyamide resin material according to claim 1 , wherein the bis(aminomethyl)cyclohexane (A-2) is 1 claim 1 ,4-bis(aminomethyl)cyclohexane claim 1 , 1 claim 1 ,3-bis(aminomethyl)cyclohexane or a mixture thereof.6. The polyamide resin material according to claim 1 , wherein the dicarboxylic acid structural unit is derived from sebacic acid (B).7. The polyamide resin material according to claim 1 , which has a number average molecular weight of 10 claim 1 ,000 to 50 claim 1 ,000.8. The polyamide resin material according to claim 1 , wherein the reaction molar ratio of the diamine component to the dicarboxylic acid component represented by the following equation (1) is 0.98 to 1.1;{'br': None, 'i': r', ...

POLYAMIDE RESIN COMPOSITIONS

[Problems] 1. A polyamide resin composition , comprising:a polyamide resin (A) comprising a diamine structural unit and a dicarboxylic acid structural unit, and 1 to 40 parts by mass of a copolyamide (B),wherein 70 mol % of the diamine structural unit is derived from xylylenediamine and50 mol % of the dicarboxylic acid structural unit is derived from sebacic acid; andthe copolyamide (B) is selected from the group consisting of (B-1)-(B-3) per 100 parts by mass of the polyamide resin (A);(B-1) is a copolyamide 6/66/12;(B-2) is a copolyamide 6/66/11; and(B-3) is a polyether-polyamide copolymer comprising 12 units of a polyamide or 11 units of a polyamide and one unit of a polyether.2. The polyamide resin composition of claim 1 , wherein the xylylene diamine is m-xylylenediamine claim 1 , p-xylylenediamine claim 1 , or a mixture thereof.3. The polyamide resin composition of claim 1 , wherein the polyamide resin is a polyamide resin obtained by a process comprising polycondensing m-xylylenediamine claim 1 , p-xylylenediamine claim 1 , or a mixture thereof with sebacic acid.4. The polyamide resin composition of claim 1 , further comprising 0.1 to 2 parts by mass of a carbodiimide compound (C) per 100 parts by mass of the polyamide resin (A).5. The polyamide resin composition of claim 4 , wherein the carbodiimide compound (C) is an aliphatic or alicyclic polycarbodiimide compound.6. The polyamide resin composition of claim 1 , further comprising 0.01 to 1 parts by mass of a stabilizer (D) per 100 parts by mass of the polyamide resin (A).7. The polyamide resin composition of claim 6 , wherein the stabilizer (D) is selected from the group consisting of an inorganic stabilizer claim 6 , a secondary aromatic amine stabilizer claim 6 , and an organic sulfur stabilizer.8. The polyamide resin composition of claim 1 , wherein the polyamide resin composition is suitable for a film with a tensile modulus of elasticity (E) of from 70 to 97% of a tensile modulus of elasticity (E) of ...

MULTILAYERED CONTAINER, DIE FOR MULTILAYERED CONTAINER, AND METHOD FOR PRODUCING MULTILAYERED CONTAINER

Provided is a multi-layer container excellent in delamination resistance and gas barrier property, which can be manufactured without employing any molding method involving a special apparatus, which increases a production cost, and a complicated step. Specifically, the multi-layer container includes a laminate structure of three or more layers having at least a gas barrier layer between an innermost layer and an outermost layer, in which the gas barrier layer in a site formed of the laminate structure has a portion having a thickness 0.01 to 0.9 times as large as the maximum thickness of the gas barrier layer. Further, provided are a mold suitable for manufacturing the multi-layer container, and a manufacturing method for a multi-layer container using the mold. 1. A multi-layer container , comprising a laminate structure of three or more layers having at least a gas barrier layer between an innermost layer and an outermost layer , whereinthe gas barrier layer in a site formed of the laminate structure has a portion having a thickness 0.01 to 0.9 times as large as a maximum thickness of the gas barrier layer.2. The multi-layer container according to claim 1 , wherein a mass of the site formed of the laminate structure equals 30 mass % or more of a mass of an entire multi-layer container.3. The multi-layer container according to claim 1 , wherein the laminate structure comprises a laminate structure of three layers or five layers.4. The multi-layer container according to claim 1 , wherein the gas barrier layer is formed of at least one component selected from the group consisting of a polyamide resin claim 1 , an ethylene-vinyl acetate copolymer resin claim 1 , a polyacrylonitrile resin claim 1 , a polyvinylidene chloride resin claim 1 , and a polyglycolic acid.5. The multi-layer container according to claim 4 , wherein the gas barrier layer is formed of at least one polyamide resin comprising a m-xylylene group-containing polyamide resin.6. The multi-layer container ...

REACTIVE POLYAMIDE RESINS AND POLYAMIDE RESIN COMPOSITIONS

Provided is a polyamide resin composition comprising an elastomer etc, and a reactive polyamide resin excellent in reactivity. The polyamide resin composition comprises 0.5 to 100 parts by mass of an elastomer per 100 parts by mass of a reactive polyamide resin, wherein the reactive polyamide resin obtained by polycondensing a diamine (A) containing 70 mol % or more of a diamine structural unit derived from xylylenediamine and a dicarboxylic acid (B) containing 50 mol % or more of a dicarboxylic acid structural unit derived from sebacic acid, and has a concentration of reactive functional groups of 100 μeq/g or more and a molar ratio of reacted diamine to reacted dicarboxylic acid (the number of moles of reacted diamine/the number of moles of reacted dicarboxylic acid) of 1.0 or more. 1. A reactive polyamide resin obtained by polycondensing:(A) a diamine comprising 70 mol % or more of a diamine structural unit derived from a xylylenediamine; and(B) a dicarboxylic acid comprising 50 mol % or more of a dicarboxylic acid structural unit derived from sebacic acid,wherein:the reactive polyamide resin has a concentration of reactive functional groups of 100 μeq/g or more;the reactive polyamide resin has a molar ratio of reacted diamine to reacted dicarboxylic acid (the number of moles of reacted diamine/the number of moles of reacted dicarboxylic acid) of 1.0 or more; andthe reactive functional groups are a carboxylic group, an amino group, or both.2. The reactive polyamide resin according to claim 1 , wherein the reactive functional groups are located at ends of the polyamide resin.3. (canceled)4. The reactive polyamide resin according to claim 1 , which has an amino group concentration of 50 μeq/g or more.5. The reactive polyamide resin according to claim 1 , which has a number average molecular weight of 20 claim 1 ,000 or less.6. The reactive polyamide resin according to claim 1 , wherein the xylylenediamine is m-xylylenediamine or p-xylylenediamine.7. The reactive ...

POLYAMIDE RESIN MOLDINGS

Provided is a xylylenesebacamide resin molding which is excellent in mechanical strength such as elastic modulus and avoids the problem of mechanical strength loss during long-term use. This is a molding of a polyamide resin or a polyamide resin composition containing the polyamide resin, wherein 70 mol % or more of the diamine structural unit is derived from xylylenediamine (A) and 50 mol % or more of the dicarboxylic acid structural unit is derived from sebacic acid (B), and the molding has a crystallinity index of 0 to 50% and a moisture content of 0.1 to 2% by mass. 1. A polyamide resin molding , which is formed from a polyamide resin comprising a diamine structural unit and a dicarboxylic acid structural unit or a polyamide resin composition containing the polyamide resin ,wherein 70 mol % or more of the diamine structural unit is derived from xylylenediamine (A) and 50 mol % or more of the dicarboxylic acid structural unit is derived from sebacic acid (B), and which has a crystallinity index of 0 to 50% and a moisture content of 0.1 to 2% by mass.2. The polyamide resin molding according to claim 1 , wherein xylylenediamine (A) is m-xylylenediamine claim 1 , p-xylylenediamine or a mixture thereof.3. The polyamide resin molding according to claim 1 , wherein the polyamide resin has a number average molecular weight of 8 claim 1 ,000 to 50 claim 1 ,000.4. The polyamide resin molding according to claim 1 , wherein the polyamide resin composition contains 0.1 to 2 parts by mass of a carbodiimide compound (C) per 100 parts by mass of the polyamide resin.5. The polyamide resin molding according to claim 1 , which is a film claim 1 , sheet claim 1 , thread claim 1 , tube or injection-molded article.6. The polyamide resin molding according to claim 1 , which is formed in such a manner that an inlet temperature (Tin) and an outlet temperature (Tout) of a cylinder in which the polyamide resin or polyamide resin composition containing the polyamide resin is melted satisfy ...

POLYAMIDE RESINS AND PROCESSES FOR MOLDING THEM

Provided is a polyamide resin having high heat resistance, excellent moldability and excellent mechanical properties. The polyamide resin comprises a diamine unit containing 70 mol % or more of a xylylenediamine unit and a dicarboxylic acid unit containing 70 mol % or more of a straight chain aliphatic dicarboxylic acid unit, wherein the xylylenediamine unit is composed of 50 to 95 mol % of p-xylylenediamine and 50 to 5 mol % of m-xylylenediamine; the straight chain aliphatic dicarboxylic acid unit is composed of 50 to 100 mol % of adipic acid and 0 to less than 50 mol % of sebacic acid or other straight chain aliphatic dicarboxylic acids; the molar ratio of reacted diamine units to reacted dicarboxylic acid units (the number of moles of reacted diamine units/the number of moles of reacted dicarboxylic acid units) is less than 0.994; and the polyamide resin has a number average molecular weight of 10,000 to 25,000 and a melting point of 285° C. or more. 1. A polyamide resin comprising a diamine unit containing 70 mol % or more of a xylylenediamine unit and a dicarboxylic acid unit containing 70 mol % or more of a straight chain aliphatic dicarboxylic acid unit ,wherein the xylylenediamine unit is composed of 50 to 95 mol % of p-xylylenediamine and 50 to 5 mol % of m-xylylenediamine;the straight chain aliphatic dicarboxylic acid unit is composed of 50 to 100 mol % of adipic acid and 0 to less than 50 mol % of sebacic acid or other straight chain aliphatic dicarboxylic acids;the molar ratio of reacted diamine units to reacted dicarboxylic acid units (the number of moles of reacted diamine units/the number of moles of reacted dicarboxylic acid units) is less than 0.994; andthe polyamide resin has a number average molecular weight of 10,000 to 25,000 and a melting point of 285° C. or more.2. The polyamide resin according to claim 1 , which has a terminal amino group concentration of 10 to 100 μeg/g.3. The polyamide resin according to claim 1 , which has a terminal ...

POLYAMIDE RESIN FILMS AND PROCESSES FOR MANUFACTURING THEM

Provided is a windable thin single layer film comprising a xylylenediamine-based polyamide resin. 1. A polyamide resin film comprising:a polyamide resin which is a polycondensate of a diamine and a dicarboxylic acid,wherein the diamine comprises 70 mol % or more of xylylenediamine, and the polyamide resin film has a thickness of 10 to 50 μm and a surface having a texture.2. The polyamide resin film according to claim 1 ,wherein the polyamide resin film has the texture formed by texturing a surface of a film comprising the polyamide resin with a plurality of texturing rolls comprising a first roll and a second roll positioned opposite to the first roll, and the first roll is positioned such that the film contacts with the first roll after the film is extruded from an extrusion die.3. The polyamide resin film according to claim 1 , wherein the polyamide resin film has a surface roughness of 0.01 to 1 μm.4. The polyamide resin film according to claim 1 , wherein the xylylenediamine is m-xylylenediamine claim 1 , p-xylylenediamine or a mixture of m-xylylenediamine and p-xylylenediamine.5. The polyamide resin film according to claim 1 , wherein the dicarboxylic acid is a dicarboxylic acid comprising 50 mol % or more of a straight chain aliphatic α claim 1 ,ω-dicarboxylic acid having 4 to 20 carbon atoms.6. The polyamide resin film according to claim 1 , wherein the dicarboxylic acid is a dicarboxylic acid comprising 70 mol % or more of a straight chain aliphatic α claim 1 ,ω-dicarboxylic acid having 4 to 20 carbon atoms and 1 mol % or more and less than 30 mol % of isophthalic acid.7. The polyamide resin film according to claim 1 , wherein the dicarboxylic acid is adipic acid claim 1 , sebacic acid or a combination thereof.8. The polyamide resin film according to claim 1 , wherein the polyamide resin is a poly(m-xylylene sebacamide) resin claim 1 , a poly(p-xylylene sebacamide) resin or a poly(m-xylylene/p-xylylene sebacamide) copolymer resin.9. The polyamide resin film ...

FIBER FABRIC AND MOLDED ARTICLE OBTAINABLE BY MOLDING FIBER FABRIC

Provided is a fiber fabric excellent in high mechanical strength and shapability. The fiber fabric comprising warps and wefts: wherein either one of the warps and the wefts is configured by a polyamide resin fiber composed of a polyamide resin composition, and the other is configured by a continuous carbon fiber; in an arbitrary square area of the fiber fabric, one side of the arbitrary square area is aligned in parallel to the warps, and other one side of the arbitrary square area is aligned in parallel to the wefts, the continuous carbon fiber has an average length 1.1 to 1.6 times longer than the length of a side of the square; the polyamide resin composition contains a polyamide resin in which 50% by mole or more of diamine structural units thereof is derived from xylylenediamine; and wherein the polyamide resin has a number-average molecular weight (Mn) of 6,000 to 30,000, and 0.5 to 5% by mass of the polyamide resin has a molecular weight of 1,000 or smaller. 1. A fiber fabric comprising warps and wefts: in an arbitrary square area of the fiber fabric, one side of the arbitrary square area is aligned in parallel to the warps, and other one side of the arbitrary square area is aligned in parallel to the wefts, the continuous carbon fiber has an average length 1.1 to 1.6 times longer than the length of a side of the square;', 'the polyamide resin composition contains a polyamide resin in which 50% by mole or more of diamine structural units thereof is derived from xylylenediamine; and, 'wherein either one of the warps and the wefts is configured by a polyamide resin fiber composed of a polyamide resin composition, and the other is configured by a continuous carbon fiber;'}wherein the polyamide resin has a number-average molecular weight (Mn) of 6,000 to 30,000, and 0.5 to 5% by mass of the polyamide resin has a molecular weight of 1,000 or smaller.2. The fiber fabric of claim 1 , wherein the polyamide resin fiber has an average length 1.0 to 1.6 times longer ...

COMMINGLED YARNS, WEAVE FABRIC, KNITTED FABRICS, COMPOSITE MATERIALS, AND PROCESSES FOR PREPARING THE COMPOSITE MATERIALS

Provided is commingled yarn excellent in strength. The commingled yarn comprises a continuous thermoplastic resin fiber and a continuous reinforcing fiber as fiber components, which has twist. 1. A commingled yarn comprising a continuous thermoplastic resin fiber and a continuous reinforcing fiber as fiber components , which has twist.2. The commingled yarn according to claim 1 , wherein the continuous thermoplastic resin fiber is a polyamide resin fiber.3. The commingled yarn according to claim 1 , wherein the continuous thermoplastic resin fiber comprises at least one kind selected from polyamide 6 claim 1 , polyamide 66 and a xylylenediamine-based polyamide.4. The commingled yarn according to claim 1 , wherein the continuous reinforcing fiber is a carbon fiber and/or a glass fiber.5. (canceled)6. (canceled)7. (canceled)8. (canceled)9. (canceled)10. The commingled yarn according to claim 2 , wherein the continuous thermoplastic resin fiber comprises at least one kind selected from polyamide 6 claim 2 , polyamide 66 and a xylylenediamine-based polyamide.11. The commingled yarn according to claim 2 , wherein the continuous reinforcing fiber is a carbon fiber and/or a glass fiber.12. The commingled yarn according to claim 3 , wherein the continuous reinforcing fiber is a carbon fiber and/or a glass fiber.13. A weave fabric using a commingled yarn according to .14. A weave fabric using a commingled yarn according to .15. A weave fabric using a commingled yarn according to .16. A knitted fabric using a commingled yarn according to .17. A knitted fabric using a commingled yarn according to .18. A knitted fabric using a commingled yarn according to .19. A composite material obtainable by thermally processing a commingled yarn according to .20. A composite material obtainable by thermally processing a commingled yarn according to .21. A composite material obtainable by thermally processing a commingled yarn according to .22. A composite material obtainable by thermally ...

POLYESTER-BASED RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND MOLDING USING RESIN COMPOSITION

The present invention provides a polyester-based resin composition containing: a resin component which contains 80 to 98 mass % of polyester resin (A) including aromatic dicarboxylic acid units and diol units, and 20 to 2 mass % of polyamide resin (B) including diamine units and dicarboxylic acid units, the diamine units containing 70 mol % or more m-xylylenediamine units and the dicarboxylic acid units containing 70 mol % or more α,ω-aliphatic dicarboxylic acid units; and 0.005 to 0.1 parts by mass of a specific epoxy-functional polymer (C) with respect to 100 parts by mass of the resin component. 3. The polyester-based resin composition according to claim 1 , wherein the polyester resin (A) includes aromatic dicarboxylic acid units containing 70 mol % or more terephthalic acid units claim 1 , and diol units containing 70 mol % or more aliphatic glycol units having carbon atoms of 2 to 4.4. The polyester-based resin composition according to claim 1 , wherein the polyester resin (A) includes 0.01 to 2 mol % of metal sulfoisophthalate units in the aromatic dicarboxylic acid units.5. The polyester-based resin composition according to claim 1 , wherein Rin formula (c2) is a hydrogen atom or a methyl group.6. The polyester-based resin composition according to claim 2 , wherein Rin formula (c3) is a hydrogen atom or a methyl group.7. The polyester-based resin composition according to claim 2 , wherein Rin formula (c3) is a methyl group.8. A method for producing a polyester-based resin composition as recited in claim 1 , the method comprising the following steps 1 and 2 claim 1 , wherein:step 1: melt-kneading 100 parts by mass of polyester resin (A) including aromatic dicarboxylic acid units and diol units, with 10 to 40 parts by mass of epoxy-functional polymer (C), to thereby prepare a master batch (X); andstep 2: melt-kneading 100 parts by mass of a resin component which contains 80 to 98 mass % of polyester resin (A) including aromatic dicarboxylic acid units and diol ...

COMPOSITE FIBERS, WEAVE FABRICS, KNITTED FABRICS AND COMPOSITE MATERIALS

Provided is a composite fiber in which a polyamide resin fiber and a continuous reinforcing fiber are dispersed. A composite fiber comprising (A) a polyamide resin fiber made from a polyamide resin composition, (B) a continuous reinforcing fiber, and (a) a treating agent for the polyamide resin fiber (A); wherein an amount of the treating agent (a) is 0.1 to 2.0% by mass of the polyamide resin fiber (A); and the polyamide resin composition comprises a polyamide resin containing a diamine structural unit, 50 mol % or more of which is derived from xylylenediamine, and having a number average molecular weight (Mn) of 6,000 to 30,000; and 0.5 to 5% by mass of the polyamide resin has a molecular weight of 1,000 or less. 1. A composite fiber comprising (A) a polyamide resin fiber made from a polyamide resin composition , (B) a continuous reinforcing fiber , and (a) a treating agent for the polyamide resin fiber (A); wherein an amount of the treating agent (a) is 0.1 to 2.0% by mass of the polyamide resin fiber (A); andthe polyamide resin composition comprises a polyamide resin containing a diamine structural unit, 50 mol % or more of which is derived from xylylenediamine, and having a number average molecular weight (Mn) of 6,000 to 30,000; and0.5 to 5% by mass of the polyamide resin has a molecular weight of 1,000 or less.2. The composite fiber according to claim 1 , further comprising (b) a treating agent for the continuous reinforcing fiber (B) containing a functional group reactive with the polyamide resin claim 1 , wherein an amount of the treating agent (b) is 0.01 to 1.5% by mass of the continuous reinforcing fiber (B).3. The composite fiber according to claim 1 , which has a dispersity of the continuous reinforcing fiber (B) of 40 to 100% in the composite fiber.4. The composite fiber according to claim 1 , which is obtainable by using a polyamide resin fiber bundle having a fineness of 40 to 600 dtex and composed of 1 to 200 filaments.5. The composite fiber ...

XYLYLENEDIAMINE COMPOSITION, AND METHOD FOR PRODUCING POLYAMIDE RESIN

Provided are a xylylenediamine composition containing xylylenediamine and bis(methylbenzyl)amine, a content of the bis(methylbenzyl)amine being 0.0005 to 0.1 parts by mass based on 100 parts by mass of the xylylenediamine; and a method for producing a polyamide resin including the steps of introducing a diamine containing xylylenediamine, a dicarboxylic acid, and bis(methylbenzyl)amine in an amount of 0.0005 to 0.1 parts by mass based on 100 parts by mass of the xylylenediamine into a reaction system and performing a polycondensation reaction. 1. A xylylenediamine composition comprising xylylenediamine and bis(methylbenzyl)amine , a content of the bis(methylbenzyl)amine being 0.0005 to 0.1 parts by mass based on 100 parts by mass of the xylylenediamine.2. The xylylenediamine composition according to claim 1 , wherein the xylylenediamine is m-xylylenediamine claim 1 , p-xylylenediamine claim 1 , or a mixture thereof.3. The xylylenediamine composition according to claim 1 , wherein the xylylenediamine is m-xylylenediamine.4. The xylylenediamine composition according to claim 1 , wherein a content of the xylylenediamine is 99.5% by mass or more.5. The xylylenediamine composition according to claim 1 , which is used for a raw material for polyamide resin.6. The xylylenediamine composition according to claim 1 , which is used for an epoxy resin curing agent.7. A method for producing a polyamide resin comprising the steps of introducing a diamine containing xylylenediamine claim 1 , a dicarboxylic acid claim 1 , and bis(methylbenzyl)amine in an amount of 0.0005 to 0.1 parts by mass based on 100 parts by mass of the xylylenediamine into a reaction system and performing a polycondensation reaction.8. The method for producing a polyamide resin according to claim 7 , wherein the dicarboxylic acid is at least one selected from an aliphatic dicarboxylic acid having 4 to 20 carbon atoms claim 7 , terephthalic acid claim 7 , and isophthalic acid.9. The method for producing a ...

METHOD FOR PRODUCING POLYAMIDE RESIN

A polyamide resin is produced by polycondensing a polyamide oligomer having a relative viscosity of from 1.1 to 1.3 and a water content of 3% by weight or less by melt-kneading using an intermeshed co-rotation twin screw extruder having at least one or more open vents OV and OV and at least one or more vacuum vents VV and VV. A pressure-decreasing element Y for increasing the resin filling rate is provided at a position nearer to the supply section side than positions at which the vacuum vents VV and VV are provided, and an area of 30% or less of the total screw length is a vacuum area having a pressure of 300 Torr or less. 2. The polyamide resin production method according to claim 1 , wherein a relative viscosity of the polyamide resin is from 1.8 to 4.0.3. The polyamide resin production method according to claim 1 , wherein a molecular weight distribution (Mw/Mn) of the polyamide resin is from 1.8 to 2.5.4. The polyamide resin production method according to claim 1 , wherein a phosphorus compound is blended in the polyamide oligomer in an amount of from 10 to 500 ppm in terms of the phosphorus atom concentration.5. The polyamide resin production method according to claim 1 , wherein the open vent is arranged nearer to the supply section side than the vacuum area.6. The polyamide resin production method according to claim 1 , wherein a kneading section that kneads the polyamide oligomer is provided both in the vacuum area and in a position nearer to the supply section side than the vacuum area.7. The polyamide resin production method according to claim 1 , wherein at least one vacuum vent is provided in an area of 25% or less of the total screw length from an end on the die side of the extruder.8. The polyamide resin production method according to claim 1 , wherein a kneading section that comprises a kneading element having strong distributive mixing performance is provided in the area of 25% or less of the total screw length from an end on the die side of the ...

POLYAMIDE RESIN-TYPE COMPOSITE MATERIAL AND METHOD FOR PRODUCING SAME

A xylylenediamine-based polyamide resin/fiber composite material and molding are provided that do not exhibit a decline in properties under high temperatures and high humidities, and that exhibit a high elastic modulus and present little warping, and exhibit better recycle characteristics, a better moldability, and a better productivity than for thermosetting resins. The polyamide resin-type composite material comprises a fibrous material (B) impregnated with a polyamide resin (A) wherein at least 50 mole % of diamine structural units derived from xylylenediamine, and having a number-average molecular weight (Mn) of 6,000 to 30,000, and containing a component of a molecular weight of not more than 1,000 at 0.5 to 5 mass %. 1. (canceled)2. A polyamide resin composite material comprising:a fibrous material (B) impregnated with a polyamide resin (A),wherein the polyamide resin (A) is composed of diamine structural units and dicarboxylic units, at least 50 mole % of the diamine structural units is derived from xylylenediamine, the polyamide resin (A) has a number-average molecular weight (Mn) of 6,000 to 30,000, and 0.5 to 5 mass % of the polyamide resin (A) is a polyamide resin with a molecular weight of not more than 1,000.3. The material of claim 2 , wherein 0.01 to 1 mass % of the polyamide resin (A) is a cyclic compound which is produced when a salt from a diamine component and dicarboxylic acid component as starting materials for the polyamide resin (A) forms a ring.4. The material of claim 2 , wherein the polyamide resin (A) has a molecular weight distribution (Mw/Mn) of 1.8 to 3.1.5. The material of claim 2 , wherein the polyamide resin (A) has a melt viscosity of 50 to 1 claim 2 ,200 Pa·s claim 2 , when measured at a temperature of a melting point of the polyamide resin (A)+30° C. claim 2 , at a shear rate of 122 sec claim 2 , and at a moisture content in the polyamide resin (A) of not more than 0.06 mass %.6. The material of claim 2 , wherein the polyamide ...

NON-WEAVE FABRIC, SHEET OR FILM, MULTI-LAYERED SHEET, MOLDED ARTICLE AND METHOD FOR MANUFACTURING NON-WEAVE FABRIC

Provided is a non-weave fabric containing a thermoplastic resin fiber and a carbon fiber as major ingredients, capable of yielding a resin molded article when molded thereinto, which is excellent in mechanical strength and in appearance, and, a multi-layered sheet having the non-weave fabric and a textile layer, which is excellent in mechanical strength and less likely to warp. The non-weave fabric includes a thermoplastic resin fiber (A), a carbon fiber (B), and a thermoplastic resin (C) having a glass transition temperature lower than that of the thermoplastic resin fiber (A), the ratio of content of the thermoplastic resin (C) being 1 to 50% by weight of the total content of the thermoplastic resin fiber (A) and the thermoplastic resin (C). 1. A non-weave fabric comprising:a thermoplastic resin fiber (A);a carbon fiber (B); anda thermoplastic resin (C) having a glass transition temperature lower than a glass transition temperature of the thermoplastic resin fiber (A),which comprises the thermoplastic resin (C) in a content of 1 to 50% by weight, relative to a total content of the thermoplastic resin fiber (A) and the thermoplastic resin (C).2. The non-weave fabric of claim 1 , wherein the carbon fiber (B) has an average fiber length of 1 to 15 mm.3. The non-weave fabric of claim 1 , wherein the thermoplastic resin fiber (A) has an average fiber length of 1 to 15 mm.4. The non-weave fabric of claim 1 , wherein the thermoplastic resin (C) is in a form of a fiber.5. The non-weave fabric of claim 1 , wherein the thermoplastic resin (C) is in a form of a fiber having an average fiber length of 1 to 15 mm.6. The non-weave fabric of claim 1 , which has a difference between the average fiber length of the thermoplastic resin fiber (A) and the average fiber length of the carbon fiber (B) of 10 mm or smaller.7. The non-weave fabric of claim 1 , which has a ratio of mixing (ratio by weight) of the thermoplastic resin fiber (A) and the carbon fiber (B) of 99:1 to 25:75.8. ...

PACKAGING BODY AND STORAGE METHOD

Provided are [1] a packaging body consisting of a resin composition containing a polyester resin (A), a polyamide resin (B), and an oxidation reaction accelerator (C), wherein when a thickness of the packaging body is defined as d (μm), and an average long diameter, an average short diameter, and a volume fraction of dispersed particles of the polyamide resin (B) in the packaging body are defined as L (μm), W (μm), and Vf, respectively, the following expression (1A) is satisfied; an oxygen transmission rate after a lapse of 100 hours after preparing of the packaging body is 0.01 [cc/(package·day·0.21 atm)] or less; and a haze value is 8% or less, and [2] a method for preserving goods by filling in a packaging body containing a polyester resin (A), a polyamide resin (B), and an oxidation reaction accelerator (C), wherein a content of the polyamide resin (B) in the packaging body is 2.0 to 3.5% by mass, and when an oxygen transmission rate of the packaging body after a lapse of 100 hours after preparing of the packaging body is defined as X [cc/(package·day·0.21 atm)], a volume of the packaging body is defined as V [L], and a mass of the packaging body is defined as M [g], the following expression (1B) is satisfied. 1. A packaging body consisting of a resin composition comprising a polyester resin (A) , a polyamide resin (B) , and an oxidation reaction accelerator (C) , whereinwhen a thickness of the packaging body is defined as d (pm), and an average long diameter, an average short diameter, and a volume fraction of dispersed particles of the polyamide resin (B) in the packaging body are defined as L (pm), W (pm), and Vf, respectively, the following expression (1A) is satisfied;an oxygen transmission rate after a lapse of 100 hours after preparing of the packaging body is 0.01 [cc/(package·day·0.21 atm)] or less; and {'br': None, 'i': d×L×Vf/', 'W<, '10<2120 \u2003\u2003(1A).'}, 'a haze value is 8% or less2. The packaging body according to claim 1 , wherein the ...

THIN-WALL ARTICLE

Provided is a thin-wall article formed from a polyamide resin which can be stably produced with little variation in mechanical properties such as flexural strength, flexural modulus and impact resistance. A thin-wall article formed by molding a polyamide resin (C) obtained by polycondensing a diamine (A) and a dicarboxylic acid (B) or a polyamide resin composition containing the polyamide resin, wherein 70 mol % or more of a diamine structural unit is derived from xylylenediamine and the polyamide resin has a melt viscosity (i) of 50 to 200 Pa·s as measured at a temperature of the melting point plus 10° C. for a holding time of 6 minutes at a shear rate of 122 sec. 1. A thin-wall article formed by molding (i) a polyamide resin obtained by polycondensing a diamine and a dicarboxylic acid , or (ii) a polyamide resin composition comprising the polyamide resin ,{'sup': '−1', 'wherein 70 mol % or more of a diamine structural unit is derived from xylylenediamine and the polyamide resin has a first melt viscosity of 50 to 200 Pa·s as measured at a temperature of a melting point plus 10° C. for a holding time of 6 minutes at a shear rate of 122 sec.'}2. The thin-wall article of claim 1 , wherein the polyamide resin has a second melt viscosity of 50 to 200 Pa·s as measured at a temperature of the melting point plus 10° C. for a holding time of 15 minutes at a shear rate of 122 sec.3. The thin-wall article of claim 2 , wherein the first and second melt viscosities differ by 100 Pa·s or less.4. The thin-wall article of claim 1 , wherein the polyamide resin has a molecular weight distribution of 2.1 to 3.1.5. The thin-wall article of claim 1 , wherein the polyamide resin comprises 0.5 to 5% by mass of a component having a molecular weight of 1 claim 1 ,000 or less.6. The thin-wall article of claim 1 , wherein the polyamide resin has a crystallization half time of 1 to 100 seconds.7. The thin-wall article of claim 1 , wherein the polyamide resin has a crystallization heat of 5 ...

CRYSTALLINE THERMOPLASTIC POLYIMIDE RESIN

A thermoplastic polyimide resin containing a repeating structural unit represented by the following formula (1) and a repeating structural unit represented by the following formula (2), a content ratio of the repeating structural unit of formula (1) with respect to the total of the repeating structural unit of formula (1) and the repeating structural unit of formula (2) being from 40 to 70% by mol: 4. The thermoplastic polyimide resin according to claim 1 , wherein Rrepresents an alkylene group having from 5 to 12 carbon atoms.5. The thermoplastic polyimide resin according to claim 4 , wherein Rrepresents a hexamethylene group.11. The thermoplastic polyimide resin according to claim 1 , having a melting point of 360° C. or less and a glass transition temperature of 200° C. or more.12. The thermoplastic polyimide resin according to claim 1 , having an exothermic amount of a crystallization exothermic peak of 5 mJ/mg or more claim 1 , the crystallization exothermic peak being observed when the resin is melted and then cooled at a cooling rate of 10° C./min or more in a differential scanning calorimeter.13. A film comprising the thermoplastic polyimide resin according to .14. A fiber comprising the thermoplastic polyimide resin according to .15. A heat-resistant adhesive comprising the thermoplastic polyimide resin according to . The present invention relates to a novel crystalline thermoplastic polyimide resin.A polyimide resin is a useful engineering plastic that has high thermal stability, high strength and high solvent resistance due to rigidity, resonance stabilization and firm chemical bond of the molecular chain thereof, and is being applied to a wide range of fields. A polyimide having crystallinity is further enhanced in the heat resistance, the strength and the chemical resistance thereof, and thus is expected for applications as alternatives of metals or the like.The major factors for the excellent thermal stability of a polyimide include the high glass ...

MULTILAYERED CONTAINER, DIE FOR MULTILAYERED CONTAINER, AND METHOD FOR PRODUCING MULTILAYERED CONTAINER

The present invention relates to a mold for a multi-layer container. The mold includes a cold-half portion containing a cavity, and a hot-half portion containing a first resin flow path for connecting an interior of a first injection cylinder to the cavity, a second resin flow path for connecting an interior of a second injection cylinder to the cavity, and a junction portion of the first resin flow path and the second resin flow path. The junction portion in the hot-half portion is positioned upstream of a gate portion opened to the cavity included in the cold-half portion, the second resin flow path contains an inhibitor for partially inhibiting a resin flow. 1. A mold for a multi-layer container , the mold comprising:a cold-half portion (I) comprising a cavity; anda hot-half portion (II) comprising a first resin flow path for connecting an interior of a first injection cylinder to the cavity, a second resin flow path for connecting an interior of a second injection cylinder to the cavity, and a junction portion of the first resin flow path and the second resin flow path,wherein:the junction portion in the hot-half portion (II) is positioned upstream of a gate portion opened to the cavity included in the cold-half portion (I); andthe second resin flow path comprises an inhibitor for partially inhibiting a resin flow.2. The mold according to claim 1 ,wherein:the inhibitor comprises a convex portion in at least one part in the second resin flow path; [{'br': None, 'i': r≦a≦', 'r, '0.011\u2003\u2003(Expression 1), and'}, {'br': None, 'i': r≦b≦', 'r, '0.011\u2003\u2003(Expression 2); and'}], 'a longest portion in a diameter direction and a longest portion in a circumferential tangential direction of a cross-section in a direction vertical to a flow direction of the second resin flow path have a length of a mm and a length of b mm, respectively, a and b satisfying the following relationships'}r represents a radius (mm) of the second resin flow path.3. The mold ...

Method for producing polyimide resin powder, and thermoplastic polyimide resin powder

The present invention provides a method for producing a polyimide resin powder, including the step of reacting (A) a tetracarboxylic acid component containing a tetracarboxylic dianhydride with (B) a diamine component containing an aliphatic diamine in the presence of (C) a solvent containing an alkylene glycol-based solvent represented by the formula (1): wherein Ra 1 represents a hydrogen atom or an alkyl group having from 1 to 4 carbon atoms, Ra 2 represents a linear alkylene group having from 2 to 6 carbon atoms, and n represents an integer of 1-3.

POLYMIDE RESIN

A polyimide resin containing a repeating structural unit of the following formula (1), a repeating structural unit of the following formula (2), and a repeating structural unit of the following formula (A) or a repeating structural unit of the following formula (B), a content ratio of formula (1) with respect to the total of formula (1) and formula (2) being from 40 to 70 mol %, and a content ratio of formula (A) or formula (B) with respect to the total of formula (1) and formula (2) being more than 0 mol % and 25 mol % or less: 2: The polyimide resin according to claim 1 , wherein the electron-attracting group is halogen claim 1 , an alkyl halide group claim 1 , or an alkylene halide group.3: The polyimide resin according to claim 2 , wherein the electron-attracting group is fluorine claim 2 , an alkyl fluoride group claim 2 , or an alkylene fluoride group.4: The polyimide resin according to claim 1 , comprising the repeating structural unit represented by the formula (B) and having an oxygen index of 23 or more.5: The polyimide resin according to claim 4 , wherein the oxygen index is 26 or more.7: The polyimide resin according to claim 1 , having a melting point of 360° C. or less and a glass transition temperature of 200° C. or more.8: A film comprising the polyimide resin according to .9: A fiber comprising the polyimide resin according to .10: A heat-resistant adhesive comprising the polyimide resin according to .11: A composite material comprising a fiber material impregnated with the polyimide resin according to .12: The polyimide resin according to claim 1 , comprising the repeating structural unit represented by the formula (A).13: The polyimide resin according to claim 1 , comprising the repeating structural unit represented by the formula (B). The present invention relates to a polyimide resin.A polyimide resin is a useful engineering plastic that has high thermal stability, high strength and high solvent resistance due to rigidity, resonance ...

POLYIMIDE RESIN COMPOSITION, AND (POLYIMIDE RESIN)-FIBER COMPOSITE MATERIAL

[1] A polyimide resin composition containing a polyimide resin (A) and an additive (B), the polyimide resin (A) containing a repeating structural unit represented by the following formula (1) and a repeating structural unit represented by the following formula (2), a content ratio of the repeating structural unit of formula (1) with respect to the total of the repeating structural unit of formula (1) and the repeating structural unit of formula (2) being from 40 to 70 mol %; and [2] a composite material containing a fiber material (C) impregnated with a polyimide resin (A) containing a repeating structural unit represented by the following formula (1) and a repeating structural unit represented by the following formula (2), a content ratio of the repeating structural unit of formula (1) with respect to the total of the repeating structural unit of formula (1) and the repeating structural unit of formula (2) being from 40 to 70 mol %: 2: The polyimide resin composition according to claim 1 , wherein the additive is at least one selected from the group consisting of a filler claim 1 , a flame retardant claim 1 , a colorant claim 1 , a slidability-improving agent claim 1 , an antioxidant claim 1 , and a conductive agent.5: The polyimide resin composition according to claim 1 , wherein Rrepresents an alkylene group comprising 5 to 12 carbon atoms.6. (canceled)9: The polyimide resin composition according to claim 1 , wherein the polyimide resin has a melting point of 360° C. or less and a glass transition temperature of 200° C. or more.10: The polyimide resin composition according to claim 2 , wherein the filler is at least one selected from the group consisting of silica claim 2 , alumina claim 2 , kaolinite claim 2 , wollastonite claim 2 , mica claim 2 , talc claim 2 , clay claim 2 , sericite claim 2 , magnesium carbonate claim 2 , magnesium sulfate claim 2 , glass beads claim 2 , glass fiber claim 2 , carbon fiber claim 2 , alumina fiber claim 2 , potassium titanate ...

MULTILAYER STRUCTURE

A multilayer structure including a polyolefin layer (A) and a polyamide resin composition layer (B), wherein the polyamide resin composition constituting the layer (B) contains a polyamide resin (b-1) in which a diamine constituent unit thereof contains a constituent unit derived from a xylylenediamine and a dicarboxylic acid constituent unit thereof contains a constituent unit derived from an α,ω-linear aliphatic dicarboxylic acid having from 4 to 20 carbon atoms and a modified polyolefin (b-2), and the content of the modified polyolefin (b-2) is from 5 to 30 parts by mass relative to 100 parts by mass of the polyamide resin (b-1). 1. A multilayer structure including a polyolefin layer (A) and a polyamide resin composition layer (B) , wherein:the polyamide resin composition constituting the layer (B) comprises a polyamide resin (b-1) in which a diamine constituent unit thereof comprises a constituent unit derived from a xylylenediamine and a dicarboxylic acid constituent unit thereof comprises a constituent unit derived from an α,ω-linear aliphatic dicarboxylic acid having from 4 to 20 carbon atoms and a modified polyolefin (b-2); andthe content of the modified polyolefin (b-2) is from 5 to 30 parts by mass relative to 100 parts by mass of the polyamide resin (b-1).2. The multilayer structure according to claim 1 , wherein the modified polyolefin (b-2) is a polyolefin modified with a carboxyl group-containing monomer claim 1 , or a polyolefin graft-modified with a polyamide.3. The multilayer structure according to claim 2 , wherein the polyolefin modified with a carboxyl group-containing monomer is a maleic anhydride-modified polyethylene.4. The multilayer structure according to claim 2 , wherein the polyamide for graft formation is at least one selected from the group consisting of nylon 6 claim 2 , nylon 66 claim 2 , nylon 11 claim 2 , nylon 12 claim 2 , nylon 612 and copolymers thereof.5. The multilayer structure according to claim 1 , wherein the degree of ...

POLYETHER POLYAMIDE COMPOSITION

Provided is a polyether polyamide composition including 100 parts by mass of a polyether polyamide in which a diamine constituent unit thereof is derived from a specified polyether diamine compound and a xylylenediamine, and a dicarboxylic acid constituent unit thereof is derived from an α,ω-linear aliphatic dicarboxylic acid having from 4 to 20 carbon atoms, having blended therein from 0.01 to 15 parts by mass of at least one molecular chain extender selected from a carbodiimide compound and a compound containing two or more epoxy groups in a molecule thereof. 2. The polyether polyamide composition according to claim 1 , wherein the xylylenediamine (a-2) is m-xylylenediamine claim 1 , p-xylylenediamine claim 1 , or a mixture thereof.3. The polyether polyamide composition according to claim 1 , wherein the xylylenediamine (a-2) is m-xylylenediamine.4. The polyether polyamide composition according to claim 1 , wherein the xylylenediamine (a-2) is a mixture of m-xylylenediamine and p-xylylenediamine.5. The polyether polyamide composition according to claim 4 , wherein a proportion of the p-xylylenediamine relative to a total amount of m-xylylenediamine and p-xylylenediamine is 90% by mole or less.6. The polyether polyamide composition according to claim 1 , wherein the α claim 1 ,ω-linear aliphatic dicarboxylic acid having from 4 to 20 carbon atoms is at least one member selected from adipic acid and sebacic acid.7. The polyether polyamide composition according to claim 1 , wherein a proportion of the constituent unit derived from the xylylenediamine (a-2) in the diamine constituent unit is from 50 to 99.8% by mole.8. The polyether polyamide composition according to claim 1 , wherein the molecular chain extender (B) is an aliphatic carbodiimide compound.9. The polyether polyamide composition according to claim 1 , wherein the molecular chain extender (B) is an epoxy group-containing (meth)acrylic polymer.10. The polyether polyamide composition according to claim 1 , ...

METHOD FOR PRODUCING A POLYOLEFIN STRUCTURE

The production method for a polyolefin-based structure of the present invention produces a polyolefin-based structure from a mixed source material containing a polyolefin (A), an acid-modified polyolefin (B) and a gas barrier resin (C) using a molding machine , under the condition mentioned below. The molding machine is equipped with a single-screw extruder , a die head , and an adaptor for feeding the mixed source material from the single-screw extruder to the die head . Am+10° C.≦T≦Cm−10° C. (1), Cm−30° C.≦T≦Cm+30° C. (2), Cm−10° C.≦T≦Cm+50° C. (3), Cm−30° C.≦T≦Cm+30° C. (4). T is a cylinder temperature in a section corresponding to a supply zone A and a compression zone B, T is a cylinder temperature in a section corresponding to a metering zone C, T is a temperature of an adaptor , T is a temperature of a die head, Am is the melting point of the component (A), and Cm is the melting point of the component (C). 22. The method for producing a polyolefin-based structure according to claim 1 , wherein the temperature T is lower than the melting point Cm of the gas barrier resin (C).3. The method for producing a polyolefin-based structure according to claim 1 , wherein the melting point (Cm) of the gas barrier resin (C) is higher than the melting point (Am) of the polyolefin (A) and the melting point difference (Cm−Am) is 20 to 150° C.45. The method for producing a polyolefin-based structure according to claim 1 , wherein a temperature T of the resin being extruded out through the discharge port of the die head satisfies the following formula (5):{'br': None, 'i': Cm−', 'T', '≦Cm−, '30° C.≦55° C.\u2003\u2003(5).'}52. The method for producing a polyolefin-based structure according to claim 1 , wherein the screw has a barrier-type mixing section in the metering zone claim 1 , and the temperature T satisfies the following condition:{'br': None, 'i': Cm−', 'T', '≦Cm−, '30° C.≦25° C.'}6. The method for producing a polyolefin-based structure according to claim 1 , wherein ...

MOISTURE-ABSORBING/RELEASING MATERIAL

Provided is a moisture absorbing and releasing material including a polyether polyamide in which a diamine constituent unit thereof is derived from a specified polyether diamine compound (A-1) and a xylylenediamine (A-2), and a dicarboxylic acid constituent unit thereof is derived from an α,ω-linear aliphatic dicarboxylic acid having from 4 to 20 carbon atoms, wherein in the case where when held at 23° C. and 80% RH, its coefficient of saturated moisture absorption is defined as 100%, a normalized coefficient of moisture absorption after holding in an environment at 23° C. and 80% RH until a coefficient of moisture absorption reaches a saturated state and then further holding in an environment at 23° C. and 50% RH for 60 minutes is from 1 to 50%. 2. The moisture absorbing and releasing material according to claim 1 , wherein the α claim 1 ,ω-linear aliphatic dicarboxylic acid having from 4 to 20 carbon atoms is at least one member selected from the group consisting of adipic acid and sebacic acid.3. The moisture absorbing and releasing material according to claim 1 , wherein the xylylenediamine (A-2) is m-xylylenediamine claim 1 , p-xylylenediamine claim 1 , or a mixture thereof.4. The moisture absorbing and releasing material according to claim 1 , wherein the xylylenediamine (A-2) is m-xylylenediamine.5. The moisture absorbing and releasing material according to claim 1 , wherein the xylylenediamine (A-2) is a mixture of m-xylylenediamine and p-xylylenediamine.6. The moisture absorbing and releasing material according to claim 5 , wherein a proportion of p-xylylenediamine relative to a total amount of m-xylylenediamine and p-xylylenediamine is 90% by mole or less.7. The moisture absorbing and releasing material according to claim 1 , wherein a proportion of the constituent unit derived from the xylylenediamine (A-2) in the diamine constituent unit is from 50 to 99.8% by mole.8. The moisture absorbing and releasing material according to claim 1 , which is a film.9. ...

Polyether-polyamide composition

Provided is a polyether polyamide composition including a polyether polyamide in which a diamine constituent unit thereof is derived from a specified polyether diamine compound and a xylylenediamine, and a dicarboxylic acid constituent unit thereof is derived from an α,ω-linear aliphatic dicarboxylic acid having from 4 to 20 carbon atoms and a stabilizer.

POLYETHER POLYAMIDE RESIN COMPOSITION

Provided is a polyether polyamide composition including 100 parts by mass of a polyether polyamide resin in which a diamine constituent unit thereof is derived from a specified polyether diamine compound and a xylylenediamine, and a dicarboxylic acid constituent unit thereof is derived from an α,ω-linear aliphatic dicarboxylic acid having from 4 to 20 carbon atoms, having blended therein from 15 to 200 parts by mass of a filler. 2. The polyether polyamide resin composition according to claim 1 , wherein the filler (B) is at least one member selected from kaolinite claim 1 , silica claim 1 , calcium carbonate claim 1 , magnesium carbonate claim 1 , calcium sulfate claim 1 , magnesium sulfate claim 1 , alumina claim 1 , glass bead claim 1 , carbon black claim 1 , a sulfide claim 1 , a metal oxide claim 1 , glass fiber claim 1 , a whisker claim 1 , wollastonite claim 1 , carbon fiber claim 1 , mineral fiber claim 1 , alumina fiber claim 1 , glass flake claim 1 , mica claim 1 , talc claim 1 , clay claim 1 , graphite claim 1 , sericite claim 1 , an aromatic liquid crystalline polyester resin claim 1 , a wholly aromatic polyamide resin claim 1 , acrylic fiber claim 1 , poly(benzimidazole) fiber claim 1 , kenaf claim 1 , pulp claim 1 , hemp pulp claim 1 , and wood pulp.3. The polyether polyamide resin composition according to claim 1 , wherein the xylylenediamine (a-2) is m-xylylenediamine claim 1 , p-xylylenediamine claim 1 , or a mixture thereof.4. The polyether polyamide resin composition according to claim 1 , wherein a proportion of the constituent unit derived from the polyether diamine compound (a1-1) in the diamine constituent unit is from 0.1 to 50% by mole.5. The polyether polyamide resin composition according to claim 1 , wherein the α claim 1 ,ω-linear aliphatic dicarboxylic acid having from 4 to 20 carbon atoms is at least one member selected from adipic acid claim 1 , sebacic acid claim 1 , and a mixture thereof.6. The polyether polyamide resin composition ...

POLYETHER POLYAMIDE FIBER

Provided is a polyether polyamide fiber including a polyether polyamide in which a diamine constituent unit thereof is derived from a specified polyether diamine compound and a xylylenediamine, and a dicarboxylic acid constituent unit thereof is derived from an α,ω-linear aliphatic dicarboxylic acid having from 4 to 20 carbon atoms. 2. The polyether polyamide fiber according to claim 1 , which is a monofilament having a fineness of from 50 to 12 claim 1 ,000 dtex.3. The polyether polyamide fiber according to claim 1 , which is a multifilament having a fineness of from 1 to 10 claim 1 ,000 dtex.4. The polyether polyamide fiber according to claim 1 , which is a microfiber having a fineness of from 0.001 to 0.8 dtex.5. The polyether polyamide fiber according to claim 1 , wherein the α claim 1 ,ω-linear aliphatic dicarboxylic acid having from 4 to 20 carbon atoms is at least one member selected from adipic acid and sebacic acid.6. The polyether polyamide fiber according to claim 1 , wherein the xylylenediamine (a-2) is m-xylylenediamine claim 1 , p-xylylenediamine claim 1 , or a mixture thereof.7. The polyether polyamide fiber according to claim 6 , wherein the xylylenediamine (a-2) is m-xylylenediamine.8. The polyether polyamide fiber according to claim 6 , wherein the xylylenediamine (a-2) is a mixture of m-xylylenediamine and p-xylylenediamine.9. The polyether polyamide fiber according to claim 8 , wherein a proportion of the p-xylylenediamine relative to a total amount of m-xylylenediamine and p-xylylenediamine is 90% by mole or less.10. The polyether polyamide fiber according to claim 1 , wherein a proportion of the constituent unit derived from the xylylenediamine (a-2) in the diamine constituent unit is from 50 to 99.8% by mole.11. The polyether polyamide fiber according to claim 1 , which is composed of a composition containing the polyether polyamide (A1) and further having a molecular chain extender (B) blended therein.12. The polyether polyamide fiber ...

POLYAMIDE PELLETS, METHOD FOR PRODUCING POLYAMIDE PELLETS, AND METHOD FOR PRODUCING POLYAMIDE MOLDED ARTICLE

The polyamide pellet of the present invention includes a polyamide including diamine units and dicarboxylic acid units, 50% by mole or more of the diamine units being derived from m-xylylenediamine, wherein a spherulite density of a skin portion of the pellet is 40,000 to 250,000/mm. 1. A polyamide pellet comprising a polyamide including diamine units and dicarboxylic acid units , 50% by mole or more of the diamine units being derived from m-xylylenediamine , wherein a spherulite density of a skin portion of the pellet being 40 ,000 to 250 ,000/mm.2. The polyamide pellet according to claim 1 , wherein a spherulite density of a core portion of the pellet is 10 claim 1 ,000 to 40 claim 1 ,000/mm.3. The polyamide pellet according to claim 1 , wherein 50% by mole or more of the dicarboxylic acid units in the polyamide are derived from an aliphatic dicarboxylic acid having 6 to 12 carbon atoms.4. The polyamide pellet according to claim 3 , wherein the aliphatic dicarboxylic acid having 6 to 12 carbon atoms is adipic acid claim 3 , sebacic acid claim 3 , or a mixture thereof.5. The polyamide pellet according to claim 1 , which satisfies a condition of the following formula (1):{'br': None, 'sub': '2', '−110 μeq/g≦([COOH]—[NH])≦110 μeq/g\u2003\u2003(1)'}{'sub': '2', 'wherein [COOH] represents a terminal carboxyl group concentration (μeq/g) of the polyamide and [NH] represents a terminal amino group concentration (μeq/g) of the polyamide.'}6. The polyamide pellet according to claim 1 , which has a relative viscosity of 2.0 to 4.2.7. The polyamide pellet according to claim 1 , wherein the spherulite density of the skin portion is 80 claim 1 ,000 to 110 claim 1 ,000/mm.8. The polyamide pellet according to claim 1 , which is obtained by solid-phase polymerization of a pelletized polyamide being in an amorphous state.9. The polyamide pellet according to claim 8 , wherein the pelletized polyamide being in the amorphous state is one obtained by melt polycondensation.10. The ...

COMMINGLED YARN, METHOD FOR MANUFACTURING THE COMMINGLED YARN, AND, WEAVE FABRIC

Provided is a commingled yarn having a dispersing property and having a smaller amount of voids, a method for manufacturing the commingled yarn, and a weave fabric using the commingled yarn. The commingled yarn comprises a continuous thermoplastic resin fiber, a continuous reinforcing fiber, and a surface treatment agent and/or sizing agent, comprises the surface treatment agent and/or sizing agent in a content of 2.0% by weight or more, relative to a total amount of the continuous thermoplastic resin fiber and the continuous reinforcing fiber, and has a dispersibility of the continuous thermoplastic resin fiber and the continuous reinforcing fiber of 70% or larger. 1. A commingled yarn comprising a continuous thermoplastic resin fiber , a continuous reinforcing fiber , and a surface treatment agent and/or sizing agent;wherein the commingled yarn comprises the surface treatment agent and/or sizing agent in a content of 2.0% by weight or more, relative to a total amount of the continuous thermoplastic resin fiber and the continuous reinforcing fiber, and has a dispersibility of the continuous thermoplastic resin fiber and the continuous reinforcing fiber of 70% or larger.2. The commingled yarn of claim 1 , having a void ratio of 20% or smaller.3. The commingled yarn of claim 1 , comprising at least two or more species of the surface treatment agent and/or sizing agent.4. The commingled yarn of claim 1 , wherein the continuous thermoplastic resin fiber contains a polyamide resin.5. The commingled yarn of claim 1 , wherein the continuous thermoplastic resin fiber contains at least one species selected from polyamide 6 claim 1 , polyamide 66 and xylylene diamine-based polyamide resin.6. The commingled yarn of claim 5 ,wherein the xylylene diamine-based polyamide resin contains a diamine structural unit and a dicarboxylic acid structural unit;70 mol % or more of the diamine structural unit is derived from xylylene diamine; and50 mol % or more of the dicarboxylic acid ...

MOLDED PRODUCTS

Provide is a molded product showing low water absorption, high chemical resistance, high crystallinity index. A molded product formed from a polyamide resin composition containing 50 to 99 parts by mass of (A) an aliphatic polyamide resin and 50 to 1 parts by mass of (B) a polyamide resin including 70 mol % or more of a diamine structural unit derived from xylylenediamine and 50 mol % or more of a dicarboxylic acid structural unit derived from sebacic acid, provided that the total of (A) and (B) is 100 parts by mass. 1. A molded product formed from a polyamide resin composition containing 50 to 99 parts by mass of (A) an aliphatic polyamide resin and 50 to 1 parts by mass of (B) a polyamide resin including 70 mol % or more of a diamine structural unit derived from xylylenediamine and 50 mol % or more of a dicarboxylic acid structural unit derived from sebacic acid , provided that the total of (A) and (B) is 100 parts by mass.2. The molded product according to claim 1 , wherein the aliphatic polyamide resin (A) is polyamide 6 or polyamide 66.3. The molded product according to claim 1 , wherein the xylylenediamine is m-xylylenediamine claim 1 , p-xylylenediamine or a mixture thereof.4. The molded product according to claim 1 , wherein the polyamide resin (B) is a poly(m-xylylene sebacamide) resin claim 1 , a poly(p-xylylene sebacamide) resin claim 1 , or a poly(m-/p-xylylene sebacamide) resin.5. The molded product according to claim 1 , wherein the polyamide resin composition further contains 1 to 230 parts by mass of (C) a filler per 100 parts by mass of the total of the polyamide resin (A) and the polyamide resin (B).6. The molded product according to claim 1 , which has a thinnest part having thickness of 0.5 mm or more.7. The molded product according to claim 1 , wherein the amount of the polyamide resin (B) contained in the polyamide resin composition is 20 to 50 parts by mass per 100 parts by mass of the total of (A) and (B).8. The molded product according to ...

XYLYLENEDIAMINE COMPOSITION AND METHOD FOR PRODUCING POLYAMIDE RESIN

Provided are [1] a xylylenediamine composition containing xylylenediamine and 1,2-ditolylethane wherein the content of 1,2-ditolylethane is 0.001 to 0.02 parts by mass based on 100 parts by mass of the xylylenediamine; and [2] a method for producing a polyamide resin including the steps of introducing a diamine containing xylylenediamine, a dicarboxylic acid, and 1,2-ditolylethane into a reaction system and performing polycondensation reaction, wherein the amount of the 1,2-ditolylethane to be introduced is 0.001 to 0.02 parts by mass based on 100 parts by mass of the xylylenediamine. 1. A xylylenediamine composition comprising xylylenediamine and 1 ,2-ditolylethane , wherein the content of the 1 ,2-ditolylethane is 0.001 to 0.02 parts by mass based on 100 parts by mass of the xylylenediamine2. The xylylenediamine composition according to claim 1 , wherein the xylylenediamine is m-xylylenediamine claim 1 , p-xylylenediamine claim 1 , or a mixture thereof.3. The xylylenediamine composition according to claim 1 , wherein the xylylenediamine is m-xylylenediamine.4. The xylylenediamine composition according to claim 1 , wherein the content of xylylenediamine is 99.5% by mass or more.5. The xylylenediamine composition according to claim 1 , which is used for a raw material for polyamide resin.6. The xylylenediamine composition according to claim 1 , which is used for an epoxy resin curing agent.7. A method for producing a polyamide resin comprising the steps of introducing a diamine comprising xylylenediamine claim 1 , a dicarboxylic acid claim 1 , and 0.001 to 0.02 parts by mass claim 1 , based on 100 parts by mass of the xylylenediamine claim 1 , of 1 claim 1 ,2-ditolylethane into a reaction system and performing a polycondensation reaction.8. The method for producing a polyamide resin according to claim 7 , wherein the dicarboxylic acid is at least one selected from an aliphatic dicarboxylic acid having 4 to 20 carbon atoms claim 7 , terephthalic acid claim 7 , and ...

XYLYLENEDIAMINE COMPOSITION AND METHOD FOR PRODUCING POLYAMIDE RESIN

Provided are [1] a xylylenediamine composition containing xylylenediamine and a pyridine compound (A) having at least one substituent including an amino group, wherein the content of the pyridine compound (A) is 0.001 to 0.1 parts by mass based on 100 parts by mass of the xylylenediamine; and [2] a method for producing a polyamide resin including the steps of introducing a pyridine compound (A) having at least one substituent including an amino group, a diamine including xylylenediamine (but excluding a diamine corresponding to the above-mentioned pyridine compound (A)), and a dicarboxylic acid into a reaction system and performing a polycondensation reaction, wherein the amount of the pyridine compound (A) to be introduced is 0.001 to 0.1 parts by mass based on 100 parts by mass of xylylenediamine. 1. A xylylenediamine composition comprising xylylenediamine and a pyridine compound (A) having at least one substituent including an amino group , wherein the content of the pyridine compound (A) is 0.001 to 0.1 parts by mass based on 100 parts by mass of the xylylenediamine.2. The xylylenediamine composition according to claim 1 , wherein the pyridine compound (A) has two substituents including an amino group.4. The xylylenediamine composition according to claim 1 , wherein the xylylenediamine is m-xylylenediamine claim 1 , p-xylylenediamine claim 1 , or a mixture thereof.5. The xylylenediamine composition according to claim 1 , wherein the xylylenediamine is m-xylylenediamine.6. The xylylenediamine composition according to claim 1 , wherein the content of xylylenediamine is 99.5% by mass or more.7. The xylylenediamine composition according to claim 1 , which is used for a raw material for polyamide resin.8. The xylylenediamine composition according to claim 1 , which is used for an epoxy resin curing agent.9. A method for producing a polyamide resin comprising the steps of introducing a pyridine compound (A) having at least one substituent including an amino group ...

XYLYLENE DIAMINE COMPOSITION, AND METHOD FOR PRODUCING POLYAMIDE RESIN

Provided are [1] a xylylenediamine composition containing xylylenediamine and a compound represented by the following general formula (1), wherein the content of the compound represented by the general formula (1) is 0.001 to 0.1 parts by mass based on 100 parts by mass of the xylylenediamine; and a method for producing a polyamide resin including the steps of introducing a compound represented by the following general formula (1), a diamine including xylylenediamine (but excluding the compound represented by the general formula (1)), and a dicarboxylic acid into a reaction system and performing a polycondensation reaction, wherein the amount of the compound represented by the general formula (1) to be introduced is 0.001 to 0.1 parts by mass based on 100 parts by mass of the xylylenediamine, where, in the general formula (1), n and m each independently represent an integer of 0 to 6, excluding the case where n and m are both 1. 3. The xylylenediamine composition according to claim 1 ,wherein the xylylenediamine is m-xylylenediamine, p-xylylenediamine, or a mixture thereof.4. The xylylenediamine composition according to claim 1 ,wherein the xylylenediamine is m-xylylenediamine.5. The xylylenediamine composition according to claim 1 , wherein the content of xylylenediamine is 99.5% by mass or more.6. The xylylenediamine composition according to claim 1 , which is used for a raw material for polyamide resin.7. The xylylenediamine composition according to claim 1 , which is used for an epoxy resin curing agent.10. The method for producing a polyamide resin according to claim 8 , wherein the dicarboxylic acid is at least one selected from an aliphatic dicarboxylic acid having 4 to 20 carbon atoms claim 8 , terephthalic acid claim 8 , and isophthalic acid.11. The method for producing a polyamide resin according to claim 8 , wherein the content of xylylenediamine in the xylylenediamine-containing diamine is 70 mol % or more claim 8 , and the content of the aliphatic ...

XYLYLENEDIAMINE COMPOSITION AND METHOD FOR PRODUCING POLYAMIDE RESIN

Provided are [1] a xylylenediamine composition containing xylylenediamine and a 5-membered or 6-membered heterocyclic compound (A) having at least one nitrogen-containing substituent and having two nitrogen atoms as atoms constituting a ring, wherein the content of the heterocyclic compound (A) is 0.001 to 0.02 parts by mass based on 100 parts by mass of the xylylenediamine; and [2] a method for producing a polyamide resin including the steps of introducing a 5-membered or 6-membered heterocyclic compound (A) having at least one nitrogen-containing substituent and having two nitrogen atoms as atoms constituting a ring, a diamine including xylylenediamine (but excluding a diamine corresponding to the above-mentioned heterocyclic compound (A)), and a dicarboxylic acid into a reaction system and performing a polycondensation reaction, wherein the amount of the heterocyclic compound (A) to be introduced is 0.001 to 0.02 parts by mass based on 100 parts by mass of xylylenediamine. 1. A xylylenediamine composition comprising xylylenediamine and a 5-membered or 6-membered heterocyclic compound (A) having at least one nitrogen-containing substituent and having two nitrogen atoms as atoms constituting a ring , wherein the content of the heterocyclic compound (A) is 0.001 to 0.02 parts by mass based on 100 parts by mass of the xylylenediamine.2. The xylylenediamine composition according to claim 1 , wherein the nitrogen-containing substituent is a substituent including an amino group.4. The xylylenediamine composition according to claim 1 , wherein the xylylenediamine is m-xylylenediamine claim 1 , p-xylylenediamine claim 1 , or a mixture thereof.5. The xylylenediamine composition according to claim 1 , wherein the xylylenediamine is m-xylylenediamine.6. The xylylenediamine composition according to claim 1 , wherein the content of xylylenediamine is 99.5% by mass or more.7. The xylylenediamine composition according to claim 1 , which is used for a raw material for polyamide ...

POLYAMIDE RESIN COMPOSITION

The present invention relates to a polyamide resin composition comprising polyamide (X) comprising a diamine unit containing 70 mol % or more of a metaxylylenediamine unit and a dicarboxylic acid unit and an alkali compound (A), wherein the following equations (1) to (4) are satisfied: 110-. (canceled)11. A process for producing the polyamide resin composition comprising:(a) polycondensating a diamine comprising 70 mol % or more of metaxylylenediamine and dicarboxylic acid in the presence of a phosphorus atom-comprising compound (B), to obtain the polyamide (X); and(b) adding the alkali compound (A) to the polyamide (X)wherein the polyamide resin composition, comprises:a polyamide (X) comprising a diamine unit comprising 70 mol % or more of a metaxylylenediamine unit and a dicarboxylic acid unit; andan alkali compound (A), [{'br': None, 'sub': '2', '10≦([COOH]—[NH])≦80\u2003\u2003(1)'}, {'br': None, '0.32≦P<6.46\u2003\u2003(2)'}, {'br': None, '0.50≦M<17.00\u2003\u2003(3)'}, {'br': None, '2≦M/P≦3\u2003\u2003(4)'}], 'wherein equations (1) to (4) are satisfiedwherein [COOH] is a concentration (μeq/g) of a terminal carboxyl group in the polyamide (X);{'sub': '2', '[NH] is a concentration (μeq/g) of a terminal amino group in the polyamide (X);'}P is a mole concentration (μmol/g) of a phosphorus atom contained per gram of the polyamide resin composition; andM is a sum (μmol/g) of values obtained by multiplying a mole concentration of an alkali metal atom and a mole concentration of an alkaline earth metal atom each contained per gram of the polyamide resin composition by valencies thereof, respectively.12. The process of claim 11 , wherein claim 11 , in (a) claim 11 , the polycondensation is carried out in the presence of the phosphorus atom-comprising compound (B) and an alkali metal compound (C).13. The process of claim 11 , wherein the adding (b) comprises:(b1) melting and kneading 90 to 99 parts by mass of the polyamide (X) and 10 to 1 part by mass of the alkali ...

METHOD FOR PRODUCING POLYAMIDE RESIN

Provided is a method for producing a polyamide resin including reacting a dicarboxylic acid component containing sebacic acid in an amount of 50 mol % or more and a diamine component containing xylylenediamine in an amount of 70 mol % or more, wherein the total content of the specific compounds in the sebacic acid is 100 ppm by mass or less. 2. The method for producing a polyamide resin according to claim 1 , wherein the sebacic acid has a purity of 99.5% by mass or more.3. The method for producing a polyamide resin according to claim 1 , wherein the xylylenediamine is metaxylylenediamine claim 1 , paraxylylenediamine or a mixture thereof.4. The method for producing a polyamide resin according to claim 1 , wherein the dicarboxylic acid component and the diamine component are reacted in the presence of a phosphorus atom-containing compound.5. The method for producing a polyamide resin according to claim 4 , wherein the phosphorus atom-containing compound is selected from the group consisting of sodium hypophosphite claim 4 , calcium hypophosphite and hydrates of these compounds.6. The method for producing a polyamide resin according to claim 1 , wherein the sebacic acid is obtained according to a recrystallization method using methanol as a solvent. The present invention relates to a method for producing a polyamide resin, and specifically to a method for producing a polyamide resin using sebacic acid as a dicarboxylic acid component.Polyamide resins as typified by nylon 6, nylon 66 and the like are widely utilized for fibers for clothing, engineering plastics and others, because of their excellent characteristics of toughness, chemical resistance, electric characteristics and others and their easiness in melt molding.ε-caprolactam that is a starting material for nylon 6 and adipic acid and hexamethylenediamine that are starting materials for nylon 66 are fossil resources-derived materials, but because of consideration of the global environment in recent years, it ...

FIBER REINFORCED POLYAMIDE RESIN MATERIAL

Provided is a fiber reinforced polyamide resin material which has high rigidity and low water absorbency, and is excellent in moldability and mechanical properties of the molded article. A fiber reinforced polyamide resin material, comprises 100 parts by mass of polyamide resin (A) which is a polycondensate of diamine and dicarboxylic acid and 5 to 300 parts by mass of a carbon fiber (B); wherein 70 mol % or more of the diamine is a xylylenediamine; 50 mol % or more the dicarboxylic acid is a Straight-chain aliphatic dicarboxylic acid containing 4 to 20 carbon atoms; the polyamide resin (A) has a terminal amino group concentration ([NH]) (in μeq/g) of 5<[NH]<150; and the carbon fiber (B) has on a surface thereof a compound (C) which is reactive with amino group. 1. A fiber reinforced polyamide resin material , comprising 100 parts by mass of polyamide resin (A) which is a polycondensate of diamine and dicarboxylic acid and 5 to 300 parts by mass of a carbon fiber (B); 50 mol % or more of the dicarboxylic acid is a straight-chain aliphatic dicarboxylic acid containing 4 to 20 carbon atoms;', {'sub': 2', '2, 'the polyamide resin (A) has a terminal amino group concentration ([NH]) (in μeq/g) of 5<[NH]<150; and'}, 'the carbon fiber (B) has on a surface thereof a compound (C) which is reactive with amino group., 'wherein 70 mol % or more of the diamine is a xylylenediamine;'}2. The fiber reinforced polyamide resin material of claim 1 , wherein the polyamide resin (A) has a terminal carboxy group concentration ([COOH]) (in μeq/g) of 5<[COOH]<80.3. The fiber reinforced polyamide resin material of claim 1 , wherein the polyamide resin (A) has a terminal amino group concentration ([NH]) (in μeq/g)/terminal carboxy group concentration ([COOH]) (in μeq/g) of [NH]/[COOH]≧1.00.4. The fiber reinforced polyamide resin material of claim 1 , wherein the terminal amino group concentration ([NH]) (in μeq/g) of the polyamide resin (A) falls in the range of 50<[NH]<150 (in μeq/g).5. The ...

Polyamide resin composition

The present invention relates to a polyamide resin composition comprising polyamide (X) comprising a diamine unit containing 70 mol % or more of a metaxylylenediamine unit and a dicarboxylic acid unit and an alkali compound (A), wherein the following equations (1) to (3) are satisfied: 0.03≦P<0.32   (1) 2.2≦M≦26.1   (2) 5< M/P ≦200   (3) wherein P represents a mole concentration (μmol/g) of a phosphorus atom contained per g of the polyamide resin composition; and M represents a sum (μmol/g) of values obtained by multiplying a mole concentration of an alkali metal atom and a mole concentration of an alkaline earth metal atom each contained per g of the polyamide resin composition by valencies thereof respectively.

METHOD FOR PRODUCING POLYAMIDE RESIN

A polyamide resin is produced through polycondensation by melt-kneading a polyamide oligomer having a relative viscosity of from 1.1 to 1.3 and a water content of 3% by mass or less in a cylinder (S) of an extruder. The extruder includes open vents (OV) and (OV) and vacuum vents (V) and (V). The open vent (OV) is arranged near a supply port (A), e.g., above the supply port (A), and a pressure-decreasing element (Y) is arranged on an upstream side with respect to positions of the vacuum vents (V) and (V). In addition, the open vent (OV) is arranged in a preceding area (OA) and is brought into a pressurized state. 22. The polyamide resin production method according to claim 1 , wherein the extruder comprises only one open vent ().3. The polyamide resin production method according to claim 1 , wherein a relative viscosity of the polyamide resin is from 1.8 to 4.0.4. The polyamide resin production method according to claim 1 , wherein the polyamide oligomer has blended therein a phosphorus compound at a phosphorus atom concentration of from 10 ppm to 500 ppm.5. The polyamide resin production method according to claim 1 , wherein a kneading section for kneading the polyamide oligomer is arranged both in the vacuum area and at a position on an upstream side with respect to the vacuum area.6. The polyamide resin production method according to claim 1 , wherein at least one vacuum vent is arranged in an area of 25% or less of the total screw length from an end on a die side of the extruder.7. The polyamide resin production method according to claim 1 , wherein a kneading section comprising a kneading element having strong distributive mixing performance is arranged in an area of 25% or less of the total screw length from an end on a die side of the extruder.8. The polyamide resin production method according to claim 1 , wherein a kneading section for kneading the polyamide oligomer is arranged at a position on an upstream side with respect to the vacuum area and the ...

Polyimide resin composition, and (polyimide resin)-fiber composite material

Polyyamide resin composition and molded article

Reactive polyamide resins and polyamide resin compositions

Provided is a polyamide resin composition comprising an elastomer etc, and a reactive polyamide resin excellent in reactivity. The polyamide resin composition comprises 0.5 to 100 parts by mass of an elastomer per 100 parts by mass of a reactive polyamide resin, wherein the reactive polyamide resin obtained by polycondensing a diamine (A) containing 70 mol % or more of a diamine structural unit derived from xylylenediamine and a dicarboxylic acid (B) containing 50 mol % or more of a dicarboxylic acid structural unit derived from sebacic acid, and has a concentration of reactive functional groups of 100 µeq/g or more ,and a molar ratio of reacted diamine to reacted dicarboxylic acid (the number of moles of reacted diamine / the number of moles of reacted dicarboxylic acid) of 1.0 or more, and the reactive functional groups are a carboxyl group and/or an amino group.

Polyamide resin composition and molded product

Disclosed is an m-xylene group-containing polyamide resin composition having excellent gas barrier properties and heat aging resistance, which contains (A) a polyamide composed of a diamine unit containing 30 % by mole or more of an m-xylylenediamine unit and a dicarboxylic acid unit and (B) an aromatic secondary amine based compound and has an oxygen permeability coefficient of not more than 1 cc.cndot.mm/m2.cndot.day.cndot.atm at 23°C and 75 % RH.

Fiber fabric and molded article obtainable by molding fiber fabric

Provided is a fabric that exhibits excellent mechanical strength and shaping properties. In the fabric, one of the warp and the weft is a polyamide resin fiber comprising a polyamide resin composition, and the other is a continuous carbon fiber. The average fiber length of the continuous carbon fiber in a discretionary square portion of the fabric in which one side of the square is parallel to the warp and another side of the square is parallel to the weft is 1.1-1.6 times the length of one of the sides of the square. The polyamide resin composition comprises a polyamide resin in which 50 mol% or more of a diamine constituent unit is derived from a xylylenediamine, the number-average molecular weight (Mn) is 6,000-30,000, and the molecular weight of 0.5-5 mass% thereof is 1,000 or less.

Polyamide resin compositions

Disclosed is a polyamide resin composition that has a high elastic modulus, favorable gas barrier properties, low water absorption, and excellent flexibility and transparency. The polyamide resin composition is characterized by containing 1-40 masses of at least one copolymer polyamide (B) selected from the group consisting of the belowmentioned B-1 to B-3 for every 100 masses of a polyamide resin (A) of which at least 70 mol% of the diamine constituent units are derived from xylenediamine, and at least 50 mol% of the dicarboxylic acid constituent units are derived from sebacic acid. (B-1): Copolymer polyamide 6/66/12. (B-2) Copolymer polyamide 6/66/11. (B-3) Polyether copolymer polyamide configured from polyamide 12 units or polyamide 11 units, and polyether units.

Polyamide resins

Provided is a polyamide resin having excellent color tone and elastic modulus, excellent gas barrier properties and low water absorption. The polyamide resin comprises a diamine structural unit and a dicarboxylic acid structural unit, wherein 70 mol % or more of the diamine structural unit is derived from xylylenediamine (A-1) and/or bis(aminomethyl)cyclohexane (A-2) and 50 mol % or more of the dicarboxylic acid structural unit is derived from sebacic acid (B), characterized in that it has a sulfur atom concentration of 1 to 200 ppm by mass.

Polyamide pellets, method for producing polyamide pellets, and method for producing polyamide molded article

Polyamide resin

Provided is a polyamide resin having excellent color tone and elastic modulus, excellent gas barrier properties and low water absorption. The polyamide resin comprises a diamine structural unit and a dicarboxylic acid structural unit, wherein 70 mol % or more of the diamine structural unit is derived from xylylenediamine (A-1) and/or bis(aminomethyl)cyclohexane (A-2) and 50 mol % or more of the dicarboxylic acid structural unit is derived from sebacic acid (B), characterized in that it has a sulfur atom concentration of 1 to 200 ppm by mass.

Fiber reinforced polyamide resin material

Provided is a fiber-reinforced polyamide resin material which has high stiffness, low water absorbability and excellent moldability and can be molded into a molded article having excellent mechanical properties. A fiber-reinforced polyamide resin material comprising 100 parts by mass of a polyamide resin (A) that is a polycondensation product of a diamine and a dicarboxylic acid and 5 to 300 parts by mass of carbon fibers (B), wherein xylylene diamine makes up 70 mol% or more of the diamine, a linear aliphatic dicarboxylic acid having 4 to 20 carbon atoms makes up 50 mol% or more of the dicarboxylic acid, the concentration of a terminal amino group ([NH2]) in the polyamide resin (A) falls within the range represented by the formula: 5 < [NH2] < 150 (unit: µeq/g), and each of the carbon fibers (B) has a compound (C) having reactivity with an amino group on the surface thereof.

Polyester-based resin composition, method for producing same, and molding using resin composition

Multilayered container, die for multilayered container, and method for producing multilayered container

The present invention relates to a mold for a multi-layer container. The mold includes a cold-half portion containing a cavity, and a hot-half portion containing a first resin flow path for connecting an interior of a first injection cylinder to the cavity, a second resin flow path for connecting an interior of a second injection cylinder to the cavity, and a junction portion of the first resin flow path and the second resin flow path. The junction portion in the hot-half portion is positioned upstream of a gate portion opened to the cavity included in the cold-half portion, the second resin flow path contains an inhibitor for partially inhibiting a resin flow.

Polyamide resin composition

Use of a fuel-impermeable polyamide resin

Polyamide resin moldings

Provided is a xylylenesebacamide resin molding which is excellent in mechanical strength such as elastic modulus and avoids the problem of mechanical strength loss during long-term use. This is a molding of a polyamide resin or a polyamide resin composition containing the polyamide resin, wherein 70 mol % or more of the diamine structural unit is derived from xylylenediamine (A) and 50 mol % or more of the dicarboxylic acid structural unit is derived from sebacic acid (B), and the molding has a crystallinity index of 0 to 50 % and a moisture content of 0.1 to 2 % by mass.

Non-woven fabric, sheet or film, multi-layer sheet, molded article, and method for manufacturing non-woven fabric

本發明提供一種不織布，係將熱塑性樹脂纖維與碳纖維作為主成分，將該不織布製成樹脂成形品時，機械強度優異且成形品外觀優異，並提供一種多層片材，具有前述不織布與紡織品層，且機械強度優異、翹曲少。 一種不織布，包含熱塑性樹脂纖維(A)、碳纖維(B)、以及玻璃轉移溫度低於前述熱塑性樹脂纖維(A)之熱塑性樹脂(C)，前述熱塑性樹脂(C)之含量為熱塑性樹脂纖維(A)與熱塑性樹脂(C)之合計量之1~50重量%。

Polyamide resin composition and molded product

Fuel-barrier polyamide resin and multilayer shaped article

The fuel-barrier polyamide resin of the present invention is a product of the polycondensation of a diamine component comprising 70 mol % or higher of m-xylylenediamine and a dicarboxylic acid component comprising 70 mol % or higher of a mixed dicarboxylic acid which comprises a C 4 to C 20 α,ω-linear aliphatic dicarboxylic acid and at least one dicarboxylic acid selected from the group consisting of isophthalic acid and naphthalenedicarboxylic acid in a molar ratio of 30:70 to 95:5. The polyamide resin is excellent in not only fuel-barrier property and heat resistance, but also moldability and recyclability, and therefore suitably used as a barrier material of fuel containers.

Method for producing polyamide resin

Provided is a method for producing a polyamide resin including reacting a dicarboxylic acid component containing sebacic acid in an amount of 50 mol % or more and a diamine component containing xylylenediamine in an amount of 70 mol % or more, wherein the total content of the specific compounds in the sebacic acid is 100 ppm by mass or less.

Polyamide resin composition.

La presente invención se refiere a una composición de resma de poliamida que comprende la poliamida (X) que comprende una unidad de diamina que contiene 70% en mol b más de una unidad de metaxililendiamina y una unidad de ácido dicarboxílico y un compuesto alcalino (A), en donde se satisfacen las siguientes ecuaciones (1) a (4) 10 =( [COOH] - [NH2])= 80 (1) 0.32 = P < 6.46 (2) 0.50 = M < 17.00 (3) 2 = M/P = 3 (4) en donde [COOH] representa una concentración (µeq/g) de un grupo carboxilo terminal en la poliamida (X); [NH2] representa una concentración (µeq/g) de un grupo amino terminal en la poliamida (X); P representa una concentración en mol (µmol/g) de un átomo de fósforo contenido por g de la composición de resma de poliamida; y M representa una suma (µmol/g) de valores obtenidos al multiplicar una concentración en mol de un átomo de metal alcalino y una concentración en mol de un átomo de metal alcalinotérreo cada uno contenido por g de la composición de resma de poliamida por las valencias de los mismos respectivamente.

Polyamide resin

Provided is a polyamide resin having excellent color tone and elastic modulus, excellent gas barrier properties and low water absorption. The polyamide resin comprises a diamine structural unit and a dicarboxylic acid structural unit, wherein 70 mol % or more of the diamine structural unit is derived from xylylenediamine (A-1) and/or bis(aminomethyl)cyclohexane (A-2) and 50 mol % or more of the dicarboxylic acid structural unit is derived from sebacic acid (B), characterized in that it has a sulfur atom concentration of 1 to 200 ppm by mass.

Polyamide resin and method to mold it

Una resina de poliamida que comprende una unidad de diamina que contiene el 70 % en moles o más de una unidad de xililendiamina y una unidad de ácido carboxílico que contiene un 70 % en moles o más de una unidad de ácido carboxílico alifático de cadena recta; en la que la unidad de xililendiamina se compone del 55 al 95 % en moles de p-xililendiamina y del 45 al 5 % en moles de m-xililendiamina; la unidad de ácido dicarboxílico alifático de cadena larga se compone del 50 al 100 % en moles de ácido adípico y de 0 a menos del 50 % en moles de ácido sebácico u otros ácidos dicarboxílicos alifáticos de cadena recta; la relación molar de unidades de diamina reaccionadas a unidades de ácido carboxílico reaccionadas (el número de moles de unidades de diamina reaccionadas/el número de moles de unidades de ácido dicarboxílico reaccionadas) es menos de 0,994; y la resina de poliamina tiene un peso molecular medio en número de 10.000 a 25.000 y un punto de fusión de 285 ºC o más; en la que el punto de fusión se determina por calorimetría diferencial de barrido (DSC) fundiendo una muestra de resina de poliamida calentando de 30 ºC a una temperatura igual a o superior a un punto de fusión esperado a una velocidad de 10 ºC/min y después se enfría rápidamente y a continuación, la muestra se calienta a una velocidad de 10 ºC/min a una temperatura igual a o mayor al punto de fusión; y en la que el peso molecular medio en número se calcula en el presente documento a partir de la concentración de grupos amino terminales [NH2] (μeq/g) y la concentración de grupos carboxilo terminales [COOH] (μeq/g) de una resina de poliamida mediante la ecuación siguiente: Peso molecular medio en número >= 2.000.000/([COOH] + [NH2]). A polyamide resin comprising a diamine unit containing 70 mol% or more of a xylylenediamine unit and a carboxylic acid unit containing 70 mol% or more of a straight chain aliphatic carboxylic acid unit; wherein the xylylenediamine unit is composed of 55 to 95 mole% p- ...

Storage method

A storage method for storing a package containing content, under irradiation of light. At least a part of a package is formed by polyamide (A) which is obtained by polycondensation of a diamine component containing at least 70 mol% of meta-xylylenediamine, and a dicarboxylic component containing at least 70 mol% of α,ω-straight-chain aliphatic dicarboxylic acid having 4 to 20 carbons. When the light is irradiated to the package comprising the polyamide (A), oxygen permeability is decreased, and deterioration of the content can be suppressed.

polyamide resin-like composite material, and methods for producing a polyamide resin-like composite material and for producing a molding

material compósito do tipo resina de poliamida, e, métodos para produzir um material compósito do tipo resina de poliamida e para produzir uma moldagem. uma resina de poliamida com base em xililenodiamina/material compósito de fibra e moldagem são fornecidos que não exibem um declíneo nas propriedades sob temperaturas altas e umidades altas e que exibem um módulo elástico alto e aprensentam pouco empenamento e exibem características de reciclagem menores, uma moldabilidade melhor e uma produtividade melhor do que para as resinas de termocura. o material compósito do tipo resina de poliamida compreende um material fibroso (b) impregnado com uma resina de poliamida (a) em que pelo menos 50% em mol das unidades estruturais de diamina derivadas de xililenodiamina e tendo um peso molecular médio numérico (mn) de 6.000 a 30.000 e que contém um componente de um peso molecular de não mais do que 1.000 de 0,5 a 5% em massa. polyamide resin-like composite material, and methods for producing a polyamide resin-like composite material and for producing a molding. a xylylenediamine based polyamide resin / fiber composite and molding material are provided that do not exhibit a decline in properties at high temperatures and high humidity and that exhibit a high elastic modulus and exhibit low warping and exhibit minor recycle characteristics, a moldability better and better productivity than thermosetting resins. the polyamide resin-like composite material comprises a fibrous material (b) impregnated with a polyamide resin (a) wherein at least 50 mol% of the xylylenediamine-derived diamine structural units and having a number average molecular weight (mn) from 6,000 to 30,000 and containing a component of a molecular weight of no more than 1,000 of 0.5 to 5% by weight.

Molded polyamide resin article

Provided is a xylylenesebacamide resin molding which is excellent in mechanical strength such as elastic modulus and avoids the problem of mechanical strength loss during long-term use. This is a molding of a polyamide resin or a polyamide resin composition containing the polyamide resin, wherein 70 mol % or more of the diamine structural unit is derived from xylylenediamine (A) and 50 mol % or more of the dicarboxylic acid structural unit is derived from sebacic acid (B), and the molding has a crystallinity index of 0 to 50 % and a moisture content of 0.1 to 2 % by mass.

Polyamide resin composition

Disclosed is a polyamide resin composition comprising a resin component containing at least a polyamide (X) and a fatty acid metal salt having 10-50 carbon atoms. This polyamide resin composition may optionally contain an additive (A) and/or an additive (B). The polyamide (X) is obtained by melt polycondensation of a diamine component containing not less than 70 mol% of meta-xylylenediamine and a dicarboxylic acid component containing not less than 70 mol% of an α,ω-linear aliphatic dicarboxylic acid. The additive (A) is composed of one or more compounds selected from the group consisting of diamide compounds obtained from a fatty acid having 8-30 carbon atoms and a diamine having 2-10 carbon atoms, diester compounds obtained from a fatty acid having 8-30 carbon atoms and a diol having 2-10 carbon atoms, and surface active agents. The additive (B) is composed of one or more compounds selected from the group consisting of metal hydroxides, metal acetates, metal alkoxides, metal carbonates, and fatty acids.

Polyamide resin composition

The present invention relates to a polyamide resin composition comprising polyamide (X) comprising a diamine unit containing 70 mol% or more of a metaxylylenediamine unit and a dicarboxylic acid unit and an alkali compound (A), wherein the following equations (1) to (3) are satisfied; 0.03 ‰¤ P &lt; 0.32 2.2 ‰¤ M ‰¤ 26.1 5 &lt; M / P ‰¤ 200 wherein P represents a mole concentration (µmol/g) of a phosphorus atom contained per g of the polyamide resin composition; and M represents a sum (µmol/g) of values obtained by multiplying a mole concentration of an alkali metal atom and a mole concentration of an alkaline earth metal atom each contained per g of the polyamide resin composition by valencies thereof respectively.

Packaging body and storage method

Provided are [1] a packaging body consisting of a resin composition containing a polyester resin (A), a polyamide resin (B), and an oxidation reaction accelerator (C), wherein when a thickness of the packaging body is defined as d (µm), and an average long diameter, an average short diameter, and a volume fraction of dispersed particles of the polyamide resin (B) in the packaging body are defined as L (µm), W (µm), and Vf, respectively, the following expression (1A) is satisfied; an oxygen transmission rate after a lapse of 100 hours after preparing of the packaging body is 0.01 [cc/(package · day · 0.21 atm)] or less; and a haze value is 8% or less, and [2] a method for preserving goods by filling in a packaging body containing a polyester resin (A), a polyamide resin (B), and an oxidation reaction accelerator (C), wherein a content of the polyamide resin (B) in the packaging body is 2.0 to 3.5% by mass, and when an oxygen transmission rate of the packaging body after a lapse of 100 hours after preparing of the packaging body is defined as X [cc/(package · day · 0.21 atm)], a volume of the packaging body is defined as V [L], and a mass of the packaging body is defined as M [g], the following expression (1B) is satisfied. 10 < d × L × Vf / 2 W < 120 X / 2.5 × V 2 / M ˆ’ 8 < 0.3

Storage method

A storage method of storing a package with its contents under irradiationof light. At least part of the package is made of polyamide (A) which is obtained by polycondensation of a diamine component comprising 70 mol % or more of m xylylenediamine and a dicarboxylic acid component comprising 70 mol % or more of [err],[err]-linear aliphatic dicarboxylic acid having 4 to 20 carbon atoms. Theoxygen transmission of the package including polyamide (A) is reduced by irradiation of light, to prevent the spoilage of the contents.No Suitable Figure

Polyamide resin composition

Polyamide resin composition and molded article

Multi-layered bottle

Fiber-reinforced polyamide resin material

Provided is a fiber reinforced polyamide resin material which has high rigidity and low water absorbency, and is excellent in moldability and mechanical properties of the molded article. A fiber reinforced polyamide resin material, comprises 100 parts by mass of polyamide resin (A) which is a polycondensate of diamine and dicarboxylic acid and 5 to 300 parts by mass of a carbon fiber (B); wherein 70 mol% or more of the diamine is a xylylenediamine; 50 mol% or more the dicarboxylic acid is a Straight-chain aliphatic dicarboxylic acid containing 4 to 20 carbon atoms; the polyamide resin (A) has a terminal amino group concentration ([NH 2 ]) (in µeq/g) of 5<[NH 2 ]<150; and the carbon fiber (B) has on a surface thereof a compound (C) which is reactive with amino group.

Polyamide resin

Provided is a polyamide resin which exhibits an excellent color tone and has a high elastic modulus, excellent gas barrier properties, and a low water absorption rate. The polyamide resin is a polyamide resin, in which at least 70 mol% of diamine constituent units are derived from xylylenediamine (A-1) and/or bis(aminomethyl)cyclohexane (A-2), and at least 50 mol% of dicarboxylic acid constituent units are derived from sebacic acid (B), and which is characterized by having a sulfur atom concentration of 1 to 200 ppm by mass.

Crystalline thermoplastic polyimide resin

Crystalline thermoplastic polyimide resin

一種熱塑性聚醯亞胺樹脂，其係包含下式(1)表示之重複構成單元及下式(2)表示之重複構成單元，且相對於式(1)之重複構成單元與式(2)之重複構成單元之合計量，式(1)之重複構成單元之含有比例為40~70莫耳%。□(R1為包含至少1個脂環烴結構之碳數6~22之2價基；R2為碳數5~12之2價鏈狀脂肪族基；X1及X2各自獨立地為包含至少1個芳香環之碳數6~22之4價基)。

Polyether polyamide fiber

Polyamide resin and method for molding same

Polyamide resin composition

A polyamide resin composition comprises a resin component containing a polyamide (X) and a fatty acid metallic salt having from 10 to 50 carbon atoms. The polyamide (X) is obtained through melt polycondensation of a diamine component containing 70% by mol or more of m-xylylenediamine and a dicarboxylic acid component containing 70% by mol or more of an α,ω-linear aliphatic dicarboxylic acid in the presence of a phosphorus atom-containing compound and an alkali metal compound (C), and contains the phosphorus atom-containing compound in a concentration of from 50 to 400 ppm in terms of the phosphorus atom. The polyamide (X) has a ratio represented by the expression: M1/M2 in which expression M1 represents the total molar number of the fatty acid metallic salt in the polyamide resin composition, and M2 represents the molar number of the phosphorus atom-containing compound used in the polycondensation for producing the polyamide (X) in the polyamide resin composition of from 0.05 to 0.5; and a ratio of (molar number of the alkali metal compound (C))/(molar number of the phosphorus atom-containing compound) of from 0.5 to 1.

Xylylenediamine composition, and method for producing polyamide resin

[1] A xylylenediamine composition comprising xylylenediamine and bis(methylbenzyl)amine, wherein the content of bis(methylbenzyl)amine is 0.0005 to 0.1 part by mass relative to 100 parts by mass of xylylenediamine; and [2] a method for producing a polyamide resin, which comprises a step of introducing a diamine containing xylylenediamine, a dicarboxylic acid and bis(methylbenzyl)amine in an amount of 0.0005 to 0.1 part by mass relative to 100 parts by mass of the xylylenediamine into a reaction system to carry out a polycondensation reaction.

Multi-layered bottle

There is provided a multilayer bottle comprising a barrel portion including an outermost layer, an innermost layer and at least one barrier layer interposed between the outermost layer and the innermost layer, which satisfies the requirements represented by the following formulae (1) to (3) at the same time: (1) OTR ‰¤ 0.2 cc-mm/(m 2 -day-atm) where OTR represents an average oxygen transmission rate of the barrier layer of the barrel portion; (2) 20 ‰¤ (Average degree of orientation of barrier layer of barrel portion) ‰¤ 45; and (3) 0 ‰¤ b/a x 100 ‰¤ 200 where "a" represents an average thickness (µm) of the barrier layer of the barrel portion; and "b" represents an average thickness (µm) of the barrier layer of a bottom portion of the bottle. The multilayer bottle is free from delamination owing to impact upon dropping even when the bottle is formed with irregularities and bends and therefore exhibits a large freedom of design choice.

Xylylenediamine composition and method of producing polyamide resin

本發明提供：[1]一種亞二甲苯二胺組成物，含有亞二甲苯二胺、以及具有至少1個含胺基之取代基的吡啶化合物(A)，該吡啶化合物(A)之含量相對於亞二甲苯二胺100質量份為0.001~0.1質量份；及[2]一種聚醯胺樹脂之製造方法，包括以下步驟：將具有至少1個含胺基之取代基之吡啶化合物(A)、包括亞二甲苯二胺之二胺(惟排除屬於該吡啶化合物(A)之二胺)、及二羧酸導入到反應系中並進行縮聚反應；該吡啶化合物(A)之導入量相對於亞二甲苯二胺100質量份為0.001~0.1質量份。

Method for producing polyamide resin

Provided is a method for producing a polyamide resin including reacting a dicarboxylic acid component containing sebacic acid in an amount of 50 mol% or more and a diamine component containing xylylenediamine in an amount of 70 mol% or more, wherein the total content of the specific compounds in the sebacic acid is 100 ppm by mass or less.

Polyamide resin composition and molded article

Disclosed is a polyamide resin composition having excellent gas barrier properties and heat aging resistance, which contains (A) a polyamide composed of a diamine unit containing a 1,3-bis(aminomethyl)cyclohexane unit and a dicarboxylic unit and at least either of (B) an aromatic secondary amine based compound and (D) a phenol based antioxidant and has an oxygen permeability coefficient of not more than 1.5 cc.cndot.mm/m2.cndot.day.cndot.atm at 23°C and 75 % RH.

Polyamide resin composition and molded article

Provided is a composition of a polyamide resin containing metaxylene groups, the composition comprising a polyamide (A) constituted of diamine units including 1,3-bis(aminomethyl)cyclohexane units and dicarboxylic acid units and at least an aromatic secondary amine compound (B) or a phenolic antioxidant (D), the composition having a coefficient of oxygen permeability at 23ºC and 75% RH of 1.5 cc∙mm/m∙day∙atm or lower. This composition hence has excellent gas-barrier properties and resistance to thermal deterioration.

Composite fiber, fabric, knitted article, and composite material

本發明提供一種聚醯胺樹脂纖維與連續強化纖維分散而得的複合纖維。一種複合纖維，包含由聚醯胺樹脂組成物組成的聚醯胺樹脂纖維(A)、連續強化纖維(B)、以及聚醯胺樹脂纖維(A)之處理劑(a)，該處理劑(a)的量為聚醯胺樹脂纖維(A)之0.1~2.0質量%，該聚醯胺樹脂組成物，係二胺構成單元之50莫耳%以上來自二甲苯二胺，數目平均分子量(Mn)為6,000~30,000，且其0.5~5質量%係分子量為1,000以下的成分的聚醯胺樹脂。

Polyamide resin and method for molding same

Xylylenediamine composition and method for producing polyamide resin

Polyamide resin-type composite material and method of producing same

A xylylenediamine-based polyamide resin/fiber composite material and molding are provided that do not exhibit a decline in properties under high temperatures and high humidities, and that exhibit a high elastic modulus and present little warping, and exhibit better recycle characteristics, a better moldability, and a better productivity than for thermosetting resins. The polyamide resin-type composite material comprises a fibrous material (B) impregnated with a polyamide resin (A) wherein at least 50 mole% of diamine structural units derived from xylylenediamine, and having a number-average molecular weight (Mn) of 6,000 to 30,000, and containing a component of a molecular weight of not more than 1,000 at 0.5 to 5 mass %.

Polyamide resin compositions

[Problems] Provided is a polyamide resin material having high elastic modulus, good gas barrier properties, low water absorption and excellent flexibility. [Means for solving the problems] This is a polyamide resin composition comprising a polyamide resin (A) composed of a diamine structural unit and a dicarboxylic acid structural unit wherein 70 mol % or more of the diamine structural unit is derived from xylylenediamine and 50 mol % or more of the dicarboxylic acid structural unit is derived from sebacic acid, and 1 to 40 parts by mass of at least one copolyamide (B) selected from the following group consisting of (B-1)-(B-3) per 100 parts by mass of the polyamide resin (A); (B-1): a copolyamide 6/66/12; (B-2): a copolyamide 6/66/11; (B-3): a polyether-polyamide copolymer composed of a polyamide 12 unit or a polyamide 11 unit and a polyether unit.

Use of a fuel-barrier polyamide resin

Polyamide resin composition

Disclosed is a polyamide resin composition comprising a resin component containing at least a polyamide (X) and a fatty acid metal salt having 10-50 carbon atoms. This polyamide resin composition may optionally contain an additive (A) and/or an additive (B). The polyamide (X) is obtained by melt polycondensation of a diamine component containing not less than 70 mol% of meta-xylylenediamine and a dicarboxylic acid component containing not less than 70 mol% of an α,ω-linear aliphatic dicarboxylic acid. The additive (A) is composed of one or more compounds selected from the group consisting of diamide compounds obtained from a fatty acid having 8-30 carbon atoms and a diamine having 2-10 carbon atoms, diester compounds obtained from a fatty acid having 8-30 carbon atoms and a diol having 2-10 carbon atoms, and surface active agents. The additive (B) is composed of one or more compounds selected from the group consisting of metal hydroxides, metal acetates, metal alkoxides, metal carbonates, and fatty acids.