Seed layer deposition

Disclosed are methods for depositing a copper seed layer on a substrate having a conductive layer. Such methods are particularly suitable for depositing a copper seed layer on a substrate having small apertures, and preferably very small apertures.

Imaging composition and method

Imaging compositions and methods of using the compositions are disclosed. The imaging compositions are sensitive to low levels of energy such that upon application of the low levels of energy the compositions change color or shade. The compositions may be used in methods of marking.

Methods of forming waveguides and waveguides formed therefrom

Provided are methods of forming optical waveguides. The methods involve: (a) forming over a substrate a layer of a photodefinable composition; (b) exposing a portion of the layer to actinic radiation; (c) developing the exposed layer to form a waveguide core structure; and (d) heating the waveguide core structure to a temperature and for a time effective to reflow the structure such that it becomes at least partially rounded in cross-section. Also provided are optical waveguides formed from the described methods and electronic devices including one or more of the optical waveguides.

Residue and scum reducing composition and method

A composition and method to reduce or to prevent residue and scum formation on a substrate or in a solution. The composition contains an aromatic alkoxylate in combination with a polyol or ether or ester of a polyol. The composition also reduces or prevents foam formation such as in developing processes in the manufacturing of printed wiring boards.

Imaging methods

An imaging method is disclosed. An imaging composition is coated on a work piece followed by applying a sufficient amount of energy from a 3-D imaging system to form an image on the coated work piece. The image may be a logo or marker for alignment of parts.

Imaging methods

An imaging method is disclosed. An imaging composition is coated on a work piece followed by applying a sufficient amount of energy from a 3-D imaging system to form an image on the coated work piece. The image may be a logo or marker for alignment of parts.

Sequential build circuit board

A method for manufacture of a circuit board and the board formed by the novel method. The method comprises selective plating of metallic reinforcing members, solder mount pads, signal lines and interconnections sequentially. The resultant board is desirably free of glass fiber reinforcement.

Imaging compositions and methods

An imaging composition, article and method of imaging are disclosed. The imaging composition is energy sensitive such that upon application of a sufficient amount of energy to the composition a color or shade change is affected. The imaging composition is coated on an article to form an energy sensitive article, which may be used in marking work pieces.

Dielectric composition

Low VOC, dielectric compositions suitable for use in circuit board manufacture are disclosed. Also disclosed are methods of making circuit boards using the low VOC, dielectric compositions.

Seed layer

Disclosed are methods for repairing or enhancing discontinuous metal seed layers prior to subsequent metallization during the manufacture of electronic devices. Such repair methods do not require the use of a second electroplating bath.

Process for treating adhesion promoted metal surfaces with epoxy resins

A method for treating a micro-roughened metal surface to improve bonding between the metal surface and a polymer material. The method involves post-treating the micro-roughened conversion coated metal surface with an epoxy resin composition after having formed the micro-roughened conversion coated metal surface with an adhesion promotion composition. The method can be employed in the circuit board industry to improve bonding between innerlayers in a multiplayer circuit board.

Waveguide compositions and waveguides formed therefrom

Provided are compositions suitable for use in forming a flexible optical waveguide. The compositions include a polymer, having units of the formula (RSiO_1.5), wherein R is a substituted or unsubstituted organic group, and a plurality of functional end groups. A first component is provided for altering the solubility of the composition in a dried state upon activation. A second component contains a plurality of functional groups chosen from hydroxy, amino, thiol, sulphonate ester, carboxylate ester, silyl ester, anhydride, aziridine, methylolmethyl, silyl ether, and combinations thereof. The second component is present in an effective amount to improve flexibility of the composition in a dried state before and after activation. Also provided are flexible optical waveguides, methods of forming flexible optical waveguides and electronic devices that include a flexible optical waveguide.

PHOTOLUMINESCENT FIBERS, COMPOSITIONS AND FABRICS MADE THEREFROM

Disclosed are photoluminescent fibers containing photoluminescent phosphorescent materials and photoluminescent fluorescent materials which emit electromagnetic energies to give an emission signature. Also disclosed are the use of the inventive fibers, fabrics made therefrom, and objects containing the fiber.

Sequential build circuit board

A method for manufacture of a circuit board and the board formed by the novel method. The method comprises selective plating of metallic reinforcing members, solder mount pads, signal and interconnections sequentially. The resultant board is desirably free of glass fiber reinforcement.

Imaging methods

An imaging method is disclosed. An imaging composition is coated on a work piece followed by applying a sufficient amount of energy from a 3-D imaging system to form an image on the coated work piece. The image may be a logo or marker for alignment of parts.

Seed layer repair bath

Disclosed are methods for repairing seed layers prior to subsequent metallization during the manufacture of electronic devices.

Methods of forming printed circuit boards

Provided are methods of forming a printed circuit board having optical functionality. The methods involve: (a) providing a first, printed circuit board substrate; (b) forming an optical waveguide structure comprising a clad and a core structure on a second substrate separate from the printed circuit board substrate, wherein the optical waveguide structure comprises a silicon-containing material; (c) separating the optical waveguide structure from the second substrate; and (d) affixing the optical waveguide structure to the printed circuit board substrate. The invention has particular applicability in the electronics and optoelectronics industries for the formation of hybrid printed circuit boards.

Conductive polymer colloidal compositions with selectivity for non-conductive surfaces

A conductive polymer colloidal composition that selectively forms a coating on a non-conductive surface. The conductive polymer colloidal composition is composed of a polymer and a sulfonate dopant. The conductive polymer colloidal composition may also contain conductive colloidal particles such as conductive carbon or metal salt particles, oxidants, stabilizers, and preservatives. The conductive polymer colloidal composition may be employed to selectively coat the non-conductive parts of printed wiring boards such that a uniform metal layer can be deposited on the conductive polymer coat. In addition to a uniform metal layer being formed over the conductive polymer, adhesion between the metal layer and the printed wiring board is improved.

Photoluminescent fibers, compositions and fabrics made therefrom

Disclosed are photoluminescent fibers containing photoluminescent phosphorescent materials and photoluminescent fluorescent materials whose emission signature lies partly or fully in the infrared region of the electromagnetic spectrum. Also disclosed are the use of the inventive fibers, fabrics made therefrom, and objects containing the fiber.

Waveguide compositions and waveguides formed therefrom

Provided are compositions which include a polymer, having units of the formula (RSiO 1.5 ), wherein R is a substituted or unsubstituted organic group, and a plurality of functional end groups. A first component is provided for altering the solubility of the composition in a dried state upon activation. A second component contains a plurality of functional groups chosen from epoxides, oxetanes, vinyl ethers and combinations thereof. The second component is present in an effective amount to improve flexibility of the composition in a dried state before and after activation. Also provided are flexible optical waveguides, methods of forming flexible optical waveguides and electronic devices that include a flexible optical waveguide.

Photodefinable composition, method of manufacturing an optical waveguide with the photodefinable composition, and optical waveguide formed therefrom

Provided are photodefinable compositions. The compositions include a silsesquioxane oligomer that has polymerized units of the formula (RSiO1.5), wherein R is selected from hydroxyphenyl or hydroxybenzy, and a photoactive component. The solubility of the silsesquioxane oligomer is altered upon exposure to actinic radiation. Also provided are methods of manufacturing optical waveguides, optical waveguides and electronic devices.

Waveguide compositions and waveguides formed therefrom

Provided are compositions suitable for use in forming a flexible optical waveguide. The compositions include a polymer that has units of the formula (R 1 SiO 1.5 ) and (R 2 2 SiO), wherein R 1 and R 2 are the same or different, and are substituted and/or unsubstituted organic groups, and wherein the (R 2 2 SiO) units are present in an amount of 14 wt % or more based on the polymer; and a plurality of functional end and/or internal groups. Also included is a component for altering the solubility of the composition upon activation. The solubility of the composition in a dried state is alterable upon activation of the component such that the composition is developable in an aqueous developer solution. Also provided are flexible optical waveguides, methods of forming flexible optical waveguides and electronic devices that include a flexible optical waveguide.

Optical dry-films and methods of forming optical devices with dry films

Provided is a dry-film suitable for use in forming an optical component. The dry-film includes a carrier substrate having a front surface and a back surface. A negative-working photoimageable polymeric layer is disposed over the front surface of the carrier substrate, and includes a photoactive component and units of the formula (RSiO_1.5), wherein R is a substituted or unsubstituted organic group. In each of the units, R is free of hydroxy groups. The units include units of the formula (R¹SiO_1.5) and (R²SiO_1.5), wherein R¹ is a substituted or unsubstituted aliphatic group and R² is a substituted or unsubstituted aromatic group. A protective cover layer is disposed over the front surface or back surface of the carrier substrate. Also provided are methods of forming optical devices with dry-films. The invention finds particular applicability in the optoelectronics industry.

I-line photoresist compositions

Negative photoimageable compositions are disclosed which contain a radiation sensitive component for producing an acid when subjected to radiation at wavelengths of 320 to 420 nanometers, a resin binder and a reactive oligomer. The compositions are useful in constructing printed circuits and integrated circuit packages.

Silicon-containing polymers and polymers and optical waveguides formed therefrom

Provided are polymers comprising the condensation product of silicon-containing reactants. Also provided are compositions suitable for use in forming optical waveguides which include such polymers, as well as optical waveguides formed from such polymers. The polymers, compositions and optical waveguides have particular use in the formation of printed wiring boards having electrical and optical functionality.

Optical dry-films and methods of forming optical devices with dry films

Provided is a dry-film suitable for use in forming an optical component. The dry-film includes a carrier substrate having a front surface and a back surface. A non-photoimageable, thermally curable polymeric layer is provided over the front surface of the carrier substrate. The polymeric layer includes a thermally active component and units of the formula (RSiO_1.5), wherein R is a substituted or unsubstituted organic group. A protective cover layer is disposed over the front or back surface of the carrier substrate. Also provided are methods of forming optical devices with dry-films. The invention finds particular applicability in the optoelectronics industry.

Sequential build circuit board

The invention provides multilayer circuit boards and methods for formation of a sequential build circuit board. Among other things, glass fiber reinforced copper clad epoxy substrates, required to provide strength or rigidity to prior boards, are not required for preferred circuit boards of the invention. Preferred methods of the invention include applying a dielectric coating onto a support; forming recesses in the dielectric coating that define openings including opening for at least one reinforcing member; depositing copper metal into the recesses to form a first layer; applying a second dielectric coating onto the first circuit layer; forming recesses in the second dielectric coating that define openings including openings for at least one reinforcing member in registration with the one or more reinforcing members in the first layer; depositing metal into the recesses in the dielectric coating to form the second layer; and repeating the process to form sequential build board having ...

Dry film photoimageable compositions

Dry film resists of the invention in general comprise a photoactive component, a highly viscous or solid (at room temperature, ca. 25° C.) crosslinker component, and preferably a flexibilizing agent. Preferred dry film constructions of the invention do not require the use of a protective cover sheet due to the composition's very dry nature.

Photoimageable waveguide composition and waveguide formed therefrom

Provided are photodefinable compositions suitable for use in forming an optical waveguide. The compositions include a silsesquioxane polymer having polymerized units of the formula (R<1>SiO1.5) and (R<2>SiO1.5), wherein R<1 >and R<2 >are different and are substituted or unsubstituted organic side chain groups and are free of hydroxy groups, and two or more functional end groups, and a photoactive component. The solubility of the silsesquioxane polymer is altered upon exposure to actinic radiation such that the composition is developable in an aqueous developer solution. Also provided are methods of forming an optical waveguide with the inventive compositions, optical waveguides, and electronic devices including one or more optical waveguide.

Photoluminescent fibers, compositions and fabrics made therefrom

Disclosed are photoluminescent fibers containing photoluminescent phosphorescent materials and photoluminescent fluorescent materials which emit electromagnetic energies to give an emission signature. Also disclosed are the use of the inventive fibers, fabrics made therefrom, and objects containing the fiber.

Multilayer circuit board manufacturing process

A method for manufacture of a multilayer board and the board formed by the novel method. The method comprises selective plating of metallic reinforcing members, solder mount pads, signal lines and interconnections sequentially. The resultant board is desirably free of glass fiber reinforcement.

Seed layer repair method

Disclosed are methods of repairing metal seed layers prior to subsequent metallization. Such repair methods provide metal seed layers disposed on a substrate that are substantially free of metal oxide and substantially free of discontinuities.

Imaging methods

An imaging method is disclosed. An imaging composition is coated on a work piece followed by applying a sufficient amount of energy from a 3-D imaging system to form an image on the coated work piece. The image may be a logo or marker for alignment of parts.

Photoimageable composition having improved adhesion promoter

A photoimageable composition contains from 0.5 to 5 wt. percent of a compound of the formula: <IMAGE> wherein R=alkyl, aryl, aralkyl, alkenyl, alkynyl, and substituted forms thereof X=OR', SR', NR'2, R' R'=H, R, CO-R, G=nothing or C1-C8 alipathic hydrocarbon, and Y=COOH, PO3H, SO3H, SO2H and SOH. X'=R' to promote adhesion of the photoimageable composition to metal.

Waveguide compositions and waveguides formed therefrom

Electroplating process and composition

A process for electroplating a nonconducting substrate comprising formation of a film of a conductive polymer on the surface of a nonconducting substrate and electrolytic deposition of metal thereover. The conductive film is formed by deposition of the conductive polymer onto said surface from an aqueous suspension of said polymer.

Electroplating process and composition

A process for electroplating a nonconducting substrate comprising formation of a film of a conductive polymer on the surface of a nonconducting substrate and electrolytic deposition of metal thereover. The conductive film is formed by deposition of the conductive polymer onto said surface from an aqueous suspension of said polymer.

Radiation sensitive compositions

Radiation sensitive compositions, processes for using the compositions, and articles of manufacture comprising the compositions. The compositions of the invention are use to form flexible coatings having a dielectric constant of 3 or less. The compositions comprise a resin binder and a polybutadiene that comprises one or more internal epoxide groups. In preferred aspect of the invention, the compositions of the invention further comprise a crosslinking agent capable of solvating the remaining constituents of the composition. The coatings are used for the manufacture of electronic and other devices.

I-line photoresist compositions

Negative photoimageable compositions are disclosed which contain a radiation sensitive component for producing an acid when subjected to radiation at wavelengths of 320 to 420 nanometers, a resin binder and a reactive oligomer. The compositions are useful in constructing printed circuits and integrated circuit packages.

Seed layer

Seed layer repair bath

Disclosed are methods for repairing seed layers prior to subsequent metallization during the manufacture of electronic devices.

Plating Bath

Disclosed are electroplating baths for enhancing copper seed layers and for subsequent metallization on the seed layers. Methods of enhancing copper seed layers and depositing metal on such seed layers are also disclosed.

Dry film photoresist construction suitable for rolling up on itself

A dry film photoresist construction suitable for rolling up which includes a support layer having a top surface having thereon a thin layer of photoresist adhered thereto, and on the bottom surface a silicone release coating having greater adherence to said support layer than to said photoresist.

Electroplating process and composition

A process for electroplating a nonconducting substrate comprising formation of a film of a conductive polymer on the surface of a nonconducting substrate and electrolytic deposition of metal thereover. The conductive film is formed by deposition of the conductive polymer onto said surface from an aqueous suspension of said polymer containing a polymeric stabilizer having repeating alkylene oxide groups and a hydrophilic--lipophilic balance of at least 10.

Methods of forming printed circuit boards having optical functionality and printed wiring board having optical functionality

Dielectric composition

Silicon-containing polymers and optical waveguides formed therefrom

Method of forming optical waveguides using a photodefinable silsesquioxane composition

Disclosed are photodefinable silsesquioxane compositions and methods of forming optical waveguides using such silsesquioxane compositions.

Process for producing optical waveguides using a silsesquioxane composition

Methods of forming printed circuit boards

Provided are methods of forming a printed circuit board having optical functionality. The methods involve: (a) providing a first, printed circuit board substrate; (b) forming an optical waveguide structure comprising a clad and a core structure on a second substrate separate from the printed circuit board substrate, wherein the optical waveguide structure comprises a silicon-containing material; (c) separating the optical waveguide structure from the second substrate; and (d) affixing the optical waveguide structure to the printed circuit board substrate. The invention has particular applicability in the electronics and optoelectronics industries for the formation of hybrid printed circuit boards.

A photodefinable composition of a silsesquioxane polymer and optical waveguide formed therefrom

Photoluminescent fibers, compositions and fabrics made therefrom

Disclosed are photoluminescent fibers containing photoluminescent phosphorescent materials and photoluminescent fluorescent materials whose emission signature lies partly or fully in the infrared region of the electromagnetic spectrum. Also disclosed are the use of the inventive fibers, fabrics made therefrom, and objects containing the fiber.

Waveguide compositions and waveguides formed therefrom

Optical dry-films and methods of forming optical devices with dry-films

Optical dry-films and methods of forming optical devices with dry-films

Dielektrische zusammensetzung

Methods of forming electronic and optical components using laser ablation

Verfahren und Zusammenstellung zur Elektroplattierung

Verfahren und Zusammenstellung zur Elektroplattierung